US20010053063A1 - Surface mounted conduction heat sink - Google Patents
Surface mounted conduction heat sink Download PDFInfo
- Publication number
- US20010053063A1 US20010053063A1 US09/841,087 US84108701A US2001053063A1 US 20010053063 A1 US20010053063 A1 US 20010053063A1 US 84108701 A US84108701 A US 84108701A US 2001053063 A1 US2001053063 A1 US 2001053063A1
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- Prior art keywords
- heat sink
- heat
- circuit board
- printed circuit
- coupled
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Definitions
- the present invention is related to heat sinks for printed circuit boards, and more particularly to a system and method of transferring heat from electronic devices using a surface mounted conduction heat sink.
- Circuit boards are becoming more and more densely packed with electronic devices as the need for power, memory and additional capabilities increases. As a result the heat generated by these electronic devices also increases. The heat that is generated by an electronic device must be transferred away from the electronic device or the performance of the electronic device(s) will deteriorate.
- the problem of dissipating heat from electronic devices mounted on circuit boards gets worse when the piece of equipment employing the circuit board is mounted within a housing.
- fiber optic transmitter/receiver modules that include circuit boards are often environmentally sealed in a housing to prevent damage from the elements.
- the environmental housing's only mode of heat transfer to the ambient is natural convection.
- the transmitter/receiver module's only mode of heat transfer to the environmental housing is conduction.
- a classic thermal management technique uses thermal vias to dissipate heat.
- the thermal vias are located in a copper pad of a printed circuit board, under the device that needs cooling.
- a heat sink pad of a device is soldered to the copper pad of the circuit board.
- heat is transferred from the device's heat sink pad to the copper pad on the primary side of the circuit board.
- the heat is then transferred through the thermal vias to the far (secondary) side of the circuit board and to the housing of the transmitter/receiver module.
- the heat is then transferred by conduction from the transmitter/receiver module to the unit's environmental housing.
- a printed circuit board includes a first heat transfer pad on a surface of the printed circuit board and an electronic device having a top surface and a bottom surface, the bottom surface includes a second heat transfer pad.
- the second heat transfer pad is coupled to the first heat transfer pad.
- the printed circuit board includes a heat sink mounting pad on the surface of the printed circuit board, the heat sink mounting pad is located adjacent to and thermally coupled to the first heat transfer pad.
- the printed circuit board further includes a heat sink coupled to the heat sink mounting pad, the heat sink is thermally coupled to the electronic device.
- an environmentally sealed housing for a fiber optic transmitter/receiver module includes a printed circuit board having a primary and a secondary surface.
- the primary surface includes a first heat transfer pad and a heat sink mounting pad adjacent to and thermally coupled to the first heat transfer pad.
- the housing includes an electronic device having a top and a bottom surface.
- the bottom surface includes a second heat transfer pad that is coupled to the first heat transfer pad.
- the housing further includes a heat sink coupled to the heat sink mounting pad. The heat sink is thermally coupled to both the electronic device and the environmentally sealed housing.
- a heat sink in a further embodiment, includes a pair of substantially parallel vertical legs and a horizontal member coupled between the legs to form a “U” shape.
- the horizontal member includes an outer surface and an inner surface both having a layer of thermal interface material.
- the heat sink is surface mountable to a heat sink mounting pad on a surface of a printed circuit board.
- the heat sink mounting pad is adjacent and coupled to a heat transfer pad of an electronic device.
- the heat sink adapted to be thermally coupled to the electronic device.
- FIG. 1 is an illustration of one embodiment of a heat sink according to the teachings of the present invention.
- FIG. 2 is an illustration of another embodiment of a heat sink according to the teachings of the present invention.
- FIG. 3 is an illustration of a top and a side view of an embodiment of a heat transfer pad and heat sink mounting pad according to the teachings of the present invention.
- FIG. 4 is an illustration of a top and a side view of an embodiment of a heat transfer pad and solder mask according to the teachings of the present invention.
- FIG. 1 is an illustration of one embodiment of a heat sink mounted on a circuit board shown generally at 100 and constructed according to the teachings of the present invention.
- an electronic device 110 is mounted on a printed circuit board 111 .
- the printed circuit board 111 has a primary surface 112 and a secondary surface 114 .
- the electronic device 110 is mounted onto a heat transfer pad 150 on the surface of the printed circuit board 111 .
- electronic device 110 includes a heat sink pad or heat transfer pad 161 which couples to the heat sink pad 150 on the printed circuit board 111 .
- the electronic device 110 is coupled to heat sink 140 via heat sinking mounting pads 154 thermally coupled to the heat sink pad 150 on the printed circuit board 111 .
- Heat transfer pad 150 on the surface of printed circuit board 111 and heat transfer pad 161 of electronic device 110 are illustrated as being approximately the same width and length as electronic device 110 . It is understood that the dimensions of heat transfer pads 150 and 161 are not limited to the dimensions of the electronic device such as 110 that couples to them. The heat transfer pads 150 and 161 may comprise one or more pads larger or smaller than the dimensions of the electronic device 110 .
- FIG. 3 is an illustration of one embodiment of a top view 300 and a side view 301 of a heat transfer pad 350 and a heat sink mounting pad 354 - 1 as discussed above.
- Heat transfer pad 350 and heat sink mounting pad 354 - 1 are on the top or primary surface 312 of printed circuit board 311 .
- heat transfer pad 350 is coupled to heat sink mounting pad 354 - 1 by thermally conductive leads 352 .
- Leads 352 are for illustration and may comprise one or more leads of varying sizes.
- heat transfer pad 350 and heat sink mounting pad 354 - 1 are one continuous pad.
- heat transfer pad 350 includes two heat sink mounting pads 354 - 1 and 354 - 2 having one or more interconnecting leads such as 352 .
- FIG. 3 illustrates that the heat sink mounting pads 354 are located on opposite sides of heat transfer pad 350 . It is understood by one skilled in the art that the heat sink mounting pads 354 are not restricted to the size, shape or location illustrated but may include any number of pads of any shape or location about the heat transfer pad 350 .
- FIG. 4 is another illustration of one embodiment of a top view 400 and a side view 401 of a heat transfer pad and heat sink mounting pad as a single pad 450 with a solder mask 429 - 1 .
- Solder mask 429 - 1 is located on top of pad 450 separating heat transfer pad portion 459 from heat sink mounting pad portion 454 - 1 .
- Heat transfer pad 450 and solder mask 429 - 1 are on the top or primary surface 412 of printed circuit board 411 .
- FIG. 4 illustrates a single pad 450 for mounting an electronic device on heat transfer pad portion 459 and mounting a heat sink on heat sink mounting pad portion 454 - 1 .
- solder masks 429 - 1 and 429 - 2 are placed on pad 450 so as to form two heat sink mounting pads 454 - 1 and 454 - 2 and a single heat transfer pad 459 .
- the use of solder masks in FIG. 4 is by way of illustration only and the method of separating the electronic device from the heat sink on a printed circuit board may include any suitable method such barriers, spacers or the like.
- the electronic devices, heat sinks, and other components are not limited to soldering but may be attached to the printed circuit board or heat sink pad via surface mounting, soldering using solder balls or the like, thermally and electrically conductive adhesives or other suitable materials having appropriate thermal and electrical properties. It is understood by one skilled in the art that the mounting pads discussed with respect to FIGS. 3 and 4, although shown on top of the printed circuit board, are not restricted to being located on top of the board. For example, the mounting pads may be part of the printed circuit board surface, below the printed board circuit surface or on top of another layer or surface on the printed circuit board.
- FIG. 3 illustrates heat sink mounting pads 354 located on opposite sides of heat transfer pad 350 and FIG. 4 illustrates solder masks 454 for separating heat sinks mounted on opposite sides of heat transfer pad portion 459 .
- the heat sink mounting pads 354 and masks 454 are not restricted to the size, shape or location illustrated but may include any number of pads of any shape or location adjacent to and thermally coupled to heat transfer pads 350 and 450 .
- the heat transfer pads 350 and 450 are not restricted to one single pad, in alternate embodiments, pads 350 and 450 comprise two or more smaller pads that are thermally interconnected to provide a path to draw heat from the electronic device.
- Heat sink mounting pads 354 and heat transfer pad 350 and 450 are made of a thermally conductive material such as copper.
- the pads and interconnects are formed from other suitable materials having appropriate thermal and electrical properties such as, for example, aluminum, gold, silver, or other metal.
- the pads may include a thermal insert layer such as T-PLITM, T-FORMTM, CHO-THERMTM, or thermally and electrically conductive adhesives or pastes or other suitable materials having appropriate thermal and electrical properties.
- T-PLITM and T-FORMTM are thermal interface materials manufactured by Thermagon, Inc., 4707 Detroit St., Cleveland, Ohio 44109.
- CHO-THERMTM is a thermal interface material manufactured by Chomerics, a division of Parker Hannifin, 77 Dragon Court, Woburn, Mass. 01888.
- an electronic device such as 110 of FIG. 1, heats up.
- the heat is transferred to a heat transfer pad such as 350 and to heat sink 140 via heat sink mounting pads such as 354 .
- the heat is transferred to heat sink 140 via a heat transfer pad such as 450 .
- Heat sink 140 conducts the heat away from electronic device 110 .
- the printed circuit board 111 is mounted into a housing 130 and heat sink 140 is thermally coupled to housing 130 .
- heat sink 140 conducts the heat to housing 130 that in turn disperses the heat to the ambient air.
- heat sink 140 straddles the electronic device 110 and is thermally coupled with the top of the electronic device 110 and draws heat from the surface of the electronic device 110 .
- heat sink 140 includes a thermally conductive interface layer 120 between the electronic device 110 and the heat sink 140 .
- the thermal interface layer 120 consists of a thermal interface material such as T-PLITM, T-FORMTM, CHO-THERMTM, or the like.
- the heat sink 140 is coupled to an outer housing 130 that includes an inner layer of a thermally conductive material 122 such as T-PLITM, T-FORMTM, CHO-THERMTM, or the like.
- heat sink 140 includes a layer of thermally conductive material such as T-PLITM, T-FORMTM, CHO-THERMTM, or the like.
- printed circuit board 111 is part of a fiber optic transmitter/receiver module within housing 130 .
- the fiber optic transmitter/receiver module is environmentally sealed within a second housing 155 .
- the transmitter/receiver module housing 130 is thermally coupled to environmentally sealed housing 155 .
- environmentally sealed housing 155 includes an inner layer of a thermally conductive material between the transmitter/receiver module housing 130 and the environmentally sealed housing 155 .
- the thermally conductive material comprises a material such as T-PLITM, T-FORMTM, CHO-THERMTM, or the like.
- FIG. 2 is an illustration of another embodiment of a heat sink mounted on a circuit board, shown generally at 200 , and constructed according to the teachings of the present invention.
- a circuit board 211 has a primary surface 212 and a secondary surface 214 .
- an electronic device 210 is mounted to the primary surface 212 of circuit board 211 .
- electronic device 210 includes a heat transfer pad 261 coupled to the bottom of electronic device 210 . The heat transfer pad 261 draws heat from the electronic device 210 .
- electronic device 210 is mounted to a heat transfer pad 250 that is on the primary surface 212 of the circuit board 211 and aids in drawing heat from electronic device 210 .
- a component 260 is mounted to the secondary surface 214 of circuit board 211 .
- Component 260 may be an electronic device, an enclosure for an electronic device, a spacer or any other component mounted on the printed circuit board.
- a heat sink 240 is coupled to the secondary surface 214 of circuit board 211 .
- circuit board 211 includes thermal vias 280 which are formed through circuit board 211 and aid in conducting heat from electronic device 210 on the primary side 212 through the printed circuit 211 to heat sink 240 on the secondary side 214 .
- Electronic device 210 on the primary side is thermally coupled to heat sink 240 on the secondary side by vias 280 . Although only two vias 280 are illustrated with respect to FIG.
- heat sink 240 includes thermally conductive heat sink mounting pads 264 that aid in conducting heat from electronic device 210 through vias 280 .
- thermal via is a thermally conductive conduit through which heat is conducted.
- thermal vias 280 are formed by drilling holes through printed circuit board 211 and filling the hole with a thermally conductive material such as copper.
- thermal vias 280 are formed by drilling, routing, punching holes or slots, or the like in the printed circuit board 211 and filling with an appropriate thermally conductive material.
- electronic component 210 heats up, this heat is transferred to heat sink 240 by thermal vias 280 .
- the heat is transferred to a heat sink pad such as 350 or 450 of FIGS. 3 and 4, respectively, and then transferred to heat sink 240 by thermal vias 280 .
- printed circuit board 211 is enclosed in a housing 230 and heat sink 240 is thermally coupled to housing 230 . The heat is conducted from heat sink 240 to enclosure 230 for dispersion to the ambient air.
- enclosure 230 includes a layer of thermally conductive material 220 , such as T-PLITM, T-FORMTM, CHO-THERMTM, that is thermally coupled to heat sink 240 and aids in the conduction of heat from the heat sink 240 to the housing 230 .
- thermally conductive material 220 such as T-PLITM, T-FORMTM, CHO-THERMTM
- printed circuit board 211 is part of a fiber optic transmitter/receiver module within housing 230 .
- the fiber optic transmitter/receiver module is environmentally sealed within a second housing 255 .
- the transmitter/receiver module housing 230 is thermally coupled to environmentally sealed housing 255 .
- environmentally sealed housing 255 includes an inner layer of a thermally conductive material between the transmitter/receiver module housing 230 and the environmentally sealed housing 255 .
- the thermally conductive material comprises a material such as T-PLITM, T-FORMTM, CHO-THERMTM, or the like.
- both the heat sink 140 described with respect to FIG. 1 and the heat sink 240 described with respect to FIG. 2 are employed on one circuit board to draw heat from electronic devices.
- Heat sinks 140 and 240 may be employed in any combination for one or more electronic components. It is understood that components such as electronic device 110 and 210 , heat sink 140 and 240 , component 260 may be coupled to the printed circuit in a number of ways to include surface mounting, soldering using solder balls or the like, thermally and electrically conductive adhesives or any other suitable materials having appropriate thermal and electrical properties.
- the heat sinks described are made of a thermally conductive material such as copper.
- the heat sinks are formed from other suitable materials having appropriate thermal and electrical properties such as, for example, aluminum, gold, silver, or other metal.
- the electronic devices, heat sinks, and other components mounted on the circuit board are not limited to soldering but may be attached to the printed circuit board or heat sink pads via surface mounting, soldering using solder balls or the like, thermally and electrically conductive adhesives or other suitable materials having appropriate thermal and electrical properties.
- the heat sink in one embodiment is a “U” shape and straddles the electronic device.
- the heat sink is “L” shaped and is thermally coupled to the top of the electronic device from one side.
- the heat sink has four legs and straddles the electronic device. Each of the legs thermally couples to the electronic device. It is understood that the heat sink can be one of a variety of shapes that thermally couple to one or more electronic devices.
- the heat sink is employed in a fiber optic transmitter/receiver module that is environmentally sealed in a housing in other embodiments, the heat sink is employed in housings that are not environmentally sealed and in applications other than fiber optic transmitter/receiver modules.
- the heat sink aids in drawing heat away from an electronic device, in other embodiments, the heat sink aids in drawing heat away from one or more electronic devices.
- a heat sink is thermally coupled to one or more electronic devices, heat transfer pads and/or thermal vias or any combination of electronic devices, heat transfer pads and thermal vias to aid in drawing heat away from one or more electronic devices.
Abstract
Description
- The present invention is related to heat sinks for printed circuit boards, and more particularly to a system and method of transferring heat from electronic devices using a surface mounted conduction heat sink.
- Circuit boards are becoming more and more densely packed with electronic devices as the need for power, memory and additional capabilities increases. As a result the heat generated by these electronic devices also increases. The heat that is generated by an electronic device must be transferred away from the electronic device or the performance of the electronic device(s) will deteriorate. The problem of dissipating heat from electronic devices mounted on circuit boards gets worse when the piece of equipment employing the circuit board is mounted within a housing. For example, fiber optic transmitter/receiver modules that include circuit boards are often environmentally sealed in a housing to prevent damage from the elements. As a result, the ability to dissipate heat from the electronic devices mounted on the circuit boards becomes challenging. The environmental housing's only mode of heat transfer to the ambient is natural convection. The transmitter/receiver module's only mode of heat transfer to the environmental housing is conduction.
- A classic thermal management technique uses thermal vias to dissipate heat. The thermal vias are located in a copper pad of a printed circuit board, under the device that needs cooling. A heat sink pad of a device is soldered to the copper pad of the circuit board. During operation of the device, heat is transferred from the device's heat sink pad to the copper pad on the primary side of the circuit board. The heat is then transferred through the thermal vias to the far (secondary) side of the circuit board and to the housing of the transmitter/receiver module. The heat is then transferred by conduction from the transmitter/receiver module to the unit's environmental housing. As the component density in an electronic module increases, it becomes difficult to use classical thermal vias to dissipate heat.
- The above mentioned problems with meeting the thermal requirements of electronic devices mounted on circuit boards are addressed by the present invention and will be understood by reading and studying the following specification.
- In one embodiment, a printed circuit board is provided. The printed circuit board includes a first heat transfer pad on a surface of the printed circuit board and an electronic device having a top surface and a bottom surface, the bottom surface includes a second heat transfer pad. The second heat transfer pad is coupled to the first heat transfer pad. The printed circuit board includes a heat sink mounting pad on the surface of the printed circuit board, the heat sink mounting pad is located adjacent to and thermally coupled to the first heat transfer pad. The printed circuit board further includes a heat sink coupled to the heat sink mounting pad, the heat sink is thermally coupled to the electronic device.
- In another embodiment, an environmentally sealed housing for a fiber optic transmitter/receiver module is provided. The housing includes a printed circuit board having a primary and a secondary surface. The primary surface includes a first heat transfer pad and a heat sink mounting pad adjacent to and thermally coupled to the first heat transfer pad. The housing includes an electronic device having a top and a bottom surface. The bottom surface includes a second heat transfer pad that is coupled to the first heat transfer pad. The housing further includes a heat sink coupled to the heat sink mounting pad. The heat sink is thermally coupled to both the electronic device and the environmentally sealed housing.
- In a further embodiment, a heat sink is provided. The heat sink includes a pair of substantially parallel vertical legs and a horizontal member coupled between the legs to form a “U” shape. The horizontal member includes an outer surface and an inner surface both having a layer of thermal interface material. The heat sink is surface mountable to a heat sink mounting pad on a surface of a printed circuit board. The heat sink mounting pad is adjacent and coupled to a heat transfer pad of an electronic device. The heat sink adapted to be thermally coupled to the electronic device.
- FIG. 1 is an illustration of one embodiment of a heat sink according to the teachings of the present invention.
- FIG. 2 is an illustration of another embodiment of a heat sink according to the teachings of the present invention.
- FIG. 3 is an illustration of a top and a side view of an embodiment of a heat transfer pad and heat sink mounting pad according to the teachings of the present invention.
- FIG. 4 is an illustration of a top and a side view of an embodiment of a heat transfer pad and solder mask according to the teachings of the present invention.
- In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the present invention.
- Since the component density is so high in the new circuit board designs, it is physically impossible to directly contact the far (secondary) side of the printed circuit board with the housing of the device modules as stated in the classic technique. This invention overcomes this obstacle by providing alternate conduction/cooling paths from the electrical device to the housing.
- FIG. 1 is an illustration of one embodiment of a heat sink mounted on a circuit board shown generally at100 and constructed according to the teachings of the present invention. In this embodiment, an
electronic device 110 is mounted on a printedcircuit board 111. The printedcircuit board 111 has aprimary surface 112 and asecondary surface 114. In one embodiment, theelectronic device 110 is mounted onto aheat transfer pad 150 on the surface of the printedcircuit board 111. In one embodiment,electronic device 110 includes a heat sink pad orheat transfer pad 161 which couples to theheat sink pad 150 on the printedcircuit board 111. Theelectronic device 110 is coupled toheat sink 140 via heatsinking mounting pads 154 thermally coupled to theheat sink pad 150 on the printedcircuit board 111.Heat transfer pad 150 on the surface of printedcircuit board 111 andheat transfer pad 161 ofelectronic device 110 are illustrated as being approximately the same width and length aselectronic device 110. It is understood that the dimensions ofheat transfer pads heat transfer pads electronic device 110. - FIG. 3 is an illustration of one embodiment of a
top view 300 and aside view 301 of aheat transfer pad 350 and a heat sink mounting pad 354-1 as discussed above.Heat transfer pad 350 and heat sink mounting pad 354-1 are on the top orprimary surface 312 of printedcircuit board 311. In one embodiment,heat transfer pad 350 is coupled to heat sink mounting pad 354-1 by thermallyconductive leads 352.Leads 352 are for illustration and may comprise one or more leads of varying sizes. For example, in one embodiment,heat transfer pad 350 and heat sink mounting pad 354-1 are one continuous pad. In another embodiment,heat transfer pad 350 includes two heat sink mounting pads 354-1 and 354-2 having one or more interconnecting leads such as 352. FIG. 3 illustrates that the heat sink mounting pads 354 are located on opposite sides ofheat transfer pad 350. It is understood by one skilled in the art that the heat sink mounting pads 354 are not restricted to the size, shape or location illustrated but may include any number of pads of any shape or location about theheat transfer pad 350. - FIG. 4 is another illustration of one embodiment of a
top view 400 and aside view 401 of a heat transfer pad and heat sink mounting pad as asingle pad 450 with a solder mask 429-1. Solder mask 429-1 is located on top ofpad 450 separating heattransfer pad portion 459 from heat sink mounting pad portion 454-1.Heat transfer pad 450 and solder mask 429-1 are on the top orprimary surface 412 of printedcircuit board 411. FIG. 4 illustrates asingle pad 450 for mounting an electronic device on heattransfer pad portion 459 and mounting a heat sink on heat sink mounting pad portion 454-1. As a result once soldered to pad 459 an electronic device is thermally coupled to a heat sink via single combination heat transfer pad and heatsink mounting pad 450. In an alternate embodiment, solder masks 429-1 and 429-2 are placed onpad 450 so as to form two heat sink mounting pads 454-1 and 454-2 and a singleheat transfer pad 459. The use of solder masks in FIG. 4 is by way of illustration only and the method of separating the electronic device from the heat sink on a printed circuit board may include any suitable method such barriers, spacers or the like. The electronic devices, heat sinks, and other components are not limited to soldering but may be attached to the printed circuit board or heat sink pad via surface mounting, soldering using solder balls or the like, thermally and electrically conductive adhesives or other suitable materials having appropriate thermal and electrical properties. It is understood by one skilled in the art that the mounting pads discussed with respect to FIGS. 3 and 4, although shown on top of the printed circuit board, are not restricted to being located on top of the board. For example, the mounting pads may be part of the printed circuit board surface, below the printed board circuit surface or on top of another layer or surface on the printed circuit board. - FIG. 3 illustrates heat sink mounting pads354 located on opposite sides of
heat transfer pad 350 and FIG. 4 illustrates solder masks 454 for separating heat sinks mounted on opposite sides of heattransfer pad portion 459. It is understood by one skilled in the art that the heat sink mounting pads 354 and masks 454 are not restricted to the size, shape or location illustrated but may include any number of pads of any shape or location adjacent to and thermally coupled toheat transfer pads heat transfer pads pads - Heat sink mounting pads354 and
heat transfer pad pads - In operation, an electronic device such as110 of FIG. 1, heats up. The heat is transferred to a heat transfer pad such as 350 and to
heat sink 140 via heat sink mounting pads such as 354. In another embodiment, the heat is transferred toheat sink 140 via a heat transfer pad such as 450.Heat sink 140 conducts the heat away fromelectronic device 110. In one embodiment, the printedcircuit board 111 is mounted into ahousing 130 andheat sink 140 is thermally coupled tohousing 130. In this embodiment,heat sink 140 conducts the heat tohousing 130 that in turn disperses the heat to the ambient air. In another embodiment,heat sink 140 straddles theelectronic device 110 and is thermally coupled with the top of theelectronic device 110 and draws heat from the surface of theelectronic device 110. In one embodiment,heat sink 140 includes a thermallyconductive interface layer 120 between theelectronic device 110 and theheat sink 140. Thethermal interface layer 120 consists of a thermal interface material such as T-PLI™, T-FORM™, CHO-THERM™, or the like. In another embodiment, theheat sink 140 is coupled to anouter housing 130 that includes an inner layer of a thermallyconductive material 122 such as T-PLI™, T-FORM™, CHO-THERM™, or the like. In an alternate embodiment,heat sink 140 includes a layer of thermally conductive material such as T-PLI™, T-FORM™, CHO-THERM™, or the like. - In one embodiment, printed
circuit board 111 is part of a fiber optic transmitter/receiver module withinhousing 130. In another embodiment, the fiber optic transmitter/receiver module is environmentally sealed within asecond housing 155. In one embodiment, the transmitter/receiver module housing 130 is thermally coupled to environmentally sealedhousing 155. In another embodiment, environmentally sealedhousing 155 includes an inner layer of a thermally conductive material between the transmitter/receiver module housing 130 and the environmentally sealedhousing 155. The thermally conductive material comprises a material such as T-PLI™, T-FORM™, CHO-THERM™, or the like. - FIG. 2 is an illustration of another embodiment of a heat sink mounted on a circuit board, shown generally at200, and constructed according to the teachings of the present invention. A
circuit board 211 has aprimary surface 212 and asecondary surface 214. In this embodiment, anelectronic device 210 is mounted to theprimary surface 212 ofcircuit board 211. In one embodiment,electronic device 210 includes aheat transfer pad 261 coupled to the bottom ofelectronic device 210. Theheat transfer pad 261 draws heat from theelectronic device 210. In one embodiment,electronic device 210 is mounted to aheat transfer pad 250 that is on theprimary surface 212 of thecircuit board 211 and aids in drawing heat fromelectronic device 210. Acomponent 260 is mounted to thesecondary surface 214 ofcircuit board 211.Component 260 may be an electronic device, an enclosure for an electronic device, a spacer or any other component mounted on the printed circuit board. Aheat sink 240 is coupled to thesecondary surface 214 ofcircuit board 211. In one embodiment,circuit board 211 includesthermal vias 280 which are formed throughcircuit board 211 and aid in conducting heat fromelectronic device 210 on theprimary side 212 through the printedcircuit 211 toheat sink 240 on thesecondary side 214.Electronic device 210 on the primary side is thermally coupled toheat sink 240 on the secondary side byvias 280. Although only twovias 280 are illustrated with respect to FIG. 2, it is understood that any number of vias as appropriate may be utilized to aid in conducting heat from electronic devices such as 210 mounted on thecircuit board 211. In one embodiment,heat sink 240 includes thermally conductive heatsink mounting pads 264 that aid in conducting heat fromelectronic device 210 throughvias 280. - A thermal via is a thermally conductive conduit through which heat is conducted. In one embodiment,
thermal vias 280 are formed by drilling holes through printedcircuit board 211 and filling the hole with a thermally conductive material such as copper. In alternate embodiments,thermal vias 280 are formed by drilling, routing, punching holes or slots, or the like in the printedcircuit board 211 and filling with an appropriate thermally conductive material. - In operation,
electronic component 210 heats up, this heat is transferred toheat sink 240 bythermal vias 280. In one embodiment, the heat is transferred to a heat sink pad such as 350 or 450 of FIGS. 3 and 4, respectively, and then transferred toheat sink 240 bythermal vias 280. In one embodiment, printedcircuit board 211 is enclosed in ahousing 230 andheat sink 240 is thermally coupled tohousing 230. The heat is conducted fromheat sink 240 toenclosure 230 for dispersion to the ambient air. In an alternate embodiment,enclosure 230 includes a layer of thermallyconductive material 220, such as T-PLI™, T-FORM™, CHO-THERM™, that is thermally coupled toheat sink 240 and aids in the conduction of heat from theheat sink 240 to thehousing 230. - In one embodiment, printed
circuit board 211 is part of a fiber optic transmitter/receiver module withinhousing 230. In another embodiment, the fiber optic transmitter/receiver module is environmentally sealed within asecond housing 255. In one embodiment, the transmitter/receiver module housing 230 is thermally coupled to environmentally sealedhousing 255. In another embodiment, environmentally sealedhousing 255 includes an inner layer of a thermally conductive material between the transmitter/receiver module housing 230 and the environmentally sealedhousing 255. The thermally conductive material comprises a material such as T-PLI™, T-FORM™, CHO-THERM™, or the like. - In another embodiment, both the
heat sink 140 described with respect to FIG. 1 and theheat sink 240 described with respect to FIG. 2 are employed on one circuit board to draw heat from electronic devices. Heat sinks 140 and 240 may be employed in any combination for one or more electronic components. It is understood that components such aselectronic device heat sink component 260 may be coupled to the printed circuit in a number of ways to include surface mounting, soldering using solder balls or the like, thermally and electrically conductive adhesives or any other suitable materials having appropriate thermal and electrical properties. - In one embodiment, the heat sinks described are made of a thermally conductive material such as copper. For an alternate embodiment of the present invention, the heat sinks are formed from other suitable materials having appropriate thermal and electrical properties such as, for example, aluminum, gold, silver, or other metal.
- The electronic devices, heat sinks, and other components mounted on the circuit board are not limited to soldering but may be attached to the printed circuit board or heat sink pads via surface mounting, soldering using solder balls or the like, thermally and electrically conductive adhesives or other suitable materials having appropriate thermal and electrical properties.
- Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that any arrangement that is calculated to achieve the same purpose may be substituted for the specific embodiment shown. This application is intended to cover any adaptations or variations of the present invention. For example, the heat sink in one embodiment is a “U” shape and straddles the electronic device. In further embodiments, the heat sink is “L” shaped and is thermally coupled to the top of the electronic device from one side. In other embodiments, the heat sink has four legs and straddles the electronic device. Each of the legs thermally couples to the electronic device. It is understood that the heat sink can be one of a variety of shapes that thermally couple to one or more electronic devices. In addition, in one embodiment the heat sink is employed in a fiber optic transmitter/receiver module that is environmentally sealed in a housing in other embodiments, the heat sink is employed in housings that are not environmentally sealed and in applications other than fiber optic transmitter/receiver modules. Further, in one embodiment the heat sink aids in drawing heat away from an electronic device, in other embodiments, the heat sink aids in drawing heat away from one or more electronic devices. For example, a heat sink is thermally coupled to one or more electronic devices, heat transfer pads and/or thermal vias or any combination of electronic devices, heat transfer pads and thermal vias to aid in drawing heat away from one or more electronic devices.
Claims (62)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US09/841,087 US6356447B2 (en) | 2000-06-20 | 2001-04-24 | Surface mounted conduction heat sink |
US09/991,456 US6519156B2 (en) | 2000-06-20 | 2001-11-20 | Surface mounted conduction heat sink |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US09/597,535 US6249434B1 (en) | 2000-06-20 | 2000-06-20 | Surface mounted conduction heat sink |
US09/841,087 US6356447B2 (en) | 2000-06-20 | 2001-04-24 | Surface mounted conduction heat sink |
Related Parent Applications (1)
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US09/597,535 Division US6249434B1 (en) | 2000-06-20 | 2000-06-20 | Surface mounted conduction heat sink |
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US09/991,456 Continuation US6519156B2 (en) | 2000-06-20 | 2001-11-20 | Surface mounted conduction heat sink |
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US09/991,456 Expired - Lifetime US6519156B2 (en) | 2000-06-20 | 2001-11-20 | Surface mounted conduction heat sink |
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US09/597,535 Expired - Lifetime US6249434B1 (en) | 2000-06-20 | 2000-06-20 | Surface mounted conduction heat sink |
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US09/991,456 Expired - Lifetime US6519156B2 (en) | 2000-06-20 | 2001-11-20 | Surface mounted conduction heat sink |
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Also Published As
Publication number | Publication date |
---|---|
US6249434B1 (en) | 2001-06-19 |
US6519156B2 (en) | 2003-02-11 |
US20020030973A1 (en) | 2002-03-14 |
US6356447B2 (en) | 2002-03-12 |
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