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Publication numberUS1254987 A
Publication typeGrant
Publication dateJan 29, 1918
Filing dateOct 15, 1917
Priority dateOct 15, 1917
Publication numberUS 1254987 A, US 1254987A, US-A-1254987, US1254987 A, US1254987A
InventorsHugh S Cooper
Original AssigneeCooper Res Company
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Alloy.
US 1254987 A
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Description  (OCR text may contain errors)

and is much harder than STATES {PATENT OFFICE.

BOOK 8. COOPER. O1 CLEVELAND, OHIO, ASSIGNOB TO THE COOPER RESEARCH COMPANY, OF CLEVELAND, OHIO, A CORPORATION.

5 of Ohio, have invented certain new and use ful Improvements in' Alloys, of which the following is a specification.

This invention relates to an improved alloy, comprising aluminum and beryllium.

n and my ob ect is to combine these metals in suitable proportions to provide an alloy of superior properties and characteristics compared with other light-weight metal alloys m use or known at t e present time.

5 In the periodic table, beryllium is classed with several other metals, among which are the light metals magnesium and calcium. In appearance it, is of a silvery color, and is permanent in air. It. is very ductile and n malleable. and-the melting point'which is about 1500 C. is very high for a metal of this class. It is slightly heavier than magnesium with a specific gravity of about 1.80. It is not aflected by water, either hot orcold, aluminum, calcium or magnesium.

The most'common mineral containing this metal is beryl which contains about twelve per cent.- of the oxid and is a silicate of this 0 metal with aluminum. This mineral is quite widely distributed throughout the world and isfound in large amounts in the Eastern States 'of this-country where it occurs in massive crystals of several hundred pounds in wei ht. r To 0 tain alloys of this metal with aluminum at a relatively low cost commercially one procedure is to subject to the action oi an electric current a bath containing the mixed oxide of aluminum and beryllium, which are held in solution, said bathbeing of course a conducting medium, and inithis manner obtain an alloy of the two me'tals at a much lower cost than if'salts of these two metals were first separated by chemical means, the metals then extractedand melted.

to ther to make the alloys ahere the method employed in the extraction of beryllium is expensive, I prefer I to make the alloy of preponderating amounts of aluminum and lesser amounts of beryllium, usmgsueh relatively amounts ALLOY.

' 1,254,987.- n at letter! nt- Patented Jan. 29, 1918.

no Drawing. lppllcatlonflledoctobcr 15, 1911. Serial No. 190,592.

of beryllium as will impart to aluminum sufliclent valuable properties as to justify the production of this alloy on a commercial scale. \Vhere the method permits the production of beryllium at a low cost, an allo made of a preponderating amount of bcry lium is preferred, 'such alloy being much lighter in weight for one thin than an alloy having a lower percentage of eryllium.

An alloy prepared by melting together the two metals named is much stronger than certain limits the alloy is ductile and malleable, and may be drawn, rolled or pressed into various products.

I have found that small amounts of this element, say from one to five per cent., combined with aluminum, greatly increases the tensile strength of aluminum, even beyond that obtained with magnesium; and by increasing these amounts it ispossible to retain this strength and at the same time produce alloys variably lighter than aluminum,

depending upon the amount of beryllium contained.

Undera high cost of beryllium, it is advisable to use from one per cent. to about twenty per cent., beryllium, with the balance aluminum. However, alloys with preponderating amounts of beryllium, say from sixty-five per cent. to about ninety-nine per cent. will prove even more valuable commercially where the cost is reduced, bein much lighter than the former alloys an from twenty per cent. to thirty per cent. lighter than aluminum.

What I claim is: 1. An alloy composed of the metals aluminum and beryllium.

. 2. An alloy, comprising aluminum and pine per cent, to ninety-nine per cent. beryl- 3. An alloy comprising be llium and a metal in the class embracing ,ummum.

4. An alloy possessing greater strength 6. An alloy, composed of one to twenty and less weight than aluminum, comprising per cent. beryllium, with. the balancenlu- 1 aluminum and beryllium, the aluminunabeminum. ing in preponde'rating amount. Signed at Cleveland, in the county of 5 5. An alloy which 1s stronger, harder and Cuyahoga and State of Ohio, this 10th day of lighter weight than aluminum, consisting of October, 1917.

of a uminum and less than sixty-five per cent. beryllium. HUGH S. COOPER.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US2565768 *Apr 2, 1948Aug 28, 1951United States Steel CorpAluminum coating of ferrous metal and resulting product
US3150968 *Nov 2, 1962Sep 29, 1964Brush Beryllium CoIntermetallic compositions and bodies
US3199979 *Oct 27, 1961Aug 10, 1965William F Jobbins IncAluminum base casting alloys and method
US3337334 *Dec 6, 1963Aug 22, 1967Lockheed Aircraft CorpBeryllium-aluminum alloy
US5994777 *Aug 26, 1998Nov 30, 1999Micron Technology, Inc.Method and support structure for air bridge wiring of an integrated circuit
US6190060Jul 13, 1998Feb 20, 2001Nidec Copal CorporationIncreased focal plane shutter speeds.
US6312534 *Nov 14, 1997Nov 6, 2001Brush Wellman, Inc.High strength cast aluminum-beryllium alloys containing magnesium
US6502296Jan 9, 2001Jan 7, 2003Copal Company LimitedMethod of fabricating a light-shielding blade composed of beryllium-aluminum alloy
US6509590Jul 20, 1998Jan 21, 2003Micron Technology, Inc.Aluminum-beryllium alloys for air bridges
US6717191Jan 21, 2003Apr 6, 2004Micron Technology, Inc.Aluminum-beryllium alloys for air bridges
US6943090Apr 6, 2004Sep 13, 2005Micron Technology, Inc.Aluminum-beryllium alloys for air bridges
US6995470Feb 25, 2004Feb 7, 2006Micron Technology, Inc.Multilevel copper interconnects with low-k dielectrics and air gaps
US7067421Nov 24, 2003Jun 27, 2006Micron Technology, Inc.Multilevel copper interconnect with double passivation
US7262505Aug 30, 2004Aug 28, 2007Micron Technology, Inc.Selective electroless-plated copper metallization
US7300821Aug 31, 2004Nov 27, 2007Micron Technology, Inc.Integrated circuit cooling and insulating device and method
US7304380Jul 7, 2006Dec 4, 2007Micron Technology, Inc.Integrated circuit cooling and insulating device and method
US7335965Sep 1, 2004Feb 26, 2008Micron Technology, Inc.Packaging of electronic chips with air-bridge structures
US7387912Aug 31, 2005Jun 17, 2008Micron Technology, Inc.Packaging of electronic chips with air-bridge structures
US7402516Jul 12, 2006Jul 22, 2008Micron Technology, Inc.Method for making integrated circuits
US7485497Oct 25, 2007Feb 3, 2009Micron Technology, Inc.Integrated circuit cooling and insulating device and method
US7492042Oct 25, 2007Feb 17, 2009Micron Technology, Inc.Integrated circuit cooling and insulating device and method
Classifications
U.S. Classification420/528, 109/85, 89/36.2, 420/401, 205/364
Cooperative ClassificationC22C21/00