US20020075655A1 - Heat dissipation assembly and method of assembling the same - Google Patents

Heat dissipation assembly and method of assembling the same Download PDF

Info

Publication number
US20020075655A1
US20020075655A1 US09/746,597 US74659700A US2002075655A1 US 20020075655 A1 US20020075655 A1 US 20020075655A1 US 74659700 A US74659700 A US 74659700A US 2002075655 A1 US2002075655 A1 US 2002075655A1
Authority
US
United States
Prior art keywords
heat sink
apertures
circuit board
printed circuit
columns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US09/746,597
Other versions
US6392888B1 (en
Inventor
Yung Chen
Che Lin
Hsueh Hsiao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
Gold Charm Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW89221276U external-priority patent/TW487294U/en
Application filed by Individual filed Critical Individual
Assigned to FOXCONN PRECISION COMPONENTS CO., LTD. reassignment FOXCONN PRECISION COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, YUNG CHOU, LIN, CHE CHENG
Application granted granted Critical
Publication of US6392888B1 publication Critical patent/US6392888B1/en
Publication of US20020075655A1 publication Critical patent/US20020075655A1/en
Assigned to GOLD CHARM LIMITED reassignment GOLD CHARM LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HON HAI PRECISION INDUSTRY CO., LTD.
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49359—Cooling apparatus making, e.g., air conditioner, refrigerator

Definitions

  • the present invention relates to a heat dissipation assembly and method of assembling the same, and more particularly to a heat dissipation assembly forming a grounding mechanism and a method for firmly attaching a heat sink to a printed circuit board and a chip.
  • FIG. 3 shows a conventional heat dissipation assembly for attaching a heat sink 300 to a chip 500 which is mounted on a printed circuit board (PCB) 400 .
  • a heat sink 300 is attached to the chip 500 using pins 100 and springs 200 . But retaining force exerted by the springs 200 is generally insufficient to firmly secure the heat sink 300 to the chip 500 . This reduces the efficiency of heat removal.
  • heat-conductive adhesive tape is used between a heat sink and a chip. But such tape is prone to age and lose stickiness. Thus the connection between the heat sink and the chip often becomes loose.
  • an object of the present invention is to provide a method for firmly attaching a heat sink to a printed circuit board (PCB) and a chip.
  • PCB printed circuit board
  • Another object of the present invention is to provide a heat dissipation assembly having a grounding mechanism for reducing electromagnetic interference (EMI).
  • EMI electromagnetic interference
  • a heat dissipation assembly in accordance with the present invention comprises a PCB, a chip and a heat sink.
  • the PCB comprises a grounding circuit, and four through apertures in the grounding circuit.
  • the chip is mounted on the PCB, and is surrounded by the through apertures.
  • the heat sink has four metal columns depending from a bottom surface of a base thereof, the columns corresponding to the four through apertures.
  • a method of assembling the heat dissipation assembly includes the steps of: mounting a chip on a PCB; inserting metal columns of a heat sink into corresponding through apertures of the PCB; and welding the metal columns in the through apertures so that the heat sink is in intimate thermal contact with an upper surface of the chip.
  • FIG. 1 is an exploded view of a heat dissipation assembly of the present invention
  • FIG. 2 is an assembled view of FIG. 1;
  • FIG. 3 is an exploded view of a conventional heat dissipation assembly.
  • a heat dissipation assembly of the present invention comprises a printed circuit board (PCB) 20 , a chip 30 and a heat sink 10 .
  • the PCB 20 comprises a grounding circuit (not shown).
  • the PCB 20 defines four through apertures 22 in the grounding circuit, the apertures being arranged in a rectangular formation.
  • the chip 30 is mounted onto a center portion of the PCB 20 , and is surrounded by the four through apertures 22 .
  • the heat sink 10 comprises a base 12 , and a plurality of fins 14 extending upwardly from the base 12 .
  • Four columns 16 depend from a bottom surface of the base 12 , corresponding to the four through apertures 22 .
  • the columns 16 are made of metal.
  • the columns 16 of the heat sink 10 are inserted into the through apertures 22 of the PCB 20 , and are welded in the through apertures 22 with soldering tin (not shown).
  • the heat sink 10 is thereby in intimate thermal contact with an upper surface of chip 30 .
  • the columns 16 are thus electrically connected to the grounding circuit of the PCB, so that the grounding circuit and the heat sink 10 together form a grounding mechanism for reducing electromagnetic interference (EMI) generated from the PCB 20 .
  • EMI electromagnetic interference
  • connection between the heat sink 10 and the PCB 20 is very firm and durable. Another advantage of welding is that the grounding mechanism thereby formed by the heat sink 10 and the grounding circuit of the PCB 20 reduces EMI.
  • a method of assembling the heat dissipation assembly comprises the steps of: mounting a chip on a PCB; inserting metal columns of a heat sink into corresponding through apertures of the PCB; and welding the metal columns in the through apertures so that the heat sink is in intimate thermal contact with an upper surface of the chip.

Abstract

A heat dissipation assembly comprises a printed circuit board (PCB) (20), a chip (30) and a heat sink (10). The PCB comprises a grounding circuit and four through apertures (22) in the grounding circuit. The chip is mounted on the PCB, and is surrounded by the through apertures. The heat sink has four metal columns (16) depending from a bottom surface of a base (12) thereof, the columns corresponding to the four through apertures. A method of assembling the heat dissipation assembly includes the steps of: mounting a chip on a PCB; inserting metal columns of a heat sink into corresponding through apertures of the PCB; and welding the metal columns in the through apertures so that the heat sink is in intimate thermal contact with an upper surface of the chip.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to a heat dissipation assembly and method of assembling the same, and more particularly to a heat dissipation assembly forming a grounding mechanism and a method for firmly attaching a heat sink to a printed circuit board and a chip. [0002]
  • 2. Related Art [0003]
  • Many computer electronic devices such as chips and central processing units (CPUs) generate large amounts of heat. Excessive heat can adversely affect the stability and operation of a computer. Heat generated by a chip must be quickly removed therefrom. This is conventionally done by attaching a heat sink to the chip. Various kinds of clips, pins and adhesive tapes are used to closely attach a heat sink to a chip. [0004]
  • FIG. 3 shows a conventional heat dissipation assembly for attaching a [0005] heat sink 300 to a chip 500 which is mounted on a printed circuit board (PCB) 400. A heat sink 300 is attached to the chip 500 using pins 100 and springs 200. But retaining force exerted by the springs 200 is generally insufficient to firmly secure the heat sink 300 to the chip 500. This reduces the efficiency of heat removal.
  • In some systems, heat-conductive adhesive tape is used between a heat sink and a chip. But such tape is prone to age and lose stickiness. Thus the connection between the heat sink and the chip often becomes loose. [0006]
  • Furthermore, with the development of high-speed chips, generation of electromagnetic interference (EMI) is becoming an increasingly serious problem. Conventional heat dissipation assemblies do not address this problem. [0007]
  • Thus an improved heat dissipation assembly and a method of assembling the same which overcome the problems of the related art are desired. [0008]
    • SUMMARY OF THE INVENTION
  • Accordingly, an object of the present invention is to provide a method for firmly attaching a heat sink to a printed circuit board (PCB) and a chip. [0009]
  • Another object of the present invention is to provide a heat dissipation assembly having a grounding mechanism for reducing electromagnetic interference (EMI). [0010]
  • To achieve the above objects, a heat dissipation assembly in accordance with the present invention comprises a PCB, a chip and a heat sink. The PCB comprises a grounding circuit, and four through apertures in the grounding circuit. The chip is mounted on the PCB, and is surrounded by the through apertures. The heat sink has four metal columns depending from a bottom surface of a base thereof, the columns corresponding to the four through apertures. A method of assembling the heat dissipation assembly includes the steps of: mounting a chip on a PCB; inserting metal columns of a heat sink into corresponding through apertures of the PCB; and welding the metal columns in the through apertures so that the heat sink is in intimate thermal contact with an upper surface of the chip. [0011]
    • DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view of a heat dissipation assembly of the present invention; [0012]
  • FIG. 2 is an assembled view of FIG. 1; and [0013]
  • FIG. 3 is an exploded view of a conventional heat dissipation assembly.[0014]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Referring to FIG. 1, a heat dissipation assembly of the present invention comprises a printed circuit board (PCB) [0015] 20, a chip 30 and a heat sink 10. The PCB 20 comprises a grounding circuit (not shown). The PCB 20 defines four through apertures 22 in the grounding circuit, the apertures being arranged in a rectangular formation. The chip 30 is mounted onto a center portion of the PCB 20, and is surrounded by the four through apertures 22. The heat sink 10 comprises a base 12, and a plurality of fins 14 extending upwardly from the base 12. Four columns 16 depend from a bottom surface of the base 12, corresponding to the four through apertures 22. The columns 16 are made of metal.
  • Referring also to FIG. 2, in assembly, the columns [0016] 16 of the heat sink 10 are inserted into the through apertures 22 of the PCB 20, and are welded in the through apertures 22 with soldering tin (not shown). The heat sink 10 is thereby in intimate thermal contact with an upper surface of chip 30. The columns 16 are thus electrically connected to the grounding circuit of the PCB, so that the grounding circuit and the heat sink 10 together form a grounding mechanism for reducing electromagnetic interference (EMI) generated from the PCB 20.
  • Because the present invention uses the technique of welding, the connection between the heat sink [0017] 10 and the PCB 20 is very firm and durable. Another advantage of welding is that the grounding mechanism thereby formed by the heat sink 10 and the grounding circuit of the PCB 20 reduces EMI.
  • A method of assembling the heat dissipation assembly comprises the steps of: mounting a chip on a PCB; inserting metal columns of a heat sink into corresponding through apertures of the PCB; and welding the metal columns in the through apertures so that the heat sink is in intimate thermal contact with an upper surface of the chip. [0018]
  • It is understood that the invention may be embodied in other forms without departing from the spirit thereof. Thus, the present example and embodiment is to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein. [0019]

Claims (13)

1. A heat dissipation assembly comprising:
a printed circuit board having a grounding circuit and a plurality of through apertures in the grounding circuit;
a chip mounted on the printed circuit board, the chip being surrounded by the through apertures of the printed circuit board; and
a heat sink attached to the chip, the heat sink comprising a base and a plurality of columns depending from the base, the columns being received in the corresponding through apertures and being connected to the grounding circuit of the printed circuit board.
2. The heat dissipation assembly as recited in claim 1, wherein the columns respectively depend from each of four corners of a bottom surface of the base, and the printed circuit board has four corresponding through apertures.
3. The heat dissipation assembly as recited in claim 1, wherein the columns of the heat sink are welded in the through apertures of the printed circuit board with soldering tin.
4. The heat dissipation assembly as recited in claim 1, wherein the columns and the heat sink are made separately, and the columns are embedded in the base of the heat sink.
5. The heat dissipation assembly as recited in claim 1, wherein the printed circuit board has four through apertures arranged in a rectangular formation.
6. The heat dissipation assembly as recited in claim 1, wherein the heat sink further comprises a plurality of fins extending upwardly from an upper surface of the base.
7. A heat sink comprising:
a base;
a plurality of fins extending upwardly from the base; and
a plurality of metal columns depending from the base, wherein the columns are adapted for being received in corresponded through apertures in a grounding circuit of a printed circuit board, and for being welded to the printed circuit board thereat.
8. The heat sink as recited in claim 7, wherein the metal columns respectively depend from each of four corners of a bottom surface of the base.
9. A method of assembling a heat dissipation assembly, comprising the steps of:
providing a printed circuit board, the printed circuit board having a grounding circuit and a plurality of through apertures in the grounding circuit;
mounting a chip on the printed circuit board so that the chip is surrounded by the through apertures;
attaching a heat sink to the chip, the heat sink comprising a base and a plurality of metal columns depending from the base, the columns of the heat sink being inserted into the corresponding through apertures of the printed circuit board; and
welding the metal columns of the heat sink in the through apertures of the printed circuit board so that the heat sink is in intimate thermal contact with an upper surface of the chip.
10. The method of assembling the heat dissipation assembly as recited in claim 9, wherein the columns respectively depend from each of four corners of a bottom surface of the base, and the printed circuit board has four corresponding through apertures.
11. The method of assembling the heat dissipation assembly as recited in claim 9, wherein the columns and the heat sink are made separately and the columns are embedded in the base of the heat sink.
12. The method of assembling the heat dissipation assembly as recited in claim 9, wherein the printed circuit board has four through apertures arranged in a rectangular formation.
13. The method of assembling the heat dissipation assembly as recited in claim 9, wherein the heat sink further comprises a plurality of fins extending upwardly from an upper surface of the base.
US09/746,597 2000-12-07 2000-12-20 Heat dissipation assembly and method of assembling the same Expired - Fee Related US6392888B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW89221276U TW487294U (en) 2000-12-07 2000-12-07 Heat sink assembly
TW89126898A 2000-12-15
TW89126898 2000-12-15
TW089126898 2000-12-15

Publications (2)

Publication Number Publication Date
US6392888B1 US6392888B1 (en) 2002-05-21
US20020075655A1 true US20020075655A1 (en) 2002-06-20

Family

ID=26666939

Family Applications (2)

Application Number Title Priority Date Filing Date
US09/746,597 Expired - Fee Related US6392888B1 (en) 2000-12-07 2000-12-20 Heat dissipation assembly and method of assembling the same
US09/746,407 Expired - Fee Related US6396697B1 (en) 2000-12-07 2000-12-20 Heat dissipation assembly

Family Applications After (1)

Application Number Title Priority Date Filing Date
US09/746,407 Expired - Fee Related US6396697B1 (en) 2000-12-07 2000-12-20 Heat dissipation assembly

Country Status (1)

Country Link
US (2) US6392888B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100223877A1 (en) * 2009-03-03 2010-09-09 The Board Of Regents Of Oklahoma State University Roof truss system for long span and wide spacing with one-sided assembly
EP3264456A1 (en) * 2016-06-23 2018-01-03 Laird Technologies, Inc. Laser weldable brackets for attachment of heat sinks to board level shields
WO2020223300A1 (en) * 2019-04-29 2020-11-05 Ventiva, Inc. Ionic wind generator

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6515861B1 (en) * 2001-04-02 2003-02-04 Advanced Micro Devices, Inc. Method and apparatus for shielding electromagnetic emissions from an integrated circuit
US6822867B2 (en) * 2001-06-29 2004-11-23 Intel Corporation Electronic assembly with solderable heat sink and methods of manufacture
US20030033346A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for managing multiple resources in a system
US20030033398A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for generating and using configuration policies
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
US7133907B2 (en) * 2001-10-18 2006-11-07 Sun Microsystems, Inc. Method, system, and program for configuring system resources
US6965559B2 (en) * 2001-10-19 2005-11-15 Sun Microsystems, Inc. Method, system, and program for discovering devices communicating through a switch
US6459584B1 (en) * 2001-12-13 2002-10-01 Kuo Yung-Pin Fixing frame for positioning heat dispensing device of computers
US20030135609A1 (en) * 2002-01-16 2003-07-17 Sun Microsystems, Inc. Method, system, and program for determining a modification of a system resource configuration
US20030183369A1 (en) * 2002-04-02 2003-10-02 John Makaran Heat sink and method of removing heat from power electronics components
TW524434U (en) * 2002-05-07 2003-03-11 Polo Tech Co Ltd Combinational structure of heat sink
TW535489B (en) * 2002-05-31 2003-06-01 Peng Jian Composite working method of heat conduction device and the product thereof
TW520149U (en) * 2002-06-14 2003-02-01 San-Yuan Lin Heat dissipating fan capable of emitting light
US6595275B1 (en) * 2002-07-02 2003-07-22 Waffer Technology Corp. Heat sink assembly
JP3853263B2 (en) * 2002-07-08 2006-12-06 Ｎｅｃエレクトロニクス株式会社 Semiconductor device
US7103889B2 (en) 2002-07-23 2006-09-05 Sun Microsystems, Inc. Method, system, and article of manufacture for agent processing
US7143615B2 (en) 2002-07-31 2006-12-05 Sun Microsystems, Inc. Method, system, and program for discovering components within a network
US20040022200A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for providing information on components within a network
US20040024887A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for generating information on components within a network
JP3894070B2 (en) * 2002-08-06 2007-03-14 富士通株式会社 Heat sink, heat sink device, fixing method of heat sink, and electronic device using the heat sink
TW536139U (en) * 2002-09-09 2003-06-01 Hon Hai Prec Ind Co Ltd Dissipating assembly
US6953227B2 (en) * 2002-12-05 2005-10-11 Sun Microsystems, Inc. High-power multi-device liquid cooling
US6657865B1 (en) * 2002-12-12 2003-12-02 Wuh Chuong Indutrial Co., Ltd. Heat dissipating structure
US20040184272A1 (en) * 2003-03-20 2004-09-23 Wright Steven A. Substrate for light-emitting diode (LED) mounting including heat dissipation structures, and lighting assembly including same
US6903271B2 (en) * 2003-09-30 2005-06-07 Intel Corporation Electronic assembly with thermally separated support
US7327578B2 (en) * 2004-02-06 2008-02-05 Sun Microsystems, Inc. Cooling failure mitigation for an electronics enclosure
US7497248B2 (en) * 2004-04-30 2009-03-03 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device
TW200611107A (en) * 2004-09-24 2006-04-01 Via Tech Inc Heat dissipation module
CN2799931Y (en) * 2004-12-03 2006-07-26 鸿富锦精密工业（深圳）有限公司 Fan fixing device
US7284882B2 (en) 2005-02-17 2007-10-23 Federal-Mogul World Wide, Inc. LED light module assembly
CN1913766A (en) * 2005-08-12 2007-02-14 鸿富锦精密工业（深圳）有限公司 Heat sink capable of preventing interference of electromagnetic
US7304845B2 (en) * 2005-11-02 2007-12-04 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat sink assembly
US7289330B2 (en) * 2005-11-10 2007-10-30 Fu Shun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a fan mounting device
US7493940B2 (en) * 2006-10-10 2009-02-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having mounting brackets
US20080089031A1 (en) * 2006-10-17 2008-04-17 Hon Hai Precision Industry Co., Ltd. Heat sink assembly
US7950446B2 (en) * 2007-07-16 2011-05-31 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with clip for mounting a fan to a heat sink thereof
TW200905458A (en) * 2007-07-30 2009-02-01 Inventec Corp Heat-dissipating module
US9086213B2 (en) * 2007-10-17 2015-07-21 Xicato, Inc. Illumination device with light emitting diodes
US20090284933A1 (en) * 2008-05-15 2009-11-19 Edison Opto Corporation Combination type heat dissipation module
CN101742819B (en) * 2008-11-21 2013-03-20 鸿富锦精密工业（深圳）有限公司 Circuit board compobination
CN101778553A (en) * 2009-01-12 2010-07-14 鸿富锦精密工业（深圳）有限公司 Radiator
DE102009034829B4 (en) * 2009-07-27 2011-06-09 Siemens Aktiengesellschaft Device for releasably securing a fan
WO2011060319A1 (en) * 2009-11-13 2011-05-19 Uni-Light Llc Led thermal management
EP2608258A1 (en) * 2011-12-20 2013-06-26 STMicroelectronics (Grenoble 2) SAS A package
US10239164B2 (en) 2013-10-23 2019-03-26 Onanon, Inc. Robotic wire termination system
USD732655S1 (en) * 2013-11-21 2015-06-23 Sanyo Denki Co., Ltd. Fan
EP2963680A1 (en) * 2014-07-01 2016-01-06 Siemens Aktiengesellschaft Electronics assembly with a heat sink
KR20200107201A (en) * 2019-03-06 2020-09-16 삼성전기주식회사 Electronic device module and manufacturing method thereof
US10886685B2 (en) * 2019-03-08 2021-01-05 Onanon, Inc. Preformed solder-in-pin system
US10868401B1 (en) 2020-03-04 2020-12-15 Onanon, Inc. Robotic wire termination system
US11699884B2 (en) * 2020-07-27 2023-07-11 International Business Machines Corporation Electromagnetic shielding of heatsinks with spring press-fit pins

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4544942A (en) * 1982-02-22 1985-10-01 Aavid Engineering, Inc. Heat sinks with staked solderable studs
US5241453A (en) * 1991-11-18 1993-08-31 The Whitaker Corporation EMI shielding device
FR2686765B1 (en) * 1992-01-28 1994-03-18 Alcatel Converters FIXING DEVICE, PARTICULARLY FOR FIXING AN ELECTRONIC COMPONENT ON A WALL OF A HEAT SINK.
US5699610A (en) * 1994-04-22 1997-12-23 Nec Corporation Process for connecting electronic devices
GB2293487B (en) * 1994-09-21 1998-08-12 Hewlett Packard Co Method and apparatus for attaching a heat sink and a fan to an intergrated circuit package
US5566052A (en) * 1995-06-08 1996-10-15 Northern Telecom Limited Electronic devices with electromagnetic radiation interference shields and heat sinks
US5706169A (en) * 1996-05-15 1998-01-06 Yeh; Robin Cooling apparatus for a computer central processing unit
US5864464A (en) * 1997-06-09 1999-01-26 Lin; Alex Heat sink for integrated circuit
US5875097A (en) * 1997-06-09 1999-02-23 Power Trends, Inc. Heat sink for auxiliary circuit board
US5870286A (en) * 1997-08-20 1999-02-09 International Business Machines Corporation Heat sink assembly for cooling electronic modules
TW477437U (en) * 1998-06-23 2002-02-21 Foxconn Prec Components Co Ltd Assembled-type CPU heat sink
US6017185A (en) * 1998-08-13 2000-01-25 Chaun-Choung Industrial Corp. Fan fixing structure of a radiator
US6219239B1 (en) * 1999-05-26 2001-04-17 Hewlett-Packard Company EMI reduction device and assembly
US6278615B1 (en) * 1999-06-30 2001-08-21 International Business Machines Corporation Heatsink grounding spring and shield apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100223877A1 (en) * 2009-03-03 2010-09-09 The Board Of Regents Of Oklahoma State University Roof truss system for long span and wide spacing with one-sided assembly
EP3264456A1 (en) * 2016-06-23 2018-01-03 Laird Technologies, Inc. Laser weldable brackets for attachment of heat sinks to board level shields
US10624245B2 (en) 2016-06-23 2020-04-14 Laird Technologies, Inc. Laser weldable brackets for attachment of heat sinks to board level shields
WO2020223300A1 (en) * 2019-04-29 2020-11-05 Ventiva, Inc. Ionic wind generator

Also Published As

Publication number Publication date
US6396697B1 (en) 2002-05-28
US20020075654A1 (en) 2002-06-20
US6392888B1 (en) 2002-05-21

Similar Documents

Publication Publication Date Title
US6392888B1 (en) Heat dissipation assembly and method of assembling the same
US6493233B1 (en) PCB-to-chassis mounting schemes
US6220884B1 (en) BGA socket
EP0129966B1 (en) High cooling efficiency circuit module
US5513070A (en) Dissipation of heat through keyboard using a heat pipe
EP0683450B1 (en) Card type semiconductor device
JP5160434B2 (en) Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a ground spring having multi-junction spring fingers
JP3360179B2 (en) Ball grid array socket
US6153932A (en) Fix base of integrated circuit chipset and heat sink
US6269864B1 (en) Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors
US5894408A (en) Electronic cartridge which allows differential thermal expansion between components of the cartridge
US7333338B2 (en) Memory module assembly including a clip for mounting a heat sink thereon
US7015073B2 (en) Method of forming heat spreader with down set leg attachment feature
US7980861B2 (en) Printed circuit board unit and socket
US6483702B1 (en) Apparatus and methods for attaching thermal spreader plate to an electronic card
JPH08321367A (en) Low atittude socket type integrated circuit packaging system
US6542366B2 (en) Circuit board support
KR100416980B1 (en) Fixing device for ball grid array chip
US6434004B1 (en) Heat sink assembly
US20040124517A1 (en) Structural reinforcement for electronic substrate
US6408509B1 (en) Vertically mountable interposer, assembly and method
US20050233628A1 (en) Land grid array connector with reinforcement stiffener
US20020185728A1 (en) Thermal transfer plate
US6373701B1 (en) Heat dissipation assembly
US6053240A (en) Heat sink

Legal Events

Date Code Title Description
AS Assignment

Owner name: FOXCONN PRECISION COMPONENTS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, YUNG CHOU;LIN, CHE CHENG;REEL/FRAME:011405/0817

Effective date: 20001210

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

AS Assignment

Owner name: GOLD CHARM LIMITED, SAMOA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HON HAI PRECISION INDUSTRY CO., LTD.;REEL/FRAME:029558/0392

Effective date: 20121227

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Expired due to failure to pay maintenance fee

Effective date: 20140521