US20020125170A1 - Transport module - Google Patents
Transport module Download PDFInfo
- Publication number
- US20020125170A1 US20020125170A1 US10/013,305 US1330501A US2002125170A1 US 20020125170 A1 US20020125170 A1 US 20020125170A1 US 1330501 A US1330501 A US 1330501A US 2002125170 A1 US2002125170 A1 US 2002125170A1
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- United States
- Prior art keywords
- pair
- door
- plastic
- container portion
- handles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
Abstract
Description
- This application is a Continuation-in-Part of application Ser. No. 09/476,546, filed Jan. 3, 2000, which is a Continuation of application Ser. No. 08/891,644, filed Jul. 11, 1997 issued as U.S. Pat. No. 6,010,008 which are hereby incorporated herein by reference in their entirety.
- This invention relates to carriers for semiconductor wafers and more particularly it relates to a closeable container for storing and transporting wafers.
- Sealable enclosures, generally termed transport modules, have been utilized in the semiconductor processing industry for a number of years for storing and transporting wafers between processing steps and/or between facilities. Semiconductor wafers are notoriously vulnerable to damage from contaminants such as particles. Extraordinary measures are taken to eliminate contaminants in cleanrooms and other environments where semiconductor wafers are stored or processed into circuits.
- For wafers in the range of 200 mm and smaller, containers known as SMIF pods (standardized mechanism interface) have been utilized to provide a clean sealed mini-environment. Examples of these pods are shown in U.S. Pat. Nos. 4,532,970 and 4,534,389. Such SMIF pods typically utilize a transparent box-shaped shell with a lower door frame or flange defining an open bottom and a latchable door. The door frame clamps onto processing equipment and a door on the processing equipment and the lower SMIF pod door closing the open bottom are simultaneously lowered downwardly from the shell into a sealed processing environment in said processing equipment. A separate H-bar carrier positioned on the top surface inside of the SMIF pod door and loaded with wafers is lowered with the pod door for accessing and processing said wafers. In such pods the weight of the wafers would be directly on the door during storage and transport.
- The semiconductor processing industry is moving toward utilization of larger and heavier wafers, specifically 300 mm wafers. Transport modules for such modules, by way of developing industry standards, will utilize a front opening door for insertion and removal of the wafers as opposed to a bottom door that drops downwardly from the module. The door would not support the load of the wafers, rather a container portion which would include a clear plastic (such as polycarbonate) shell and other members or supporting the wafers molded from a low particle generating plastic (such as polyetheretherketone) would carry the load of the wafers. Such container portions necessarily are made from multiple components assembled together.
- In handling and processing semiconductor wafers, static electricity is a continuing concern. Electrostatic discharges can damage or ruin semiconductor wafers. Therefore, means must be taken to minimize any such generation of potentials which may cause static electric discharges. H-bar carriers have been manufactured with convention static dissipative materials such as carbon filled polyetheretherketone (PEEK) and polycarbonate (PC).
- The developing industry standards for such 300 mm modules require a machine interface, such as a kinematic coupling, on the bottom of the module to repeatedly and with precision align the module with respect to the processing equipment. This allows robotic handling means to engage the door on the front side of the module, open the door, and with the necessary amount of precision grasp and remove specific horizontally arranged wafers. It is highly critical to have the wafers positioned at a particular height and orientation with reference to the equipment machine interface such that the wafers will not be located and damaged during the robotic withdrawal and insertion of said wafers.
- Due to inconsistencies in molding plastic parts assembly of such plastic parts lead to inconsistencies, such as open cracks between parts and the stacking of the tolerances of each individual part leading to undesirable variations in critical dimensions.
- Known front opening 300 mm transport modules utilize multiple component parts including multiple components between the equipment interface and the wafer supports. This can lead to difficulty in producing modules with acceptable tolerances between the wafer planes and the equipment interface. Additionally, such modules have a path to ground from the wafer shelves to the equipment interface through several different components including metallic screws.
- The 300 mm wafers are substantially greater in size and weight than the 200 mm modules; therefore, a structurally stronger module for transporting batches of wafers is required. Typically with the 200 mm SMIF pods the module was simply carried manually by grasping the lower edges at the juncture of the shell door flange and the door. Handles have been provided on the top of the shell portion for bottom opening pods. For carrying the larger, heavier, and bulkier modules for 300 mm wafers side handles are appropriate. For certain applications, the movement of the 300 mm module may be exclusively by way of robotic means thus not requiring handles or other means for manually transporting the container. Thus, a robotic lifting handle should be provided and any manual lifting handles should be easily removable.
- Additionally, due to the high susceptibility of wafers to contamination by particles, moisture or other contaminants it is ideal to have a minimal number of potential entry paths to the interior of the module. Paths or breaks in the plastic between the interior and exterior of the pod such as for fasteners or at the junction of separate component parts of the module are to be avoided. Any such path required should be adequately sealed.
- Additionally, the use at any location in the pod of metallic fasteners or other metal parts are highly undesirable in semiconductor wafer carriers or containers. Metallic parts generate highly damaging particulates when rubbed or scrapped.
- A front-opening wafer transport module has a container portion with transparent shell and a central support structure which includes a machine interface exposed at the bottom of the module and integral wafer support columns extending upwardly in the container portion for supporting wafers. Additionally, the side walls of the shell have recessed portions with engagement members that cooperate with engagement members on removable handles. The handles utilize detents to lock into place in the recesses on the side walls of the carrier. Attachment of the handles to the side walls is accomplished without breaks between the interior and exterior of the module and without separate fastners.
- A feature and advantage of the invention is that there are no stacking of tolerances among parts relative to the machine interface level and the levels of the wafers on the wafer shelves. Where multiple components define the machine interface level and the wafer levels, each part has a separate manufacturing tolerance and when such components are assembled into the module the tolerances are cumulative. This translates into a higher rejection of individual parts and/or a higher rejection level of assembled modules. The instant invention utilizes a single integral component for the machine interface and the wafer support members.
- Another advantage and feature of the invention is that a non-interrupted path-to-ground extends from each wafer support shelf to the machine interface.
- Another object and advantage of the invention is that the central support structure which holds the wafers is assembled into the shell through a lower opening and is secured in place by a rotation of the central support structure with respect to the shell. No metallic fasteners are used.
- Additionally, the central support structure engages and locks at the top of the shell by way of a top portion with a collar that extends into an aperture in the top of the shell and robotic lifting flange that slidably engages the top portion of the central support structure and also thereby non-rotatably locks the support structure to the shell. Again, no metallic fasteners or components are used.
- Another object and advantage of the invention is that the breaks or openings in the module between the interior and exterior are sealed such as by elastomeric seals. The breaks or openings other than at the front door are circular in shape and are sealed such as by O-rings.
- Anther object and advantage of the invention is that handles may be easily added and removed to the module without utilizing metallic fasteners or other separate fasteners and without breaks or openings in the solid side walls.
- Another object and advantage of the invention is that the component parts may be easily disassembled for cleaning and/or replacement for maintenance.
- FIG. 1 is a perspective view of a transport module plotting the invention.
- FIG. 2 is a perspective view of the container portion of a transport module embodying the invention.
- FIG. 3 is a perspective view of the inside facing cover of the door for the transport module embodying the invention.
- FIG. 4 is an exploded view showing the various component parts of a transport module.
- FIG. 5 is a perspective view of a container portion of the transport module.
- FIG. 6 is a perspective view of a guide-in structure.
- FIG. 7 is a bottom view of the shell of the container portion.
- FIG. 8 is a top plan view of the central support structure.
- FIG. 9 is a cross-sectional view taken at line9-9 of FIG. 8.
- FIG. 10 is a cross-sectional view taken at line10-10 of FIG. 7.
- FIG. 11 is a front elevational view of the top portion of the central support structure.
- FIG. 12 is a front elevational view of the second connecting member including the robotic flange.
- FIG. 13 is a cross-sectional view taken at line13-13 of FIG. 8.
- FIG. 14 is a front elevational view of the handle.
- FIG. 15 is a side elevational view of the handle.
- FIG. 16 is a side elevational view of a portion of the shell showing the recess for the handle.
- FIG. 17 is a cross-sectional view taken at line17-17 of FIG. 6.
- FIG. 18 is an elevational view of an alternative embodiment of the invention focusing on the handle and recess for receiving the handle.
- FIG. 19 is a cross-sectional view taken at line19-19 of FIG. 18.
- FIG. 20 is a cross-sectional view taken at line20-20 of FIG. 18.
- FIG. 21 is a side elevational view of a portion of the module showing an alternative embodiment of the handle.
- FIG. 22 is a side elevational view of the handle.
- FIG. 23 is a cross-sectional view taken at line23-23 of FIG. 21.
- FIG. 24 is a cross-sectional view taken at line24-24 of FIG. 21.
- Referring to FIGS. 1, 2, and3 a composite transport module for wafers generally designated with the numeral 20 is principally comprised of a
container portion 22 and adoor 24. The container portion includes arobotic lifting flange 26 and manual lifting handles 28. Thedoor 24 has manual opening handles 30 and akey slot 32 which provides capability of being opened by way of robotic means. FIG. 2 shows the container portion and its open interior 36 with a plurality ofwafers 38 shown supported and axially arranged in said open interior. FIG. 3 shows theinside surface 40 of the door. The door has a pair ofwafer restraints 42 which engage and restrain the wafers when the door is in place. The wafer retainers are formed offlexible teeth 44 which are of resilient molded plastic. Thedoor 24 fits within adoor flange 46 on thecontainer portion 22 and utilizeslatches 48 which extend and retract from thedoor enclosure 50 to engagerecesses 54 in the door flange. The door has a pair ofinternal latch mechanisms 53 which operate independently of each other and by way of themanual door handle 30 orkey slot 32. FIG. 3 also depicts a piece ofprocessing equipment 55 with amodule interface portion 56 on which thetransport module 20 is engaged. - Referring to FIG. 4, an exploded perspective view of the transport module which show details of the construction and the various component parts. The
container portion 22 is comprised principally of ashell 58 and acentral support structure 60. - The
shell 58 has a top 64 with anaperture 66, a bottom 68 with alower opening 70, an openfront side 72, aleft side wall 74, and aright side wall 76 both with handle receiving portions configured asrecesses 78 extending inwardly. Notably, the recesses project into the interior but have no cracks, breaks, openings or apertures between the interior 74 and the exterior of the container. The side walls may be continuous and solid. The handle receiving portions include a recessedplanar portion 80 which is part of the side walls. Shelves may be as shown in U.S. patent application Ser. No. 09/523,745 to David Nyseth filed Mar. 13, 2000. Said application is hereby incorporated by reference. - The
central support structure 60 is comprised of a bottom portion with anequipment interface 86 configured as a plate with threeinterface structures 88 which comprise a kinematic coupling. Integral with themachine interface portion 86 are a pair ofwafer support columns 92 each of which comprise a plurality of shelves 94 and defining awafer receiving region 95. Each shelf havingwafer engagement portions 96. Thewafer support columns 92 are integral with atop portion 100 which includes a spanningmember 101 which extends between the tops 98 of thesupport columns 92 and also includes a first connectingmember 104. - The
central support structure 60 assembles upwardly into thelower opening 70 of theshell 58 with the first connecting member extending upwardly through theaperture 66 on the top 64 of theshell 58. The second connectingmember 106 slidably engages on the first connectingmember 104 for retention of the central support structure in the shell. A second connectingmember 106 which is integral with a robotic lifting handle 108 configured as a flange. The shell also includesfirst engagement members 112 as part of a support structure engagement portion 113 which engage withsecond engagement members 114 as part of a shell engagement portion 115 on the central support structure. These cooperating engagement members also secure the central support structure to and within the shell. A first O-ring 118 engages between thetop portion 100 of the central support structure and the top 64 of the shell to create a seal thereabout. Similarly, a second O-ring 120 seals between themachine interface portion 86 and the bottom 68 of the shell. Referring to FIG. 5, thetransport module 20 with thedoor 24 removed reveals theopen interior 36 and the various interior structures. This particular embodiment utilizes a guide-instructure 122 which engages withrails interior surface 130 of theside walls elongate engagement members 136 to fit within therails structure 122 includesteeth 138 which defineslots 140 which are substantially parallel to and correlate with each of theslots 142 as defined by the shelves 94 of saidwafer support columns 92. Typically the guide-in members are intended to be used when there is manual insertion of the wafers as opposed to robotic insertion. The guide-instructures 122 can also be expanded to support each wafer during more of each wafer's travel into and out of the transport module. - As shown best in FIGS. 4, 5 and8, the lower portion of the central support structure includes a
machine interface plate 86 which has a planartop surface 170 and astep 174 down to a lowerplanar surface 176. Note that the lowerplanar surface 176 confronts the inwardly-extendingportion 180 of the bottom 68 of theshell 58. Note that this inwardly-extendingportion 180 does not extend uniformly as a chord across the lower generallycircular opening 70; rather afurther inset portion 184 allows thecentral support structure 60 to be put in place slightly rotated off the fully aligned position to provide for the insertion of the second engagement members into position intermediate thefirst engagement member 112 on the shelf. Thecentral support structure 60 can then be partially rotated to the assembled position as shown in FIG. 5. - Referring to FIGS. 4, 8,11 and 12, details of the elements and components which comprise the connection between the
top portion 100 of thecentral support structure 60 and theshell 58 are shown in detail. Thetop portion 100 has a pair of first connectingmembers 104 which have a generally T-shaped cross section as best shown in FIG. 11. The first connectingmembers 104 engage with and fit intoslots 186 also having a T-shaped cross section in the second connectingmember 106 which is part of therobotic lifting flange 108. After thecentral support structure 60 is inserted into place in theshell 58 and rotated to the proper alignment position, the collar orneck 188 of thetop portion 100 will extend through theaperture 66 and will confront theinner edge 190 which defines said aperture. The smaller O-ring 118 fits into the O-ring groove 194 on saidneck 188 and creates a seal with the shell at theinner edge 190. The phantom line of FIG. 11 shows the relationship of the top 64 of theshell 58 as it confronts theneck 188 of the top portion of thecentral support structure 60. Thus, when the second connectingmember 106 is engaged with the first connectingmembers 104, the top 64 of theshell 58 is sandwiched between saidfirst engagement member 106 and thetop portion 100 of the central support structure. The second connectingmember 106 may be locked in place on the first connectingmember 104 by way of an appropriately positioned detent ornub 202 such as shown in FIG. 4 on thetop surface 203 of the top of theshell 58. Alternatively or additionally, screws 206 may be utilized which would extend through the robotic pick-upflange 108 through the second connectingmember 106 and into the threadedholes 208 in the first connectingmembers 106. The screws are appropriately nylon as opposed to a metallic material. - The
equipment interface 86 as best shown in FIGS. 4, 5 and 8, includes akinematic coupling 90 formed by way of theequipment engagement portion 88. Referencing FIG. 13 which is a cross section through one such structure, thelower surface 220 includes a pair of angled faces 222, 224 defining a groove 225 which would engage partial, spherical surfaces on the equipment, not shown. Alternatively, the interface portion of thecentral support structure 60 could include said three partial spheres and the cooperating equipment include the grooves formed by angled faces. Alternatively, theequipment interface 86 could include alternate configurations and features to interface with the associated equipment. - Referring to FIGS. 2, 14,15, 16, and 17, details of the construction and assembly of the removable manual lifting handles 28 are shown. The handle comprises a
gripping portion 240 and ashell engagement portion 242. Theshell engagement portion 242 utilizesresilient portions 244 withdetents 246 and stops 248. Thedetents 246 have awedge portion 250 which facilitates installation of the handle into therecesses 78 and rotation under thesecond engagement structures 254 on theshell 58. The said second engagement structures comprises a pair of inwardly-extendingmembers 255 configured as guide strips which correspond to theextended portion 258 on thehandle engagement portion 242 when said handle is in a locked position in saidrecess 78. In such a locked position, thedetents 246 and thestops 248 are at opposite ends of the guide strips 255. Therecess 78 is defined by way of aplanar portion 262 integral with a circumferential recess wall configured as a ring-shapedportion 264 which is integral with the shell. Theguide members 255 are integral with and extend from saidring portion 264. Said configuration allows easy installation simply by placement of thehandles 28 into therecesses 78 shown in FIG. 16 with the outwardly-extending portions positioned intermediate theguide members 255 and then rotating in a clockwise direction said handle with the first engagement structure whereby the extendingportions 258 including thedetent 246 rotate underneath theguide members 255 until thedetents 246 snap into place at theirseating positions 269 at which point thestops 248 are in their respective seating positions 270. - Significantly, this particular configuration allows easy installation and removal of the handle such as for cleaning or storage or when a robotic application does not require use of the handle. Additionally, the integrity of the separation between the interior of the transport module and the exterior is not affected. In other words, there are no breaks, openings or fasteners through the side walls to accomplish the connection of the handle to said shell.
- Referring to FIG. 18, engagement structure275 includes an alternative embodiment of the
removable handle 28 shown. This embodiment again utilizes arecess 78 extending inwardly in theside wall 74 with aplanar portion 262 at the bottom of said recess. A recess wall orborder portion 274 extends around and defines said recess and is integral with theplanar portion 262 and theside wall 74.First engagement member 276 configured as four tabs extending inwardly from therecess wall 274. The manual lifting handle 28 comprises agripping portion 240 and theengagement portion 254 which includesplanar portion 277 with resiliently-flexible portions withdetents 284. The manual handle 28 is inserted into therecess 78 such that theresilient portions 280 are placed intermediate thetabs 276 and the handle is then slid to the left such that the detents extend under said tabs and slide until they reach their locking position as shown in FIG. 18. Again, this configuration does not breach the integrity of the side wall separating the interior of the transport module from the exterior. Other configurations are also available for utilization of the handle with cooperating engagement members utilizing detents. The use of the detents provides a high level of flexibility in placement and removal of the handles and allows exchange of different sizes of handles, for example, for different operators. - The shell portion of the material is preferably injection molded form polycarbonate or polyetherimide or the like. The central support structure is also ideally integrally injection molded and may be formed from carbon fiber filled PEEK or similar materials, ideally which provide a static dissipative feature. The handles may be injection molded from polycarbonate or polyetherimide. The top second connecting member including the robotic lifting handle may be also formed from carbon fiber filled PEEK or other static dissipative injection molded material.
- The mechanisms utilized for latching the doors can be varied and may be such as shown in U.S. Pat. Ser. No. 4,995,430 to Anthony C. Bonora et al., 5,915,562 to Nyseth, or similar mechanisms.
- Referring to FIGS. 19 and 20, cross-sectional views are taken through the shell and handle member as shown in FIG. 18. Note the
detent 284 includes a wedge-shapedportion 250 to aid insertion under theengagement member 276. Referring to FIGS. 21, 22, 23, and 24, various views are shown of an additional embodiment of the handle member and the cooperating engagement structure of the shell. In this particular embodiment thedetent members 300 extend normally from the recessedplanar portion 304 and thus normally from the side wall of the shell. The detent members generally comprise a pair of angled or wedge-shapedportions 308 sized to fit into a cooperatingsecond engagement member 312 utilizing acircular aperture 314. - The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof; and it is, therefore, desired that the present embodiment be considered in all respects as illustrative and not restrictive, reference being made to the appended claims rather than to the foregoing description to indicate the scope of the invention.
Claims (19)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US10/013,305 US6736268B2 (en) | 1997-07-11 | 2001-11-13 | Transport module |
US10/848,096 US7370764B2 (en) | 1997-07-11 | 2004-05-18 | Transport module |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/891,644 US6010008A (en) | 1997-07-11 | 1997-07-11 | Transport module |
US47654600A | 2000-01-03 | 2000-01-03 | |
US10/013,305 US6736268B2 (en) | 1997-07-11 | 2001-11-13 | Transport module |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US47654600A Continuation-In-Part | 1997-07-11 | 2000-01-03 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/848,096 Continuation US7370764B2 (en) | 1997-07-11 | 2004-05-18 | Transport module |
Publications (2)
Publication Number | Publication Date |
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US20020125170A1 true US20020125170A1 (en) | 2002-09-12 |
US6736268B2 US6736268B2 (en) | 2004-05-18 |
Family
ID=46278470
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/013,305 Expired - Lifetime US6736268B2 (en) | 1997-07-11 | 2001-11-13 | Transport module |
US10/848,096 Expired - Fee Related US7370764B2 (en) | 1997-07-11 | 2004-05-18 | Transport module |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/848,096 Expired - Fee Related US7370764B2 (en) | 1997-07-11 | 2004-05-18 | Transport module |
Country Status (1)
Country | Link |
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US (2) | US6736268B2 (en) |
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US20060151404A1 (en) * | 2003-07-11 | 2006-07-13 | Jakob Blattner | Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components |
US20130270152A1 (en) * | 2010-10-19 | 2013-10-17 | Entegris, Inc. | Front opening wafer container with robotic flange |
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US20050224391A1 (en) * | 2001-11-27 | 2005-10-13 | Gregory Bores | Front opening wafer carrier with path to ground effectuated by door |
US7886910B2 (en) * | 2001-11-27 | 2011-02-15 | Entegris, Inc. | Front opening wafer carrier with path to ground effectuated by door |
US20060151404A1 (en) * | 2003-07-11 | 2006-07-13 | Jakob Blattner | Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components |
US7682455B2 (en) * | 2003-07-11 | 2010-03-23 | Tec-Sem Ag | Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components |
US20130270152A1 (en) * | 2010-10-19 | 2013-10-17 | Entegris, Inc. | Front opening wafer container with robotic flange |
US9929032B2 (en) | 2010-10-19 | 2018-03-27 | Entegris, Inc. | Front opening wafer container with robotic flange |
WO2020236923A1 (en) * | 2019-05-23 | 2020-11-26 | Entegris, Inc. | Handle for wafer carrier |
Also Published As
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US20040206664A1 (en) | 2004-10-21 |
US7370764B2 (en) | 2008-05-13 |
US6736268B2 (en) | 2004-05-18 |
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