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Publication numberUS1379050 A
Publication typeGrant
Publication dateMay 24, 1921
Filing dateJul 24, 1918
Priority dateJul 24, 1918
Publication numberUS 1379050 A, US 1379050A, US-A-1379050, US1379050 A, US1379050A
InventorsLouis Schulte
Original AssigneeDu Pont
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Nickel-plating solution
US 1379050 A
Abstract  available in
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Claims  available in
Description  (OCR text may contain errors)

LQUIS SCETYLTE, OFPIT'ISBUBGH, PENNSYLVANIA, ASSIGNOR NEMOURS & COMPANY, 01? WILMINGTON, DELAWARE, A CORPORATION 01? nnnawann.

NICKEL-PLATING SOLUTION.

No Drawing.

To all '21. 710123. it may concern:

Be it known that 1, Louis sorrows, of Pittsburgh, in the county of Allegheny and in the the State of Pennsylvania, have invented a certain new and useful Improvement in Nickel-Plating Solutions, and do hereby declare that the following is a full, clear, and exact description thereof.

The object of my invention is to provide a solution suitable for the electrodeposition of nickel plate, which solution, although capable of general application, is particularly adapted for depositing nickel upon a highly polished nickel surface.

A. further object of the invention is to provide such a solution which will produce a soft, bright and flexible nickel coating, and by means of which the plating operation may be carried out in a relatively short time, and having high current activity.

Further objects and advantages of the invention will be in part obvious and in part specificall mentioned in the description contained hereinafter, in which I have disclosed one embodiment of my invention, which embodiment however, is to be considered merely as illustrative of its principle.

l have found it to be advantageous to employ an alkali salt, such as sulfate of sodium in combination with the nickel containing ingredients of the solution, inasmuch as the sodium salt gives a good conductivity to the solution, thus enabling a higher current to be used, and the plating process to be carried out in a shorter time. The sodium salt also aids in the production of a flexible nickel deposit having a bright surface.

The sodium salt is combined in the solution with nickel salts, preferably sulfate of nickel, and a certain amount of double sulfate of nickel and ammonia. It is also ad vantageous to acidify the bath or solution to some extent by the addition of a weak acid, such as acetic acid.

I prefer to make up the solution by com- Speoification of Letters Patent. Patented May 24, 1921.

Application filed July 24, 1918. Serial No. 246,531.

bining the above elements in approximately the proportions stated below:

Sulfate of nickel 17% Double sulfate of nickel and ammonia 1. 4% Sulfate of sodium 8. 5% Acetic acid 2. 2% Water 7O. 9%

The proportions of the ingredients how-- ever may be varied to a considerable extent without producing any detrimental effect in the nickel deposit.

A solution of the character above described will deposit nickel uniformly upon another nickel surface even though said surface be highly polished, and the deposit is substantially without peeling or blistering, and still is soft and bright. Such a solution is particularly useful in plating nickel upon nickel, for instance in the process of renovating press polishing plates, as described in my co-pendin ap lication, Serial Number246,532, filed Ju y 24, 1918.

I claim:

1. A nickel plating solution containing sulfate of sodium and single and double nickel salts.

2. A nickel platin solution containing sulfate of sodium, nic el sulfate, and double sulfate of nickel and ammonia.

3. A nickel platin solution containin approximately 8%: su fate of sodium, an 1520% sulfate of nickel.

4. A nickel plating solution containing approximately 8% sulfate of sodium, 1520% sulfate of nickel, and a relatively small percentage of double sulfate of nickel and ammonia.

5. A nickel plating solution containing sulfate of sodium, single and double nickel salts, and a weak-acid.

6. A nickel platin solution containing sulfate of sodium, nic el sulfate, double sulfata of nickel and ammonia, and a weak aci 7. A nickel plating solution containing approximately 8% sulfate of sodium, 1T. A nickel plating solution containing 1520% sulfate of nickel, and a weak acid. approximately 8% sulfate of sodium, 15 8. A nickel plating solution containing 15-20% sulfate of nickel, and about 2% of approximately 8% sulfate of sodium, acetic acid.

15-20% sulfate of nickel, a relatively small 12. A nickel plating solution containing percentage of double sulfate of nickel and approximately 8% sulfate of sodium,

ammonia, and a weak acid. 1520% sulfate of nickel, a relatively small 20 9. A nickel plating solution containing percentage of doublesulfate of nickel and sulfate of sodium, single and double nickel ammonia, and about 2% of acetic acid.

salts, and acetic acid. In testimony that I claim the foregoing 10. A nickel plating solution containing I have hereunto set my hand.

sulfate of sodium, nickel sulfate, double sulfate of. nickel and ammonia, and acetic acid. LOUIS SCHULTE.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US5647967 *Sep 1, 1994Jul 15, 1997Yamaha Hatsudoki Kabushiki KaishaPlating method for cylinder
Classifications
U.S. Classification205/271
International ClassificationC25D3/12
Cooperative ClassificationC25D3/12
European ClassificationC25D3/12