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Publication numberUS20020149948 A1
Publication typeApplication
Application numberUS 09/987,312
Publication dateOct 17, 2002
Filing dateNov 14, 2001
Priority dateApr 13, 2001
Also published asCA2364809A1, CA2364809C, CN1215280C, CN1381692A, DE10211913A1, DE20221879U1, US6834980, US20030210545
Publication number09987312, 987312, US 2002/0149948 A1, US 2002/149948 A1, US 20020149948 A1, US 20020149948A1, US 2002149948 A1, US 2002149948A1, US-A1-20020149948, US-A1-2002149948, US2002/0149948A1, US2002/149948A1, US20020149948 A1, US20020149948A1, US2002149948 A1, US2002149948A1
InventorsHirofumi Okano, Keiji Shimoyama
Original AssigneeHirofumi Okano, Keiji Shimoyama
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Illumination lamp equipment
US 20020149948 A1
Abstract
When molding the illumination lamp with a conventional resin, since the temperature of the resin is in the range of 240 to 300 C. and the injection pressure is in the range of 400 to 1300 Kg/cm2 at the time of injection, the illumination lamp may be melt by the temperature of the resin or may be broken by the injection pressure.
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Claims(5)
What is claimed is:
1. Illumination lamp equipment wherein the illumination lamp constructed of a LED or a small light bulb is molded with a hot-melt resin with a part of the head portion of the illuminating lamp exposed.
2. Illumination lamp equipment according to claim 1, wherein the lead exposed from the mold is connected to the connector.
3. Illumination lamp equipment according to claim 1, wherein the illumination lamp is a LED, the lead of the LED is connected to the printed board to which a resistor is connected, and then the LED and the printed board are molded with the hot-melt resin except for a part of the head portion of the LED.
4. Illumination lamp equipment wherein the lead of the illumination lamp constructed of a LED or a small light bulb is connected to the terminal of the connector in advance, and then the illumination lamp and a part of the connector are molded with the hot-melt resin with a part of the illumination lamp exposed.
5. Illumination lamp equipment according to claim 4, wherein the illumination lamp is a LED, the lead of the LED is connected to the printed board to which a resistor is connected, and then the printed board is connected in turn to the connector, and subsequently, the printed board, the LED except for a part of the head portion, and a part of the connector are molded with the hot-melt resin.
Description
BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to an improvement of illumination lamp equipment to be mounted on the vehicle illumination such as the interior lighting of the window control switch, the interior lighting of the ashtray, and the foot lighting, or on the front panel of the electronic equipment, comprising a LED, a small light bulb, or the like for indicating the operating position or the driving condition.

[0003] 2. Description of the Related Art

[0004] The conventional lighting tool used for illumination lamp equipment described above includes LEDs or small light bulbs. The exposed portion of the LED or the small light bulb is made of glass or synthetic resin. Therefore, it is difficult to mount these illumination lamps on the vehicle or on the electronic equipment in the exposed state and it may be broken very easily in the exposed state.

[0005] Therefore, in general, a housing for mounting the illumination lamp such as the LED or the small light bulb is manufactured and the illumination lamp is fitted into the housing. However, since the housing is constructed of two halves or formed into cylindrical shape, it is necessary to combine two halves and secure with an adhesive agent with the illumination lamp mounted, or to close the lid with the illumination lamp mounted. Therefore, there is a problem in that the point of fixation between the housing and the illuminating lamp is susceptible to generation of a gap, which may result in entering of dust or backlash, in addition to the problem in that the number of components or the number of manufacturing steps increases.

[0006] As a consequent, as a measure to solve the conventional problems described above, molding the illumination lamp with a nylon base synthetic resin, which is normally used for molding, is conceivable. However, in the method of molding the illumination lamp with nylon base resin, the temperature of the resin is in the range of 240 to 300 C. and the injection pressure is in the range of 400 to 1300 Kg/cm2 at the time of injection as shown in FIG. 5, and thus the illumination lamp such as the LED or the small light bulb may be melt disadvantageously by the temperature of the resin or may be broken by the injection pressure.

SUMMARY OF THE INVENTION

[0007] Accordingly, the present invention is intended to solve the problems described above, and it is an object of the present invention to provide an illumination lamp equipment in which the illumination lamp is not melted or damaged during injection molding by employing a hot-melt resin as a material for molding the illumination lamp.

[0008] In order to achieve the object described above, the illumination lamp equipment is constructed in such a manner that the illumination lamp such as a LED or a small light bulb is molded with a hot-melt resin with a part of the head portion of the illuminating lamp exposed.

[0009] The lead exposed from the molded portion may be connected to the connector, and in the case where a LED is used as an illuminating lamp, it is also possible to connect the lead of the LED to the printed board to which a resistor is connected, and then mold the LED and the printed board with the hot-melt resin except for a part of the head portion of the LED.

[0010] Alternatively, in the case where the lead of the illumination lamp constructed of a LED or a small light bulb is connected to the terminal of the connector in advance, the illumination lamp and a part of the connector are molded with the hot-melt resin with a part of the illumination lamp exposed, and a LED is used as an illumination lamp, it may be constructed in such a manner that the lead of the LED is connected to the printed board to which a resistor is connected, and then the printed board is connected in turn to the connector, and subsequently, the printed board, the LED except for a part of the head portion, and a part of the connector are molded with the hot-melt resin.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011]FIG. 1 is a perspective view of the illumination lamp equipment according to the first embodiment of the present invention showing a state before molding;

[0012]FIG. 2 is the same view as FIG. 1 showing a state after molding;

[0013]FIG. 3 is a perspective view of the second embodiment showing a state before molding;

[0014]FIG. 4 is the same view as FIG. 3 showing a state after molding; and

[0015]FIG. 5 is a comparative table showing the injection temperature and the injection pressure that vary according to the material of molding resin.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Referring now to the drawing, an embodiment of the illumination lamp equipment according to the present invention will be described. FIG. 1 and FIG. 2 show the first embodiment, in which the connector 1 to be connected to the power supply (the connector shown in the figure is a female connector) and the illumination lamp 2 such as a LED, a small light bulb, or the like (the LED is shown in the figure) are provided separately, and the LED 2 and the connector 1 is connected by the lead 3.

[0017] The connector 1 used here is a known type, which is detachably mounted to the male connector (not shown) for receiving power supply. Since the terminal of the illumination lamp 2 is connected to the printed board 4 to which a protective resistor (not shown) is connected, and the printed board 4 is in turn connected to the lead 3, the illumination lamp 2 is electrically connected to the connector 1.

[0018] In this embodiment, the printed board 4 and the illumination lamp 2 except for a part of the head portion are molded by injection molding using a hot-melt resin. Hereinafter, the portion formed by molding is referred to as a molded portion 5.

[0019] Since the temperature of the hot-melt resin during injection is in the range of 175 to 225 C. and the injection pressure thereof is in the range of 3 to 35 Kg/cm2 as is apparent from FIG. 5, which is lower both in temperature and pressure in comparison with the generally used synthetic resin, even the illumination lamp 2 such as a LED, a small light bulb, or the like that may easily be affected by heat and pressure may be prevented from being melted by heat or being broken by the pressure.

[0020] Since the hot-melt resin is a material that is primarily used for adhesive agent, it exhibits superior adhesiveness, waterproof property, dust-proof property, and shake-proof property, molding the illumination lamp 2 with a hot-melt resin having such characteristics may prevent occurrence of breakdown even when it gets wet in the rain or gathers dust, or even when it is exposed to vibration during travel when mounted on the vehicle.

[0021] In the figure, the molded portion 5 is formed with a projection 5 a. The projection 5 a is to be used as a claw for fixing to the mounted member such as the vehicle, the electronic equipment or the like, and the configuration thereof may be modified depending on that of the mounting portion of the mounted member.

[0022] Referring now to FIG. 3 and FIG. 4, the second embodiment will be described. In this embodiment, the illumination lamp 2 and the connector 1 are combined as a single unit. The same reference numerals as the first embodiment described above designate the same members, and the description is not made again.

[0023] In this embodiment, a part of the connector 1, the entire printed board 4, and the illumination lamp 2 except for the head portion are molded with a hot-melt resin in a state in which the conductive pattern of the printed board 4 on which the illumination lamp 2 is mounted and the terminal of the connector 1 are soldered.

[0024] In this embodiment as well, the illumination lamp integrated with the connector 1 is obtained while preventing the illumination lamp 2 from being melted or damaged as in the case of the first embodiment. In addition, by mounting the molded portion 5 to the mounted body by the use of a projection 5 a, the connector 1 can also be mounted. Therefore, the illumination lamp 2 can receive power supply only by connecting the male connector to the connector 1.

[0025] Since the illumination lamp constructed of a LED or a small light bulb is molded with a hot-melt resin with a part of the head portion of the illumination lamp exposed in the present invention, the illumination lamp is prevented from being melted or damaged due to the temperature of the pressure during molding. Concurrently, since the illumination lamp is covered by the hot-melt resin except for the head portion, it is prevented from being damaged even when an impact is applied thereto when it is mounted on the mounted body or while it is in use.

[0026] Moreover, since the lead of the illumination lamp constructed of a LED or a small light bulb is connected to the terminal of the connector in advance, and then the illumination lamp and a part of the connector are molded with the hot-melt resin with a part of the illumination lamp exposed, the connector is fixed on the mounted body simply by mounting the illumination lamp on the mounted body, thereby eliminating the necessity of the lead, simplifying the mounting operation onto the mounted body, and decreasing time and cost.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7160140Jul 13, 2005Jan 9, 2007Gelcore LlcLED string light engine
US7520771Oct 5, 2006Apr 21, 2009Lumination LlcLED string light engine and devices that are illuminated by the string light engine
US7677914Apr 1, 2009Mar 16, 2010Lumination LlcLED string light engine and devices that are illuminated by the string light engine
US8371723Nov 23, 2011Feb 12, 2013GE Lighting Solultions LLCLED lighting assemblies with thermal overmolding
US8465175Nov 29, 2005Jun 18, 2013GE Lighting Solutions, LLCLED lighting assemblies with thermal overmolding
US8756801Nov 23, 2011Jun 24, 2014GE Lighting Solutions, LLCMethod of manufacturing a lighting assembly with thermal overmolding
WO2004023033A1 *Sep 3, 2003Mar 18, 2004Maikel A W KlompLed assembly
Classifications
U.S. Classification362/549, 362/555, 362/800
International ClassificationB60Q3/02, B29C45/14, F21V19/00, F21W101/08, F21Y101/02, B29C45/00, H01L33/52
Cooperative ClassificationY10S362/80, F21Y2101/02, B29C45/14836, B29L2031/30, F21V19/001, B29L2031/747, B29C45/0001
European ClassificationB29C45/00B, B29C45/14U
Legal Events
DateCodeEventDescription
Nov 14, 2001ASAssignment
Owner name: KABUSHIKI KAISHA T AN T, JAPAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:OKANO, HIROFUMI;SHIMOYAMA, KEIJI;REEL/FRAME:012307/0571
Effective date: 20011011