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Publication numberUS20010015012 A1
Publication typeApplication
Application numberUS 09/079,857
Publication dateAug 23, 2001
Filing dateMay 15, 1998
Priority dateMar 6, 1997
Also published asUS6351885
Publication number079857, 09079857, US 2001/0015012 A1, US 2001/015012 A1, US 20010015012 A1, US 20010015012A1, US 2001015012 A1, US 2001015012A1, US-A1-20010015012, US-A1-2001015012, US2001/0015012A1, US2001/015012A1, US20010015012 A1, US20010015012A1, US2001015012 A1, US2001015012A1
InventorsEtsuji Suzuki, Akira Yonezawa, Toshio Okuno
Original AssigneeEtsuji Suzuki, Akira Yonezawa, Toshio Okuno
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Structure of conductive bump in wiring board
US 20010015012 A1
Abstract
A structure of a conductive bump in a wiring board having a wiring pattern on a surface of an insulating base, characterized in that a local portion of the insulating base is raised from the surface of the insulating base to form a projection and a surface of the projection is covered with a part of a lead forming the wiring pattern to form a conductive bump.
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Claims(2)
What is claimed is:
1. A structure of a conductive bump in a wiring board having a wiring pattern on a surface of an insulating base, characterized in that a local portion of said insulating base is raised from the surface of said insulating base to form a projection and a surface of said projection is covered with a part of a lead forming said wiring pattern to form a conductive bump.
2. A structure of a conductive bump in a wiring board characterized in that a bump is formed by a part of a lead forming said wiring pattern and a cavity is formed in said bump.
Description
    BACKGROUND OF THE INVENTION
  • [0001]
    This invention relates to a structure of a wiring board used for contact or connection with a given electronic part such as an IC or the like, and more particularly to a conductive bump in a wiring board to be subjected to the above contact or connection.
  • [0002]
    In this embodiment, the term “contact” refers to an electrical connection through free contact surface which comes into and out of connection freely, and the term “connection” refers to an electrical connection disconnectably joined through solder or the like.
  • [0003]
    Conventionally, when a given electronic part such as an IC is to be loaded on a wiring board for electrical connection, a wiring pattern is formed on the surface of the wiring board and an unlike metal such as a conductive paste or the like is bulged to form a conductive bump on the surface of a lead forming this wiring pattern, so that a terminal of the electrical part is contacted with or connected to the conductive bump.
  • [0004]
    Also, for achieving an electrical connection between a wiring board and another wiring board, according to another conventional method, the conductive bump is formed on the lead forming the wiring pattern of one of the wiring boards and contacted with or connected to a terminal formed on an end of the lead of the other wiring board.
  • [0005]
    However, the above conventional method for forming the conductive bump on the conductive lead of the wiring board by raising an unlike metal such as a solder paste or the like has such problems that the method for forming thereof is complicated, a positional accuracy is difficult to obtain, the configuration of the height of the conductive bumps is irregular, and so forth. Although this conventional technique can effectively cope with the requirement for a smaller pitch arrangement of terminals, actual practice thereof is jeopardized because of the above problems.
  • [0006]
    The present invention has been accomplished in view of the above situation.
  • SUMMARY OF THE INVENTION
  • [0007]
    It is, therefore, a general object of the present invention to provide a structure of a conductive bump in a wiring board which is capable of properly solving the above problems and enhancing the actual practice thereof.
  • [0008]
    To achieve the above object, there is essentially provided a structure of a conductive bump in a wiring board having a wiring pattern on a surface of an insulating base, characterized in that a local portion of the insulating base is raised from the surface of the insulating base to form a projection and a surface of the projection is covered with a part of a lead forming the wiring pattern to form a conductive bump.
  • [0009]
    From another aspect of the present invention, there is also provided a structure of a conductive bump in a wiring board characterized in that a bump is formed by a part of a lead forming the wiring pattern and a cavity is formed in the bump.
  • [0010]
    A more complete application of the present invention and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0011]
    [0011]FIG. 1 is a perspective view of a wiring board according to the present invention with a given electronic part such as an IC loaded thereon;
  • [0012]
    [0012]FIG. 2A is a sectional view of the wiring board of FIG. 1, showing a structure of a bump in which a conductive bump is backed up with an insulating projection, and FIG. 2B is a sectional view of FIG. 2A, showing a structure of a bump in which the conductive bump is backed up by a cavity;
  • [0013]
    [0013]FIG. 3A is an enlarged sectional view of FIG. 2A and FIG. 3B is an enlarged sectional view of FIG. 2B;
  • [0014]
    [0014]FIGS. 4A to 4E are sectional views showing the first example of a method of manufacturing a wiring board having the structure of a bump of FIG. 2A in the sequential order of processes;
  • [0015]
    [0015]FIGS. 5A to 5E are sectional views showing the second example of a method of manufacturing a wiring board having the structure of a bump of FIG. 2A in the sequential order of processes;
  • [0016]
    [0016]FIGS. 6A and 6B are sectional views showing the third example of a process of manufacturing a wiring board having a structure of a bump of FIG. 2A;
  • [0017]
    [0017]FIG. 7A is a sectional view of a wiring board showing a structure of a bump in which the conductive bump is of a hollow structure and backed up by the cavity and FIG. 7B is a plan view of FIG. 7A;
  • [0018]
    [0018]FIGS. 8A to 8E are sectional views showing one example of a method of manufacturing a wiring board of FIG. 7 in the sequential order of processes;
  • [0019]
    [0019]FIG. 9 is an enlarged sectional view of a bump portion, showing an example in which the conductive bump is made of hard metal;
  • [0020]
    [0020]FIG. 10 is a sectional view showing a tool for forming the conductive bump forming recesses in the transfer plate; and
  • [0021]
    [0021]FIGS. 11 A and 11B are side views showing another example of a tool for forming the conductive bump forming recesses in the transfer plate, and FIG. 11C is a perspective view showing still another example thereof.
  • DETAILED DESCRIPTION OF THE EMBODIMENT
  • [0022]
    As shown in FIG. 1, the wiring board 1 has a wiring pattern. This wiring pattern is formed by a lead 3 integrally attached to the surface of the insulating base 2 and extending in that condition. On end of the lead 3 is concentrated in a loading area of the IC 4 so the a conductive bump 3 a is formed by one end of the lead. The pump 3 a thus formed is subjected to contact or connection with a pad (terminal) 5 intimately contacted with the surface of the IC 4.
  • [0023]
    As means for forming the conductive bump 3 a, as shown in FIGS. 2A, 3A and 3B, a local portion of the insulating base 2 is raised from the surface of the insulating base 2 to form an insulating projection 6. This projection 6 is covered with a part of the lead 3. That is, the lead 3 is wired in such a manner as to cover the projection, thereby forming the conductive bump 3 a on an end portion of the lead 3.
  • [0024]
    This conductive bump 3 a is a bump which is formed by a known technique for forming the lead 3 on the surface of the insulating base 2. This bump 3 a has a bump structure in which an internal cavity, which can be formed when a part of the lead 3 is given with a chevron-like configuration, is filled by the projection 6 formed by locally raising the insulating base 2 and backed up.
  • [0025]
    The above conductive bump 3 a can be realized, for example, by a lead forming method of FIG. 4.
  • [0026]
    As shown in FIG. 4A, a transfer plate 8 formed of a metal plate as represented by SUS and provided with a chevron-like bump forming recess 7 opening at the surface, is prepared.
  • [0027]
    Then, as shown in FIG. 4B, a conductive film 10 is integrally overlain on the surface of the transfer plate 8. This conductive film 10 covers the entire surface of the transfer plate 8. However, where the bump forming recess 7 exists, the conductive film 10 is intimately contacted with the bottom surface in the recess 7 and given with a chevron-like configuration thereby to form the conductive bump 3 a and further to form the recess 7 inwardly of the conductive bump 3 a.
  • [0028]
    Then, as shown in FIG. 4C, an insulating layer is formed on the surface of the conductive film 10, thereby forming the insulating base 2 having a uniform thickness.
  • [0029]
    This insulating layer, i.e., the insulating layer 2 is partly filled in the recess 7 and locally raised to form the insulating projection 6 and further to form the conductive bump 3 a which is integrally intimately contacted with the surface of the projection 6 to cover thereof.
  • [0030]
    Then, as shown in FIG. 4D, the insulating base 2 is removed from the transfer plate 8. Then, as shown in FIG. 4E, the surface of the insulating base 2 thus removed is subjected to etching treatment so that the wiring pattern is formed. Thus, the bump 3 a covering the projection 16 is formed by a part of the lead 3 forming the wiring pattern. In other words, the bump 3 a covering the projection 6 by a part of the lead 3 is formed on an end portion of the lead 3 or at an intermediate part of the lead 3.
  • [0031]
    [0031]FIG. 5 shows another method for forming the bump 3 a of FIGS. 2A, 3A and 3B.
  • [0032]
    As shown in FIG. 5A, the transfer sheet 8 made of a metal plate as represented by SUS and provided with the chevron-like bump forming recesses 7 opening at the surface thereof is prepared.
  • [0033]
    Then, as shown in FIG. 5B, a photoresist is applied to the surface of the transfer plate 8, or a photoresist is laminated on the surface of the transfer plate 8 and subjected to patterning treatment through exposure and development so that resist patterns 11 are formed.
  • [0034]
    Then, as shown in FIG. 5C, the wiring pattern (lead 3) is grown on the surface of the transfer plate 8 between the resist patterns 11 through plating.
  • [0035]
    One end or an intermediate part of the lead 3 thus grown is integrally contacted with the bottom surface in the recess 7 at its area where the bump forming recess 7 exists and given with the chevron-like configuration, thereby forming the conductive bump 3 a and further forming the recess 7 in the inner surface of the conductive bump 3 a.
  • [0036]
    As shown in FIG. 5D, an insulating layer having a uniform thickness is formed in such a manner as to cover the surface of the wiring pattern. this insulating layer, i.e., the insulating base 2 is partly filled in the bump forming recess 7 to raise a local portion of the insulating base 2 so that the insulating projection 6 is formed. By doing so, there can be formed the conductive bump 3 a which is integrally intimately contacted with the surface of the insulating projection 6 to cover the surface.
  • [0037]
    Then, as shown in FIG. 5E, the insulating base 2 is removed from the transfer plate 8 to obtain the wiring board 1 having a structure of a conductive bump of FIGS. 2A, 3A and 3B.
  • [0038]
    [0038]FIG. 6 shows a method of manufacturing a wiring board having a structure in which the conductive bump 3 a is backed up by the insulating projection 6.
  • [0039]
    As shown in FIG. 6A, a transfer plate 6 made of metal having bump forming recesses 7 as in the abovementioned example is prepared. Then, the transfer plate 8, a conductive film 14 of a copper foil or the like, and an insulating base 2 are superimposed with a conductive film 14 disposed between the transfer plate 8 and the insulating base 2. The resultant is thermally welded together under pressure with use of a vacuum heat pressing machine or the like to form an integral layer structure. At the same time, a part of the insulating base 2 and a part of the conductive film 14 are pushed into the bump forming recesses 7 altogether and the resultant is removed to obtain a board with bumps as shown in FIG. 6B.
  • [0040]
    By pushing a local portion of the insulating base 2 and a local portion of the conductive film 14 into the bump forming recesses 7, a chevron-like insulating projection 6 is formed in each recess 7. At the same time, a chevron-like conductive film 14 is formed in the recess 7 to form the conductive bump 3 a.
  • [0041]
    Then, as in the same manner as in FIG. 4E, the conductive film 14 is subjected to patterning treatment through a photo-etching process or the like so that a wiring pattern is obtained.
  • [0042]
    In the embodiment of FIG. 6, as means for tightly and positively pushing the local portions of the insulating base 2 and the conductive film 14 into the bump forming recesses 7, as shown in FIG. 6A, the insulating bumps 15 are provided on the surface of the insulating base 2, i.e., the surface on the other side of the recesses 7. Then, by flatly compressing the insulating bumps 15 through a thermal pressure welding, a part of the base is tightly filled in the recesses 7 so that the wholesome insulating projections 6 can be formed.
  • [0043]
    In case the configuration of each conductive bump 3 a is small and the pitch is very small, too, the bumps 15 made of comparatively harder insulating material than the base 2 are formed on the insulating base 2 by printing or the like and then hot pressed. By doing so, the insulating base 2 and the conductive film 14 can more effectively be pushed into the recesses 7 and the conductive bumps 3 a can be formed into a predetermined configuration copying the inner surface of each conductive bump 3 a.
  • [0044]
    As one preferred example, in a wiring board 1 having a structure of a bump in which the conductive bumps 3 a are bucked up with the insulating projections 6, a rubber material is used as a material of the insulating base 2. By doing so, a bump structure in which the conductive pumps 3 a are backed up with the insulating projections 6 made of rubber material can be formed. In case the conductive bumps 3 a are brought into contact with another wiring board or a given electronic part such as an IC or the like, as shown in FIG. 1, it becomes possible that an appropriate elastic force is applied to the conductive bumps 3 a to increase the contacting pressure.
  • [0045]
    In the wiring board 1 obtained by FIGS. 4, 5 and 6, a local portion of the insulating base 2 is raised from the surface of the base 2 to form the projections 6. When the wiring patterns are to be formed, the surface of each projection 6 is covered with a part of the lead 3 to form the conductive bump 3.
  • [0046]
    In FIGS. 2A, 3A, 4, 5 and 6, another wiring pattern may be formed on the surface of the insulating base 2 on the other side of the wiring pattern. In this case, both the wiring patterns can be electrically connected together through the insulating base 2.
  • [0047]
    [0047]FIGS. 2B, 7A and 7B show a structure of a conductive bump in a wiring board, in which the wiring board 1 has a wiring pattern on the surface of the insulating base 2 and in such a wiring board 1, the bump 3 a is formed by a part of the lead 3 forming the wiring pattern and the cavity 12 is formed in the bump 3 a.
  • [0048]
    When the lead 3 is formed, a part of the lead 3 is locally applied with a chevron configuration and the same is intimately contacted with the insulating base 2. By doing so, the conductive bump 3 a having a cavity 12 formed between the projection and the insulating base by the chevron-like projection can be obtained.
  • [0049]
    The conductive bump 3 a is backed up by the cavity 12 and the cavity applies an elasticity to the conductive bump 3 a. The foregoing arrangement serves as means for increasing the contacting pressure with respect to the terminal 5 of the electronic part such as the IC 4 or the like. In order to ensure the elastic contacting pressure by the cavity 12, an air hole 13 leading to the cavity 12 may be formed in the insulating base 2 in such a manner that the air hole 13 extends through the insulating base 2.
  • [0050]
    One example of a method of forming the conductive bump 3 a backed up by the cavity 12 will now be described with reference to FIG. 8.
  • [0051]
    As shown in FIG. 8A, a transfer plate 8 made of a metal plate as represented by SUS and provided with chevron-like bump forming recesses 7 opening at the surface thereof is prepared.
  • [0052]
    Then, as shown in FIG. 8B, the conductive film 10 is integrally overlain on the surface of the transfer plate 8. This conductive film 10 covers the entire surface of the transfer plate 8. However, where the bump forming recess 7 exists, the conductive film 10 is intimately contacted with the bottom surface in the recess 7 and given with a chevron-like configuration thereby to form the conductive bump 3 a and further to form the recess 7 inwardly of the conductive bump 3 a.
  • [0053]
    Then, as shown in FIG. 8C, an insulating base 2 is integrally overlain on the surface of the conductive surface 8. By doing so, the recess 7 is tightly closed to form the cavity 12.
  • [0054]
    Then, as shown in FIG. 8D, the insulating base 2 is removed from the transfer plate 8. Then, as shown in FIG. 8E, the surface of the insulating base 2 thus removed is subjected to etching treatment so that the wiring pattern is formed. Thus, the bump 3 a backed up by the cavity 12 is formed on a part of the lead 3 forming the wiring pattern, for example, on an end portion of the lead 3 or at an intermediate part of the lead 3.
  • [0055]
    A method of forming the bump forming recesses 7 in the transfer plate 8 of FIGS. 4, 5, 6 and 8 will now be described with reference to FIGS. 10 and 11. The conductive bumps 3 a are often so small as 10 to 50 μm in height and 20 to 100 μm in bottom side length and arranged at so small pitches as 30 to 200 μm. The bump for the test use desirably has a generally conical configuration and is required to be uniform in configuration and pitch with precision.
  • [0056]
    In a method of forming such recesses 7 in the transfer plate 8, as shown in FIGS. 10, 11A and 11B, a tool 16 having a conical or generally conical tip 17 and made of ultra hard metal is vertically hammered on to the surface of the transfer plate 8 to give hammering traces thereon. Those hammering traces each have a conical or a generally conical configuration depending on the configuration of the tool tip 1 and provided as the bump forming recesses 7.
  • [0057]
    [0057]FIG. 10 shows an example in which the tool tip 17 has a conical configuration and the recesses having the same configuration are formed on the surface of the transfer plate 8.
  • [0058]
    In FIGS. 11A and 11B, the tool tip 17 has a conical configuration with a cutting head. In FIG. 11A, the top surface of the cutting head is flat, and in FIG. 11B, the top surface of the cutting head is formed with a plurality of teeth 18 each having a sharpened tip portion. In the example of FIG. 11C, the recesses 7 each having a trigonal prism like configuration are formed with use of a tool 16 having a tool tip 17 of the same configuration as the recesses 7. Accordingly, the conductive bumps 3 a formed by the recesses 7 exhibit a trigonal prism like configuration. The sharpened ridge lines of the conductive bumps 3 a are subjected to contact with or connected to the terminals of the electronic part such as the IC 4 or the like.
  • [0059]
    In any of the bump structure in which the conductive bumps 3 a are backed up by the conductive bumps 3 a as shown in FIG. 3 and of the bump structure in which the conductive bumps 3 a are backed up by the cavities 12 as shown in FIG. 7, only the conductive bumps 3 a may be made of harder metal than other lead 3 portion, such as Ni, Cr or the like, as shown in FIG. 9.
  • [0060]
    As a method of forming thereof, prior to formation of the conductive film 10, 14 or prior to plating of the leads 3 of FIGS. 4B, SC, 6A and 8B, the conductive bumps 3 a made of hard metal are formed on the inner surfaces of the recesses 7 and then, the soft conductive film 10, 14 made of copper or copper alloy or the like is overlain or the leads 3 are formed by growth of plating. In that case, as shown in FIG. 9, the leads made of copper or copper alloy are partly (conductive bumps 3 a) formed of a hard metal as shown in FIG. 9 or the leads 3 are partly applied with a chevron-like configuration by the recesses 7 to form the conductive bumps 3 a and the surfaces of the conductive bumps 3 a are covered with a harder conductive metal than the bumps, so that a composite structure is obtained. Those can be realized by the embodiments of the manufacturing methods of FIGS. 4, 5, 6 and 8.
  • [0061]
    The abovementioned wiring board may include a case where a plurality of leads 3 are arranged in array on the surface of the insulating base 2 and the conductive bumps 3 a having any one of the abovementioned bump structures are provided on the end portions of the leads 3 and thereafter, the conductive bumps 3 a are brought into contact, under pressure, with the terminals (electronic pads) of a given electronic part such as a liquid crystal display unit or the like.
  • [0062]
    According to the present invention, when a wiring pattern is formed on a wiring pattern, a conductive bump can be formed by a part of the conductive lead forming the wiring pattern and the conductive bumps can be formed at small pitches utilizing the technique for forming the wiring patterns at small pitches.
  • [0063]
    Furthermore, when the wiring pattern is formed through application of the known technique for forming the wiring pattern, merely by employing an additional means for providing the bump forming recesses in a local area of the pattern forming surface, uniform conductive bumps can be formed at equal pitches with precision.
  • [0064]
    Obviously, numerous modifications and variations of the present invention are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims, the present invention may be practiced otherwise than as specifically described herein.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US20080012592 *Jun 11, 2007Jan 17, 2008Samsung Electronics Co., Ltd.Device and method for testing semiconductor packages
Legal Events
DateCodeEventDescription
Jul 15, 1998ASAssignment
Owner name: YAMAICHI ELECTRONICS CO., LTD., JAPAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SUZUKI, ETSUJI;YONEZAWA, AKIRA;OKUNO, TOSHIO;REEL/FRAME:009311/0873
Effective date: 19980525
Owner name: SHOSHOTECH CO., LTD., JAPAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SUZUKI, ETSUJI;YONEZAWA, AKIRA;OKUNO, TOSHIO;REEL/FRAME:009311/0873
Effective date: 19980525
Sep 21, 2005REMIMaintenance fee reminder mailed
Mar 6, 2006LAPSLapse for failure to pay maintenance fees
May 2, 2006FPExpired due to failure to pay maintenance fee
Effective date: 20060305