Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUS20010005311 A1
Publication typeApplication
Application numberUS 09/741,822
Publication dateJun 28, 2001
Filing dateDec 22, 2000
Priority dateOct 26, 1998
Also published asUS6201695, US6319756, US6449161, US6707673, US20010000684, US20020186539
Publication number09741822, 741822, US 2001/0005311 A1, US 2001/005311 A1, US 20010005311 A1, US 20010005311A1, US 2001005311 A1, US 2001005311A1, US-A1-20010005311, US-A1-2001005311, US2001/0005311A1, US2001/005311A1, US20010005311 A1, US20010005311A1, US2001005311 A1, US2001005311A1
InventorsKevin Duesman, L. Bissey
Original AssigneeDuesman Kevin G., Bissey L. Jan
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat sink for chip stacking applications
US 20010005311 A1
Abstract
A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.
Images(10)
Previous page
Next page
Claims(104)
1. A heat sink for stacked integrated circuits, said heat sink comprising:
at least one heat absorbing section; said heat absorbing section having at least one planar extending element configured to be interposed between stacked integrated circuits;
a heat dissipation section; and,
a heat transfer section interconnecting said heat absorbing section and said heat dissipating section, said heat transfer section having at least one heat transfer element connected to a respective planar extending element.
2. The heat sink of
claim 1
, wherein said heat dissipating section contains a plurality of outwardly extended fins.
3. The heat sink of
claim 2
, wherein said plurality of outwardly extending fins extend the length of said heat dissipating section.
4. The heat sink of
claim 1
, wherein said heat dissipating section contains corrugations.
5. The heat sink of
claim 4
, wherein said corrugations extend along the length of said heat dissipating section.
6. The heat sink of
claim 1
, wherein said heat absorbing section is comprised of a plurality of planar extending elements each configured to be interposed between stacked integrated circuits, and said heat transfer section is comprised of a plurality of heat transfer elements respectively connected to said plurality of planar extending elements.
7. The heat sink of
claim 6
, wherein said heat sink is plurality of planar extending elements extend from opposite sides of said heat dissipating section.
8. The heat sink of
claim 7
, wherein said absorbing section is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
9. The heat sink of
claim 6
, wherein at least one heat transfer element is the same width as at least one of said planar extending elements.
10. The heat sink of
claim 6
, wherein at least one heat transfer element is narrower than at least one of said planar extending elements.
11. The heat sink of
claim 10
, wherein at least one of said plurality of planar extending elements is rectangular.
12. The heat sink of
claim 6
, wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are coplanar.
13. The heat sink of
claim 6
, wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are not coplanar.
14. The heat sink of
claim 13
, wherein said heat dissipating section is orthogonal to said heat absorbing section.
15. The heat sink of
claim 6
, wherein at least one of said heat transfer elements is configured so that in use it is located outside said stacked integrated circuits.
16. The heat sink of
claim 6
, wherein at least one of said heat transfer elements is configured so that in use it is located within said stacked integrated circuits.
17. A heat sink for a stacked integrated circuit, said heat sink comprising:
a first portion configured to be interposed between two stacked integrated circuits; and,
a second portion connected to said first portion for dissipating heat.
18. The heat sink of
claim 17
, wherein said second portion includes a plurality of outwardly extended fins configured to remove heat from said heat sink.
19. The heat sink of
claim 17
, wherein said second portion contains areas of corrugation.
20. The heat sink of
claim 17
, wherein said heat sink is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
21. The heat sink of
claim 17
, wherein said first portion is comprised of a plurality of rectangular elements.
22. The heat sink of
claim 17
, wherein said heat sink is substantially flat.
23. The heat sink of
claim 17
, wherein said heat sink is not substantially flat.
24. The heat sink of
claim 17
, wherein said heat sink is configured so that in use at least of portion of said heat sink is located outside said stacked integrated circuit.
25. The heat sink of
claim 17
, wherein said heat sink is configured so that in use at least of portion of said heat sink is located within said stacked integrated circuit.
26. A method of removing heat from stacked integrated circuits, said method comprising:
providing at least one heat absorbing section; said heat absorbing section having at least one planar extending element interposed between stacked integrated circuits;
providing a heat dissipation section; and,
providing a heat transfer section interconnecting said heat absorbing section and said heat dissipating section, said heat transfer section having at least one heat transfer element connected to a respective planar extending element.
27. The method of
claim 26
, wherein said heat dissipating section contains a plurality of outwardly extended fins.
28. The method of
claim 27
, wherein said plurality of outwardly extending fins extend the length of said heat dissipating section.
29. The method of
claim 26
, wherein said heat dissipating section contains corrugations.
30. The method of
claim 29
, wherein said corrugations extend along the length of said heat dissipating section.
31. The method of
claim 26
, wherein said heat absorbing section is comprised of a plurality of planar extending elements each configured to be interposed between stacked integrated circuits, and said heat transfer section is comprised of a plurality of heat transfer elements respectively connected to said plurality of planar extending elements.
32. The method of
claim 31
, wherein said plurality of planar extending elements extend from opposite sides of said heat dissipating section.
33. The method of
claim 32
, wherein said heat absorbing section is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
34. The method of
claim 31
, wherein at least one heat transfer element is the same width as at least one of said planar extending elements.
35. The method of
claim 31
, wherein at least one heat transfer element is narrower than at least one of said planar extending elements.
36. The method of
claim 35
, wherein at least one of said plurality of planar extending elements is rectangular.
37. The method of
claim 31
, wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are coplanar.
38. The method of
claim 31
, wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are not coplanar.
39. The method of
claim 38
, wherein said heat dissipating section is orthogonal to said heat absorbing section.
40. The method of
claim 31
, wherein at least one of said heat transfer elements is configured so that in use it is located outside said stacked integrated circuits.
41. The method of
claim 31
, wherein at least one of said heat transfer elements is configured so that in use it is located within said stacked integrated circuits.
42. A method for removing heat from a stacked integrated circuit, said method comprising:
providing a heat sink having a first portion configured to be interposed between two stacked integrated circuits and a second portion connected to said first portion for dissipating heat.
43. The method of
claim 42
, wherein said second portion includes a plurality of outwardly extended fins configured to remove heat from said heat sink.
44. The method of
claim 42
, wherein said second portion contains areas of corrugation.
45. The method of
claim 42
, wherein said heat sink is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
46. The method of
claim 42
, wherein said first portion is comprised of a plurality of rectangular elements.
47. The method of
claim 42
, wherein said heat sink is substantially flat.
48. The method of
claim 42
, wherein said heat sink is not substantially flat.
49. The method of
claim 42
, wherein said heat sink is configured so that in use at least of portion of said heat sink is located outside said stacked integrated circuits.
50. The method of
claim 42
, wherein said heat sink is configured so that in use at least of portion of said heat sink is located within said stacked integrated circuits.
51. A memory module comprising a printed circuit board mounting memory devices, wherein said printed circuit board comprises a heat sink for stacked integrated circuits, wherein said heat sink comprises:
at least one heat absorbing section; said heat absorbing section having at least one planar extending element configured to be interposed between stacked integrated circuits;
a heat dissipation section; and,
a heat transfer section interconnecting said heat absorbing section and said heat dissipating section, said heat transfer section having at least one heat transfer element connected to a respective planar extending element.
52. The memory module of
claim 51
, wherein said heat dissipating section contains a plurality of outwardly extended fins.
53. The memory module of
claim 52
, wherein said plurality of outwardly extending fins extend the length of said heat dissipating section.
54. The memory module of
claim 51
, wherein said heat dissipating section contains corrugations.
55. The memory module of
claim 54
, wherein said corrugations extend along the length of said heat dissipating section.
56. The memory module of
claim 51
, wherein said heat absorbing section is comprised of a plurality of planar extending elements each configured to be interposed between stacked integrated circuits, and said heat transfer section is comprised of a plurality of heat transfer elements respectively connected to said plurality of planar extending elements.
57. The memory module of
claim 56
, wherein said heat sink is plurality of planar extending elements extend from opposite sides of said heat dissipating section.
58. The memory module of
claim 57
, wherein said heat absorbing section is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
59. The memory module of
claim 56
, wherein at least one heat transfer element is the same width as at least one of said planar extending elements.
60. The memory module of
claim 56
, wherein at least one heat transfer element is narrower than at least one of said planar extending elements.
61. The memory module of
claim 60
, wherein at least one of said plurality of planar extending elements is rectangular.
62. The memory module of
claim 56
, wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are coplanar.
63. The memory module of
claim 56
, wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are not coplanar.
64. The memory module of
claim 63
, wherein said heat dissipating section is orthogonal to said heat absorbing section.
65. The memory module of
claim 56
, wherein at least one of said heat transfer elements is configured so that in use it is located outside said stacked integrated circuits.
66. The memory module of
claim 56
, wherein at least one of said heat transfer elements is configured so that in use it is located within said stacked integrated circuits.
67. A memory module for a stacked integrated circuit, said memory module comprising:
a heat sink including a first portion configured to be interposed between two stacked integrated circuits and a second portion connected to said first portion for dissipating heat.
68. The memory module of
claim 67
, wherein said second portion includes a plurality of outwardly extended fins configured to remove heat from said heat sink.
69. The memory module of
claim 67
, wherein said second portion contains areas of corrugation.
70. The memory module of
claim 67
, wherein said heat sink is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
71. The memory module of
claim 67
, wherein said first portion is comprised of a plurality of rectangular elements.
72. The memory module of
claim 67
, wherein said heat sink is substantially flat.
73. The memory module of
claim 67
, wherein said heat sink is not substantially flat.
74. The memory module of
claim 67
, wherein said heat sink is configured so that in use at least of portion of said heat sink is located outside said stacked integrated circuits.
75. The memory module of
claim 67
, wherein said heat sink is configured so that in use at least of portion of said heat sink is located within said stacked integrated circuits.
76. An electronic system comprising a printed circuit board mounting electronic devices, wherein said printed circuit board comprises a heat sink for stacked integrated circuits, wherein said heat sink comprises:
at least one heat absorbing section; said heat absorbing section having at least one planar extending element configured to be interposed between stacked integrated circuits;
a heat dissipation section; and,
a heat transfer section, wherein said heat transfer section is comprised of at least one heat transfer element coupled to said heat absorbing section.
77. The system of
claim 76
, wherein said heat dissipating section contains a plurality of outwardly extended fins.
78. The system of
claim 77
, wherein said plurality of outwardly extending fins extend the length of said heat dissipating section.
79. The system of
claim 76
, wherein said heat dissipating section contains corrugations.
80. The system of
claim 79
, wherein said corrugations extend along the length of said heat dissipating section.
81. The system of
claim 76
, wherein said heat absorbing section is comprised of a plurality of planar extending elements each configured to be interposed between stacked integrated circuits, and said heat transfer section is comprised of a plurality of heat transfer elements respectively connected to said plurality of planar extending elements.
82. The system of
claim 81
, wherein said heat sink is plurality of planar extending elements extend from opposite sides of said heat dissipating section.
83. The system of
claim 82
, wherein said heat absorbing section is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
84. The system of
claim 81
, wherein at least one heat transfer element is the same width as at least one of said planar extending elements.
85. The system of
claim 81
, wherein at least one heat transfer element is narrower than at least one of said planar extending elements.
86. The system of
claim 85
, wherein at least one of said plurality of planar extending elements is rectangular.
87. The system of
claim 81
, wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are coplanar.
88. The system of
claim 81
, wherein said heat absorbing section, said heat transfer section, and said heat dissipating section are not coplanar.
89. The system of
claim 88
, wherein said heat dissipating section is orthogonal to said heat absorbing section.
90. The system of
claim 81
, wherein at least one of said heat transfer elements is configured so that in use it is located outside said stacked integrated circuits.
91. The system of
claim 81
, wherein at least one of said heat transfer elements is configured so that in use it is located within said stacked integrated circuits.
92. An electronic system comprising a printed circuit board mounting electronic devices, wherein said printed circuit board comprises a heat sink for a stacked integrated circuit, wherein said heat sink comprises a first portion configured to be interposed between two stacked integrated circuits and a second portion connected to said first portion for dissipating heat.
93. The system of
claim 92
, wherein said second portion includes a plurality of outwardly extended fins configured to remove heat from said heat sink.
94. The system of
claim 92
, wherein said second portion contains areas of corrugation.
95. The system of
claim 92
, wherein said heat sink is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked integrated circuits.
96. The system of
claim 92
, wherein said first portion is comprised of a plurality of rectangular elements.
97. The system of
claim 92
, wherein said heat sink is substantially flat.
98. The system of
claim 92
, wherein said heat sink is not substantially flat.
99. The system of
claim 92
, wherein said heat sink is configured so that in use at least of portion of said heat sink is located outside said stacked integrated circuits.
100. The system of
claim 92
, wherein said heat sink is configured so that in use at least of portion of said heat sink is located within said stacked integrated circuits.
101. A memory module comprising a printed circuit board having at least a first side and a second side each mounting stacked integrated circuits, wherein said printed circuit board comprises at least a first heat sink for removing heat from stacked integrated circuits mounted on said first side and a second heat sink for removing heat from stacked integrated circuits mounted on said second side, wherein at least one of said first and second heat sinks comprises:
at least one heat absorbing section; said heat absorbing section having at least one planar extending element configured to be interposed between stacked integrated circuits;
a heat dissipation section; and,
a heat transfer section interconnecting said heat absorbing section and said heat dissipating section, said heat transfer section having at least one heat transfer element connected to a respective planar extending element.
102. The memory module of
claim 101
, wherein at least one first heat sink is connected to at least one second heat sink.
103. An electronic system comprising a printed circuit board having at least a first side and a second side each mounting stacked integrated circuits, wherein said printed circuit board comprises at least a first heat sink for removing heat from stacked integrated circuits mounted on said first side and a second heat sink for removing heat from stacked integrated circuits mounted on said second side, wherein at least one of said first and second heat sinks comprises:
at least one heat absorbing section; said heat absorbing section having at least one planar extending element configured to be interposed between stacked integrated circuits;
a heat dissipation section; and,
a heat transfer section, wherein said heat transfer section is comprised of at least one heat transfer element coupled to said heat absorbing section.
104. The system of
claim 103
, wherein at least one first heat sink is connected to at least one second heat sink.
Description
    BACKGROUND OF THE INVENTION
  • [0001]
    1. Field of the Invention
  • [0002]
    The present invention relates to the field of integrated circuits. More particularly, the invention provides a heat sink for use with stacks of integrated circuits.
  • [0003]
    2. Description of the Related Art
  • [0004]
    As computer manufacturers have attempted to build more powerful machines, the use of chip stacks in modern computing applications has become increasingly desirable. The term ‘chips’ used with the present invention is intended to include any packaged integrated circuit device including processing devices e.g. microprocessors etc., memory devices e.g. DRAMS, SRAMS, etc., and the like. In essence, a chip stack comprises multiple integrated circuit packages which are stacked together (back-to-front or back-to-back). The chip stacks may be oriented either in face up position or in a side-to-side orientation with chip edges down.
  • [0005]
    There are a number of advantages to the chip stack configuration over conventional single chip mounting arrangements. In particular, the chip stacks provide a more compact circuit arrangement for computers and other high speed electronic systems.
  • [0006]
    In addition, chip stacks particularly allow for more efficient use of space on circuit boards. The stack takes advantage of relatively less valuable space above the circuit board, while at the same time leaving a small footprint on a circuit board or card, thereby increasing the space available for other components or chip stacks.
  • [0007]
    While there are numerous advantages to a stacked chip configuration, there are also associated problems. Specifically, larger and larger chip stacks create unique cooling problems. Because the chip stacks contain multiple chips, they generate more heat per unit volume, requiring greater heat dissipation, while at the same time providing significantly smaller surface areas which may be used as a heat sink. In view of this problem, the general response in the industry to the need for cooling chip-stacks has been to immerse the entire chip-stack in liquid or to operate at greatly reduced power levels. This is often an unwelcome solution because of technical concerns and also because of customer and user preferences.
  • SUMMARY OF THE INVENTION
  • [0008]
    The present invention is generally directed at providing a relatively low cost heat sink for dissipating heat generated within chip stacks (sometimes referred to as ‘chip cubes’, although a cubic structure is not necessary). The invention provides a heat absorbing surface between at least a first and second chip within a chip stack which is connected to a heat dissipating surface located outside the stack. According to a preferred embodiment, the heat sink includes one or more heat absorbing sections for respective insertion between chips within one or more chip stacks; a heat transfer section for transferring heat away from the absorbing sections; and a heat dissipating section for commonly dissipating heat transferred from the heat absorbing sections.
  • [0009]
    These and other features and advantages of the invention will become more readily apparent from the following detailed description of preferred embodiments of the invention which are provided in connection with the accompanying drawings.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0010]
    [0010]FIG. 1 is a plan view of a heat sink of a first embodiment of the invention.
  • [0011]
    [0011]FIG. 2 is a side view of the heat sink shown in FIG. 1.
  • [0012]
    [0012]FIG. 3 is a perspective view of the heat sink of FIG. 1 secured to chips on a chip mounting surface.
  • [0013]
    [0013]FIG. 4 is a side view of the heat sink configuration shown in FIG. 3.
  • [0014]
    [0014]FIG. 5 is a side view of a first alternative heat sink configuration of the invention.
  • [0015]
    [0015]FIG. 6 is a side view of a second alternative heat sink configuration of the invention.
  • [0016]
    [0016]FIG. 7 is a side view of a third alternative heat sink configuration of the invention.
  • [0017]
    [0017]FIG. 8 is a perspective view of a preferred embodiment of the invention.
  • [0018]
    [0018]FIG. 9 is a perspective view of a fourth alternative embodiment of the invention.
  • [0019]
    [0019]FIG. 10 is a perspective view of a fifth alternative embodiment of the invention.
  • [0020]
    [0020]FIG. 11 is a perspective view of a sixth alternative embodiment of the invention.
  • [0021]
    [0021]FIG. 12 is a perspective view of a second preferred embodiment of the invention.
  • [0022]
    [0022]FIG. 13 is a sideview of the second preferred embodiment shown in FIG. 12.
  • [0023]
    [0023]FIG. 14 is a side view of an alternative embodiment of the second preferred embodiment shown in FIGS. 12 and 13.
  • [0024]
    [0024]FIG. 15 is a block diagram of a processor system in which the invention may be utilized.
  • DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
  • [0025]
    Referring to FIG. 1, a planar heat sink 20 in accordance with a preferred embodiment of the invention will now be described. Heat sink 20 is shown including three interconnected co-planar sections: a heat absorbing section 22, a heat transfer section 24, and a heat dissipating section 26. FIG. 2 is a side view of heat sink 20 showing the relative lateral dimensions of the heat absorbing section 22, heat transfer section 24, and heat dissipating section 26.
  • [0026]
    Heat absorbing section 22 includes one or more fingers 22 a-22 h, each of which is configured to be insertable between chips of a chip stack. Heat transfer section 24 includes heat transfer elements 24 a-24 h. The fingers 22 a-22 h remove heat from the chip stack, which flows through respective heat transfer sections 24 a-24 h to dissipation section 26. Preferably, fingers 22 a-22 h are of a generally rectangular shape and sized to maximize heat absorption from a target chip's surface. As shown in FIG. 1, the width of the fingers 22 a-22 h is larger than the width of the heat transfer elements 24 a-24 h. Alternatively, the width of the fingers 22 a-22 h may be the same, narrower or wider than the width of the heat transfer elements 24 a-24 h.
  • [0027]
    Preferably, heat sink 20 is comprised of a thermally conductive material having a thermal rate of expansion approximately equal to the thermal expansion rate of the stacked chips. In accordance with a preferred embodiment, heat sink 20 is comprised of a metal such as aluminum or copper and may be easily stamped out of plate metal. In alternative embodiments, it is possible for each of the three sections of heat sink 20 to be formed of different materials in accordance with each section's functional constraints.
  • [0028]
    With reference to FIGS. 3, 4, and 8, heat sink 20 is utilized by placing each heat absorbing finger 22 a-22 h over a first layer chip 30 secured on a mounting surface 28 such as a plug-in board having edge connectors 27. A second layer of chips is then secured over each heat absorbing finger 22 a-22 h. Each finger 22 a-22 h may be affixed to the first and second layer chips 30, 32 using thermally conductivity enhancing mediums such as a thermal paste or epoxy. With reference to FIGS. 3 and 4, heat sink 20 is shown with each finger 22 a-22 h placed over a respective first layer chip 30 with the heat transfer elements 24 a-24 h and heat dissipating section 26 extending away from the location of the chips 30, 32. As shown in FIG. 8, a second layer of chips 32 is provided over the first layer of chips 30 with each respective finger 22 a-22 h positioned between each pair of first and second layer chips 30, 32. As shown, the heat transfer elements 24 a-24 h and heat dissipating section 26 are provided outside the chip stack 33 created by the first and second layers of chips 30, 32. In an alternative embodiment, the heat transfer elements 24 a-24 h may be provide so that at least a portion of the heat transfer elements 24 a-24 h lie within the chip stack 33.
  • [0029]
    With reference to FIGS. 3, 4, and 8, the heat transfer and heat dissipating sections 24, 26 are shown provided coplanar with heat absorbing section 22. As shown in FIGS. 5-7, the heat transfer and heat dissipating sections 24,26 may extend from the heat absorbing section 22 at any angle necessary to take advantage of unused space above and below the chip stack. With reference to FIG. 5, an alternative embodiment is shown in which heat dissipating section 26 is at approximately a 45 degree angle to the heat absorbing section 22. With reference to FIG. 6, an alternative embodiment is shown in which the heat dissipating section 26 is orthogonal to the heat absorbing section 22. With reference to FIG. 7, an alternative embodiment is shown in which the heat dissipating section 26 is initially orthogonal to the heat absorbing section 22 and then is bent again be in parallel with the heat absorbing section 22 at a point above the heat absorbing section.
  • [0030]
    With reference to FIG. 9, an alternative embodiment is shown in which the heat dissipating section 26 is comprised of heat dissipating fins 34 in order to further enhance heat dissipation by enlarging the surface area of section 26. With reference to FIG. 10, an additional alternative embodiment is shown in which the heat dissipating section 26 is formed as corrugation waves 36 in order to increase surface area and heat dissipation.
  • [0031]
    With reference to FIG. 11, an alternative embodiment is shown in which heat sink 27 includes a heat dissipating section 26 in thermal contact with a pair of heat transfer sections 24, 25 and a pair of heat absorbing sections 22, 23, which extend along both sides of heat dissipating section 26. As shown in FIG. 11, heat transfer sections 24 and 25 respectively contain heat transfer elements 24 a-24 h and 25 a-25 h, and heat absorbing sections 22 and 23 respectively contain heat absorbing elements 22 a-22 h and 23 a-23 h.
  • [0032]
    With reference to FIGS. 12 and 13, a second preferred embodiment is shown in which a pair of planar heat sinks 37, 39 are used together to dissipate heat from chip stacks 33, 35 positioned on each side of mounting surface 28. Alternatively, as shown in FIG. 14, a single continuous heat sink 41 may be used to dissipate heat from chip stacks 33, 35 positioned on each side of mounting surface 28.
  • [0033]
    One particular environment in which the heat sink of the invention may be used is within a memory module for a processor-based system. In this case, the integrated circuits 30, 32 may be integrated circuit memory devices such as DRAMS, SRAMS, EEPROM, etc. and the mounting surface 28 may be constructed as a plug-in board such as a SIMM (Single In-Line Memory Module), DIMM (Dual In-Line Memory Module), SO-SIMM (Small Outline-Single In-Line Memory Module), SO-DIMM (Small Outline-Dual In-Line Memory Module), RIMM (Rambus In-Line Memory Module) or other plug-in module, for receipt in a system memory socket.
  • [0034]
    A typical processor-based system, which includes the present invention formed as a memory module, is illustrated generally at 640 in FIG. 15. A processor-based system typically includes a processor, which connects through a bus structure with memory modules, which contain data and instructions. The data in the memory modules is accessed during operation of the processor. This type of processor-based system is used in general purpose computer systems and in other types of dedicated processing systems, e.g. radio systems, television systems, GPS receiver systems, telephones and telephone systems to name a few.
  • [0035]
    Referring to FIG. 15, such a processor-based system generally comprises a central processing unit (CPU) 644, e.g. microprocessor, that conmmunicates to at least one input/output (I/O) device 642 over a bus 652. A second (I/O) device 646 is illustrated, but may not be necessary depending upon the system requirements. The processor-based system 640 also may include a static or dynamic random access memory (SRAM, DRAM) 648 in the form of memory modules of the kind described and illustrated above, a read only memory (ROM) 650 which may also be formed in the form of memory modules of the kind described above. The processor-based system may also include peripheral devices such as a floppy disk drive 654 and a compact disk (CD) ROM drive 656, which also communicate with CPU 644 over the bus 652. It must be noted that the exact architecture of the processor-based system 600 is not important and that any combination of processor compatible devices may be incorporated into the system. Each of the memories 648 and 650 may be constructed as plug-in modules employing a heat sink constructed in accordance with the teachings of the invention.
  • [0036]
    The above description and accompanying drawings are only illustrative of preferred embodiments, which can achieve and provide the features and advantages of the present invention. It is not intended that the invention be limited to the embodiments shown and described in detail herein. For instance, the present invention is described only with respect to stack of two chips stacked vertically. Alternatively, the present invention may be used with any number of stacked chips, which may be stacked in a vertical, horizontal, or in side-by-side fashion. Accordingly, the invention is not limited by the foregoing description but is limited only by the spirit and scope of the appended claims.
  • [0037]
    What is claimed as new and desired to be protected by Letters Patent of the United States is:
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7084511 *Mar 27, 2002Aug 1, 2006Nec Electronics CorporationSemiconductor device having resin-sealed area on circuit board thereof
US7268439Jun 6, 2006Sep 11, 2007Nec Electronics CorporationSemiconductor device having resin-sealed area on circuit board thereof
US7692291 *Apr 12, 2002Apr 6, 2010Samsung Electronics Co., Ltd.Circuit board having a heating means and a hermetically sealed multi-chip package
US8338963Nov 29, 2011Dec 25, 2012Tessera, Inc.Multiple die face-down stacking for two or more die
US8633576 *Nov 29, 2011Jan 21, 2014Tessera, Inc.Stacked chip-on-board module with edge connector
US8928153Nov 29, 2011Jan 6, 2015Tessera, Inc.Flip-chip, face-up and face-down centerbond memory wirebond assemblies
US8941999Oct 4, 2013Jan 27, 2015Tessera, Inc.Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
US8952516Oct 23, 2012Feb 10, 2015Tessera, Inc.Multiple die stacking for two or more die
US8970028Dec 29, 2011Mar 3, 2015Invensas CorporationEmbedded heat spreader for package with multiple microelectronic elements and face-down connection
US9013033Jan 15, 2013Apr 21, 2015Tessera, Inc.Multiple die face-down stacking for two or more die
US9093291Oct 21, 2013Jul 28, 2015Tessera, Inc.Flip-chip, face-up and face-down wirebond combination package
US9281266Jan 16, 2014Mar 8, 2016Tessera, Inc.Stacked chip-on-board module with edge connector
US9281295Dec 30, 2014Mar 8, 2016Invensas CorporationEmbedded heat spreader for package with multiple microelectronic elements and face-down connection
US9312239Jan 26, 2015Apr 12, 2016Tessera, Inc.Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
US9312244Feb 9, 2015Apr 12, 2016Tessera, Inc.Multiple die stacking for two or more die
US9437579Apr 17, 2015Sep 6, 2016Tessera, Inc.Multiple die face-down stacking for two or more die
US20020140083 *Mar 27, 2002Oct 3, 2002Nec CorporationSemiconductor device haivng resin-sealed area on circuit board thereof
US20020158330 *Apr 12, 2002Oct 31, 2002Ho-Jeong MoonCircuit board having a heating means and a hermetically sealed multi-chip package
US20060146497 *Dec 30, 2004Jul 6, 2006Intel CorporationHeat exchanger for memory modules
US20060231936 *Jun 6, 2006Oct 19, 2006Nec Electronics CorporationSemiconductor device having resin-sealed area on circuit board thereof
US20120267771 *Nov 29, 2011Oct 25, 2012Tessera, Inc.Stacked chip-on-board module with edge connector
Classifications
U.S. Classification361/703, 257/E23.103
International ClassificationH01L23/367
Cooperative ClassificationH01L23/3672, H01L2924/0002
European ClassificationH01L23/367F
Legal Events
DateCodeEventDescription
Apr 28, 2005FPAYFee payment
Year of fee payment: 4
Apr 22, 2009FPAYFee payment
Year of fee payment: 8
Jun 28, 2013REMIMaintenance fee reminder mailed
Nov 20, 2013LAPSLapse for failure to pay maintenance fees
Jan 7, 2014FPExpired due to failure to pay maintenance fee
Effective date: 20131120