EP1297572B1 - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
EP1297572B1
EP1297572B1 EP01942891A EP01942891A EP1297572B1 EP 1297572 B1 EP1297572 B1 EP 1297572B1 EP 01942891 A EP01942891 A EP 01942891A EP 01942891 A EP01942891 A EP 01942891A EP 1297572 B1 EP1297572 B1 EP 1297572B1
Authority
EP
European Patent Office
Prior art keywords
lamp
light emitting
junctions
light
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01942891A
Other languages
German (de)
French (fr)
Other versions
EP1297572A4 (en
EP1297572A1 (en
Inventor
Balu Jeganathan
John Albert Montagnat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lednium Technology Pty Ltd
Original Assignee
Lednium Technology Pty Ltd
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Publication date
Application filed by Lednium Technology Pty Ltd filed Critical Lednium Technology Pty Ltd
Publication of EP1297572A1 publication Critical patent/EP1297572A1/en
Publication of EP1297572A4 publication Critical patent/EP1297572A4/en
Application granted granted Critical
Publication of EP1297572B1 publication Critical patent/EP1297572B1/en
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Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the present invention relates to an LED lamp.
  • US Patent No. 5998925 discloses a light emitting device which comprises a semi-conductor light emitting layer embedded in a transparent globe.
  • a fluorescent material covers the semi-conductor layer to receive the emitted light for transmission at a different wavelength, i.e, in a predetermined colour.
  • GB 2311126 discloses a comparatively large scale light source which includes an array of separately mounted light emitting diodes which appear to have respective leads hardwired to a planar conductor. The diodes are encapsulated by a lens which is used to focus the light from the array.
  • US 5084804 discloses a wide-area lamp in which luminescent semi-conductor elements in a wide-area spread are connected to one another by a conducting path structure.
  • FR 2588109 discloses a support onto which are fixed light emitting diodes where the support is shaped in such a way that in use the axes of the various diodes are not all parallel.
  • the present invention seeks to provide an alternative form of LED lamp which can provide high intensity output by utilising a plurality of light emitting diodes, whilst maintaining the appearance of a substantially point source of illumination.
  • the lamp1 as shown in Figure 1 , includes a globe portion 2 with a cylindrical base 3 and a parabolic end 4, configured to enhance illumination output in an axial direction of the lamp.
  • the lamp also includes first and second terminals, which are preferably in the form of conductors 5,6 which are embedded within the globe portion 2.
  • the lead 5 has a support platform 7 to which is mounted an integrated circuit wafer 8.
  • the wafer includes two junctions which are arranged substantially adjacent each other so that a common layer of fluorescent material, such as a phosphor layer, may be applied over both junctions.
  • Intermediate conductors 9 to 12 electrically couple the junctions to the respective terminals 5,6 so that the LED junctions 14,15 are arranged in reverse polarity, as indicated in the circuit diagram Figure 3 .
  • a resistive element 16 is provided between a further conductor 13 (connecting the intermediate conductors 11 and 12) and the lead 5.
  • the conductors 5,6, intermediate conductors 9 to 13, and wafer 8 are all embedded within the globe portion 2 so that the lamp is presented as a robust unitary structure.
  • the reverse polarity of the junctions allows the lamp to be connected to a power source without concern for polarity.
  • the use of a single phosphor layer, common to each of the junctions, also simplifies manufacture and provides an aesthetic advantage in that the light from either junction is perceived to originate from a single source.
  • the following specifications may apply: NOMINAL SIZE - 9.5mm diameter LIGHT COLOUR - WHITE GLOBE COLOUR - WATER CLEAR LIGHT INTENSITY - SUPERBRIGHT TYPICAL LIGHT OUTPUT > 500mCd @ 20mA GUARANTEED LIFE - 30,000 HOURS FOCUS - HALF ANGLE 15° typ. BASE STYLE - INTERCHANGEABLE WITH WEDGE TYPE LAMPS LEAD DIMENSIONS - 6mm nom. OUTSIDE BASE WEDGE SUPPLY VOLTAGE - 12VOLTS nom.
  • any of the component parts of the lamp may vary, as required and the number of LED junctions may also be increased to suit illumination needs.
  • FIG. 1 A second example of a lamp 20 which does not form part of the invention is now described with reference to Figures 4 to 8 .
  • the lamp 20 is generally similar in construction to that of Figures 1 to 3 , in sofar as first and second terminals 21 and 22 are provided, in the form of conductors 23,24 embedded in a globe portion 25, together with additional conductors 26,27.
  • Each of the conductors 23,26 and 27 have a respective recess 28, to profile support structure for receiving an associated junction, indicated by reference numerals 29,30,31.
  • the junctions are covered by a common layer of phosphor 35 and are electrically coupled between each respective conductors 23,26,27 to which they are mounted, and the adjacent conductor via intermediate conductors 32,33,34. In the example shown, the junctions are serially connected, as represented by the circuit diagram of Figure 5 .
  • All of the conductors 23,24,26,27 are preferably formed in a two dimensional lead frame structure 40 shown in Figure 6 , to allow ease of manufacture and reliability in directly positioning the junctions 29,30,31 within the globe portion 25, after application of the phosphor layer 25.
  • the junctions 29,30,31 are arranged in a generally linear array, with the conductors 23,27 projecting above the conductor 26 so that the overall illumination generated by the junctions will be somewhat enhanced on-axis, as represented in Figure 8 by curve A.
  • the lamp 20 may also be provided with a lens 41 which is fitted to the globe portion 25 and shaped so as to modify the light generated by the lamp to produce, for example, the illumination pattern represented by curve B in Figure 8 , whereby the output illumination is somewhat more evenly distributed.
  • a lens 41 which is fitted to the globe portion 25 and shaped so as to modify the light generated by the lamp to produce, for example, the illumination pattern represented by curve B in Figure 8 , whereby the output illumination is somewhat more evenly distributed.
  • FIG. 9 to 16 a third lamp 50 according to the invention is illustrated.
  • the lamp 50 is in general similar to the previous lamp construction insofar as a plurality of conductors 51,52,53 and 54 are embedded within a unitary globe portion 55 and have light emitting junctions 56 mounted in respective recesses 57 and covered by a common layer of fluorescent material 59.
  • Each junction is again electrically coupled to the respective conductor to which it is mounted and an adjacent conductor via intermediate conducts 58 so as to form the circuit illustrated in Figure 10 .
  • Each of the conductors 51 to 54 in this instance, however, carrying three junctions 56.
  • the conductors 51 to 53 are curved within the globe portion 55 so as to support the junctions on an imaginary curved surface such as a spheroid and, in that manner, the illumination generated by the lamp 50 will have an appearance of emanating from a small, generally spheroid point like source.
  • a lens 60 may also be provided for modifying the output of the junctions to produce a more even distribution pattern such as represented by curve C in Figure 16 , which is the illumination output observed from a plan view of the lamp 50, i.e. when the lamp is seen from the same direction as viewed in Figure 9 .
  • each recess may be such that for example, the recess side walls act as optical guides to control the direction and/or angle of divergence of light emitted from each junction.
  • the recesses 57 containing the LED junctions are positioned and shaped in the conductors 51,52,53 so that the beams of light emerging from the recesses may be combined in free space outside the lamp 50 in predictable patterns determined by the radius of the imaginary part spherical surface designated 'R', the distance from the LED junction in the recess to the intersection of the imaginary extension of the sides of a recess - designated 'r' and the angle 'A' between the centre line 61 of the lamp 50 and a centre line 62 passing through the perpendicular to any other LED junction.
  • the radius 'R' of the imaginary spherical surface is the distance from the intersection of those centre lines to the LED junction within the recess.
  • the angle between the sides of a recess determines the value of the 'r'.
  • 'r' is equal to or greater than 'R'
  • the light from each LED junction will be shaped by the recesses into beams which do not cross, regardless of the value of an angle 'A'.
  • 'r' less than 'R' it will be possible to have the light beam from each LED junction coincide with the edges of the light beams from adjacent LED junctions. The exact positioning if this instance will be determined by the ratio R/r and the value of angle 'A'.
  • the present invention allows a considerable scope for obtaining a light source using junction diodes, with a predetermined one of a variety of output illumination patterns whilst maintaining a generally simple construction.
  • a particular advantage is that the various junctions are of small size and may be configured to produce a light output which may be perceived by the naked eye to be emanating from a single point source of light.

Abstract

In accordance with the present invention, there is provided a lamp including a plurality of semi-conductor light emitting junctions with a common layer of fluorescent material arranged thereover, wherein the junctions are provided in a three-dimensional array.

Description

    Field of the Invention
  • The present invention relates to an LED lamp.
    • Background of the Invention
  • US Patent No. 5998925 discloses a light emitting device which comprises a semi-conductor light emitting layer embedded in a transparent globe. A fluorescent material covers the semi-conductor layer to receive the emitted light for transmission at a different wavelength, i.e, in a predetermined colour.
  • To increase the intensity of the light output, additional semi-conductor devices may be added, such as shown in US Patent No. 5289082 , which discloses an LED lamp having a plurality of semi-conductive chips mounted in a translucent body. Each chip emits a discrete light pattern, however, and that may be undesirable if the light from the lamp is desired to have an appearance of emitting from a single, point-like light source. In the US 5289082 , the discrete light outputs are combined and focussed, by specific shaping of the body to produce an overall light output having a required illumination pattern.
  • GB 2311126 discloses a comparatively large scale light source which includes an array of separately mounted light emitting diodes which appear to have respective leads hardwired to a planar conductor. The diodes are encapsulated by a lens which is used to focus the light from the array.
  • US 5084804 discloses a wide-area lamp in which luminescent semi-conductor elements in a wide-area spread are connected to one another by a conducting path structure. FR 2588109 discloses a support onto which are fixed light emitting diodes where the support is shaped in such a way that in use the axes of the various diodes are not all parallel.
    • Object of the Invention
  • The present invention seeks to provide an alternative form of LED lamp which can provide high intensity output by utilising a plurality of light emitting diodes, whilst maintaining the appearance of a substantially point source of illumination.
    • Summary of the Invention
  • In accordance with the present invention, there is provided a lamp as defined in the claims.
    • Brief Description of the Drawings
  • The invention will be described in more detail with reference to the drawings in which:
    • Figure 1 is a side-view of an LED lamp;
    • Figure 2 is a plan-view of the lamp of Figure 1;
    • Figure 3 is a circuit diagram for the lamp of figures 1 and 2;
    • Figure 4 is a diagrammatic cross-sectional view of a second LED lamp;
    • Figure 5 is a circuit diagram of the lamp of Figure 4;
    • Figure 6 is a cross-sectional view of the lamp of Figure 4;
    • Figure 7 is a plan view of the lamp of Figure 4;
    • Figure 8 is a representation of an illumination pattern of the lamp of Figures 4 to 7;
    • Figure 9 is a plan view of a third lamp;
    • Figure 10 is a circuit diagram for the lamp of Figure 9;
    • Figure 11 is a front view of the lamp of Figure 9;
    • Figure 12 is a side view of the lamp of Figure 9;
    • Figure 13 is a side view of a lens for fitting on the lamp of Figure 9;
    • Figure 14 is a cross-sectional view taken along the line X-X shown in Figure 9;
    • Figure 15 is a cross-sectional view taken along the line Y-Y shown in Figure 10; and,
    • Figure 16 is a representation of the illumination pattern produced by the lamp of Figures 9 to 12.
    Detailed Description of an example, not forming part of the invention
  • The lamp1, as shown in Figure 1, includes a globe portion 2 with a cylindrical base 3 and a parabolic end 4, configured to enhance illumination output in an axial direction of the lamp. The lamp also includes first and second terminals, which are preferably in the form of conductors 5,6 which are embedded within the globe portion 2. The lead 5 has a support platform 7 to which is mounted an integrated circuit wafer 8. In the example given, the wafer includes two junctions which are arranged substantially adjacent each other so that a common layer of fluorescent material, such as a phosphor layer, may be applied over both junctions. Intermediate conductors 9 to 12 electrically couple the junctions to the respective terminals 5,6 so that the LED junctions 14,15 are arranged in reverse polarity, as indicated in the circuit diagram Figure 3. A resistive element 16 is provided between a further conductor 13 (connecting the intermediate conductors 11 and 12) and the lead 5.
  • The conductors 5,6, intermediate conductors 9 to 13, and wafer 8 are all embedded within the globe portion 2 so that the lamp is presented as a robust unitary structure. The reverse polarity of the junctions allows the lamp to be connected to a power source without concern for polarity. The use of a single phosphor layer, common to each of the junctions, also simplifies manufacture and provides an aesthetic advantage in that the light from either junction is perceived to originate from a single source.
  • In a preferred form of the LED lamp, the following specifications may apply:
    NOMINAL SIZE - 9.5mm diameter
    LIGHT COLOUR - WHITE
    GLOBE COLOUR - WATER CLEAR
    LIGHT INTENSITY - SUPERBRIGHT TYPICAL LIGHT OUTPUT > 500mCd @ 20mA
    GUARANTEED LIFE - 30,000 HOURS
    FOCUS - HALF ANGLE 15° typ.
    BASE STYLE - INTERCHANGEABLE WITH WEDGE TYPE LAMPS
    LEAD DIMENSIONS - 6mm nom. OUTSIDE BASE WEDGE
    SUPPLY VOLTAGE - 12VOLTS nom. {>11.5<14 volts AC or DC}
    FORWARD CURRENT - 20 +8/-3 mA @ 12Volts
    FORWARD VOLTAGE - 3.6 min(typ) 4.0max. @ 20mA
    REVERSE VOLTAGE - 5Volts min.
    POWER DISSIPATION - LED JUNCTIONS 120Mw RESISTOR 170mW
    REVERSE CURRENT - 50 x 10-3 mA max. @ 5V
    INTERNAL RESISTOR - 430 ohms nom.
  • It should, however, be appreciated that the size configuration and operating parameters of any of the component parts of the lamp may vary, as required and the number of LED junctions may also be increased to suit illumination needs.
  • A second example of a lamp 20 which does not form part of the invention is now described with reference to Figures 4 to 8. The lamp 20 is generally similar in construction to that of Figures 1 to 3, in sofar as first and second terminals 21 and 22 are provided, in the form of conductors 23,24 embedded in a globe portion 25, together with additional conductors 26,27. Each of the conductors 23,26 and 27 have a respective recess 28, to profile support structure for receiving an associated junction, indicated by reference numerals 29,30,31. The junctions are covered by a common layer of phosphor 35 and are electrically coupled between each respective conductors 23,26,27 to which they are mounted, and the adjacent conductor via intermediate conductors 32,33,34. In the example shown, the junctions are serially connected, as represented by the circuit diagram of Figure 5.
  • All of the conductors 23,24,26,27 are preferably formed in a two dimensional lead frame structure 40 shown in Figure 6, to allow ease of manufacture and reliability in directly positioning the junctions 29,30,31 within the globe portion 25, after application of the phosphor layer 25. As can be seen from both Figures 6 and 7, the junctions 29,30,31 are arranged in a generally linear array, with the conductors 23,27 projecting above the conductor 26 so that the overall illumination generated by the junctions will be somewhat enhanced on-axis, as represented in Figure 8 by curve A.
  • The lamp 20 may also be provided with a lens 41 which is fitted to the globe portion 25 and shaped so as to modify the light generated by the lamp to produce, for example, the illumination pattern represented by curve B in Figure 8, whereby the output illumination is somewhat more evenly distributed.
  • Turning now to Figures 9 to 16, a third lamp 50 according to the invention is illustrated. Again, the lamp 50 is in general similar to the previous lamp construction insofar as a plurality of conductors 51,52,53 and 54 are embedded within a unitary globe portion 55 and have light emitting junctions 56 mounted in respective recesses 57 and covered by a common layer of fluorescent material 59. Each junction is again electrically coupled to the respective conductor to which it is mounted and an adjacent conductor via intermediate conducts 58 so as to form the circuit illustrated in Figure 10. Each of the conductors 51 to 54, in this instance, however, carrying three junctions 56.
  • The conductors 51 to 53 are curved within the globe portion 55 so as to support the junctions on an imaginary curved surface such as a spheroid and, in that manner, the illumination generated by the lamp 50 will have an appearance of emanating from a small, generally spheroid point like source. A lens 60 may also be provided for modifying the output of the junctions to produce a more even distribution pattern such as represented by curve C in Figure 16, which is the illumination output observed from a plan view of the lamp 50, i.e. when the lamp is seen from the same direction as viewed in Figure 9.
  • In addition to modifying the light output by using the lens 60, it is also possible to arrange the conductors in any desired configuration and the construction of the recesses 57 may also be used to assist in controlling the directional output of the light emitted from the various junctions. In particular, the configuration of each recess may be such that for example, the recess side walls act as optical guides to control the direction and/or angle of divergence of light emitted from each junction.
  • More specifically, the shape of each recess and its effect on the light output from the junctions will now be described in more detail with reference to Figures 14 and 15, which show cross-sectional views of the relevant conductors taken along the lines X-X and Y-Y shown in Figures 11 and 12 respectively.
  • The recesses 57 containing the LED junctions are positioned and shaped in the conductors 51,52,53 so that the beams of light emerging from the recesses may be combined in free space outside the lamp 50 in predictable patterns determined by the radius of the imaginary part spherical surface designated 'R', the distance from the LED junction in the recess to the intersection of the imaginary extension of the sides of a recess - designated 'r' and the angle 'A' between the centre line 61 of the lamp 50 and a centre line 62 passing through the perpendicular to any other LED junction.
  • The radius 'R' of the imaginary spherical surface is the distance from the intersection of those centre lines to the LED junction within the recess. The angle between the sides of a recess determines the value of the 'r'.
  • In the limiting case 'r' is equal to or greater than 'R', the light from each LED junction will be shaped by the recesses into beams which do not cross, regardless of the value of an angle 'A'. For all values of 'r' less than 'R' it will be possible to have the light beam from each LED junction coincide with the edges of the light beams from adjacent LED junctions. The exact positioning if this instance will be determined by the ratio R/r and the value of angle 'A'.
  • As may be appreciated from the above, the present invention allows a considerable scope for obtaining a light source using junction diodes, with a predetermined one of a variety of output illumination patterns whilst maintaining a generally simple construction. A particular advantage is that the various junctions are of small size and may be configured to produce a light output which may be perceived by the naked eye to be emanating from a single point source of light.
  • The above LED lamps have been described by way of a non-limiting example only.

Claims (7)

  1. A lamp (50) including a plurality of light emitting junctions (56) mounted to a plurality of curved conductors (51, 52, 53) so that said plurality of light emitting junctions (56) is arranged in three/dimensions, wherein
    said plurality of curved conductors includes recesses (57) for receipt of said light emitting junctions (56), said light emitting junctions (56) being mounted in respective ones of the recesses (57), said plurality of curved conductors (51, 52, 53) defining an imaginary spheroid surface and supporting said light emitting junctions (56) on said imaginary spheroid surface so that illumination generated by the lamp (50) appears to emanate from a single point source of light, and
    wherein each light emitting junction (56) is electrically connected to the curved conductor (51, 52, 53) out of said plurality of curved conductors (51, 52, 53) to which it is mounted, and to an adjacent conductor (52, 53, 54) out of said plurality of curved conductors (51, 52, 53).
  2. A lamp (50) as claimed in claim 1 wherein said plurality of curved conductors (51, 52, 53) includes three curved conductors (51, 52, 53).
  3. A lamp (50) as claimed in claim 2 wherein three recesses (57) are formed in each of the three curved conductors (51, 52, 53).
  4. A lamp (50) as claimed in any preceding claim, wherein the lamp (50) includes a common layer of fluorescent material over at least adjacent light emitting junctions (56).
  5. A lamp (50) as claimed in any preceding claim, wherein the recesses (57) have side walls which function as an optical guide for controlling the direction of light transmission and/or the angle of divergence of light emitted from each light emitting junction (56).
  6. A lamp (50) as claimed in any preceding claim, wherein the lamp (50) includes a globe portion, with the light emitting junctions (56) and said plurality of curved conductors (51, 52, 53) being embedded within the globe portion so that the lam(50) is formed as a unitary structure.
  7. A lamp (50) as claimed in claim 6, wherein the lamp (50) includes a lens adapted to fit with the globe portion (55), and configured to shape the light emitted from the globe portion (55) into a predetermined pattern.
EP01942891A 2000-06-15 2001-06-15 Led lamp Expired - Lifetime EP1297572B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AUPQ8181A AUPQ818100A0 (en) 2000-06-15 2000-06-15 Led lamp
AUPQ818100 2000-06-15
PCT/AU2001/000717 WO2001097287A1 (en) 2000-06-15 2001-06-15 Led lamp

Publications (3)

Publication Number Publication Date
EP1297572A1 EP1297572A1 (en) 2003-04-02
EP1297572A4 EP1297572A4 (en) 2006-09-13
EP1297572B1 true EP1297572B1 (en) 2011-07-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP01942891A Expired - Lifetime EP1297572B1 (en) 2000-06-15 2001-06-15 Led lamp

Country Status (13)

Country Link
US (2) US6809475B2 (en)
EP (1) EP1297572B1 (en)
JP (1) JP2004503120A (en)
KR (1) KR20030019426A (en)
CN (1) CN1460294A (en)
AT (1) ATE518246T1 (en)
AU (1) AUPQ818100A0 (en)
CA (1) CA2411219A1 (en)
HK (1) HK1054817A1 (en)
NZ (1) NZ512392A (en)
TW (1) TWI251350B (en)
WO (1) WO2001097287A1 (en)
ZA (1) ZA200209990B (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AUPQ818100A0 (en) * 2000-06-15 2000-07-06 Arlec Australia Limited Led lamp
US7320632B2 (en) * 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
EP1552560A4 (en) * 2002-06-14 2006-10-25 Lednium Pty Ltd A lamp and method of producing a lamp
TW200507226A (en) * 2003-03-12 2005-02-16 Lednium Pty Ltd A lamp and a process for producing a lamp
US7038370B2 (en) * 2003-03-17 2006-05-02 Lumileds Lighting, U.S., Llc Phosphor converted light emitting device
US7575030B2 (en) * 2003-12-10 2009-08-18 Hutchinson Runflat device for a motor vehicle, and a mounted assembly incorporating it
US8896216B2 (en) 2005-06-28 2014-11-25 Seoul Viosys Co., Ltd. Illumination system
KR100712891B1 (en) * 2005-12-21 2007-05-02 서울옵토디바이스주식회사 Light emitting diode and light emitting device for ac power operation with plurality of light emitting cell arrays
CN101795510A (en) 2005-06-28 2010-08-04 首尔Opto仪器股份有限公司 Light-emitting device
KR101171355B1 (en) * 2005-06-28 2012-08-10 서울옵토디바이스주식회사 Luminescent apparatus
EP2089915B1 (en) * 2007-08-03 2018-08-01 Panasonic Intellectual Property Management Co., Ltd. Wavelength-converted light-emitting device with uniform emission
US8067777B2 (en) * 2008-05-12 2011-11-29 Occam Portfolio Llc Light emitting diode package assembly
KR100889916B1 (en) * 2008-09-09 2009-04-16 동광전자 주식회사 The light at one side right department the light-emitting diode which radiates and the production method
IT1399596B1 (en) 2009-09-29 2013-04-26 Zanotta ROAD LIGHTS FOR CHROMATIC STORAGE FOR THE REDUCTION OF ENERGY CONSUMPTION AND ITS METHOD OF CONSTRUCTION, USE AND CONTROL
US9425372B2 (en) * 2010-01-29 2016-08-23 Japan Aviation Electronics Industry, Limited LED device, method of manufacturing the same, and light-emitting apparatus
EP2392850B1 (en) * 2010-06-04 2017-07-19 Ville de Geneve LED light bulb
CN202091826U (en) 2011-05-05 2011-12-28 厦门砺德光电科技有限公司 LED (Light-Emitting Diode) reflective regulating lamp
KR102007403B1 (en) * 2012-11-02 2019-08-05 엘지이노텍 주식회사 Light emitting device package and lighting unit including the same
FR3012204B1 (en) 2013-10-18 2015-10-30 Valeo Vision SYSTEM FOR ELECTRICALLY CONNECTING AT LEAST ONE LIGHT SOURCE TO AN ELECTRICAL POWER SUPPLY SYSTEM
US20150116999A1 (en) * 2013-10-30 2015-04-30 Avago Technologies General Ip (Singapore) Pte. Ltd Mono-axial lens for multiple light sources

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9414688U1 (en) * 1994-09-10 1994-12-15 Schluemer Heinz Dieter Light source for traffic light systems

Family Cites Families (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3581162A (en) 1969-07-01 1971-05-25 Rca Corp Optical semiconductor device
DE2011028A1 (en) 1969-10-10 1971-04-15 Wissenschaftlich Technisches Zentrum fur Landtechnik, χ 7912 Schheben Cleaning facility
JPS5026433B1 (en) 1970-12-21 1975-09-01
JPS48102585A (en) * 1972-04-04 1973-12-22
JPS5127988B2 (en) 1972-09-05 1976-08-16
FR2248663B1 (en) 1972-12-13 1978-08-11 Radiotechnique Compelec
US3942185A (en) * 1972-12-13 1976-03-02 U.S. Philips Corporation Polychromatic electroluminescent device
JPS5310862Y2 (en) * 1972-12-28 1978-03-23
US3886681A (en) 1973-08-29 1975-06-03 Mattel Inc Control member for toy airplane
GB1522145A (en) * 1974-11-06 1978-08-23 Marconi Co Ltd Light emissive diode displays
US4054814A (en) * 1975-10-31 1977-10-18 Western Electric Company, Inc. Electroluminescent display and method of making
US4173035A (en) * 1977-12-01 1979-10-30 Media Masters, Inc. Tape strip for effecting moving light display
US4255688A (en) * 1977-12-15 1981-03-10 Tokyo Shibaura Denki Kabushiki Kaisha Light emitter mounted on reflector formed on end of lead
US4271408A (en) 1978-10-17 1981-06-02 Stanley Electric Co., Ltd. Colored-light emitting display
JPS57156442A (en) 1981-03-23 1982-09-27 Kuraray Co Ltd Preparation of methyl lactate
US4467193A (en) 1981-09-14 1984-08-21 Carroll Manufacturing Corporation Parabolic light emitter and detector unit
DE3148843C2 (en) 1981-12-10 1986-01-02 Telefunken electronic GmbH, 7100 Heilbronn Multiple light emitting diode arrangement
US4473834A (en) * 1982-04-19 1984-09-25 Rockwell International Corporation Light emitting transistor array
JPS592384A (en) * 1982-06-28 1984-01-07 Idec Izumi Corp Light-emitting diode lamp
JPS5974687A (en) 1982-10-21 1984-04-27 Idec Izumi Corp Light emitting diode lamp
FR2554606B1 (en) * 1983-11-04 1987-04-10 Thomson Csf OPTICAL DEVICE FOR CONCENTRATION OF LIGHT RADIATION EMITTED BY A LIGHT EMITTING DIODE, AND LIGHT EMITTING DIODE COMPRISING SUCH A DEVICE
JPS6132483A (en) * 1984-07-24 1986-02-15 Kimura Denki Kk Spherical luminous body using led
DE3438154C2 (en) 1984-10-18 1994-09-15 Teves Gmbh Alfred Rear lights for motor vehicles
JPS61141165A (en) 1984-12-14 1986-06-28 Toshiba Corp Lead frame for semiconductor device
FR2588109B1 (en) * 1985-10-02 1987-12-11 Valancogne Pierre LIGHT SIGNALING DEVICE
US4878107A (en) * 1985-10-29 1989-10-31 Hopper William R Touch sensitive indicating light
JPH0326536Y2 (en) 1986-10-01 1991-06-07
US4914731A (en) 1987-08-12 1990-04-03 Chen Shen Yuan Quickly formed light emitting diode display and a method for forming the same
US4935665A (en) 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
DE3827083A1 (en) 1988-08-10 1990-02-15 Telefunken Electronic Gmbh AREA SPOTLIGHT
DE3835942A1 (en) 1988-10-21 1990-04-26 Telefunken Electronic Gmbh AREA SPOTLIGHT
US4893223A (en) 1989-01-10 1990-01-09 Northern Telecom Limited Illumination devices for inspection systems
US5055892A (en) * 1989-08-29 1991-10-08 Hewlett-Packard Company High efficiency lamp or light accepter
DE4107526C2 (en) * 1990-03-26 1996-04-11 Siemens Ag Luminescent diode device with protective device for limiting the forward current when AC voltage is present
JP2535651B2 (en) * 1990-07-24 1996-09-18 株式会社東芝 Semiconductor device
US5289082A (en) 1990-09-07 1994-02-22 Kabushiki Kaisha Toshiba LED lamp
US5119174A (en) 1990-10-26 1992-06-02 Chen Der Jong Light emitting diode display with PCB base
DE4124413A1 (en) * 1991-07-23 1993-01-28 Bernd Herzhoff Subminiature, semiconductor, power solid state laser - is optically energised by number of LED chips with radiation impinging on jacket of laser-active crystal
FR2680859B1 (en) 1991-09-02 1993-10-29 Valeo Vision OPTICAL COLLIMATION ELEMENT AND ITS ASSOCIATED SUPPORT ELEMENT, IN PARTICULAR FOR A MOTOR VEHICLE SIGNALING LIGHT.
FR2680862B1 (en) * 1991-09-02 1997-08-08 Valeo Vision SIGNAL LIGHT WITH LIGHT EMITTING ELEMENTS, PARTICULARLY FOR MOTOR VEHICLE.
JP3096824B2 (en) * 1992-04-17 2000-10-10 ローム株式会社 LED manufacturing frame and LED manufacturing method using the same
CA2152356C (en) * 1992-12-24 2005-05-10 Robert Michael Pixel, video display screen and power delivery
JP3258738B2 (en) 1993-01-22 2002-02-18 三洋電機株式会社 Light emitting diode display
US5534718A (en) * 1993-04-12 1996-07-09 Hsi-Huang Lin LED package structure of LED display
FR2707222B1 (en) 1993-07-07 1995-09-29 Valeo Vision Improved signaling light with light-emitting diodes.
US5404282A (en) * 1993-09-17 1995-04-04 Hewlett-Packard Company Multiple light emitting diode module
DE9316108U1 (en) 1993-10-21 1994-03-17 Woco Abc Automobil Formteile G Threaded bolt
DE9316106U1 (en) 1993-10-21 1994-02-03 Chang Fa Sheng LED construction
US5561346A (en) * 1994-08-10 1996-10-01 Byrne; David J. LED lamp construction
US5709453A (en) 1994-08-16 1998-01-20 Krent; Edward D. Vehicle lighting having remote light source
JP3033883B2 (en) 1994-11-30 2000-04-17 ローム株式会社 Light emitting display
US5519596A (en) * 1995-05-16 1996-05-21 Hewlett-Packard Company Moldable nesting frame for light emitting diode array
US5515253A (en) 1995-05-30 1996-05-07 Sjobom; Fritz C. L.E.D. light assembly
GB9605314D0 (en) 1996-03-13 1996-05-15 Toher C H Non-filament lights
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
JP3752760B2 (en) * 1997-01-14 2006-03-08 豊田合成株式会社 Light emitting diode device
JPH10242523A (en) 1997-02-28 1998-09-11 Kouha:Kk Light emitting diode display device and picture display device utilizing the same
JP3948789B2 (en) 1997-07-02 2007-07-25 シチズン電子株式会社 Infrared data communication module
US5962971A (en) * 1997-08-29 1999-10-05 Chen; Hsing LED structure with ultraviolet-light emission chip and multilayered resins to generate various colored lights
JP3454123B2 (en) 1997-11-25 2003-10-06 松下電工株式会社 LED lighting module
JP3505985B2 (en) 1997-11-25 2004-03-15 松下電工株式会社 LED lighting module
TW408497B (en) 1997-11-25 2000-10-11 Matsushita Electric Works Ltd LED illuminating apparatus
JPH11163412A (en) 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Led illuminator
JP3618534B2 (en) 1997-11-28 2005-02-09 同和鉱業株式会社 Optical communication lamp device and manufacturing method thereof
JPH11177144A (en) 1997-12-15 1999-07-02 Iwasaki Electric Co Ltd Light emitting diode array
US6412971B1 (en) * 1998-01-02 2002-07-02 General Electric Company Light source including an array of light emitting semiconductor devices and control method
US6068383A (en) * 1998-03-02 2000-05-30 Robertson; Roger Phosphorous fluorescent light assembly excited by light emitting diodes
JP3114805B2 (en) 1998-04-15 2000-12-04 日亜化学工業株式会社 Planar light source, display backlight using the same, and illuminated operation switch
FR2779508B1 (en) * 1998-06-03 2000-08-25 Valeo Vision SIGNAL LIGHT WITH GALBED WINDOW, ESPECIALLY A COMPLEMENTARY STOP LIGHT, FOR A MOTOR VEHICLE
JP2002520822A (en) * 1998-06-30 2002-07-09 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー オッフェネ ハンデルスゲゼルシャフト Light source that generates visible light
US5959316A (en) 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
JP3366586B2 (en) 1998-12-28 2003-01-14 日亜化学工業株式会社 Light emitting diode
JP3920486B2 (en) 1999-02-23 2007-05-30 株式会社小糸製作所 Vehicle lighting
JP3447604B2 (en) 1999-02-25 2003-09-16 株式会社シチズン電子 Surface mount type light emitting diode and method of manufacturing the same
US6521916B2 (en) * 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
WO2000057490A1 (en) 1999-03-19 2000-09-28 Eurolight Illumination Technologies Gmbh Lamp
DE19922176C2 (en) 1999-05-12 2001-11-15 Osram Opto Semiconductors Gmbh Surface-mounted LED multiple arrangement and its use in a lighting device
CA2380356C (en) * 1999-07-26 2011-01-18 Labosphere Institute Bulk-shaped lens, light-emitting unit, lighting equipment and optical information system
US6367949B1 (en) * 1999-08-04 2002-04-09 911 Emergency Products, Inc. Par 36 LED utility lamp
GB2356037B (en) 1999-11-03 2004-03-31 Page Aerospace Ltd A semiconductor light source
DE19952932C1 (en) * 1999-11-03 2001-05-03 Osram Opto Semiconductors Gmbh LED white light source with broadband excitation
DE19964252A1 (en) 1999-12-30 2002-06-06 Osram Opto Semiconductors Gmbh Surface mount component for an LED white light source
US6409938B1 (en) * 2000-03-27 2002-06-25 The General Electric Company Aluminum fluoride flux synthesis method for producing cerium doped YAG
GB2361581A (en) 2000-04-20 2001-10-24 Lite On Electronics Inc A light emitting diode device
DE10025563B4 (en) 2000-05-24 2005-12-01 Osram Opto Semiconductors Gmbh Module for the arrangement of electric light-emitting elements, which can be integrated into a luminaire housing, and method for producing such a module
AUPQ818100A0 (en) * 2000-06-15 2000-07-06 Arlec Australia Limited Led lamp
US7320632B2 (en) * 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
DE20013605U1 (en) * 2000-07-28 2000-12-28 Opto System Gmbh Elongated light source
TW521409B (en) 2000-10-06 2003-02-21 Shing Chen Package of LED
US20020043156A1 (en) * 2000-10-11 2002-04-18 Shea Michael Richard Integrated air filter and hydrocarbon adsorber
EP1244152A3 (en) * 2001-01-26 2008-12-03 Toyoda Gosei Co., Ltd. Reflective light emitting diode, reflective optical device and its manufacturing method
JP3920031B2 (en) 2001-02-20 2007-05-30 株式会社小糸製作所 Vehicle lighting
US6541800B2 (en) * 2001-02-22 2003-04-01 Weldon Technologies, Inc. High power LED
JP4905751B2 (en) 2001-05-17 2012-03-28 株式会社吉田製作所 Dental light irradiator
DE20110289U1 (en) 2001-06-21 2001-08-23 Buechner Thomas Lighting device
JP4129570B2 (en) 2001-07-18 2008-08-06 ラボ・スフィア株式会社 Light emitting diode lighting device
US6599000B2 (en) 2001-10-15 2003-07-29 Steven T. Nolan Interior lamp for producing white light using bright white LEDs
JP4009097B2 (en) * 2001-12-07 2007-11-14 日立電線株式会社 LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, AND LEAD FRAME USED FOR MANUFACTURING LIGHT EMITTING DEVICE
EP1552560A4 (en) * 2002-06-14 2006-10-25 Lednium Pty Ltd A lamp and method of producing a lamp

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9414688U1 (en) * 1994-09-10 1994-12-15 Schluemer Heinz Dieter Light source for traffic light systems

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EP1297572A1 (en) 2003-04-02
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US6809475B2 (en) 2004-10-26
KR20030019426A (en) 2003-03-06
CN1460294A (en) 2003-12-03
US7352127B2 (en) 2008-04-01
NZ512392A (en) 2002-12-20
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US20050104515A1 (en) 2005-05-19
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US20020145384A1 (en) 2002-10-10
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CA2411219A1 (en) 2001-12-20
AUPQ818100A0 (en) 2000-07-06

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