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Publication numberUS20020046825 A1
Publication typeApplication
Application numberUS 09/947,443
Publication dateApr 25, 2002
Filing dateSep 7, 2001
Priority dateOct 23, 2000
Also published asDE10147094A1
Publication number09947443, 947443, US 2002/0046825 A1, US 2002/046825 A1, US 20020046825 A1, US 20020046825A1, US 2002046825 A1, US 2002046825A1, US-A1-20020046825, US-A1-2002046825, US2002/0046825A1, US2002/046825A1, US20020046825 A1, US20020046825A1, US2002046825 A1, US2002046825A1
InventorsWen-Shi Huang, Kuo-Cheng Lin, Chien-Wen Yu
Original AssigneeWen-Shi Huang, Kuo-Cheng Lin, Chien-Wen Yu
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Cooling device using magnetizated thermal-conduction liquid
US 20020046825 A1
Abstract
The present invention discloses a cooling device using thermal-conductive liquid. The present invention includes a base, a means for generating magnetic field and a plurality of thermal-conductive fins. Among these, the base includes a circuit pipe accommodating a magnetized thermal-conductive liquid. The means for generating magnetic field is positioned in the base and used to generate a magnetic field. The thermal-conductive fins are formed on the base and the surround the circuit pipe. The magnetic field generated by the means for generating magnetic field makes the magnetized thermal-conductive liquid flows so as to dissipate heat.
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Claims(13)
What is claimed is:
1. A cooling device, comprising:
a base, including a circuit pipe accommodating a magnetized thermal-conductive liquid; and
a means for generating a magnetic field.
2. The cooling device according to claim 1, wherein said cooling device further comprises a plurality thermal-conductive fins formed on said base.
3. The cooling device according to claim 2, wherein said cooling device further comprises a seal interposed between said base and said base.
4. The cooling device according to claim 1, wherein said means for generating a magnetic field comprises a winding.
5. The cooling device according to claim 1, wherein said magnetic field generated by said means for generating a magnetic field makes said magnetized thermal-conductive liquid flow.
6. The cooling device according to claim 1, wherein said magnetized thermal-conductive liquid comprises a liquid having magnetic particles.
7. The cooling device according to claim 1, wherein said magnetized thermal-conductive liquid comprises a liquid having metallic particles.
8. A cooling device, comprising:
a base, including a circuit pipe accommodating a magnetized thermal-conductive liquid;
a means for generating a magnetic field; and
a plurality of thermal-conductive fins, formed on the base.
9. The cooling device according to claim 8, wherein said cooling device further comprises a seal interposed between said base and said base.
10. The cooling device according to claim 8, wherein said means for generating a magnetic field comprises a winding.
11. The cooling device according to claim 8, wherein said magnetic field generated by said means for generating a magnetic field makes said magnetized thermal-conductive liquid flow.
12. The cooling device according to claim 8, wherein said magnetized thermal-conductive liquid comprises a liquid having magnetic particles.
13. The cooling device according to claim 8, wherein said magnetized thermal-conductive liquid comprises a liquid having metallic particles.
Description
BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a cooling device, and more particularly to a cooling device using magnetized thermal-conduction liquid to dissipate heat.

[0003] 2. Description of the Prior Art

[0004] As the electric device progresses in performance, a cooling device or system becomes indispensable for dissipating the heat generated by the electric device. The heat generated by the electric device should be properly dissipated, otherwise the performance may be encumbered with the accumulated heat or the worst burns the electric devices. With regard to the micro-electrical device (i.e. integrated circuit), the cooling device is more important. Further, as the circuit density on a single chip and the package technology increasingly progress, the area of the integrated circuit is reduced. Meanwhile, the heat accumulated per unit area increases. In this case, prior art fails to meet the requirement of the cooling efficiency.

[0005] In prior art, the conventional cooling device generally uses of airflow to dissipate the heat. For example, the blade structure made of aluminum is attached to the top of the electrical device. Alternatively, a fan is further superimposed on the blade structure. As such, the heat from the electrical device is previously directed to the blade structure and then the rotating fan dissipates the heat. However, some portent reveals that the conventional cooling device does not meet the requirement of the advanced or high-speed electrical device. Air is not the preferred material for heat dissipation. The other material, such as water or some liquid has better heat conduction ability than air. That is, the cooling device using water or some liquid has superior effect compared to the cooling device simply using air.

[0006] In prior art, the cooling device using heat conduction liquid has been proposed and which is called “liquid-cooled system”. However, such the liquid-cooled system has to cooperate with a stirrer, such as a pump, to the liquid flowing therein. As such, the heat-generating device, the pump and the complex pipes results in bulky volume.

[0007] Therefore, there is a need in the art for a novel cooling device having and simplified pipes, and whose volume is close to the heat-generating device.

SUMMARY OF THE INVENTION

[0008] The present cooling device is superimposed on a heat-generating device, such as a microprocessor or a CPU. The present cooling device includes a base, a stirrer and a thermal-conductive fin structure. Among these, the base further includes a circuit pipe extend all over the base as possible. Especially, the circuit pipe is filled of thermal-conductive liquid, such as magnetized thermal-conductive liquid. Such the magnetized thermal-conductive liquid indicates the thermal-conductive fluid having magnetism. For example, metallic particles are added to the thermal-conductive liquid such that the thermal-conductive liquid becomes the magnetized thermal-conductive liquid. As a magnetic field or force is applied, the magnetized thermal-conductive liquid flows due to the magnetism. Note that the circuit pipe is partially full of the magnetized thermal-conductive liquid and reserves the buffer space. The buffer space is used to accommodate or tolerate the expansion of the heated magnetized thermal-conductive.

[0009] Compared to prior art, the present invention does not require the conventional stirrer (i.e. pump). The base further includes a stirrer surrounding or adjacent to the circuit pipe. It is preferred that the stirrer is a winding coupled to a power supply, such as a DC or AC power supply. As the power supply applies the electrical power to the winding, the winding generates the magnetic field. In this manner, the magnetized thermal-conductive liquid flows around the circuit pipe and thus dissipates the heat.

[0010] A thermal-conductive fin structure, such as a plurality of parallel metallic fins, is further provided on the base so as to enlarge the surface area of the cooling device and thus enhance the cooling efficiency. Besides, the seal is optionally formed between the base and the thermal-conductive fin structure to prevent the magnetized thermal-conductive liquid from leaking.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The foregoing aspects and many of the attendant advantages of this invention will become more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:

[0012]FIG. 1 depicts the cooling device according to the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT

[0013] Referring to FIG. 1, the present cooling device 100 is superimposed on a heat-generating device, such as a microprocessor or a CPU. The present cooling device 100 includes a base 200, a stirrer (not shown) and a thermal-conductive fin structure 500. Among these, the base 200 further includes a circuit pipe 210 extend all over the base 200 as possible. Especially, the circuit pipe 210 is filled of thermal-conductive liquid, such as magnetized thermal-conductive liquid. Such the magnetized thermal-conductive liquid indicates the thermal-conductive fluid having magnetism. For example, metallic particles are added to the thermal-conductive liquid such that the thermal-conductive liquid becomes the magnetized thermal-conductive liquid. As a magnetic field or force is applied, the magnetized thermal-conductive liquid flows due to the magnetism. Note that the circuit pipe 210 is partially full of the magnetized thermal-conductive liquid and reserves the buffer space. The buffer space is used to accommodate or tolerate the expansion of the heated magnetized thermal-conductive.

[0014] Still referring to FIG. 1, the base 200 further includes a stirrer (not shown) surrounding or adjacent to the circuit pipe 210. It is preferred that the stirrer is a winding coupled to a power supply, such as a DC or AC power supply. As the power supply applies the electrical power to the winding, the winding generates the magnetic field. In this manner, the magnetized thermal-conductive liquid flows around the circuit pipe 210 and thus dissipates the heat.

[0015] Still referring to FIG. 1, a thermal-conductive fin structure 500, such as a plurality of parallel metallic fins, is further provided on the base 200 so as to enlarge the surface area of the cooling device 100 and thus enhance the cooling efficiency. Besides, the seal 600 is optionally formed between the base 200 and the thermal-conductive fin structure 500 to prevent the magnetized thermal-conductive liquid from leaking. In the preferred embodiment, the seal 600 is an O-ring.

[0016] As described above, since the magnetized thermal-conductive liquid is used to dissipate heat, the present invention does not require the conventional stirrer (i.e. pump). Therefore, the circuit pipe can be simplified and the volume can be reduced. That is, the volume of the present cooling device is close to the volume of the heat-generating device.

[0017] As is understood by a person skilled in the art, the foregoing preferred embodiments of the present invention are illustrated of the present invention rather than limiting of the present invention. It is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims, the scope of which should be accorded the broadest interpretation so as to encompass all such modifications and similar structure.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7417858 *Dec 21, 2005Aug 26, 2008Sun Microsystems, Inc.Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits
US7614445Feb 2, 2006Nov 10, 2009Sun Microsystems, Inc.Enhanced heat pipe cooling with MHD fluid flow
US7628198 *Feb 2, 2006Dec 8, 2009Sun Microsystems, Inc.Cooling technique using a heat sink containing swirling magneto-hydrodynamic fluid
US8336611Aug 11, 2009Dec 25, 2012Oracle America, Inc.Enhanced heat pipe cooling with MHD fluid flow
US8550149 *Dec 31, 2009Oct 8, 2013Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Water-cooled heat sink
US8875521 *Jun 10, 2009Nov 4, 2014Robert Bosch GmbhDevice and method for cooling components using magnetizable phase-change material
US20110100597 *Dec 31, 2009May 5, 2011Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Water-cooled heat sink
US20110167838 *Jun 10, 2009Jul 14, 2011Reinhold DannerDevice and Method for Cooling Components Using Magnetizable Phase-Change Material
US20130055727 *Aug 31, 2012Mar 7, 2013Samsung Electro-Mechanics Co., Ltd.Cooling unit
Classifications
U.S. Classification165/80.4, 165/185, 257/E23.098
International ClassificationH01L23/473
Cooperative ClassificationH01L23/473, H01L2924/0002
European ClassificationH01L23/473
Legal Events
DateCodeEventDescription
Sep 7, 2001ASAssignment
Owner name: DELTA ELECTRONICS INC., TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HUANG, WEN-SHI;LIN, KUO-CHENG;YU, CHIEN-WEN;REEL/FRAME:012157/0836;SIGNING DATES FROM 20010814 TO 20010823