EP1814369A4 - Long film circuit board, and production method and production device therefor - Google Patents

Long film circuit board, and production method and production device therefor

Info

Publication number
EP1814369A4
EP1814369A4 EP05787761A EP05787761A EP1814369A4 EP 1814369 A4 EP1814369 A4 EP 1814369A4 EP 05787761 A EP05787761 A EP 05787761A EP 05787761 A EP05787761 A EP 05787761A EP 1814369 A4 EP1814369 A4 EP 1814369A4
Authority
EP
European Patent Office
Prior art keywords
circuit board
long film
film circuit
device therefor
flexible film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05787761A
Other languages
German (de)
French (fr)
Other versions
EP1814369A1 (en
Inventor
Yasuaki Tanimura
Takayoshi Akamatsu
Futoshi Okuyama
Nobuyuki Kuroki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of EP1814369A1 publication Critical patent/EP1814369A1/en
Publication of EP1814369A4 publication Critical patent/EP1814369A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

When a long film circuit board (1d) is formed by joining a plurality of flexible film substrates (1) each formed on at least one surface thereof with a circuit pattern (2), conveying spaces (4) are provided at the pair of facing ends of the flexible film substrate , at least part of the conveying space is allowed to project (15) in a direction parallel to the conveying direction of the flexible film substrate, and the projected part of the conveying space is allowed to overlap the conveying space of an adjacent flexible film substrate to be fixed.
EP05787761A 2004-10-01 2005-09-28 Long film circuit board, and production method and production device therefor Withdrawn EP1814369A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004289707 2004-10-01
JP2005131248 2005-04-28
PCT/JP2005/017786 WO2006038496A1 (en) 2004-10-01 2005-09-28 Long film circuit board, and production method and production device therefor

Publications (2)

Publication Number Publication Date
EP1814369A1 EP1814369A1 (en) 2007-08-01
EP1814369A4 true EP1814369A4 (en) 2008-10-29

Family

ID=36142574

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05787761A Withdrawn EP1814369A4 (en) 2004-10-01 2005-09-28 Long film circuit board, and production method and production device therefor

Country Status (7)

Country Link
US (1) US20080259575A1 (en)
EP (1) EP1814369A4 (en)
JP (1) JPWO2006038496A1 (en)
KR (1) KR20070063568A (en)
CN (1) CN101036422B (en)
TW (1) TW200629999A (en)
WO (1) WO2006038496A1 (en)

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KR100752011B1 (en) * 2006-04-12 2007-08-28 삼성전기주식회사 A package strip format and its array
JP4224086B2 (en) * 2006-07-06 2009-02-12 三井金属鉱業株式会社 Wiring board and semiconductor device excellent in folding resistance
TWI570900B (en) * 2006-09-29 2017-02-11 半導體能源研究所股份有限公司 Method for manufacturing semiconductor device
US8137417B2 (en) 2006-09-29 2012-03-20 Semiconductor Energy Laboratory Co., Ltd. Peeling apparatus and manufacturing apparatus of semiconductor device
TWI324380B (en) * 2006-12-06 2010-05-01 Princo Corp Hybrid structure of multi-layer substrates and manufacture method thereof
US20080221724A1 (en) * 2007-03-09 2008-09-11 Chih-Fu Chung Method For Positioning Reel-To-Reel Flexible Board In Automatic Manufacturing Process
US8178419B2 (en) 2008-02-05 2012-05-15 Twin Creeks Technologies, Inc. Method to texture a lamina surface within a photovoltaic cell
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
US8851356B1 (en) * 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US8964369B2 (en) * 2010-01-26 2015-02-24 Imation Corp. Solid-state mass data storage device
JP5867877B2 (en) 2010-09-21 2016-02-24 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． Electronic textile and method for producing electronic textile
KR101058697B1 (en) * 2010-12-21 2011-08-22 삼성전기주식회사 Mounting structure of ciruit board having thereon multi-layered ceramic capacitor, method thereof, land pattern of circuit board for the same, packing unit for multi-layered ceramic capacitor taped horizontally and aligning method thereof
JP5209750B2 (en) * 2011-03-07 2013-06-12 ファナック株式会社 Encoder
US9048309B2 (en) * 2012-07-10 2015-06-02 Applied Materials, Inc. Uniform masking for wafer dicing using laser and plasma etch
US8934215B2 (en) * 2012-07-20 2015-01-13 Samsung Electro-Mechanics Co., Ltd Laminated chip electronic component, board for mounting the same, and packing unit thereof
WO2014028349A1 (en) * 2012-08-15 2014-02-20 Gtat Corporation Bonding of thin lamina
CN104349575B (en) * 2013-07-31 2017-12-26 鹏鼎控股(深圳)股份有限公司 Flexible PCB and preparation method thereof
CN109273622B (en) 2013-08-06 2021-03-12 株式会社半导体能源研究所 Stripping method
TWI705861B (en) * 2013-08-30 2020-10-01 日商半導體能源研究所股份有限公司 Support supply apparatus and method for supplying support
TWI663722B (en) 2013-09-06 2019-06-21 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing light-emitting device
JP6513929B2 (en) 2013-11-06 2019-05-15 株式会社半導体エネルギー研究所 Peeling method
CN103831342A (en) * 2014-03-05 2014-06-04 艾柯豪博（苏州）电子有限公司 Roll-to-roll insulating varnish printing process of stamping parts
US10204737B2 (en) 2014-06-11 2019-02-12 Avx Corporation Low noise capacitors
US9799829B2 (en) 2014-07-25 2017-10-24 Semiconductor Energy Laboratory Co., Ltd. Separation method, light-emitting device, module, and electronic device
JP6774185B2 (en) * 2015-01-21 2020-10-21 太陽インキ製造株式会社 Laminated structure and printed wiring board
CN106144689B (en) * 2015-04-17 2018-08-21 上海旭恒精工机械制造有限公司 Tablet attitude adjusting method
CN106144692B (en) * 2015-04-17 2018-03-02 上海旭恒精工机械制造有限公司 Tablet attitude updating device
US10259207B2 (en) 2016-01-26 2019-04-16 Semiconductor Energy Laboratory Co., Ltd. Method for forming separation starting point and separation method
US10804407B2 (en) 2016-05-12 2020-10-13 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus and stack processing apparatus
CN107504920B (en) * 2017-06-22 2024-03-08 石家庄铁道大学 Slope model slip measuring device based on optical fiber sensing
CN108231651B (en) * 2017-12-26 2020-02-21 厦门市三安光电科技有限公司 Micro-component transfer device and transfer method
CN108962761A (en) * 2018-06-05 2018-12-07 信利半导体有限公司 A kind of COF preparation method
US11357111B2 (en) * 2018-08-27 2022-06-07 Tactotek Oy Method for manufacturing a multilayer structure with embedded functionalities and related multilayer structure
JP2020179909A (en) * 2019-04-26 2020-11-05 三井金属計測機工株式会社 Carrier tape connecting method and carrier tape
CN111315118A (en) * 2020-04-02 2020-06-19 江西兆信精密电子有限公司 Electronic contest pen electronic keyboard circuit board and preparation method thereof
CN113189474B (en) * 2021-04-26 2023-06-16 厦门理工学院 Flexible circuit board roll-to-roll light board testing device and method
CN117042342B (en) * 2023-10-08 2023-12-26 四川英创力电子科技股份有限公司 Multilayer circuit board laminating equipment and using method thereof

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JPS5890753A (en) * 1981-11-25 1983-05-30 Nec Corp Tape connecting method
DE10050797A1 (en) * 2000-10-13 2002-04-25 Daimler Chrysler Ag Device for making a conductive connection of foil cable ends with anisotropic conductive glues e.g. for motor vehicle, has two plastic support halves, guiders for positioning cable ends and fasteners to keep the ends in a joined position.
US20030179552A1 (en) * 2002-03-13 2003-09-25 Mitsui Mining & Smelting Co., Ltd. Printed circuit board and method of producing the same
US20040069112A1 (en) * 2002-07-09 2004-04-15 Jun Onoshiro Machine for punching out electronic circuitry parts, method for replacing tape supply reels, and method for producing electronic circuitry parts from tape
US20040094451A1 (en) * 2002-11-15 2004-05-20 Matsushita Electric Industrial Co., Ltd. Electron part supplying tape and electron part supplying tape connecting method
WO2004066694A1 (en) * 2003-01-23 2004-08-05 Toray Industries, Inc. Member for circuit board, method for manufacturing circuit board, apparatus for manufacturing circuit board

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JPH039657A (en) 1989-06-07 1991-01-17 Hitachi Ltd Image read processing device
JPH0497755U (en) * 1991-01-21 1992-08-24
JPH05286034A (en) * 1992-04-16 1993-11-02 Fuji Xerox Co Ltd Method and apparatus for bonding sheets by ultrasonic welding
JP3780710B2 (en) * 1997-09-03 2006-05-31 松下電器産業株式会社 Method for manufacturing flexible element substrate and apparatus for manufacturing the same
JP2000025709A (en) 1998-07-13 2000-01-25 Hitachi Ltd Production of semiconductor device, and carrier tape and semiconductor production device used therein
JP4090467B2 (en) * 2002-05-13 2008-05-28 三井金属鉱業株式会社 Flexible printed circuit board for chip-on-film
KR100536897B1 (en) 2003-07-22 2005-12-16 삼성전자주식회사 Connecting structure and method of circuit substrate

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5890753A (en) * 1981-11-25 1983-05-30 Nec Corp Tape connecting method
DE10050797A1 (en) * 2000-10-13 2002-04-25 Daimler Chrysler Ag Device for making a conductive connection of foil cable ends with anisotropic conductive glues e.g. for motor vehicle, has two plastic support halves, guiders for positioning cable ends and fasteners to keep the ends in a joined position.
US20030179552A1 (en) * 2002-03-13 2003-09-25 Mitsui Mining & Smelting Co., Ltd. Printed circuit board and method of producing the same
US20040069112A1 (en) * 2002-07-09 2004-04-15 Jun Onoshiro Machine for punching out electronic circuitry parts, method for replacing tape supply reels, and method for producing electronic circuitry parts from tape
US20040094451A1 (en) * 2002-11-15 2004-05-20 Matsushita Electric Industrial Co., Ltd. Electron part supplying tape and electron part supplying tape connecting method
WO2004066694A1 (en) * 2003-01-23 2004-08-05 Toray Industries, Inc. Member for circuit board, method for manufacturing circuit board, apparatus for manufacturing circuit board
EP1589796A1 (en) * 2003-01-23 2005-10-26 Toray Industries, Inc. Member for circuit board, method for manufacturing circuit board, apparatus for manufacturing circuit board

Non-Patent Citations (2)

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Title
CHOOI KON HING: "METHOD OF JOINING TWO COMPONENT TAPE REELS", MOTOROLA TECHNICAL DEVELOPMENTS, MOTOROLA INC. SCHAUMBURG, ILLINOIS, US, vol. 41, May 2000 (2000-05-01), pages 34 - 35, XP001096648, ISSN: 0887-5286 *
See also references of WO2006038496A1 *

Also Published As

Publication number Publication date
KR20070063568A (en) 2007-06-19
TW200629999A (en) 2006-08-16
JPWO2006038496A1 (en) 2008-05-15
WO2006038496A1 (en) 2006-04-13
CN101036422B (en) 2010-04-14
US20080259575A1 (en) 2008-10-23
CN101036422A (en) 2007-09-12
EP1814369A1 (en) 2007-08-01

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