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Publication numberUS20020050379 A1
Publication typeApplication
Application numberUS 09/881,447
Publication dateMay 2, 2002
Filing dateJun 12, 2001
Priority dateDec 31, 1997
Also published asUS6297078, US6420651
Publication number09881447, 881447, US 2002/0050379 A1, US 2002/050379 A1, US 20020050379 A1, US 20020050379A1, US 2002050379 A1, US 2002050379A1, US-A1-20020050379, US-A1-2002050379, US2002/0050379A1, US2002/050379A1, US20020050379 A1, US20020050379A1, US2002050379 A1, US2002050379A1
InventorsMichael Barrow
Original AssigneeMichael Barrow
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Integrated circuit package with bond wires at the corners of an integrated circuit
US 20020050379 A1
Abstract
An integrated circuit package which has an integrated circuit mounted to a substrate. The package includes a plurality of bond wires that couple bond pads of the integrated circuit to corresponding bond pads of the substrate. The bond wires may have an essentially uniform bond wire density about an entire outer perimeter of the integrated circuit including the corners of the circuit. The integrated circuit and bond wires are enclosed by an injected molded plastic housing. It is believed that the bond wires located at the corners impede the flow of the injected plastic and reduce the amount of wire sweep in the package from packages in the prior art. Additionally, the essentially uniform bond wire density may create a uniform fluidic resistance to the injected plastic. The uniform resistance also reduces the amount of wire sweep from packages in the prior art. The bond wires located at the corners may be dummy wires that are not electrically connected to the integrated circuit.
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Claims(9)
What is claimed is:
1. An integrated circuit package, comprising:
a substrate which has a plurality of bond pads;
an integrated circuit that is mounted to said substrate, said integrated circuit having a plurality of bond pads that extend about an outer perimeter of said integrated circuit;
a plurality of bond wires that couple said bond pads of said substrate to said bond pads of said integrated circuit, said bond wires having an essentially uniform bond wire density about said outer perimeter of said integrated circuit; and,
a housing that encloses said integrated circuit and said bond wires.
2. The integrated circuit package as recited in claim 1, wherein said housing is constructed from an injected molded plastic.
3. The integrated circuit package as recited in claim 1, further comprising a plurality of solder balls that are attached to said substrate.
4. An integrated circuit package, comprising:
a substrate which has a plurality of bond pads;
an integrated circuit that is mounted to said substrate, said integrated circuit having a plurality of corners and a plurality of bond pads that extend about an outer perimeter of said integrated circuit;
a plurality of bond wires that couple said bond pads of said substrate to said bond pads of said integrated circuit, at least two bond wires being located at said corners of said integrated circuit; and,
a housing that encloses said integrated circuit and said bond wires.
5. The integrated circuit package as recited in claim 4, wherein said bond wires located at said corners are not electrically coupled to said bond pads.
6. The integrated circuit package as recited in claim 4, wherein said housing is constructed from an injected molded plastic.
7. The integrated circuit package as recited in claim 4, further comprising a plurality of solder balls that are attached to said substrate.
8. A method for assembling an integrated circuit package, comprising:
a) mounting an integrated circuit to a substrate, wherein said integrated circuit has a plurality of corners;
b) attaching a plurality of bond wires to said integrated circuit and said substrate including said corners of said integrated circuit;
c) placing said integrated circuit, said substrate and said bond wires in a mold; and,
d) injecting a plastic material into said mold to form a housing that encloses said integrated circuit and said bond wires.
9. The method as recited in claim 8, further comprising the step of attaching a plurality of solder balls to said substrate.
Description
    BACKGROUND OF THE INVENTION
  • [0001]
    1. Field of the Invention
  • [0002]
    The present invention relates to an integrated circuit package.
  • [0003]
    2. Background Information
  • [0004]
    Integrated circuits are typically assembled into a package that is soldered to a printed circuit board. There are many types of integrated circuit packages including ball grid array (BGA) packages. BGA packages include a plurality of solder balls that are attached to a substrate. The solder balls are eventually reflowed to mount the package to a printed circuit board.
  • [0005]
    An integrated circuit is mounted to the BGA package substrate and typically wire bonded to bond pads of the substrate. The bonded integrated circuit and substrate are then placed into a mold that is injected with a plastic material. The injected plastic encloses both the integrated circuit and the bond wires.
  • [0006]
    [0006]FIG. 1 shows a typical wire bonded BGA package which has a number of wire bonds 1 that couple an integrated circuit 2 to a substrate 3 before the injection of plastic. The plastic is typically introduced through a gate at the corner(s) of the integrated circuit. The plastic is injected into the mold at very high pressures to insure that the integrated circuit is completely encapsulated.
  • [0007]
    As shown in FIG. 2, it has been found that the injected plastic 4 creates a “wire sweep” in the bond wires 1. A significant wire sweep can break the bond wires and create a defective part. It would be desirable to provide an injection molded wire bonded package that is less susceptible to wire sweep than packages in the prior art.
  • SUMMARY OF THE INVENTION
  • [0008]
    An integrated circuit package which has an integrated circuit mounted to a substrate. The package includes a plurality of bond wires that couple bond pads of the integrated circuit to corresponding bond pads of the substrate. The bond wires may have an essentially uniform bond wire density about an entire outer perimeter of the integrated circuit. The integrated circuit and bond wires are enclosed by a housing.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0009]
    [0009]FIG. 1 is a top view of an integrated circuit package of the prior art;
  • [0010]
    [0010]FIG. 2 is a sectional view of the integrated circuit package of FIG. 1 with a housing that encloses an integrated circuit and a plurality of bond wires of the package;
  • [0011]
    [0011]FIG. 3 is a top view of an embodiment of an integrated circuit package of the present invention;
  • [0012]
    [0012]FIG. 4 is a side view of the integrated circuit package of FIG. 3;
  • [0013]
    [0013]FIG. 5 is a top view of a subassembled integrated circuit package within a mold that is being injected with a plastic material;
  • [0014]
    [0014]FIG. 6 is a top view of an integrated circuit package with an alternate bond wire pattern.
  • DETAILED DESCRIPTION OF THE INVENTION
  • [0015]
    One embodiment of the present invention is an integrated circuit package which has an integrated circuit mounted to a substrate. The package includes a plurality of bond wires that couple bond pads of the integrated circuit to corresponding bond pads of the substrate. The bond wires may have an essentially uniform bond wire density about an entire outer perimeter of the integrated circuit including the corners of the circuit. The integrated circuit and bond wires are enclosed by an injected molded plastic housing.
  • [0016]
    It is believed that the bond wires located at the corners of the integrated circuit impede the flow of the injected plastic and reduce the amount of wire sweep in the package from packages in the prior art. Additionally, the essentially uniform bond wire density may create a uniform fluidic resistance to the injected plastic. The uniform resistance also reduces the amount of wire sweep from packages in the prior art. The bond wires located at the corners may be dummy wires that are not electrically connected to the integrated circuit.
  • [0017]
    Referring to the drawings more particularly by reference numbers, FIGS. 3 and 4 show one embodiment of an integrated circuit package 10 of the present invention. The package 10 includes a substrate 12 which has a first surface 14 and an opposite second surface 16. The package 10 may have a plurality of solder balls 18 that are attached to a number of corresponding contact pads 20 of the substrate 12. The solder balls 18 can be reflowed to attach the package to a printed circuit board (not shown). Although solder balls 18 are shown and described, it is to be understood that the package 10 may have other types of contacts such as pins which extend from the second surface 16 of the substrate 12.
  • [0018]
    An integrated circuit 22 is mounted to the first surface 14 of the substrate 12. The integrated circuit 22 may have a plurality of bond pads 24 that extend about the outer perimeter of the circuit 22. The first surface 14 of the substrate 12 may also have a plurality of bond pads 26 arranged in a pattern about the integrated circuit 22. The bond pads 26 are coupled to the contact pads 20 by vias 27 that extend through the substrate 12.
  • [0019]
    The package 10 includes a plurality of bond wires 28 that couple the bond pads 24 of the integrated circuit 22 to the bond pads 26 of the substrate 12. The integrated circuit 22 and bond wires 28 are enclosed by a housing 30. The housing 30 is typically constructed from an injected molded plastic material.
  • [0020]
    In one embodiment, there is an essentially uniform bond wire density about the integrated circuit. The bond wire density may be defined as the number of wires per cubic millimeters. The bond pads 26 and/or 24 and corresponding bond wires located at the corners of the integrated circuit 22 may be “dummy” wires that are not electrically connected to the circuit 22. The dummy wires are primarily provided to impede the flow of the injected plastic material that forms the housing 30 and to minimize the amount of wire sweep in the package 10. Alternatively, the corner wires may be dedicated to electrical power or electrical ground.
  • [0021]
    To assemble the package 10, the integrated circuit 22 is mounted to the substrate 12 and wire bonded to the bond pads 26. As shown in FIG. 5, the substrate 12 and wire bonded integrated circuit 22 are placed within a mold 32 that has a gate 34. Plastic material 35 is injected through the gate 34 and into the mold 32. It is believed that the bond wires 28 impede the flow of the plastic and reduce the amount of wire sweep over packages in the prior art.
  • [0022]
    The plastic 35 is injected until the integrated circuit 22 and bond wires 28 are completely encapsulated. After the plastic hardens the substrate 12 and plastic enclosed integrated circuit are removed from the mold 32. The solder balls 18 are then attached to the substrate 12. The solder balls 18 are eventually reflowed to attach the package 10 to a printed circuit board.
  • [0023]
    While certain exemplary embodiments have been described and shown in the accompanying drawings, it is to be understood that such embodiments are merely illustrative of and not restrictive on the broad invention, and that this invention not be limited to the specific constructions and arrangements shown and described, since various other modifications may occur to those ordinarily skilled in the art. For example, as shown in FIG. 6, the bond wires 28 located at the corner of the integrated circuit 22 may of a higher density and more closely spaced together than the wires 28 at the other portions of the circuit 22. For example, each corner may have two or more bond wires 28. The number, spacing and density of bond wires 28 can be selected to control the fluidic resistance within the mold 32 and the wire sweep of the package 10.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6670698 *Feb 5, 2002Dec 30, 2003Amkor Technology, Inc.Integrated circuit package mounting
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