EP0144915A3 - Method of attaching a thin electroconductive wire to electronic components, in particular semiconductor components - Google Patents

Method of attaching a thin electroconductive wire to electronic components, in particular semiconductor components Download PDF

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Publication number
EP0144915A3
EP0144915A3 EP19840114466 EP84114466A EP0144915A3 EP 0144915 A3 EP0144915 A3 EP 0144915A3 EP 19840114466 EP19840114466 EP 19840114466 EP 84114466 A EP84114466 A EP 84114466A EP 0144915 A3 EP0144915 A3 EP 0144915A3
Authority
EP
European Patent Office
Prior art keywords
wire
bonding
wedge
electronic components
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19840114466
Other languages
German (de)
Other versions
EP0144915B1 (en
EP0144915A2 (en
Inventor
Peter Urban
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DEUBZER-ELTEC GMBH
Original Assignee
DEUBZER-ELTEC GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DEUBZER-ELTEC GmbH filed Critical DEUBZER-ELTEC GmbH
Priority to AT84114466T priority Critical patent/ATE45247T1/en
Publication of EP0144915A2 publication Critical patent/EP0144915A2/en
Publication of EP0144915A3 publication Critical patent/EP0144915A3/en
Application granted granted Critical
Publication of EP0144915B1 publication Critical patent/EP0144915B1/en
Expired legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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Abstract

A method and an apparatus for bonding a thin electrically conductive wire, especially an aluminum wire (11), to electrical bonding pads or areas (12, 14) of electric or electronic components (16), especially microchips or semiconductor components. To this end the wire (11) is briefly pressed against the bonding pad (12, 14) by means of an ultrasonically energized bonding wedge (10) and is subsequently severed at a small distance from the side (17) of the wedge (10) that is opposite to the wire feeding side (15) thereof. To prevent the formation of a wire tail (TL) protruding beyond the bonding length (BL), a wire clamping tool (21) is provided on the wire feeding side of the wedge (10) by means of which the wire (11), after having been severed and prior to another bonding operation, is moved back, preferably retracted, at least to such an extent that the free wire end is approximately flush with the side (17) of the wedge (10) which is opposite to the wire feeding side (15 ) thereof.
EP19840114466 1983-12-02 1984-11-29 Method of attaching a thin electroconductive wire to electronic components, in particular semiconductor components Expired EP0144915B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT84114466T ATE45247T1 (en) 1983-12-02 1984-11-29 METHOD OF ATTACHING A THIN ELECTRICALLY CONDUCTIVE WIRE TO ELECTRONIC COMPONENTS, ESPECIALLY SEMICONDUCTOR DEVICES.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3343738 1983-12-02
DE3343738A DE3343738C2 (en) 1983-12-02 1983-12-02 Method and device for bonding a thin, electrically conductive wire to electrical contact surfaces of electrical or electronic components

Publications (3)

Publication Number Publication Date
EP0144915A2 EP0144915A2 (en) 1985-06-19
EP0144915A3 true EP0144915A3 (en) 1987-04-29
EP0144915B1 EP0144915B1 (en) 1989-08-02

Family

ID=6215937

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19840114466 Expired EP0144915B1 (en) 1983-12-02 1984-11-29 Method of attaching a thin electroconductive wire to electronic components, in particular semiconductor components

Country Status (4)

Country Link
US (1) US4619397A (en)
EP (1) EP0144915B1 (en)
AT (1) ATE45247T1 (en)
DE (2) DE3343738C2 (en)

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EP1343201A1 (en) 2002-03-08 2003-09-10 F & K Delvotec Bondtechnik GmbH Method and apparatus for manufacture and quality control of a wire bond
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DE3343738C2 (en) 1985-09-26
EP0144915B1 (en) 1989-08-02
DE3343738A1 (en) 1985-06-20
US4619397A (en) 1986-10-28
ATE45247T1 (en) 1989-08-15
DE3479270D1 (en) 1989-09-07
EP0144915A2 (en) 1985-06-19

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