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Publication numberUS1412743 A
Publication typeGrant
Publication dateApr 11, 1922
Filing dateOct 1, 1921
Priority dateOct 1, 1921
Publication numberUS 1412743 A, US 1412743A, US-A-1412743, US1412743 A, US1412743A
InventorsHerfjord Jacob K
Original AssigneeHerfjord Jacob K
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Spring oiler
US 1412743 A
Abstract  available in
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Claims  available in
Description  (OCR text may contain errors)




srnine OILER.

Specification of Letters Patent.

Patented Apr. 111, 11922.

Application filed October 1, 1921. Serial No. 504,703.

To all whom it may concern:

Be it known that I, JAoon K. HERFJORD, a citizen of the United States, and a resident of Sioux City, in the county of Woodbury and State of Iowa, have invented certa n new and useful Improvements in Spring @11- ers, of which the following is a specificatlon.

My invention aims to provide an improved device for greasing vehicle springs.

Another object of the invention is the pro duction of an improved and simplified device, inexpensive in production and adapted to be readily inserted between ad acent leaves of vehicle springs and inject grease thorebetween.

With these and other objects in view, the invention, consisting in the construction, combination and novel arrangement of parts, will be clearly understood from the following description, reference being had to the accompanying drawings, which form a part of this application and in which like characters of reference indicate corresponding parts throughout the several views, of which:

Fig. l is a plan of a device constructed in accordance with my invention.

Fig. 2 is a side elevation thereof, and

Fig. 3 is a longitudinal section thereof as applied to a vehicle spring.

The device consists of a bar, 4-, preferably flat-sided and formed at one end with a chisel blade, 5, the bar being cut away abruptly to provide shoulders, 6, which abut the edges of the springs, as will presently appear, and adjacent the said shoulders the blade, 5, is formed with flat faces, 7, against which the springs impinge. A distance from its chisel end the bar is provided with a lateral opening, 8, into which is threaded the nipple, 9, of a grease cup of familiar type, and on to the body, 10, of which is screwed the usual cap or cup, 11. The center of the end of the bar, 5, is notched, as at 12, and a longitudinal grease-way, 13, within the bar, 4t, communicates between the openin 8, and the said notch, 12.

Now, in operation it is only necessary to place the edge of the bar, 5, between adjacent leaves of the spring and the blade driven between the said leaves by means of a single blow on the extended end of the bar, l, with a hammer or other suitable tool. T he shoulders, 6, engage the edges of the leaves to prevent the blade from entering too far between the leaves. It will then be clear that by rotating the cap, 11, the grease will be forced through the passage, 13, and thus introduced between the leaves.

Having thus described my invention, what I claim as new and desire to secure by Letters Patent of the United States, is

A greasing device for vehicle leaf springs comprising a bar having a chisel-bladed end to be driven between the leaves, a grease injecting cup including body part having a nipple screwed into the side of the bar, and a cover member in screwthreaded connection with the body, whereby rotation of the cover ejects grease from the nipple, and a greaseway in the bar between the nipple and said bladed end.

In testimony whereof, I have hereunto set my hand this 28th day of September, 1921.


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US2628518 *Jan 14, 1949Feb 17, 1953Frank Mitan EdwardSpring lubricating apparatus
US5897743 *Jan 21, 1997Apr 27, 1999Komatsu Electronic Metals Co., Ltd.Jig for peeling a bonded wafer
US6263941 *Aug 10, 1999Jul 24, 2001Silicon Genesis CorporationNozzle for cleaving substrates
US6513564 *Mar 14, 2001Feb 4, 2003Silicon Genesis CorporationNozzle for cleaving substrates
US6790747Oct 9, 2002Sep 14, 2004Silicon Genesis CorporationMethod and device for controlled cleaving process
US7056808Nov 20, 2002Jun 6, 2006Silicon Genesis CorporationCleaving process to fabricate multilayered substrates using low implantation doses
US7348258Aug 6, 2004Mar 25, 2008Silicon Genesis CorporationMethod and device for controlled cleaving process
US20030113983 *Oct 9, 2002Jun 19, 2003Silicon Genesis CorporationMethod and device for controlled cleaving process
US20030124815 *Nov 20, 2002Jul 3, 2003Silicon Genesis CorporationCleaving process to fabricate multilayered substrates using low implantation doses
US20050070071 *Aug 6, 2004Mar 31, 2005Silicon Genesis CorporationMethod and device for controlled cleaving process
WO2001010644A1 *Aug 1, 2000Feb 15, 2001Silicon Genesis CorporationMethod and apparatus for cleaving a substrate
U.S. Classification81/3.7, 30/168
International ClassificationF16F1/02, F16F1/24
Cooperative ClassificationF16F1/24
European ClassificationF16F1/24