EP0188386A3 - Gold electroplating bath - Google Patents

Gold electroplating bath Download PDF

Info

Publication number
EP0188386A3
EP0188386A3 EP86300301A EP86300301A EP0188386A3 EP 0188386 A3 EP0188386 A3 EP 0188386A3 EP 86300301 A EP86300301 A EP 86300301A EP 86300301 A EP86300301 A EP 86300301A EP 0188386 A3 EP0188386 A3 EP 0188386A3
Authority
EP
European Patent Office
Prior art keywords
electroplating bath
gold
additive
gold electroplating
hydrogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP86300301A
Other languages
German (de)
French (fr)
Other versions
EP0188386A2 (en
Inventor
Peter Wilkinson
Julia Mary Mayne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Catalysts LLC
Original Assignee
Engelhard Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Corp filed Critical Engelhard Corp
Publication of EP0188386A2 publication Critical patent/EP0188386A2/en
Publication of EP0188386A3 publication Critical patent/EP0188386A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Abstract

An acid gold electroplating bath contains gold in an electrodepositable form, such as potassium gold cyanide, together with a metallic additive and an organic additive.
The organic additive is a compound of the formula wherein X is -N= or -CR³=, and R¹, R² and R³ are each hydrogen, or an amino-, amido, thioamido- or cyano- group provided that one (and no more than one) of R¹, R² and R³ is not hydrogen.
The metallic additive is preferably a cobalt, nickel or iron salt.
EP86300301A 1985-01-18 1986-01-17 Gold electroplating bath Withdrawn EP0188386A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8501245 1985-01-18
GB858501245A GB8501245D0 (en) 1985-01-18 1985-01-18 Gold electroplating bath

Publications (2)

Publication Number Publication Date
EP0188386A2 EP0188386A2 (en) 1986-07-23
EP0188386A3 true EP0188386A3 (en) 1986-10-08

Family

ID=10573027

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86300301A Withdrawn EP0188386A3 (en) 1985-01-18 1986-01-17 Gold electroplating bath

Country Status (6)

Country Link
EP (1) EP0188386A3 (en)
JP (1) JPS61204391A (en)
CN (1) CN86100895A (en)
DK (1) DK23686A (en)
GB (1) GB8501245D0 (en)
IE (1) IE860142L (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS637390A (en) * 1986-06-26 1988-01-13 Nippon Engeruharudo Kk Gold-cobalt alloy plating liquid
GB2242200B (en) * 1990-02-20 1993-11-17 Omi International Plating compositions and processes
CN102105623B (en) * 2008-06-11 2013-10-02 日本高纯度化学株式会社 Electrolytic gold plating solution and gold film obtained using same
JP2011122192A (en) * 2009-12-09 2011-06-23 Ne Chemcat Corp Electrolytic hard gold plating liquid and plating method using the same
JP5731802B2 (en) * 2010-11-25 2015-06-10 ローム・アンド・ハース電子材料株式会社 Gold plating solution
ITFI20120103A1 (en) * 2012-06-01 2013-12-02 Bluclad Srl GALVANIC BATHROOMS FOR THE ACHIEVEMENT OF A LEAGUE OF LOW-CARATHED GOLD AND GALVANIC PROCESS THAT USES THESE BATHROOMS.
CN103741180B (en) * 2014-01-10 2015-11-25 哈尔滨工业大学 Non-cyanide bright electrogilding additive and application thereof
CN105350035B (en) * 2015-11-25 2018-11-09 广东致卓环保科技有限公司 Organic amine system cyanide-free gold electroplating plating solution and method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2249979A1 (en) * 1973-11-07 1975-05-30 Degussa
FR2465798A1 (en) * 1979-09-24 1981-03-27 Rohco Inc CADMIUM COATING BATHS AND METHODS FOR ELECTROLYTIC DEPOSITION OF BRIGHT CADMIUM LAYERS
DD216260A1 (en) * 1983-06-27 1984-12-05 Robotron Elektronik ELECTROLYTE FOR THE DEPOSITION OF HALF-GLAENZING GOLD ALLOY LAYERS
EP0150439A1 (en) * 1983-12-22 1985-08-07 LeaRonal (UK) plc An acid bath for electrodeposition of gold or gold alloys, an electroplating method and the use of said bath

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2249979A1 (en) * 1973-11-07 1975-05-30 Degussa
FR2465798A1 (en) * 1979-09-24 1981-03-27 Rohco Inc CADMIUM COATING BATHS AND METHODS FOR ELECTROLYTIC DEPOSITION OF BRIGHT CADMIUM LAYERS
DD216260A1 (en) * 1983-06-27 1984-12-05 Robotron Elektronik ELECTROLYTE FOR THE DEPOSITION OF HALF-GLAENZING GOLD ALLOY LAYERS
EP0150439A1 (en) * 1983-12-22 1985-08-07 LeaRonal (UK) plc An acid bath for electrodeposition of gold or gold alloys, an electroplating method and the use of said bath

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
CHEMICAL ABSTRACTS, vol. 83, no. 22, 1st December 1975, page 414, abstract no. 185393k, Columbus, Ohio, US; Y. SHIMIZU et al.: "Effects of pyridine derivatives on the properties of electroplated nickel", & KINZOKU HYOMEN FIJUTSU 1975, 6(6), 258-63 *
GALVANOTECHNIK, vol. 64, no. 10, 1973, pages 905-910; A. KOLEV et al.: "Zur galvanischen Vergoldung" *

Also Published As

Publication number Publication date
DK23686A (en) 1986-07-19
CN86100895A (en) 1986-07-16
JPS61204391A (en) 1986-09-10
EP0188386A2 (en) 1986-07-23
DK23686D0 (en) 1986-01-17
GB8501245D0 (en) 1985-02-20
IE860142L (en) 1986-07-18

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Inventor name: MAYNE, JULIA MARY

Inventor name: WILKINSON, PETER