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Publication numberUS1526644 A
Publication typeGrant
Publication dateFeb 17, 1925
Filing dateOct 25, 1922
Priority dateOct 25, 1922
Publication numberUS 1526644 A, US 1526644A, US-A-1526644, US1526644 A, US1526644A
InventorsGeorge H Pinney
Original AssigneeWilliams Brothers Mfg Company
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Process of electroplating and apparatus therefor
US 1526644 A
Abstract  available in
Images(1)
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Claims  available in
Description  (OCR text may contain errors)

Feb. 17. 19.25. 1,526,644

' G. H. \PINNEY PROCESS OF ELECTROPLATING ANDAPPARATUS THEREFOR Filed Oct. 25, 1922 THRIVE) Patented Feb. 17, 1925.

1 UNITED STATES PATENT OFFICE.

GEORGE H. PINNEY, OF SOUTH MANCHESTER, CONNECTICUT, ASSIGNOR TO THE WILLIAMS BROTHERS MANUFACTURING COMPANY, OF GLASTONIBURY, CONNECTL CUT, A CORPORATION OF CONNECTICUT.

PROCESS OF ELECTROPLATING AND APPARATUS THEREFOR.

Application filed October 25, 1922. Serial No. 596,730.

To all whom it may concern Be it known that I, Gnonon H. PINNEY, a citizen of the United States, and a resident of South Manchester, in the county of Hartford and State of Connecticut, have invented a new and Improved Process of Electroplating and Apparatus Therefor, of which the following is a specification.

This invention relates to the electroplating of articles. more especially spoons, forks, and the like, and an object of the invention, among others, is the production of means and of a process whereby different thicknesses of plate may be. applied to articles ina particularly etlicient manner.

A process and apparatus therefor by means of which the objects herein set out, as well as others, may be attained, i's illustrated in the accompanying drawings, in which- The figure is a view in section through a plating tank supplied with apparatus for carrying this invention into effect.

In the use of tableware, such as spoons, forks and the like, the bottoms of the bowls and backs of the curves of the handles are subjected to the greatest wear, and it has, therefore, for a long time, been the practice to supply such articles with a greater thickness of the plating metal at these points. By the use of this invention, illustrated and described herein, means are provided whereby this extra plate may be applied in a particularly eflicient manner, the numeral 5 indicating a tank of ordinary construction 7 containing an electrolyte 6. An article, as

a spoon 7, is suspended within the electrolyte, as from a support 8, this support being suspended from an insulating bar 9. This support is electrically connected with a source of electric energy, as with one pole of a battery 10, and in making this connection I preferably employ a variable resistance 11.

An anode 12 composed, in the usual manner, of the metal that is to be deposited upon the article to be pl'ated, is suspended from a bar 13 and this anode is connected with the opposite pole of the battery 10 from that with which the support 8 is connected, a variable resistance 14 being comprised in the connection between the anode and the battery.

If desired an ammeter 15 may be interposed in the connection between the anode and the battery by means of which the amount of silver being deposited by this anode may be measured.

The apparatus thus far described will deposit the plating material upon the spoons 1n manner common to devices of this kind. but in order to deposit the extra plate I have )rovided the means now to be described.

This improved means comprises a supporting bar 16 of insulating material sccured to the insulating bar 9 and having secured at its lower end an anode housim 17 containing a secondary anode 18. This housing is preferably composed of insulating material and the anode 18 is preferably located within and at some distance from the edge of the open side of the housing. An electrical conductor 19 extends from this housing through a tube 20, this conductor being connected with the opposite pole of the battery 10 from that with which the support 8 is connected, and in making this connection a variable resistance 21 is preferably employed and an ammeter 22 may also be used if desired to measure the amount of silver being deposited from the secondary anode. The resistances 1i and 21 may be so adjusted as to cause either the secondary anode 18 or the primary anode 12 to deposit the plating metal in quantities as may be desired.

\Vhile the ammeters and resistances are illustrated in the drawings herein as forming a part of the apparatus, and with which extremely satisfactory results are obtained, it is not essential to the broad spirit of the invention that such shall be employed, as satisfactory results may be gained without them.

The operation of the device itself will be obvious to those skilled in the art from an inspection of the drawing, it being noted that the metal is simultaneously deposited from the primary and secondary anodes, the housing directing the activities of the secondary anode to the locality desired. This will deposit an extra amount of metal upon the outer surfaces of the bowls of the articles, and while mention is made herein of such an extra coatim of metal on the outer surfaces of the bends at the ends of the handles, devices for doing this are not.

shown in the drawings herein, but when used may be attached to the support 16 and located in a housing similar to. the housing 17, and may be operated simultaneously.

In accordance with the provisions of the patent statutes I have'described the principles of operation of my invention, to gether with the apparatus which I now consider to represent the best embodiment thereof; butI desire to have it understood that the apparatus shown is only illustrative, and that the invention may be carried out by other means.

I claim 1. An electroplating apparatus comprising a .support for an article to be plated, a primary anode, a secondary anode located in active relation to said article, a connection between each of said anodes and a source of electric energy, and a connection between said article and a source of electric energy.

2. An electroplating apparatus comprising a support for an article to be plated, a primary anode, a secondary anode located in active relation to said article, means for directing the activities of the secondary anode with respect to said article, a connection between each of said anodes and a source of electric energy, and a con-. nection between said article and the source of electric energy.

3. An electroplating apparatus comprising a su port for an article to be plated, an anode located in active relation to said article, means for-directing the activity of said anode with res ect to said article, an electrical connection between said anode and a source of electric energy, and an electrical connection between said article and said source of electric energy.

4. An electroplating apparatus comprising a support for an article to be plated,

an electrolyte within which said article is supported, an anode, an insulated housing located within said electrolyte to receive said anode, an electrical connection extending from said housing to a source of electric energy, and a connection between said article and said source of electric energy.

5. An electroplating apparatus compris ing a support for an article to be plated,

a primary anode, a secondary anode located between said article and said primary anode, both of. said anodes being located in active relation with respect to said article, a housing within which said secondary anode is inclosed, said housing being open at one side, an electrical connection between the anode in said housi and a source of electric energy, an electrical connection between the primary anode and the source of electric ener and an electrical connection between sald article and said source of electric energy.

6. An electroplating apparatus comprising a support for an article tobe plated, a primary anode, a secondary anode located in active relation to said article, a connection between each of said anodes and a source of electric energy, one of said connections comprising a variable resistance,

and a connection between said articlev and said source of electric energy.

7. An electroplating apparatus comprising a support for an article to be plated, a primary anode, a secondary anode located in active relation to said article, a connection between each of said anodes and a source of electric energy, and a connection between said article and said source of electric energy, the latter connection embodying a variable resistance. Y

8. An electro lating apparatus comprising a support or an article to be plated, a primary anode and a secondary anode located in active relation to said article, an electrical connection between each of said anodes and a source of electric energy, each of said connections comprising a variable resistance, and a connection between said article and said source of electric energy.

9. The process of plating an article that consists in subjecting said article simultaneously to the plating action of a plu rality of anodes supported in active plating relation to said article.

10. The process of plating an article that consists in subjecting said article simultaneously to the unequal and unrestricted actlon of a primary anode and to the re stricted action of a secondary anode.

11. The process of plating that consists in subjecting an article simultaneously to the unequal and unrestricted action of a primary anode and to the direct restricted action of a secondary anode.

12. The process of electroplating that consists in subjecting an article to the action of an anode confined and directed to a'certain locality upon said article.

13. An electroplating apparatus comprising a support for an article to be plated, means for depositing a plating material upon said article, an anode located in active relation to said article, a connection between said anode and a source of electric energy, and a connection between said article and a source of electric energy.

GEORGE H. PINNEY.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US2472786 *Aug 21, 1943Jun 14, 1949Sylvania Electric ProdMethod of pickling metal contact surfaces
US2696466 *Oct 14, 1949Dec 7, 1954Jr John F BeaverMethod of electroplating
US2739937 *Sep 5, 1952Mar 27, 1956Forestek Clarence WAligned anode apparatus
US2744859 *Feb 20, 1951May 8, 1956Rines Robert HElectroplating method and system
US2847376 *Nov 5, 1954Aug 12, 1958Republic Steel CorpApparatus for electrocleaning welds in internal corners
US3065153 *Oct 15, 1958Nov 20, 1962Gen Motors CorpElectroplating method and apparatus
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Classifications
U.S. Classification205/118, 204/229.9, 205/149, 205/122, 204/230.5, 205/95, 204/DIG.700
International ClassificationC25D17/00
Cooperative ClassificationC25D17/00, Y10S204/07
European ClassificationC25D17/00