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Publication numberUS1497449 A
Publication typeGrant
Publication dateJun 10, 1924
Filing dateOct 16, 1917
Priority dateOct 16, 1917
Publication numberUS 1497449 A, US 1497449A, US-A-1497449, US1497449 A, US1497449A
InventorsKempton Willard H
Original AssigneeWestinghouse Electric & Mfg Co
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Molded condenser
US 1497449 A
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Description  (OCR text may contain errors)

June 10; 1924.

W. H. KEMPTON MOLDED CONDENSER Original Filed Oct. 16 1.917

lll lil l|||| Illrl'i'lllllllllilll INVENTOR h/fi/a ra. H lfe mpto n A'II'TORNEY gym? SES:

Patented June 10, 1924.




Application filed October 18, 1917, Serial No. 196,923. Renewed October 1, 1920. Serial N'o. 414,139.

To all whom it may concern:

Be it known that I, WILLARD H. KEMPTON, a citizen of the United States, and a resident of Wilkinsburg, in the county of Allegheny and State of Pennsylvania, have invented a new and useful Improvement in Molded Condensers, of which the following is a specification.

My invention relates to electric eondensers, and it has for one of its objects to provide a method of molding condensers whereby molded covers may'lbe applied thereto.

Another object of my invention is to provide a means for preventing melting and loss of impregnating wax during the operation of molding condensercovers.

A further object of my invention is to provide a molded condenser in which the condenser stack and the molded cover may be permitted to expand or contract unequally without damage to the condenser.

A still further object of my" invention is to provide means for uniformly distributing the molding pressure over the entire .rea of the condenser.

In the drawing, Fig. 1 is an elevational view of a condenser in one st of its construction; Fig. 2 is a cross sectional view of the completed condenser structure along a horizontal plane passed through line II-II of Fig. 1.

I have found that covers may be molded upon condensers by applyin terial thereto and then a plying heat and pressure to consolidate and harden the cover, but there is a tendenc for the impregnating wax to become me ted and to be lost at the edges of the condenser structure. I have also found that the molded cover of the condenser tends to crack after the condenser has been completed. My invention provides an improved condexiser structure which effectively remedies these defects.

In constructing condensers according to my invention, sheets of conductin material and insulating material are stac ed alternately in the usual manner, and alternate conducting sheets, as sheets 1 and 2 separated by insulating sheets 3, are respectively connected by soldering, or in any other suitable manner, to terminal-lead strips 4 and 5 of opposite polarity. The condenser stack is then impregnated with any suitable impregnating material. After the impregnaa coating mation, a sheet 6, preferably ,of compressible, heat insulating material, as, for example,

asbestos or felt, is wrapped about the conline 10, respectively. The corners of the felt sheet are cut off on a diagonal line, as

shown at 11, and the projecting margins are folded over,-as at 12. For the sake of clearuess in illustration, the upper margin is not shown folded overin Fig. 1, but it is to be understood that, in practice, it is folded in the same manner as the lower mar in, except that it is generally necessary to s it the upper margin before folding, in order to accommodate the terminal-lead strips 4 and 5. Sheet, 6 is now secured in place by tape bands 13 and 14. and a cover 15 of suitable molding material is then m'olded on, by heat and pressure so as to enclose the condenser stack and lead strips 4 and 5 in the molded structure. The sheet 6, acting as a heat-insulating lining for the molded cover 15, serves to prevent the impregnating wax from becoming heated and being melted during the operation of molding the cover. If any portion of the outer surface of the impregnating wax does become softened, the wax is retained in its place by sheet 6. In the event that any portion of the condenser stack is subject to a eater pressure than adjacent portions, durmgthe molding 0 eration, the compressible sheet 6 will ten to distribute the pressure evenly over the entire surface. Sheet 6 permits difi'erent expension and contraction of the cover 15 and the condenser stack, and effectively prevents cracking of the hardened molded cover from this cause, since the sheet can yield sufficiently to accommodate the relative difl'erences in volume which occur throughout the final cooling of the condenser.

Where differences of expansion of the cover and the condenser stack materials are small, sheet 6 may be of paper, duck or other material which is a poor conductor of heat.

It will be seen that by moldin a cover on the condenser staclr, utilizing eat and pressure to consolidate the cover material, I provide means for holding the entire condenser under pressure without the use of clamping arran ements which have hitherto been used to ho d condenser stacks in posiimpregnating die ectric from becoming molten and flowing out of the condenser stack.

While I have illustrated and described a particular construction of condenser, it is to be understood that various changes in the form of the condenser, the materials used and the manner of assembling them may be made by those skilled in the art without departing from the s irit of my invention. My invention is, t BI6f0F6,JlOt to be limited, except by the scope of the appended claims. 7 a a I claim as my invention:

1. A condenser com risin 'a stack formed of alternate sheets oi concl ucting material and insulatin material, a compressible covering there or, and a molded cover.

2. A method of constructing condensers which comprises providing the condenser structures with heat-insulating covers and molding covers thereabout.

3. A method of constructing condensers which comprises assembling alternate sheets of conducting material and insulatin material, impregnating said sheets wit an insulating substance, coveri said im nated structure with a readi g compres s i bi covering and molding a covering about the body thus formed.

4. A method of covering a condenser comprising wrapping fabric about said condom ser and molding a cover upon said wrapped condenser.

5. A condenser comprising a body of alternate sheets of conducting material and insulating material, all imbedded in a suitable insulating material, a felt covering for the body and a molded cover enclosing the body and its felt covering.

6. A condenser comprisin a stack formed of alternate sheets of a con uctin and insulating material and a mo ded cover thereon.

7. A condenser unit consistingof a ri id unitary structure of molded material, an a condenser separate therefrom molded in and held compressed solely by said molded material.

8. A condenser unit consisting of a rigid unitary structure of molded material, and

a previously formed condenser separate therefrom molded in and held compressed solely by said structure.

9. A condenser unit consisting of a rigid unitary cover; structure and a condenser separate therefrom molded in and held com pressed solely-by said structure.

In testimony whereof, I have hereunto subgcribed my name this th day of Oct., 191



Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US2464029 *Apr 7, 1945Mar 8, 1949Gen ElectricMethod of making transformers
US2683766 *Aug 10, 1948Jul 13, 1954Melpar IncMethod of casting electrical device and article produced thereby
US2701392 *Dec 19, 1950Feb 8, 1955Bell Telephone Labor IncMethod of manufacture of incapsulated electrical apparatus
US2704880 *Jan 13, 1948Mar 29, 1955Joseph B BrennanMethod of making a condenser
US2742551 *Jul 27, 1951Apr 17, 1956Kohring Wilbur MPrecision resistances
US2743308 *Dec 19, 1950Apr 24, 1956Bell Telephone Labor IncHousing for electrical apparatus and method of manufacture
US3431473 *Apr 4, 1967Mar 4, 1969Sprague Electric CoEncapsulated capacitor
US4580190 *Dec 7, 1984Apr 1, 1986Illinois Tool Works Inc.Surface mountable electrical package
US4680617 *May 23, 1984Jul 14, 1987Ross Milton IEncapsulated electronic circuit device, and method and apparatus for making same
US4872825 *Jul 13, 1987Oct 10, 1989Ross Milton IMethod and apparatus for making encapsulated electronic circuit devices
US4912595 *Jun 1, 1989Mar 27, 1990Kabushiki Kaisha Route SixSimple high tension capacitor
U.S. Classification361/324, 264/272.18, 174/528, 361/274.1
International ClassificationH01G2/12, H01G2/00
Cooperative ClassificationH01G2/12
European ClassificationH01G2/12