US20010007526A1 - Light emitting diode mounting structure - Google Patents

Light emitting diode mounting structure Download PDF

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Publication number
US20010007526A1
US20010007526A1 US09/766,837 US76683701A US2001007526A1 US 20010007526 A1 US20010007526 A1 US 20010007526A1 US 76683701 A US76683701 A US 76683701A US 2001007526 A1 US2001007526 A1 US 2001007526A1
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Prior art keywords
light emitting
emitting diode
wire
mounting structure
lead
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Granted
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US09/766,837
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US6345902B2 (en
Inventor
Masaya Ohkohdo
Hirokazu Sakata
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Individual
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Individual
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Priority claimed from JP32694198A external-priority patent/JP3807131B2/en
Priority claimed from JP11004434A external-priority patent/JP2000207922A/en
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Priority to US09/766,837 priority Critical patent/US6345902B2/en
Publication of US20010007526A1 publication Critical patent/US20010007526A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
    • B60Q1/2696—Mounting of devices using LEDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
    • B60Q1/30—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating rear of vehicle, e.g. by means of reflecting surfaces
    • B60Q1/305—Indicating devices for towed vehicles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/19—Attachment of light sources or lamp holders
    • F21S43/195—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
    • H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
    • H01R4/2445—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members having additional means acting on the insulation or the wire, e.g. additional insulation penetrating means, strain relief means or wire cutting knives
    • H01R4/245—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members having additional means acting on the insulation or the wire, e.g. additional insulation penetrating means, strain relief means or wire cutting knives the additional means having two or more slotted flat portions
    • H01R4/2454—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members having additional means acting on the insulation or the wire, e.g. additional insulation penetrating means, strain relief means or wire cutting knives the additional means having two or more slotted flat portions forming a U-shape with slotted branches
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/002—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips making direct electrical contact, e.g. by piercing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/05—Two-pole devices
    • H01R33/06—Two-pole devices with two current-carrying pins, blades or analogous contacts, having their axes parallel to each other
    • H01R33/09—Two-pole devices with two current-carrying pins, blades or analogous contacts, having their axes parallel to each other for baseless lamp bulb
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the present invention relates to a light emitting diode mounting structure, and more particularly to a light emitting diode mounting structure that is suitable for application to a vehicular lamp.
  • each of the leads of the light emitting diode is soldered to the printed circuit board individually, the process of mounting the light emitting diode to the board is troublesome, and manufacturing efficiency is poor.
  • the process of removing leads from their positions on the printed circuit board and resoldering leads is complex.
  • the first aspect of a structure according to the present invention has a light emitting diode having a lead, and a metal plate fixed and connected to a wire on an upper housing.
  • the lead engages the metal plate so as to make an electrical connection therewith, and is support thereby.
  • the surface part of the metal plate has a surface area that is capable of reflecting light from the light emitting diode.
  • the above-noted light emitting diode can also have four leads, these leads being engaged with two metal plates that are disposed in proximity.
  • the light emitting diode does not tend to bend over and does not tend to change its direction after mounting. Additionally, because two metal plates are used to mount one light emitting diode, the size of one metal plate can be made small, thereby facilitating manufacture of the metal plates. Additionally, because the two metal plates are in mutual proximity, there is little affect on the rate of usage of the light.
  • the lead can be formed of a metal that has a thermal conductivity that is equivalent to or greater than that of copper.
  • the lead is formed of a metal having a thermal conductivity that is equivalent to or greater than of copper, heat that is generated by the light emitting diode is reliably transmitted via the lead to the metal plate, where it is radiated from the surface part thereof. There is thus an improvement in the heat radiation of the light emitting diode.
  • the wire can be formed by an insulation covering and a center conductor disposed within the insulation cover, and the metal plate can be formed by a foot part that faces the housing, and a cutting groove part that is formed in the end of the foot part.
  • the cutting groove cuts the insulation covering of the wire, and eats thereinto, the effect being that the metal plate comes into a conductive connection with the center conductor, and holds the wire in place.
  • a cutting groove formed in the foot part of the metal plate cuts the insulation covering of the wire and bites into the inside thereof so that an electrical connection is made to the center conductor, the biting force between the cutting groove and the wire also serving to hold the light emitting diode in one operation to the wire. For this reason, it is not necessary to perform a soldering operation to mount the light emitting diode in place, and it easy to replace the light emitting diode. Additionally, because it is possible to use the surface part of the metal plate as a surface for an operator to press with a finger, the operation of pressing the metal plate to press the wire into the cutting groove is facilitated.
  • the surface part of the metal plate can also be a surface that is colored with a metallic coloring.
  • the construction of the second embodiment of the present invention has two light emitting diodes each having a lead, and two metal plates each being connected to a wire on an upper housing.
  • the leads engage with the metal plates so as to make an electrically conductive connection thereto.
  • Each metal plate has a hole for the purpose of connecting a jumper wire between the metal plates.
  • the mounting structure according to the third embodiment has a light emitting diode having a lead, a non-metallic holder that engages with a housing, and a metal connecting member that is mounted to the holder.
  • the connecting member has an integrally formed foot part and clip part.
  • the lead is resiliently grabbed and supported by the clip part.
  • the foot part has at its end a cutting groove that accepts the wire on the housing.
  • the wire is formed by an insulation covering and a center conductor disposed therewithin. When the wire is inserted into the cutting groove, the cutting groove cuts the insulation covering of the wire and bites into the inside thereof, thereby making an electrically conducting connection between the connecting member and the center conductor, and also holding the wire in place.
  • the connecting member that is mounted to a holder engaged with the housing, the connecting member is securely held to the housing. Because the light emitting diode is resiliently grabbed and supported by the clip part of the connecting member, it is held in place with respect to the housing. As a result, the light emitting diode is held securely to the housing, thereby resulting in a stable light axis. Because the light axis of the light emitting diode is stabilized in this manner, there is an improvement in the usage of the light thereof. For this reason, the number of light emitting diodes required to achieve the desired brightness is reduced, thereby simplifying the structure and reducing the cost.
  • the cutting groove formed in the foot part of the connecting member bites into the inside of the wire insulation covering, the biting force between the cutting groove and the wire holds the wire in place with a single operation. Additionally, it is possible to hold the light emitting diode in place by inserting the wire into the clip part, thereby eliminating the need of a soldering operation to hold the lead in place, thereby simplifying the mounting task. This not only improves manufacturing efficiency and enables automation thereof, but also facilitates replacement of the light emitting diode.
  • the light emitting diode can have four leads, the holder can have two neighboring connecting members mounted to it, and each connecting member can have two clip parts. It is also possible for each of the connecting members to have two cutting grooves. The four leads are each grabbed and supported by the clip parts.
  • the clip parts can be exposed from the holder, in which case because of the exposure of the clip parts from the holder heat generated by the light emitting diode is radiated from the clip parts, thereby improving the heat radiation performance of the light emitting diode.
  • the leads can be formed of a metal that has a thermal conductivity equivalent to or greater than that of copper.
  • the leads are made of a metal that has a thermal conductivity equivalent to or greater than that of copper, heat generated by the light emitting diode is reliably transmitted to the metal plates via the leads, and is radiated from the clip parts. There is therefore a further improvement in the heat radiation performance of the light emitting diode.
  • FIG. 1 is a plan view showing a light emitting diode according to the first embodiment of the present invention.
  • FIG. 2 is a perspective view showing the structure of the light emitting diode of FIG. 1.
  • FIG. 3 is a partial perspective view showing the structure of the light emitting diode of FIG. 1.
  • FIG. 4 is a cross-section view showing the wire and cutting groove of FIG. 3.
  • FIG. 5 is an exploded perspective view showing a light emitting diode according to the second embodiment of the present invention.
  • FIG. 6 is side view showing the structure of the light emitting diode of FIG. 5.
  • FIG. 7 is a cross-section view showing the connecting member and the clip part of the light emitting diode of FIG. 5.
  • FIG. 8 is a cross-section view showing the cutting groove of FIG. 5.
  • FIG. 1 through FIG. 4 illustrate the first embodiment of the present invention. This embodiment will be described with regard to application to a vehicular stop lamp.
  • a housing 1 is provided on the inside of a lens 18 of a stop lamp 19 .
  • the stop lamp 19 (lens 18 ), as shown in FIG. 2, has a three-dimensional shape that is continuous with the outside contour of the surface of the vehicle. For this reason, the housing 1 has a plurality of mounting surfaces 1 a that are disposed in three-dimensionally skewed levels so as to follow the shape of the stop lamp 19 .
  • Two wires 2 are disposed in parallel so as to pass each mounting surface 1 a .
  • a light emitting diode 3 is mounted to the wires 2 .
  • the wires 2 are each formed by a center conductor 2 a and an insulation covering 2 b . Because each of the mounting structures for the light emitting diodes on the mounting surfaces 1 a is substantially the same, the description below is provided for only one exemplary mounting surface 1 a , based on FIG. 3.
  • two walls 4 are formed on the mounting surface 2 a so as to face each other.
  • the wires 2 are fitted into the cutouts 5 that are formed at the upper edges of the walls 4 .
  • a base 6 for supporting the wires 2 is formed at the bottom side of the cut-outs 5 .
  • a rib 7 for improving rigidity is formed at the center of each wall 4 .
  • a metal plate 8 is formed by a surface part 9 , and foot parts 10 formed by bending the ends the surface part 9 toward the mounting surface 1 a .
  • the part of the surface part 9 that is covered by the light emitting diode 3 supports the light emitting diode 3 .
  • the part of the surface part 9 that is not covered by the light emitting diode 3 is exposed in a wide area at the outside of the side of the light emitting diode 3 , and reflects light from the light emitting diode 3 . That is, the surface part 9 has a surface area that can reflect light from the light emitting diode 3 .
  • One hole 11 is formed in each end of the surface part 9 .
  • the surface part 9 has a highly reflective metallic (silver) color imparted to it.
  • a downwardly open groove 13 and a outwardly open partially cut tab 14 are formed in the ends of the foot parts 10 .
  • the light emitting diode 3 has leads 15 at each of its four corners.
  • the leads 15 are formed of copper, which has good thermal conductivity.
  • the leads 15 of the light emitting diode 3 are inserted into the slits 12 of each of the metal plates 8 .
  • the cutting grooves 13 of the metal plates 8 are set over the wires 2 , and the surface parts 9 of the metal plates 8 are pressed so as to push the cutting grooves 13 over the wires 2 . Because of the surface parts 9 in the area surrounding the light emitting diode 3 , it is possible to use this surface part 9 as a surface to press with the finger, thereby facilitating the task of pressing the metal plates 8 over the wires 2 .
  • the cutting grooves 13 When the cutting grooves 13 are pressed over the wires 2 , the cutting grooves 13 cut the insulation covering 2 b of the wires 2 , and bite into the inside thereof, thereby making an electrical connection with respect to the center conductors 2 a of the wires 2 (refer to FIG. 4).
  • the biting force between the cutting grooves 13 and the wires 2 holds the light emitting diode 3 in place over the wires 2 , and there is an electrically conductive connection via the metal plates 8 between the light emitting diode 3 an the wires 2 . Because the wires 2 are supported from the bottom by the bases 6 , there is a secure pressure pushing the cutting groove onto the wires 2 .
  • the foot parts 10 of the metal plates 8 fit between the mutually opposing walls 4 , and the bent partial cutouts 14 on the foot parts 10 thereof make a resilient connection with the walls 4 . For this reason, movement with respect to the mounting position of the metal plates 8 is restricted, so that the metal plates 8 are held securely and stably in place.
  • the mounted light emitting diode 3 has four leads 15 , it does not bend over after mounting, so that there is no tendency for the orientation of the light emitting diode 3 to change after mounting. Additionally, because a single light emitting diode 3 is held in place by two metal plates 8 , it is possible to make the size of each metal plat 8 small, thereby simplifying the manufacture of the metal plates 8 .
  • the light of the mounted light emitting diode 3 is reliably reflected by the surface part 9 of the metal plate 8 , which has had a metallic coloring imparted thereto, the result being an improvement in the usage of light from the light emitting diode 3 . Therefore, for a given brightness the number of light emitting diodes 3 required is reduced, thereby simplifying the lamp structure and reducing the cost.
  • the light emitting diode 3 is supported by two metal plates 8 , which are disposed in mutual proximity and have substantially the same shape, thereby improving the efficiency of usage of the light.
  • the leads 15 of the light emitting diode 3 are made of copper, which has a high thermal conductivity, heat generated from the light emitting diode 3 is reliably transmitted to the metal plates 8 via the leads 15 , and is radiated from the broad surface parts 9 thereof, thereby improving the radiation of heat from the light emitting diode 3 .
  • the housing 1 has a plurality of mounting surfaces 1 a has a plurality of mounting surfaces 1 a that are disposed in three-dimensionally skewed levels so as to follow the shape of the stop lamp 19 , with the light emitting diodes 3 disposed on each mounting surface 1 a .
  • a housing 21 is provided on the inside of a lens 38 of a vehicular stop lamp 39 .
  • the stop lamp 39 (lens 38 ) has a three-dimensional shape that follows the shape of the body of the vehicle. For this reason, the housing 21 has a plurality of mounting surfaces 1 a that are disposed in three-dimensionally skewed levels so as to follow the shape of the stop lamp 39 .
  • FIG. 5 shows one of the plurality of mounting surfaces 21 a .
  • Two wires 2 are disposed on the mounting surface so as to be mutually parallel, and a light emitting diode 23 is mounted in place over the wires 2 .
  • the wires 2 each are formed by a center conductor 2 a and an insulation covering 2 b that covers the center conductor 2 a.
  • Two walls 24 in mutual opposition to each other are formed on the mounting surface 21 a .
  • Mutually opposing tabs 25 are formed at the top edges of the walls 24 .
  • Bases 26 are formed so as to face the inside from both ends of the walls 24 , and the wires 2 are supported on these bases 26 .
  • the holder 27 is made up of a center block 28 , protrusions 29 that protrude from the surfaces at each side of the center blocks 28 , and upper pieces 30 disposed at the top edges of the protrusions 29 , these being integrally formed as a molded resin piece.
  • the upper pieces 30 have formed in them a pair of insertion holes 31 .
  • the connecting members 32 are pressed from sheet metal, and two of these connecting members are mounted to one holder 27 .
  • the connecting members 32 have an integrally formed foot parts 34 with a cutting groove 33 in the ends thereof, and integrally formed clip parts 35 which are formed by bending back the sheet metal material.
  • Four leads 36 extend from the four corners of the light emitting diode 3 , these leads being formed from copper, which has good thermal conductivity.
  • the holder 27 is inserted between the two walls 24 .
  • the upper pieces 30 of the holders 27 engage with the tabs 25 at the upper edges of the walls 24 , so that the holder 27 is held in place with respect to the housing 12 with a single operation.
  • the wires 2 are disposed between the bases 26 and the upper pieces 30 .
  • the connecting members 32 are mounted to the holder 27 . More specifically, the clips 35 are pushed onto the protrusions 29 of the holder 27 , so that the foot parts 34 are inserted into the insertion holes 31 of the upper pieces 30 . The upper part of the foot parts 34 are hidden within the upper pieces 30 of the holder 27 , but the clip parts 35 are totally exposed to outside the holder 27 .
  • the cutting grooves 33 in the ends of the foot parts 34 cut the insulation covering 2 b of the wires 2 , thereby biting into the insulation covering 2 b so as to engage with the center conductor 2 a therewithin (refer to FIG. 8).
  • an electrically conducting connection is made between the connecting members 32 and the wire 2 .
  • the biting force between the cutting grooves 33 and the wire 2 holds the connecting members 32 in place with respect to the holder 27 .
  • the wires 2 are supported from below by the bases 26 , making is possible to perform the task of pressing into the cutting grooves 33 .
  • the four leads 36 of the light emitting diode 23 are each inserted into the clip parts 35 of each of the connecting members 32 .
  • the leads 36 are grabbed and held by these clip parts 35 , so that the grabbing force of the clip parts 35 provides the holding force.
  • the connecting members 32 are stably held to the mounting surface 21 a of the housing 21 , and the light emitting diode 23 is held in place with respect to the housing 21 by the action of the clip parts 35 of the connecting members 32 resiliently holding and supporting the leads 36 thereof. For this reason, the light emitting diode 23 is held securely in place with respect to the housing 21 , and the light axis thereof is held stable. Because the light axis of the light emitting diode 23 is stabilized in this manner, there is an improvement in the usage of the light therefrom. For this reason, the number of light emitting diodes required to achieve the desired brightness is reduced in comparison with the related art, thereby simplifying the structure and reducing the cost.
  • the clip parts 35 are totally exposed from the holder 27 , heat generated from the light emitting diode 23 can be radiated from the clip parts 35 , thereby improving the heat radiation performance of the light emitting diode 23 .
  • the leads 36 of the light emitting diode 23 are made of copper, which has a high thermal conductivity, heat generated by the light emitting diode 23 is reliably transmitted via the leads 36 to the connecting parts 32 , thereby providing a further improvement in radiation of heat from the light emitting diode 23 .
  • the housing 21 has a plurality of mounting surfaces 21 a that are disposed in three-dimensionally skewed levels so as to follow the shape of the stop lamp 39 .

Abstract

A light emitting diode mounting structure for a light emitting diode having four leads has two metal plates fixed to wire on a housing. The leads engage the metal plates in electrical contact therewith and are supported by the metal plates, a surface part of which reflects light from the light emitting diode.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to a light emitting diode mounting structure, and more particularly to a light emitting diode mounting structure that is suitable for application to a vehicular lamp. [0002]
  • 2. Description of the Related Art [0003]
  • The leads of a light emitting diode used in such applications as vehicular lamps are soldered to a printed circuit board that is provided on the lamp, according to, for example, the disclosure of the Japanese laid-open patent application publication H10-188614. [0004]
  • In a structure whereby a light emitting diode is soldered to a printed circuit board, however, if the light axis of the light emitting diode is shifted because of such effects as deformation of the leads, there is possibility that the effective rate of usage of the light from the light emitting diode drops. For this reason, in order to achieve the required brightness, it is necessary to use a large number of light emitting diodes, this being a disadvantage from the standpoint of cost. [0005]
  • Additionally, because each of the leads of the light emitting diode is soldered to the printed circuit board individually, the process of mounting the light emitting diode to the board is troublesome, and manufacturing efficiency is poor. When replacing a light emitting diode, the process of removing leads from their positions on the printed circuit board and resoldering leads is complex. [0006]
  • Accordingly, in view of the related art, it is an object of the present invention to provide a light emitting diode mounting structure with superior light usage and work efficiency. [0007]
    • SUMMARY OF THE INVENTION
  • To achieve the above-noted object, the first aspect of a structure according to the present invention has a light emitting diode having a lead, and a metal plate fixed and connected to a wire on an upper housing. The lead engages the metal plate so as to make an electrical connection therewith, and is support thereby. The surface part of the metal plate has a surface area that is capable of reflecting light from the light emitting diode. [0008]
  • In the above-noted configuration, a surface part having a surface area capable of reflecting the light of the light emitting diode is formed on the metal plate. For this reason, the light usage efficiency of the light emitting diode is improved, the result being that a smaller number of light emitting diodes can be used to achieve the required brightness, thereby simplifying the structure and reducing the cost. [0009]
  • The above-noted light emitting diode can also have four leads, these leads being engaged with two metal plates that are disposed in proximity. [0010]
  • In the above-noted configuration, because there are four leads, the light emitting diode does not tend to bend over and does not tend to change its direction after mounting. Additionally, because two metal plates are used to mount one light emitting diode, the size of one metal plate can be made small, thereby facilitating manufacture of the metal plates. Additionally, because the two metal plates are in mutual proximity, there is little affect on the rate of usage of the light. [0011]
  • The lead can be formed of a metal that has a thermal conductivity that is equivalent to or greater than that of copper. [0012]
  • In the above-noted configuration, because the lead is formed of a metal having a thermal conductivity that is equivalent to or greater than of copper, heat that is generated by the light emitting diode is reliably transmitted via the lead to the metal plate, where it is radiated from the surface part thereof. There is thus an improvement in the heat radiation of the light emitting diode. [0013]
  • The wire can be formed by an insulation covering and a center conductor disposed within the insulation cover, and the metal plate can be formed by a foot part that faces the housing, and a cutting groove part that is formed in the end of the foot part. When the wire is inserted into the cut groove part, the cutting groove cuts the insulation covering of the wire, and eats thereinto, the effect being that the metal plate comes into a conductive connection with the center conductor, and holds the wire in place. [0014]
  • In the above-noted configuration, a cutting groove formed in the foot part of the metal plate cuts the insulation covering of the wire and bites into the inside thereof so that an electrical connection is made to the center conductor, the biting force between the cutting groove and the wire also serving to hold the light emitting diode in one operation to the wire. For this reason, it is not necessary to perform a soldering operation to mount the light emitting diode in place, and it easy to replace the light emitting diode. Additionally, because it is possible to use the surface part of the metal plate as a surface for an operator to press with a finger, the operation of pressing the metal plate to press the wire into the cutting groove is facilitated. [0015]
  • The surface part of the metal plate can also be a surface that is colored with a metallic coloring. [0016]
  • In the above-noted configuration, because a metallic coloring is imparted to the surface part of the metal plate, good reflection of light is achieved, thereby further improving the usage of light. [0017]
  • The construction of the second embodiment of the present invention has two light emitting diodes each having a lead, and two metal plates each being connected to a wire on an upper housing. The leads engage with the metal plates so as to make an electrically conductive connection thereto. Each metal plate has a hole for the purpose of connecting a jumper wire between the metal plates. [0018]
  • In the above-noted configuration, even if the wire between neighboring metal plates is broken, because of the connection made by the jumper wire between the metal plates, it is possible to maintain the electrical connection between the metal plates. [0019]
  • The mounting structure according to the third embodiment has a light emitting diode having a lead, a non-metallic holder that engages with a housing, and a metal connecting member that is mounted to the holder. The connecting member has an integrally formed foot part and clip part. The lead is resiliently grabbed and supported by the clip part. The foot part has at its end a cutting groove that accepts the wire on the housing. The wire is formed by an insulation covering and a center conductor disposed therewithin. When the wire is inserted into the cutting groove, the cutting groove cuts the insulation covering of the wire and bites into the inside thereof, thereby making an electrically conducting connection between the connecting member and the center conductor, and also holding the wire in place. [0020]
  • In the above-noted configuration, because of the connecting member that is mounted to a holder engaged with the housing, the connecting member is securely held to the housing. Because the light emitting diode is resiliently grabbed and supported by the clip part of the connecting member, it is held in place with respect to the housing. As a result, the light emitting diode is held securely to the housing, thereby resulting in a stable light axis. Because the light axis of the light emitting diode is stabilized in this manner, there is an improvement in the usage of the light thereof. For this reason, the number of light emitting diodes required to achieve the desired brightness is reduced, thereby simplifying the structure and reducing the cost. Additionally, because the cutting groove formed in the foot part of the connecting member bites into the inside of the wire insulation covering, the biting force between the cutting groove and the wire holds the wire in place with a single operation. Additionally, it is possible to hold the light emitting diode in place by inserting the wire into the clip part, thereby eliminating the need of a soldering operation to hold the lead in place, thereby simplifying the mounting task. This not only improves manufacturing efficiency and enables automation thereof, but also facilitates replacement of the light emitting diode. [0021]
  • The light emitting diode can have four leads, the holder can have two neighboring connecting members mounted to it, and each connecting member can have two clip parts. It is also possible for each of the connecting members to have two cutting grooves. The four leads are each grabbed and supported by the clip parts. [0022]
  • In the above-noted configuration, because a single light emitting diode is held in place by two connecting members, the size of each connecting member is reduced, thereby facilitating the manufacture of the connecting members. [0023]
  • The clip parts can be exposed from the holder, in which case because of the exposure of the clip parts from the holder heat generated by the light emitting diode is radiated from the clip parts, thereby improving the heat radiation performance of the light emitting diode. [0024]
  • The leads can be formed of a metal that has a thermal conductivity equivalent to or greater than that of copper. [0025]
  • In the above-noted configuration, because the leads are made of a metal that has a thermal conductivity equivalent to or greater than that of copper, heat generated by the light emitting diode is reliably transmitted to the metal plates via the leads, and is radiated from the clip parts. There is therefore a further improvement in the heat radiation performance of the light emitting diode. [0026]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a plan view showing a light emitting diode according to the first embodiment of the present invention. [0027]
  • FIG. 2 is a perspective view showing the structure of the light emitting diode of FIG. 1. [0028]
  • FIG. 3 is a partial perspective view showing the structure of the light emitting diode of FIG. 1. [0029]
  • FIG. 4 is a cross-section view showing the wire and cutting groove of FIG. 3. [0030]
  • FIG. 5 is an exploded perspective view showing a light emitting diode according to the second embodiment of the present invention. [0031]
  • FIG. 6 is side view showing the structure of the light emitting diode of FIG. 5. [0032]
  • FIG. 7 is a cross-section view showing the connecting member and the clip part of the light emitting diode of FIG. 5. [0033]
  • FIG. 8 is a cross-section view showing the cutting groove of FIG. 5. [0034]
    • DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Preferred embodiments of the present invention are described below in detail, with references being made to relevant accompanying drawings. [0035]
  • FIG. 1 through FIG. 4 illustrate the first embodiment of the present invention. This embodiment will be described with regard to application to a vehicular stop lamp. [0036]
  • As shown in FIG. 1, a [0037] housing 1 is provided on the inside of a lens 18 of a stop lamp 19. The stop lamp 19 (lens 18), as shown in FIG. 2, has a three-dimensional shape that is continuous with the outside contour of the surface of the vehicle. For this reason, the housing 1 has a plurality of mounting surfaces 1 a that are disposed in three-dimensionally skewed levels so as to follow the shape of the stop lamp 19. Two wires 2 are disposed in parallel so as to pass each mounting surface 1 a. A light emitting diode 3 is mounted to the wires 2. The wires 2 are each formed by a center conductor 2 a and an insulation covering 2 b. Because each of the mounting structures for the light emitting diodes on the mounting surfaces 1 a is substantially the same, the description below is provided for only one exemplary mounting surface 1 a, based on FIG. 3.
  • As shown in FIG. 3, two [0038] walls 4 are formed on the mounting surface 2 a so as to face each other. The wires 2 are fitted into the cutouts 5 that are formed at the upper edges of the walls 4. A base 6 for supporting the wires 2 is formed at the bottom side of the cut-outs 5. A rib 7 for improving rigidity is formed at the center of each wall 4.
  • A [0039] metal plate 8 is formed by a surface part 9, and foot parts 10 formed by bending the ends the surface part 9 toward the mounting surface 1 a. The part of the surface part 9 that is covered by the light emitting diode 3 supports the light emitting diode 3. The part of the surface part 9 that is not covered by the light emitting diode 3 is exposed in a wide area at the outside of the side of the light emitting diode 3, and reflects light from the light emitting diode 3. That is, the surface part 9 has a surface area that can reflect light from the light emitting diode 3.
  • One [0040] hole 11 is formed in each end of the surface part 9. The surface part 9 has a highly reflective metallic (silver) color imparted to it. There is a pair of two nearby opposing slits 12 punched out of the surface part 9. A downwardly open groove 13 and a outwardly open partially cut tab 14 are formed in the ends of the foot parts 10. The light emitting diode 3 has leads 15 at each of its four corners. The leads 15 are formed of copper, which has good thermal conductivity.
  • The process of mounting the housing in place is as follows. [0041]
  • First, the [0042] leads 15 of the light emitting diode 3 are inserted into the slits 12 of each of the metal plates 8. Next, the cutting grooves 13 of the metal plates 8 are set over the wires 2, and the surface parts 9 of the metal plates 8 are pressed so as to push the cutting grooves 13 over the wires 2. Because of the surface parts 9 in the area surrounding the light emitting diode 3, it is possible to use this surface part 9 as a surface to press with the finger, thereby facilitating the task of pressing the metal plates 8 over the wires 2.
  • When the cutting [0043] grooves 13 are pressed over the wires 2, the cutting grooves 13 cut the insulation covering 2 b of the wires 2, and bite into the inside thereof, thereby making an electrical connection with respect to the center conductors 2 a of the wires 2 (refer to FIG. 4). The biting force between the cutting grooves 13 and the wires 2 holds the light emitting diode 3 in place over the wires 2, and there is an electrically conductive connection via the metal plates 8 between the light emitting diode 3 an the wires 2. Because the wires 2 are supported from the bottom by the bases 6, there is a secure pressure pushing the cutting groove onto the wires 2. The foot parts 10 of the metal plates 8 fit between the mutually opposing walls 4, and the bent partial cutouts 14 on the foot parts 10 thereof make a resilient connection with the walls 4. For this reason, movement with respect to the mounting position of the metal plates 8 is restricted, so that the metal plates 8 are held securely and stably in place.
  • It is thus possible to press the cutting [0044] grooves 13 over the wires 2 with a single operation, thereby eliminating the need to perform a soldering operation with respect to the leads 15 in order to hold the light emitting diode 3 in place. The process of mounting the light emitting diode 3 in place is therefore simplified, thereby improving manufacturing efficiency and enabling automation thereof. Additionally, replacement of the light emitting diode is facilitated.
  • Because the mounted [0045] light emitting diode 3 has four leads 15, it does not bend over after mounting, so that there is no tendency for the orientation of the light emitting diode 3 to change after mounting. Additionally, because a single light emitting diode 3 is held in place by two metal plates 8, it is possible to make the size of each metal plat 8 small, thereby simplifying the manufacture of the metal plates 8.
  • The light of the mounted [0046] light emitting diode 3 is reliably reflected by the surface part 9 of the metal plate 8, which has had a metallic coloring imparted thereto, the result being an improvement in the usage of light from the light emitting diode 3. Therefore, for a given brightness the number of light emitting diodes 3 required is reduced, thereby simplifying the lamp structure and reducing the cost. The light emitting diode 3 is supported by two metal plates 8, which are disposed in mutual proximity and have substantially the same shape, thereby improving the efficiency of usage of the light.
  • Because the leads [0047] 15 of the light emitting diode 3 are made of copper, which has a high thermal conductivity, heat generated from the light emitting diode 3 is reliably transmitted to the metal plates 8 via the leads 15, and is radiated from the broad surface parts 9 thereof, thereby improving the radiation of heat from the light emitting diode 3.
  • Additionally, there is one [0048] hole 11 each formed in the surface parts 9 of the metal plates 8. Even if there is an open connection between a wire 2 and a neighboring metal plate 8, by holding a jumper wire 16 to the hole 11 of each metal plate 8 using screws 17, as shown in FIG. 1, an electrical connection is made between metal plates 8. Because of consideration given to countermeasures in the case of unexpected accidents, the reliability of the structure is high.
  • The [0049] housing 1 has a plurality of mounting surfaces 1 a has a plurality of mounting surfaces 1 a that are disposed in three-dimensionally skewed levels so as to follow the shape of the stop lamp 19, with the light emitting diodes 3 disposed on each mounting surface 1 a. By thusly disposing each light emitting diode 3 in a positional that is optimal with respect to the lens (not shown in the drawing) of the stop lamp 19, there is a further improvement in the efficiency use of the light therefrom.
  • The second embodiment of the present invention is described below, with references being made to FIG. 5 to FIG. 8. [0050]
  • A [0051] housing 21 is provided on the inside of a lens 38 of a vehicular stop lamp 39. The stop lamp 39 (lens 38) has a three-dimensional shape that follows the shape of the body of the vehicle. For this reason, the housing 21 has a plurality of mounting surfaces 1 a that are disposed in three-dimensionally skewed levels so as to follow the shape of the stop lamp 39.
  • FIG. 5 shows one of the plurality of mounting [0052] surfaces 21 a. Two wires 2 are disposed on the mounting surface so as to be mutually parallel, and a light emitting diode 23 is mounted in place over the wires 2. The wires 2 each are formed by a center conductor 2 a and an insulation covering 2 b that covers the center conductor 2 a.
  • Two [0053] walls 24 in mutual opposition to each other are formed on the mounting surface 21 a. Mutually opposing tabs 25 are formed at the top edges of the walls 24. Bases 26 are formed so as to face the inside from both ends of the walls 24, and the wires 2 are supported on these bases 26. The holder 27 is made up of a center block 28, protrusions 29 that protrude from the surfaces at each side of the center blocks 28, and upper pieces 30 disposed at the top edges of the protrusions 29, these being integrally formed as a molded resin piece. The upper pieces 30 have formed in them a pair of insertion holes 31.
  • The connecting [0054] members 32 are pressed from sheet metal, and two of these connecting members are mounted to one holder 27. The connecting members 32 have an integrally formed foot parts 34 with a cutting groove 33 in the ends thereof, and integrally formed clip parts 35 which are formed by bending back the sheet metal material. Four leads 36 extend from the four corners of the light emitting diode 3, these leads being formed from copper, which has good thermal conductivity.
  • The process of mounting a [0055] light emitting diode 23 in place in this embodiment is as follows.
  • First, with the [0056] wires 2 disposed over the bases 26, the holder 27 is inserted between the two walls 24. By doing this, the upper pieces 30 of the holders 27 engage with the tabs 25 at the upper edges of the walls 24, so that the holder 27 is held in place with respect to the housing 12 with a single operation. The wires 2 are disposed between the bases 26 and the upper pieces 30.
  • Next, the connecting [0057] members 32 are mounted to the holder 27. More specifically, the clips 35 are pushed onto the protrusions 29 of the holder 27, so that the foot parts 34 are inserted into the insertion holes 31 of the upper pieces 30. The upper part of the foot parts 34 are hidden within the upper pieces 30 of the holder 27, but the clip parts 35 are totally exposed to outside the holder 27.
  • When the connecting [0058] members 32 are inserted with respect to the holder 27, the cutting grooves 33 in the ends of the foot parts 34 cut the insulation covering 2 b of the wires 2, thereby biting into the insulation covering 2 b so as to engage with the center conductor 2 a therewithin (refer to FIG. 8). By doing this, an electrically conducting connection is made between the connecting members 32 and the wire 2. The biting force between the cutting grooves 33 and the wire 2 holds the connecting members 32 in place with respect to the holder 27. The wires 2 are supported from below by the bases 26, making is possible to perform the task of pressing into the cutting grooves 33.
  • Finally, the four leads [0059] 36 of the light emitting diode 23 are each inserted into the clip parts 35 of each of the connecting members 32. The leads 36 are grabbed and held by these clip parts 35, so that the grabbing force of the clip parts 35 provides the holding force.
  • In this manner, by simply inserting the [0060] leads 36 into the connecting members 32 that are held by the holder 27, the need to perform a soldering operation is eliminated, thereby simplifying the mounting task, improving the manufacturing efficiency, and enabling automation thereof. Additionally, replacement of the light emitting diode 23 is enabled. Because the light emitting diode 23 is held by the four leads 36, it does not tend to bend over after mounting, nor does the orientation of the light emitting diode 23 tend to change. Additionally, because the light emitting diode 23 is held in place by two connecting members 32, it is possible to make each of the connecting members 32 small, thereby facilitating manufacture thereof.
  • The connecting [0061] members 32 are stably held to the mounting surface 21 a of the housing 21, and the light emitting diode 23 is held in place with respect to the housing 21 by the action of the clip parts 35 of the connecting members 32 resiliently holding and supporting the leads 36 thereof. For this reason, the light emitting diode 23 is held securely in place with respect to the housing 21, and the light axis thereof is held stable. Because the light axis of the light emitting diode 23 is stabilized in this manner, there is an improvement in the usage of the light therefrom. For this reason, the number of light emitting diodes required to achieve the desired brightness is reduced in comparison with the related art, thereby simplifying the structure and reducing the cost.
  • Additionally, because the [0062] clip parts 35 are totally exposed from the holder 27, heat generated from the light emitting diode 23 can be radiated from the clip parts 35, thereby improving the heat radiation performance of the light emitting diode 23. Because the leads 36 of the light emitting diode 23 are made of copper, which has a high thermal conductivity, heat generated by the light emitting diode 23 is reliably transmitted via the leads 36 to the connecting parts 32, thereby providing a further improvement in radiation of heat from the light emitting diode 23.
  • The [0063] housing 21 has a plurality of mounting surfaces 21 a that are disposed in three-dimensionally skewed levels so as to follow the shape of the stop lamp 39. By thusly disposing each light emitting diode 23 in a positional that is optimal with respect to the lens 38 of the stop lamp 39, there is a further improvement in the efficiency use of the light from the light emitting diodes 23.

Claims (13)

What is claimed is:
1. A light emitting diode mounting structure comprising:
a light emitting diode having a lead;
a metal plate fixed to and connected to a wire on a housing, the lead engaging with the metal plate so as to be in electrical connection therewith and being supported thereby; and
a surface part of the metal plate having a surface area capable of reflecting light from the light emitting diode.
2. A light emitting diode mounting structure according to
claim 1
, wherein the light emitting diode comprises four leads, and
the leads are engaged with two metal plates disposed in mutual proximity.
3. A light emitting diode mounting structure according to
claim 1
, wherein the lead is formed of a metal having a thermal conductivity equivalent to or greater than that of copper.
4. A light emitting diode mounting structure according to
claim 1
, wherein the wire comprises an insulation covering and a center conductor disposed within the insulation covering,
the metal plate comprises a foot part extending toward the housing from the surface part and a cutting groove formed at the end of the foot part, and
when the wire is inserted into the cutting groove, the cutting groove cuts the insulation covering of the wire and bites into the inside thereof, forming an electrically conductive contact with respect to the center conductor thereof and holding the wire in place.
5. A light emitting diode mounting structure according to
claim 1
, wherein the surface part of the metal plate has a metallic coloring imparted thereto.
6. A light emitting diode mounting structure comprising:
two light emitting diodes each having a lead; and
two metal plate held and connected to a wire on a housing, the leads engaging with respective metal plates and the metal plates each having a hole for connecting to a jumper wire for making electrical connection between the metal plates.
7. A light emitting diode mounting structure comprising:
a light emitting diode having a lead;
a non-metallic holder engaging with a housing; and
a metal connecting member mounted to the holder, the connecting member having an integrally formed foot part and clip part, the lead being grabbed in and supported by the clip part, the foot part having a cutting groove for accepting the wire on the housing, the wire comprising an insulation covering and a center conductor disposed within the insulation covering, and when the wire is inserted into the cutting groove, the cutting groove cutting the insulation covering and biting into the inside thereof, forming an electrically conductive contact between the connecting member and the center conductor and holding the wire in place.
8. A light emitting diode mounting structure according to
claim 7
, wherein the light emitting diode comprises four leads, two connecting members are mounted in mutual proximity to the holder, each connecting member comprises a clip part, and the four leads are each grabbed and supported by the clip parts.
9. A light emitting diode mounting structure according to
claim 8
, wherein each connecting member comprises two cutting grooves.
10. A light emitting diode mounting structure according to
claim 7
, wherein the clip part is exposed from the holder.
11. A light emitting diode mounting structure according to
claim 10
, wherein the lead is formed of a metal having a thermal conductivity equivalent to or greater than that of copper.
12. A vehicular lamp comprising:
a housing disposed inside a lens and comprising a plurality of mounting surfaces disposed so as to follow a contour of the lens;
a light emitting diode comprising a lead and disposed on each mounting surface;
a metal plate fixed to and connected to each mounting surface, the lead engaging with the metal plate so as to be in electrical connection therewith and being supported thereby; and
a surface part of the metal plate, having a surface area capable of reflecting light the light emitting diode.
13. A vehicular lamp comprising:
a housing disposed inside a lens and comprising a plurality of mounting surfaces disposed so as to follow a contour of the lens;
a light emitting diode comprising a lead and disposed on each mounting surface;
a non-metallic holder engaging the housing and fixed to each mounting surface, and
a metal connecting member mounted to the holder, the connecting member having an integrally formed foot part and clip part, the lead being grabbed in and supported by the clip part, the foot part having a cutting groove for accepting the wire on the housing, the wire comprising an insulation covering and a center conductor disposed within the insulation covering, and when the wire is inserted into the cutting groove, the cutting groove cutting the insulation covering and biting into the inside thereof, forming an electrically conductive contact between the connecting member and the center conductor and holding the wire in place.
US09/766,837 1998-11-17 2001-01-23 Light emitting diode mounting structure Expired - Fee Related US6345902B2 (en)

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Application Number Priority Date Filing Date Title
JPP10-326941 1998-11-17
JP10-326941 1998-11-17
JP32694198A JP3807131B2 (en) 1998-11-17 1998-11-17 Light emitting diode fixing structure
JP11004434A JP2000207922A (en) 1999-01-11 1999-01-11 Fixing structure of light-emitting diode
JP11-4434 1999-11-01
US09/440,145 US6386733B1 (en) 1998-11-17 1999-11-15 Light emitting diode mounting structure
US09/766,837 US6345902B2 (en) 1998-11-17 2001-01-23 Light emitting diode mounting structure

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Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6832861B2 (en) 2000-12-29 2004-12-21 Diemount Gmbh Coupling device for optically coupling an optical waveguide to an electro-optical element
WO2004114736A2 (en) * 2003-06-20 2004-12-29 Yazaki Corporation Led illumination device
US20050030765A1 (en) * 2001-05-25 2005-02-10 Paul Southard Illuminated signage employing light emitting diodes
US20050201091A1 (en) * 2004-03-10 2005-09-15 Kramer Eric W. Flexible surface lighting system with replaceable led module
US20050201068A1 (en) * 2004-03-10 2005-09-15 Kramer Eric W. Replaceable LED module
US7311548B1 (en) * 2006-07-10 2007-12-25 International Business Machines Corporation Jumper installation feedback
US20080036397A1 (en) * 2006-04-21 2008-02-14 Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh Modular lighting system and lighting arrangement
US20080137377A1 (en) * 2006-12-11 2008-06-12 Gelcore, Llc Led light engine and method of manufacturing
US20090141468A1 (en) * 2007-12-03 2009-06-04 T.Y.C. Brother Industrial Co., Ltd. Light emitting assembly and method for assembling the same
US20090262529A1 (en) * 2006-04-14 2009-10-22 Dixon Mark E Illuminator
US20090272971A1 (en) * 2004-12-14 2009-11-05 Seoul Opto Device Co., Ltd. Light emitting device having a pluralilty of light emitting cells and package mounting the same
CN100585274C (en) * 2002-10-25 2010-01-27 森山产业株式会社 Light emitting module
US20100142218A1 (en) * 2008-09-29 2010-06-10 Olivier Middy Light emitting diode lamp
US20100155135A1 (en) * 2008-12-24 2010-06-24 Yazaki Corporation Illumination unit
US20100210133A1 (en) * 2009-02-13 2010-08-19 Yazaki Corporation Illumination unit and wire harness equipped with the illumination unit
US20100226140A1 (en) * 2009-03-09 2010-09-09 Yazaki Corporation Connector, LED unit, and method for producing connector
US20100224904A1 (en) * 2005-03-11 2010-09-09 Seoul Semiconductor Co., Ltd. Led package having an array of light emitting cells coupled in series
US20100230709A1 (en) * 2009-03-11 2010-09-16 Japan Aviation Electronics Industry, Limited Optical semiconductor device, socket, and optical semiconductor unit
US20110149569A1 (en) * 2009-12-23 2011-06-23 Au Optronics Corporation Light-emitting diode module
US8337071B2 (en) * 2005-12-21 2012-12-25 Cree, Inc. Lighting device
US20130059462A1 (en) * 2010-03-01 2013-03-07 David Conroy Device for connecting a cable to an electric component arranged in a housing
US20140140073A1 (en) * 2011-05-19 2014-05-22 Marquardt Mechatronik Gmbh Lighting unit for a household appliance
USD743285S1 (en) * 2014-02-14 2015-11-17 Checkpoint Systems, Inc. Deactivator
USD751936S1 (en) * 2014-02-14 2016-03-22 Checkpoint Systems, Inc. Deactivator
USD751935S1 (en) * 2014-02-14 2016-03-22 Checkpoint Systems, Inc. Deactivator
US20170130927A1 (en) * 2014-05-21 2017-05-11 Ford Global Technologies, Llc Headlight assembly with multiple high aspect ratio lenses
US11178736B2 (en) * 2018-04-27 2021-11-16 Valeo Vision Electronic assembly, lighting device and method for manufacturing a lighting device
CN116717759A (en) * 2023-05-11 2023-09-08 广州柏曼光电科技有限公司 Assembled modularized LED lamp

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2330679B (en) * 1997-10-21 2002-04-24 911 Emergency Products Inc Warning signal light
US6705745B1 (en) * 1999-06-08 2004-03-16 911Ep, Inc. Rotational led reflector
WO2000074975A1 (en) * 1999-06-08 2000-12-14 911 Emergency Products, Inc. Strip led light assembly for motor vehicle
US6547410B1 (en) * 2000-07-28 2003-04-15 911 Emergency Products, Inc. LED alley/take-down light
US20050057941A1 (en) * 1999-08-04 2005-03-17 911Ep, Inc. 360 Degree pod warning light signal
US20020170134A1 (en) * 2001-05-21 2002-11-21 Martin John H. Scraper with swiveling T-handle
TW523942B (en) * 2002-03-05 2003-03-11 Hsiu-Hen Chang package socket and package legs structure for LED and manufacturing of the same
US7380961B2 (en) * 2002-04-24 2008-06-03 Moriyama Sangyo Kabushiki Kaisha Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler
US20030218417A1 (en) * 2002-05-22 2003-11-27 Unity Opto Technology Co., Ltd. Light emitting diode lamp with light emitting diode module having improved heat dissipation
US6886963B2 (en) * 2002-06-21 2005-05-03 Pervaiz Lodhie LED light bulb for use in an illuminated aircraft sign
US6726502B1 (en) * 2003-03-21 2004-04-27 Fci Americas Technology Inc. LED and flex cable lighting assembly
JP4102240B2 (en) * 2003-04-08 2008-06-18 株式会社小糸製作所 Vehicle headlamp
US6860620B2 (en) 2003-05-09 2005-03-01 Agilent Technologies, Inc. Light unit having light emitting diodes
JP2004355968A (en) * 2003-05-29 2004-12-16 Sumitomo Wiring Syst Ltd Lighting fixture for vehicle
US20050030754A1 (en) * 2003-08-07 2005-02-10 Licht Harold Jay Systems, devices, and methods for mounting a light emitting diode
US20050036312A1 (en) * 2003-08-14 2005-02-17 Para Light Electronics Co., Ltd. Light emitting diode based lighting device
GB2409332B (en) * 2003-08-14 2006-12-13 Richard Peter James Barton Lamp assembly for direct connection to system wiring
JP2005093900A (en) * 2003-09-19 2005-04-07 Yazaki Corp Led lamp module, and manufacturing method thereof
US7429186B2 (en) 2004-04-06 2008-09-30 Lumination Llc Flexible high-power LED lighting system
US7210957B2 (en) 2004-04-06 2007-05-01 Lumination Llc Flexible high-power LED lighting system
CN100370889C (en) * 2004-05-28 2008-02-20 咸瑞科技股份有限公司 Positioning structure of welding-free light-emitting diode
JP4789433B2 (en) * 2004-06-30 2011-10-12 三洋電機株式会社 LED display housing and LED display
CA2554010A1 (en) * 2004-10-08 2006-04-20 Tempo Industries, Inc. Radiance lighting system and method
US7677763B2 (en) * 2004-10-20 2010-03-16 Timothy Chan Method and system for attachment of light emitting diodes to circuitry for use in lighting
US20060082315A1 (en) * 2004-10-20 2006-04-20 Timothy Chan Method and system for attachment of light emmiting diodes to circuitry for use in lighting
US7387403B2 (en) * 2004-12-10 2008-06-17 Paul R. Mighetto Modular lighting apparatus
US20060126346A1 (en) * 2004-12-10 2006-06-15 Paul R. Mighetto Apparatus for providing light
FR2880734B1 (en) * 2005-01-13 2011-04-22 Valeo Electronique Sys Liaison ELECTRICAL CONTACT MEMBER AND HOUSING ELEMENT FOR CONTAINING SUCH AN ORGAN
EP1858306A4 (en) * 2005-01-25 2009-03-11 Furukawa Electric Co Ltd Three-dimensional wiring body for mounting electronic component and electronic component mounting structure
US7977698B2 (en) * 2005-03-18 2011-07-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. System and method for surface mountable display
US7364346B2 (en) * 2005-09-06 2008-04-29 The L.D. Kichler Co. Low voltage track lighting assembly and system
GB0519156D0 (en) * 2005-09-20 2005-10-26 Pilkington Automotive D Gmbh Lighting arrangement for an automotive vehicle
US7341371B2 (en) * 2005-10-21 2008-03-11 Tyc Brother Industrial Co., Ltd. LED light assembly with LED connecting device
KR100736891B1 (en) * 2006-01-13 2007-07-10 서울반도체 주식회사 Led lamp
JP5038398B2 (en) * 2006-04-25 2012-10-03 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ LED array grid, LED grid, and method and apparatus for making LED components used therein
KR101249989B1 (en) * 2006-11-07 2013-04-01 삼성디스플레이 주식회사 Light source unit, backlight unit and liquid crystal display having the same
US7549786B2 (en) * 2006-12-01 2009-06-23 Cree, Inc. LED socket and replaceable LED assemblies
US7931386B2 (en) * 2007-03-19 2011-04-26 GE Lighting Solutions, LLC Flexible LED lighting strips including overmolding encasement and attached parallel electrical conductors
US7687288B2 (en) * 2007-03-19 2010-03-30 Lumination Llc Sealed lighting units
US20080310188A1 (en) * 2007-06-14 2008-12-18 Wen-Cheng Lai Light-Bulb Conductive Device
US7862204B2 (en) * 2007-10-25 2011-01-04 Pervaiz Lodhie LED light
US7784967B2 (en) * 2007-10-30 2010-08-31 Pervaiz Lodhie Loop LED light
TWM340555U (en) * 2007-11-23 2008-09-11 Everlight Electronics Co Ltd Light emmitting diode device
DE102007057765A1 (en) * 2007-11-30 2009-06-04 Osram Gesellschaft mit beschränkter Haftung LED system, LED light and method of assembling a LED system
USD631567S1 (en) 2008-01-11 2011-01-25 Pervaiz Lodhie LED bulb
US8362513B2 (en) * 2008-02-22 2013-01-29 Illinois Tool Works Inc. Surface mount LED and holder
TWI426210B (en) * 2008-04-18 2014-02-11 Delta Electronics Inc Illuminant device and manufacturing method thereof
JP5587296B2 (en) * 2008-05-05 2014-09-10 ダイアライト・コーポレーション Surface-mount circuit board indicator
USD613885S1 (en) 2008-06-10 2010-04-13 Pervaiz Lodhie Two-stage LED light module
USD614318S1 (en) 2008-06-10 2010-04-20 Pervaiz Lodhie LED light module
USD613886S1 (en) 2008-06-10 2010-04-13 Pervaiz Lodhie LED light module with cutouts
WO2010018426A2 (en) * 2008-08-14 2010-02-18 Yipi Pte Ltd Led lamp
US7952114B2 (en) * 2008-09-23 2011-05-31 Tyco Electronics Corporation LED interconnect assembly
JP5303251B2 (en) 2008-12-08 2013-10-02 株式会社小糸製作所 Power supply member and vehicle lamp
US20100309672A1 (en) * 2009-06-04 2010-12-09 Chen-Han Hsieh Clamping member for connecting light cover to light housing
US9425372B2 (en) 2010-01-29 2016-08-23 Japan Aviation Electronics Industry, Limited LED device, method of manufacturing the same, and light-emitting apparatus
TWI400407B (en) * 2010-08-13 2013-07-01 Taiwan Textile Res Inst Linear light-emitting module and textile product having the same
JP2012049367A (en) * 2010-08-27 2012-03-08 Kyocera Elco Corp Semiconductor light-emitting device attachment module, semiconductor light-emitting device module, semiconductor light-emitting device lighting apparatus, and manufacturing method of semiconductor light-emitting device attachment module
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
US20120155085A1 (en) * 2010-12-20 2012-06-21 Chih-Yang Chang Led module assembling structure
MX2012001219A (en) 2012-01-27 2013-07-29 Cemm Mex S A De C V Module for a led lamp.
WO2013156883A2 (en) 2012-04-19 2013-10-24 Koninklijke Philips N.V. A led grid device and a method of manufacturing a led grid device
FR2990263B1 (en) * 2012-05-07 2015-03-27 Idz Concept CONNECTOR HOLDING DIODE ELECTROLUMINESCENTE
US8894437B2 (en) * 2012-07-19 2014-11-25 Integrated Illumination Systems, Inc. Systems and methods for connector enabling vertical removal
KR101301719B1 (en) * 2013-01-24 2013-09-10 주식회사 트루스타 Electrode module for led lamp
KR20140100325A (en) * 2013-02-06 2014-08-14 삼성전자주식회사 Light emitting device package module
FR3011804B1 (en) * 2013-10-14 2017-05-12 Norep Int TRAFFIC LIGHT
DE102016003866A1 (en) 2015-04-10 2016-10-13 Marquardt Gmbh module
CN205944139U (en) 2016-03-30 2017-02-08 首尔伟傲世有限公司 Ultraviolet ray light -emitting diode spare and contain this emitting diode module
DE202016004792U1 (en) * 2016-08-04 2016-08-29 Hyeon Sook Jeon-Haurand Reusable plug-in module board of several connectable in a plug-in module system plug-in modules with subsequently connectable LEDs, e.g. for building a LED decoration
FR3067791B1 (en) * 2017-06-15 2020-10-02 Valeo Vision ELECTRICAL CONNECTION IN BED OF SEVERAL LIGHT MODULES
WO2021133369A1 (en) * 2019-12-24 2021-07-01 Виктор Григорьевич ПЕТРЕНКО Led element of a light-emitting array grid
US11199317B1 (en) 2020-08-14 2021-12-14 Scott Fetzer SFEG Light stick bus system

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3938177A (en) * 1973-06-25 1976-02-10 Amp Incorporated Narrow lead contact for automatic face down bonding of electronic chips
US4271408A (en) * 1978-10-17 1981-06-02 Stanley Electric Co., Ltd. Colored-light emitting display
US4555749A (en) * 1984-05-07 1985-11-26 General Instrument Corporation LED Circuit board indicator housing and tie-bar assembly
US4631650A (en) * 1984-10-24 1986-12-23 Ahroni Joseph M Series-parallel connected miniature light set
US4727648A (en) * 1985-04-22 1988-03-01 Savage John Jun Circuit component mount and assembly
US4935665A (en) 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
US4935856A (en) * 1989-10-05 1990-06-19 Dialight Corporation Surface mounted LED package
US4959761A (en) * 1989-12-21 1990-09-25 Dialight Corporation Surface mounted led package
US5339232A (en) * 1993-01-12 1994-08-16 Lin Te H Miniature light set
US5404282A (en) 1993-09-17 1995-04-04 Hewlett-Packard Company Multiple light emitting diode module
US5655830A (en) * 1993-12-01 1997-08-12 General Signal Corporation Lighting device
JP3127428B2 (en) * 1994-06-14 2001-01-22 株式会社小糸製作所 Vehicle lighting
US6045240A (en) * 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
US6079848A (en) * 1996-07-03 2000-06-27 Ahroni; Joseph M. Lamp unit with improved push-in type bulb holder
JPH10188614A (en) 1996-12-27 1998-07-21 Koito Mfg Co Ltd Vehicle lamp
JPH10208515A (en) 1997-01-23 1998-08-07 Koito Mfg Co Ltd Lighting fixture for vehicle
US6017241A (en) * 1998-01-26 2000-01-25 Tivoli Industries, Inc. Aisle lighting lampholder

Cited By (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6832861B2 (en) 2000-12-29 2004-12-21 Diemount Gmbh Coupling device for optically coupling an optical waveguide to an electro-optical element
US20050030765A1 (en) * 2001-05-25 2005-02-10 Paul Southard Illuminated signage employing light emitting diodes
US7686477B2 (en) 2001-05-25 2010-03-30 Lumination Llc Flexible lighting strips employing light-emitting diodes
US7217012B2 (en) * 2001-05-25 2007-05-15 Lumination, Llc Illuminated signage employing light emitting diodes
US20070285933A1 (en) * 2001-05-25 2007-12-13 Gelcore, Llc (Now Lumination, Llc) Illuminated signage employing light emitting diodes
US20080266858A1 (en) * 2001-05-25 2008-10-30 Gelcore, Llc (Now Lumination Llc) Illuminated signage employing light-emitting diodes
US7399105B2 (en) 2001-05-25 2008-07-15 Lumination Llc Illuminated signage employing light emitting diodes
CN100585274C (en) * 2002-10-25 2010-01-27 森山产业株式会社 Light emitting module
WO2004114736A2 (en) * 2003-06-20 2004-12-29 Yazaki Corporation Led illumination device
WO2004114736A3 (en) * 2003-06-20 2005-05-12 Yazaki Corp Led illumination device
US7458705B2 (en) 2003-06-20 2008-12-02 Yazaki Corporation LED illumination device
US20070064450A1 (en) * 2003-06-20 2007-03-22 Yazaki Corporation Led illumination device
US20050201068A1 (en) * 2004-03-10 2005-09-15 Kramer Eric W. Replaceable LED module
US7144139B2 (en) 2004-03-10 2006-12-05 Kramer Eric W Flexible surface lighting system
US20050201091A1 (en) * 2004-03-10 2005-09-15 Kramer Eric W. Flexible surface lighting system with replaceable led module
US8227272B2 (en) 2004-12-14 2012-07-24 Seoul Opto Device Co., Ltd. Light emitting device having a pluralilty of light emitting cells and package mounting the same
US8183592B2 (en) 2004-12-14 2012-05-22 Seoul Opto Device Co., Ltd. Light emitting device having a pluralilty of light emitting cells and package mounting the same
US8536612B2 (en) 2004-12-14 2013-09-17 Seoul Opto Device Co., Ltd. Light emitting device having a pluralilty of light emitting cells and package mounting the same
US20110233574A1 (en) * 2004-12-14 2011-09-29 Seoul Opto Device Co., Ltd. Light emitting device having a pluralilty of light emitting cells and package mounting the same
US8643029B2 (en) 2004-12-14 2014-02-04 Seoul Opto Device Co., Ltd. Light emitting device having a plurality of light emitting cells and package mounting the same
US20110175129A1 (en) * 2004-12-14 2011-07-21 Seoul Opto Device Co., Ltd. Light emitting device having a pluralilty of light emitting cells and package mounting the same
US20090272971A1 (en) * 2004-12-14 2009-11-05 Seoul Opto Device Co., Ltd. Light emitting device having a pluralilty of light emitting cells and package mounting the same
US8445933B2 (en) 2005-03-11 2013-05-21 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
US20110140135A1 (en) * 2005-03-11 2011-06-16 Seoul Semiconductor Co., Ltd. Led package having an array of light emitting cells coupled in series
US20110175128A1 (en) * 2005-03-11 2011-07-21 Seoul Semiconductor Co., Ltd. Led package having an array of light emitting cells coupled in series
US8368190B2 (en) 2005-03-11 2013-02-05 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
US8937326B2 (en) 2005-03-11 2015-01-20 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
US20100224904A1 (en) * 2005-03-11 2010-09-09 Seoul Semiconductor Co., Ltd. Led package having an array of light emitting cells coupled in series
US8159000B2 (en) 2005-03-11 2012-04-17 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
US8610138B2 (en) 2005-03-11 2013-12-17 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
US8337071B2 (en) * 2005-12-21 2012-12-25 Cree, Inc. Lighting device
US20090262529A1 (en) * 2006-04-14 2009-10-22 Dixon Mark E Illuminator
DE102006018668B4 (en) * 2006-04-21 2013-04-11 Osram Gmbh Modular lighting system and lighting arrangement
US7963669B2 (en) * 2006-04-21 2011-06-21 Osram Gesellschaft mit beschränkter Haftung Modular lighting system and lighting arrangement
US20080036397A1 (en) * 2006-04-21 2008-02-14 Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh Modular lighting system and lighting arrangement
US20080064253A1 (en) * 2006-07-10 2008-03-13 International Business Machines Corporation Jumper installation feedback
US7311548B1 (en) * 2006-07-10 2007-12-25 International Business Machines Corporation Jumper installation feedback
US7404734B2 (en) * 2006-07-10 2008-07-29 International Business Machines Corporation Jumper installation feedback
US20080009181A1 (en) * 2006-07-10 2008-01-10 Dunham Scott N Jumper installation feedback
US20080137377A1 (en) * 2006-12-11 2008-06-12 Gelcore, Llc Led light engine and method of manufacturing
US20090141468A1 (en) * 2007-12-03 2009-06-04 T.Y.C. Brother Industrial Co., Ltd. Light emitting assembly and method for assembling the same
US7897883B2 (en) * 2007-12-03 2011-03-01 T.Y.C. Brother Industrial Co., Ltd. Light emitting assembly and method for assembling the same
US8636390B2 (en) * 2008-09-29 2014-01-28 Cemm Thome Sk Spol Sro Light emitting diode lamp
US20100142218A1 (en) * 2008-09-29 2010-06-10 Olivier Middy Light emitting diode lamp
US20100155135A1 (en) * 2008-12-24 2010-06-24 Yazaki Corporation Illumination unit
US8128427B2 (en) * 2009-02-13 2012-03-06 Yazaki Corporation Illumination unit and wire harness equipped with the illumination unit
US20100210133A1 (en) * 2009-02-13 2010-08-19 Yazaki Corporation Illumination unit and wire harness equipped with the illumination unit
US8277093B2 (en) * 2009-03-09 2012-10-02 Yazaki Corporation Connector, LED unit, and method for producing connector
CN101834399A (en) * 2009-03-09 2010-09-15 矢崎总业株式会社 Connector, LED unit, and method for producing connector
US20100226140A1 (en) * 2009-03-09 2010-09-09 Yazaki Corporation Connector, LED unit, and method for producing connector
US9152755B2 (en) 2009-03-11 2015-10-06 Japan Aviation Electronics Industry, Limited Optical semiconductor device, socket, and optical semiconductor unit
US20100230709A1 (en) * 2009-03-11 2010-09-16 Japan Aviation Electronics Industry, Limited Optical semiconductor device, socket, and optical semiconductor unit
US20110149569A1 (en) * 2009-12-23 2011-06-23 Au Optronics Corporation Light-emitting diode module
US8052302B2 (en) * 2009-12-23 2011-11-08 Au Optronics Corporation Light-emitting diode module
US8758042B2 (en) * 2010-03-01 2014-06-24 Marlafin Ag Device for connecting a cable to an electric component arranged in a housing
US20130059462A1 (en) * 2010-03-01 2013-03-07 David Conroy Device for connecting a cable to an electric component arranged in a housing
US9903582B2 (en) * 2011-05-19 2018-02-27 Marquardt Mechatronik Gmbh Lighting unit for a household appliance
US20140140073A1 (en) * 2011-05-19 2014-05-22 Marquardt Mechatronik Gmbh Lighting unit for a household appliance
USD743285S1 (en) * 2014-02-14 2015-11-17 Checkpoint Systems, Inc. Deactivator
USD751935S1 (en) * 2014-02-14 2016-03-22 Checkpoint Systems, Inc. Deactivator
USD751936S1 (en) * 2014-02-14 2016-03-22 Checkpoint Systems, Inc. Deactivator
US20170130927A1 (en) * 2014-05-21 2017-05-11 Ford Global Technologies, Llc Headlight assembly with multiple high aspect ratio lenses
US11178736B2 (en) * 2018-04-27 2021-11-16 Valeo Vision Electronic assembly, lighting device and method for manufacturing a lighting device
CN116717759A (en) * 2023-05-11 2023-09-08 广州柏曼光电科技有限公司 Assembled modularized LED lamp

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US6386733B1 (en) 2002-05-14
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