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Publication numberUS20020071250 A1
Publication typeApplication
Application numberUS 09/732,734
Publication dateJun 13, 2002
Filing dateDec 11, 2000
Priority dateDec 11, 2000
Also published asUS6442024
Publication number09732734, 732734, US 2002/0071250 A1, US 2002/071250 A1, US 20020071250 A1, US 20020071250A1, US 2002071250 A1, US 2002071250A1, US-A1-20020071250, US-A1-2002071250, US2002/0071250A1, US2002/071250A1, US20020071250 A1, US20020071250A1, US2002071250 A1, US2002071250A1
InventorsShoei-Yuan Shih
Original AssigneeShoei-Yuan Shih
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Fan flow guide
US 20020071250 A1
Abstract
A fan flow guide comprises a wind inlet is connected to a wind outlet of a fan. A wind tube portion is installed between the wind inlet and a rear end of the computer host or a central processing unit. The thickness of the wind tube portion is smaller than that of the wind inlet so that airflow is compressed and accelerated to flow into the computer host and thus all parts dissipates heat substantially. Moreover, the thickness of the wind tube portion is sufficient to be disposed between the upper side of the memory (RAM) and computer host so as to achieve the object of sufficiently using the inner space of the computer host. A plurality of spacers are arranged in the wind tube portion for defining a plurality of air channels. The spacers have a curve shape so that adjacent spacers confine a thinner air channel. Therefore, the airflow is compressed and accelerated again.
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Claims(7)
What is claimed is:
1. A fan flow guide comprising:
a wind inlet connected to a wind outlet of a fan;
a wind tube portion being installed between the wind inlet and a rear end of a computer host or a central processing unit; a thickness of the wind tube portion being smaller than that of the wind inlet so that airflow is compressed and accelerated to flow into the computer host and thus all parts dissipates heat substantially; moreover, a thickness of the wind tube portion being sufficient to be disposed between an upper side of the memory (RAM) and computer host so as to achieve the object of sufficiently using an inner space of the computer host.
2. The fan flow guide as claimed in claim 1, wherein the flow guide has a cover plate and a bottom plate.
3. The fan flow guide as claimed in claim 2, wherein a plurality of peripheries of the cover plate and the bottom plate are installed with an ear portion and a buckle which are matched to one another.
4. The fan flow guide as claimed in claim 1, wherein a periphery of the wind tube portion is installed with a plurality of retainer so that the wind tube portion is fixed in the computer host by a positioning piece and a space in the mother board.
5. The fan flow guide as claimed in claim 2, wherein one end of the bottom plate is bent to be installed with a tilt portion with a plurality of wind outlet.
6. The fan flow guide as claimed in claim 1, wherein a plurality of spacers are arranged in the wind tube portion for defining a plurality of air channels.
7. The fan flow guide as claimed in claim 1, wherein the spacers have a curve shape so that adjacent spacers confine a thinner air channel.
Description
BACKGROUND OF THE INVENTION

[0001] The present invention relates to a fan flow guide, and especially to a flow guide structure which can absorb the heat from the parts in the computer host and then exhaust the heat out of the computer host effectively.

[0002] In a general 1U specific industrial computer servo, since the hardware, central processing unit (CPU), and various data processing parts are compressed to a very narrow space. In order to match the complexity of the logic operation, the processing speed and performance are improved, but this will induce a high heat amount in processing. Furthermore, the inner space of the 1U is finite and under the consideration of cost, no more fan can be increased for enhancing the convection of airflow. Therefore, how to improve the current used fan to enhance the heat dissipation ratio has become a popular subject in the development of heat dissipation of a computer.

[0003]FIG. 1 shows a prior art fan structure, a heat dissipating structure of a computer, is disclosed in the inventor of the present invention. The fan structure has an effect of absorbing heat in the front section of a computer host and guiding the heat to other parts for dissipating heat. However, this prior art design has a defect of a lower speed as it is used in a large fan or a large heat dissipating range. And especially for a servo with two central processing units at the rear end of the casing of a host. Furthermore, due to the isolation of heat dissipating pieces, air returns in the servo and can not be exhausted out. For example, for a fan with a rotary speed of 3600 rpm (see FIG. 2), after testing by the inventor, the output speed of the fan is 810 M/sec. By the isolation of memory and effect of distance, the air speed in the central processing unit is about 23 M/sec. Since the isolation of heat dissipating piece, a rear end of the computer casing of a host is nearly zero. Therefore, although this prior art design can improve the defect of a prior art fan, but is unsuitable to a large fan or is used in a large heat dissipating space.

SUMMARY OF THE INVENTION

[0004] Accordingly, the primary object of the present invention is to provide a fan flow guide; wherein a flow guide structure is connected at the wind outlet of the fan for compressing and accelerating air and the output of the fan is extended to the central processing unit which will generate a high heat source. The flow guide structure comprises a wind inlet connected to a wind outlet of a fan; a wind tube portion being installed between the wind inlet and a rear end of the computer host or a central processing unit. The thickness of the wind tube portion is smaller than that of the wind inlet so that airflow is compressed and accelerated to flow into the computer host and thus all part dissipates heat substantially. Moreover, the thickness of the wind tube portion be disposed between the upper side of the memory (RAM) and computer host so as to achieve the object of sufficiently using the inner space of the computer host.

[0005] A further object of the present invention is to provide a fan flow guide, wherein a plurality of spacers are arranged in the wind tube portion for defining a plurality of air channels. The spacers has a curve shape so that adjacent spacers confines a thinner air channel. Therefore, the airflow is compressed and accelerated again.

[0006] A further object of the present invention is to provide a fan flow guide, wherein one end of the bottom plate of the flow guide structure is bent to be installed with a tilt portion with a plurality of wind outlet. Therefore, part airflow may be blown out from the wind outlet to be injected to the motherboard and memory and other chips.

[0007] The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing.

BRIEF DESCRIPTION OF THE DRAWINGS

[0008]FIG. 1 is a schematic view showing the arrangement of a fan in the prior art servo.

[0009]FIG. 2 is a schematic view showing the arrangement of a fan in the other prior art servo.

[0010]FIG. 3 is a schematic perspective view of the present invention.

[0011]FIG. 4 is an exploded perspective view of the present invention.

[0012]FIG. 5 is a schematic view showing an application of the present invention.

[0013]FIG. 6 is a schematic view showing another application of the present invention.

[0014]FIG. 7 is a schematic view showing the compression and acceleration of the airflow in the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Referring to FIGS. 3, 4, and 5, the perspective view and schematic view of the present invention are illustrated. The fan flow guide of the present invention is connected to the outlet of a fan 2 for compressing and accelerating airflow. The fan flow guide has a cover plate 11 and a bottom plate 12. The peripheries thereof are installed with an ear portion 111 and a buckle 121 which are matched to one another and thus a flow guide structure 1 is formed, the flow guide structure 1 has an end installed with an wind inlet 13 which is assembled with the wind outlet of the fan 2. A wind tube portion 18 is installed between the wind inlet 13 and a rear end of the computer host 3 or a central processing unit 33. Since the thickness of the wind tube portion 18 is smaller than that of the wind inlet 13 so that airflow is compressed and accelerated to flow into the computer host 3 and thus all part dissipates heat substantially. Furthermore, the airflow absorbing heat can exhaust the heat to be out of the computer host 3. Moreover, the thickness thereof may be disposed between the upper side of the memory 32 (RAM) and computer host 3 so as to achieve the object of sufficiently using the inner space of the computer host 3. Moreover, the periphery of the wind tube portion 18 is installed with a plurality of retainer 14 so that the wind tube portion 18 can be fixed in the computer host 3 by the positioning piece 4 and the space in the mother board 31. A plurality of spacers 15, 15′ are arranged in the wind tube portion 18 for defining a plurality of air channels 16. Since the spacers 15, 15′ have a curve shape so that adjacent spacers 15, 15′ confine a short air channel 16. Thus, airflow flows into the air channel 16 through the wind inlet 13 from the fan 2 so as to be compressed again. One end of the bottom plate 12 of the flow guide structure 1 is bent to be installed with a tilt portion 17 with a plurality of wind outlets 171. Therefore, part airflow may be blown out from the wind outlets 171 to be injected to the mother board 31 and memory 32 and other chips.

[0016] Referring to FIGS. 2, 6 and 7, a schematic view showing the application of the present invention is illustrated. As shown in the figures, the bottom plate 12 and the cover plate 11 are buckled together and are formed with flow guide structure 1 having openings at two ends and a closing space in formed therein. By the positioning piece 4 to pass through the mother board 31, the wind inlet 13 in one end of the flow guide structure 1 is connected to the wind outlet of the fan 2 and is firmly secured thereon. Since the wind tube portion 18 is thinner and exactly run across between the memory 32 and computer host 3. It is known from FIGS. 5 and 6 that despite the format of the memory 32, the installation of the present invention can not be effected and the space within the computer host 3 can be used sufficiently.

[0017] The airflow is from the operation of the fan 2. Then the airflow induces from the front section of the computer host 3 flows into the wind tube portion 18 through the wind inlet 13. Part of airflow flows through the wind outlet 171 of the tilt portion 17, and thus a jet airflow is generated to dissipate heat of the mother board 31 and memory 32 underlying the flow guide structure 1. Since the wind speed of the jet flow is stronger, the hot air absorbing the heat from aforesaid parts can be blown to the central processing unit 33 and dissipate heat thereof. In the first stage, most of the airflow is compressed and accelerated from the fan 2. Furthermore, the airflow is divided into a plurality of smaller airflow flowing toward the air channel 16 spaced by the spacers 15, 15′, as illustrated in FIG. 6. Since the spacers 15, 15′ have curved shape, part of the air channel 16 enclosed by the spacers 15, 15′ is thinner. When air flows through the thinner section (such as the middle section illustrated in the drawing), since the section is shortened, the airflow will be compressed again so that the wind blowing to the rear section is accelerated. For example, for a fan 2 has a rotary speed of 3600 rpm, the wind outlet of the fan 2 has a speed of 810 M/sec, while it is compressed and accelerated as flowing through the wind tube portion 18 and spacers 15, 15′ to the rear section of the air channel 16, so that the wind speed becomes 1012 M/sec. The wind at the heat dissipating hole 34 and through the central processing unit 33 at a rear end of the computer host 3 has a speed of 22.5 M/sec. Therefore, the airflow can be brown to the parts of the computer host 3 to cause a better heat dissipation. Furthermore, the hot airflow in the heat source can be exhausted out of the computer host 3 so as to solve the heat dissipating problem in a mother board 31 having a central processing unit 33 with a speed large than 1 Ghz or with two central processing units 33.

[0018] The present invention is thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the present invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6719038Aug 8, 2002Apr 13, 2004Celestica International Inc.Heat removal system
US7123484 *May 12, 2004Oct 17, 2006Quanta Computer, Inc.Multi-layer and multi-direction fan device
US8693181 *Jul 21, 2011Apr 8, 2014Compal Electronics, Inc.Portable electronic device
US20120162871 *Jul 21, 2011Jun 28, 2012Compal Electronics, Inc.Portable electronic device
US20120224324 *May 17, 2011Sep 6, 2012Hon Hai Precision Industry Co., Ltd.Elctronic device with heat and dust dissipation mechanism
WO2003014633A2 *Aug 8, 2002Feb 20, 2003Heat Technology IncHeat removal system
Classifications
U.S. Classification361/695
International ClassificationH05K7/20, G06F1/20
Cooperative ClassificationG06F1/20
European ClassificationG06F1/20
Legal Events
DateCodeEventDescription
Oct 19, 2010FPExpired due to failure to pay maintenance fee
Effective date: 20100827
Aug 27, 2010LAPSLapse for failure to pay maintenance fees
Apr 5, 2010REMIMaintenance fee reminder mailed
Feb 24, 2006FPAYFee payment
Year of fee payment: 4