Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUS20020197752 A1
Publication typeApplication
Application numberUS 10/191,492
Publication dateDec 26, 2002
Filing dateJul 10, 2002
Priority dateMay 24, 1999
Also published asUS6440761
Publication number10191492, 191492, US 2002/0197752 A1, US 2002/197752 A1, US 20020197752 A1, US 20020197752A1, US 2002197752 A1, US 2002197752A1, US-A1-20020197752, US-A1-2002197752, US2002/0197752A1, US2002/197752A1, US20020197752 A1, US20020197752A1, US2002197752 A1, US2002197752A1
InventorsWon-bong Choi
Original AssigneeChoi Won-Bong
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Carbon nanotube field emission array and method for fabricating the same
US 20020197752 A1
Abstract
A field emission array (FEA) using carbon nanotubes having characteristics of low work function, durability and thermal stability, and a method for fabricating the same are provided. The field emission array uses carbon nanotubes as electron emission sources, thereby lowering a work function and dropping driving voltage. Accordingly, a device can be driven at low voltage. In addition, resistance to gases, which are generated during the operation of a device, is improved, thereby increasing the life span of an emitter. The method prints a mixed paste using extrusion or screen printing and performs sintering, thereby fusing carbon nanotubes such that the carbon nanotubes are aligned in a single direction.
Images(12)
Previous page
Next page
Claims(14)
What is claimed is:
1. A field emission array using carbon nanotubes, comprising:
front and rear substrates facing each other and separated by a predetermined distance;
anodes and cathodes formed on the front and rear substrates facing each other, respectively, in a striped pattern, the anodes and the cathodes crossing each other;
carbon nanotubes fixed on the cathodes corresponding to intersections between the cathodes and the anodes; and
a metal fuser element for fixing the carbon nanotubes on the cathodes and conducting currents between the cathodes and the carbon nanotubes.
2. The field emission array of claim 1, further comprising:
an insulating layer deposited on the cathodes around the carbon nanotubes and the rear substrate; and
gates formed on the insulating layer in a striped pattern to be parallel to the anodes.
3. The field emission array of claim 1 or 2, wherein each of the anodes is formed of an ITO film and coated with phosphor.
4. A method of fabricating a field emission array using carbon nanotubes, the method comprising the steps of:
(a) forming cathodes on a rear substrate in a striped pattern;
(b) printing a mixture of carbon nanotubes, metal powder and organic binder on predetermined areas of the cathodes;
(c) vaporizing the organic binder by sintering the mixture and anchoring the carbon nanotubes on the cathodes by diffusing the metal powder; and
(d) combining a front substrate, on which anodes are formed in a striped pattern, with the rear substrate having the cathodes on which the carbon nanotubes are anchored.
5. The method of claim 4, further comprising the steps of:
forming an insulating layer on the tops of the cathodes other than portions to which the carbon nanotubes are to be adhered and on the top of the exposed rear substrate, before the step (b); and
forming gates on the insulating layer after the step (c).
6. The method of claim 4 or 5, wherein in the step (b), the metal powder is composed of metal particles having a diameter of 0.1-10 μm.
7. The method of claim 4 or 5, wherein in the step (b), the metal powder is diffused at a temperature of 250-500 C.
8. The method of claim 7, wherein the metal powder is composed of particles of a metal selected from the group consisting of Ag, Al, Ni, Cu and Zn.
9. The method of claim 4 or 5, wherein in the step (b), the metal powder is melted at a low temperature of 100-350 C., and in the step (c), the mixture is sintered to evaporate the organic binder, and the low melting point metal powder is melted to anchor the carbon nanotubes on the cathodes.
10. The method of claim 9, wherein the metal powder is composed of particles of a metal selected from the group consisting of Pb, In, InSn, PbSn, AuSn and a metal alloy thereof, and the diameter of each of the particles is 0.1-10 μm.
11. The method of claim 4 or 5, wherein in the step (b), the organic binder is composed of at least one selected from the group consisting of α-terpineol, ethyl cellulose and butyl carbitol acetate.
12. The method of claim 4 or 5, wherein in the step (b), the printing is performed by an extrusion method using a filter for aligning the carbon nanotubes.
13. The method of claim 4 or 5, wherein in the step (b), the printing is performed by a screen printing method using a metal mesh screen which is patterned for aligning the carbon nanotubes.
14. The method of claim 4 or 5, wherein in the step (c), the sintering is performed at a temperature of 200-500 C.
Description
BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a field emission array (FEA) using carbon nanotubes having characteristics of low work function, durability and thermal stability, and a method for fabricating the same.

[0003] 2. Description of the Related Art

[0004] Carbon nanotubes, which were developed in 1991, are similar to fulleren (C6O). Since they have an excellent electron emission characteristic and chemical and mechanical durability, their physical properties and applications have steadily been studied.

[0005] A Spind't-type field emission emitter, which is generally used for field emission displays, is composed of an emitter for emitting electrons and a gate for facilitating the emission of electrons. The emitter has a problem in that the life span of a tip is shortened due to atmosphere gases or a non-uniform electric field during operation. In addition, with such conventional metal emitter, a work function must be decreased to decrease the driving voltage, but there are limitations. To overcome this problem, fabrication of an electron emission source using carbon nanotubes which have a substantially high aspect ratio, an excellent durability due to their structure similar to that of C6O, and an excellent electron conductivity has been studied.

[0006]FIG. 1 is a schematic exploded perspective view of a field emission device using conventional carbon nanotubes which are disclosed in Appl. Phys. Lett., Vol. 72, No. 22, Jun. 1, 1998. As shown in FIG. 1, the field emission device using the conventional carbon nanotubes includes a front substrate 1 and a rear substrate 11 facing each other and anodes 2 and cathodes 12 which are formed on the front and rear substrates 1 and 11, respectively, in a striped pattern such that the anodes 2 cross the cathodes 12. The cathodes 12 are formed of carbon nanotubes in a structure in which grooves are formed on the rear substrate 11 in a striped pattern and the grooves are filled with a carbon nanotube-epoxy mixture. The anodes 2 are formed of an ITO film coated with phosphors.

[0007]FIG. 2A shows the steps of a method of fabricating the cathodes 12 on the rear substrate 11 of the field emission device of FIG. 1 using carbon nanotubes. FIG. 2B shows the steps of a method of fabricating the anodes 2 on the front substrate 1 of the field emission device of FIG. 1 using carbon nanotubes.

[0008] In fabricating the cathodes 12 using carbon nanotubes, grooves 12 a, as shown in (b) of FIG. 2A, are formed in a striped pattern on a glass substrate 11′, as shown in (a) of FIG. 2A. Next, a carbon nanotube-epoxy mixture 12′ is deposited, as shown in (c) of FIG. 2A. Finally, the surface of the resulting structure is planarized to complete the cathodes 12, as shown in (d) of FIG. 2A.

[0009] In fabricating the anodes 2, an ITO film 2′ is deposited on the glass substrate 1, as shown in (a) of FIG. 2B. Next, as shown in (b) of FIG. 2B, the ITO film 2′ is etched in a striped pattern to form the anodes 2. As shown in (c) of FIG. 2B, the anodes 2 are coated with phosphors 3.

[0010] In fabricating cathodes using carbon nanotubes in such way, however, it is very difficult to align the carbon nanotubes in a single direction and to connect the carbon nanotubes to electrodes when manufacturing a device. Accordingly, this alignment problem must be overcome to substantially apply carbon nanotubes to a display device.

SUMMARY OF THE INVENTION

[0011] To solve the above problem, an object of the present invention is to provide a field emission array using carbon nanotubes, which can be easily aligned and closely contacts cathodes, and a method for fabricating the same.

[0012] To achieve the above object, the present invention provides a field emission array using carbon nanotubes. The field emission array includes front and rear substrates facing each other and separated by a predetermined distance; anodes and cathodes formed on the front and rear substrates facing each other, respectively, in a striped pattern, the anodes and the cathodes crossing each other; carbon nanotubes fixed on the cathodes corresponding to intersections between the cathodes and the anodes; and a metal fuser element for fixing the carbon nanotubes on the cathodes and conducting currents between the cathodes and the carbon nanotubes.

[0013] Preferably, the field emission array also includes an insulating layer deposited on the cathodes around the carbon nanotubes and the rear substrate, and gates formed on the insulating layer in a striped pattern to be parallel to the anodes. Each of the anodes is formed of an ITO film and coated with phosphor.

[0014] To achieve the above object, the present invention also provides a method of fabricating a field emission array using carbon nanotubes. The method includes the steps of: (a) forming cathodes on a rear substrate in a striped pattern; (b) printing a mixture of carbon nanotubes, metal powder and organic binder on predetermined areas of the cathodes; (c) vaporizing the organic binder by sintering the mixture and anchoring the carbon nanotubes on the cathodes by diffusing the metal powder; and (d) combining a front substrate, on which anodes are formed in a striped pattern, with the rear substrate having the cathodes on which the carbon nanotubes are anchored.

[0015] Preferably, the method also includes the steps of: forming an insulating layer on the tops of the cathodes other than portions to which the carbon nanotubes are to be adhered and on the top of the exposed rear substrate, before the step (b); and forming gates on the insulating layer after the step (c). At this time, the metal powder is composed of metal particles of a metal, selected from the group consisting of Ag, Al, Ni, Cu and Zn, having a diameter of 0.1-10 μm and is diffused at a temperature of 250-500 C.

[0016] Preferably, in the step (b), the metal powder is melted at a low temperature of 100-350 C., and in the step (c), the mixture is sintered to evaporate the organic binder, and the low melting point metal powder is melted to anchor the carbon nanotubes on the cathodes. The metal powder is preferably composed of particles of a metal selected from the group consisting of Pb, In, InSn, PbSn, AuSn and a metal alloy thereof.

[0017] In the step (b), the organic binder is composed of at least one selected from the group consisting of α-terpineol, ethyl cellulose and butyl carbitol acetate, and the printing is performed by an extrusion method using a filter for aligning the carbon nanotubes. Alternatively, in the step (b), the printing is performed by a screen printing method using a metal mesh screen which is patterned for aligning the carbon nanotubes. Preferably, in the step (c), the sintering is performed at a temperature of 200-500 C.

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above object and advantages of the present invention will become more apparent by describing in detail preferred embodiments thereof with reference to the attached drawings in which:

[0019]FIG. 1 is a schematic exploded perspective view of a field emission device using conventional carbon nanotubes;

[0020]FIG. 2A shows the steps of a method of fabricating cathodes on a rear substrate of the carbon nanotube field emission device of FIG. 1;

[0021]FIG. 2B shows the steps of a method of fabricating anodes on a front substrate of the carbon nanotube field emission device of FIG. 1;

[0022]FIG. 3A is a plan view of a field emission array using carbon nanotubes according to the present invention;

[0023]FIG. 3B is a sectional view of FIG. 3A taken along the line A-A′;

[0024]FIGS. 4A through 4D are sectional views illustrating the steps of a method of fabricating a field emission array using carbon nanotubes according to the present invention;

[0025]FIG. 5 is a sectional view of an apparatus which has a filter for alignment of carbon nanotubes and is used when a pressing method is used during the steps of FIGS. 4A through 4D;

[0026]FIGS. 6A through 6C show pressing steps using a filter formed of ceramic (alumina) when an insulating layer is not formed in the case of FIG. 5;

[0027]FIGS. 7A through 7E are plan and sectional views illustrating the structure of a screen printer in which a mask is combined with a mesh screen formed of stainless wires during the steps of FIGS. 4A through 4D;

[0028]FIG. 7A is a sectional view illustrating a step of putting a screen printer on a rear substrate having cathodes and performing printing;

[0029]FIG. 7B is a plan view of the mesh screen woven with stainless wires in the screen printer;

[0030]FIG. 7C is an enlarged view of the mesh structure of part A of FIG. 7B;

[0031]FIG. 7D is a sectional view of FIG. 7C taken along the line B-B′;

[0032]FIG. 7E is a sectional view of the structure of a completed rear substrate on which carbon nanotubes are metal fused to cathodes by firing and gates are formed on an insulating layer, after finishing the printing shown in FIGS. 7A through 7D;

[0033]FIG. 8A is a sectional view of the whole rear substrate with a dual-layer gate plate, which is previously manufactured;

[0034]FIG. 8B is a perspective view of the whole gate plate of FIG. 8A;

[0035]FIG. 9 is a photograph (480 mm) showing the electron emission characteristic of carbon nanotubes which are fabricated by screen printing;

[0036]FIG. 10 is a current-electric field graph showing the electron emission characteristic of a field emission array using carbon nanotubes according to the present invention;

[0037]FIG. 11 is a luminance-electric field graph showing the electron emission luminance characteristic of a field emission array using carbon nanotubes according to the present invention; and

[0038]FIG. 12 is a photograph showing the electron emission of a field emission array using carbon nanotubes according to the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0039] A field emission array using carbon nanotubes according to the present invention is characterized in that carbon nanotubes and metal power are adhered to cathodes with an organic matter, and then the carbon nanotubes are fused to the cathodes by evaporating the organic matter and melting the metal powder. The present invention can be adopted in any multi-electrode tube structure of a field emission array as well as a diode structure having an anode and a cathode and a triode structure having an anode, a cathode and a gate. According to the present invention, carbon nanotubes are fused to cathodes and substitute for microtips for emitting electrons. As an embodiment of the present invention, a triode field emission array will be described in detail with reference to FIGS. 3A and 3B.

[0040] As shown in FIG. 3B, a field emission array using carbon nanotubes according to the present invention includes a front substrate 101 and a rear substrate 111 facing each other and anodes 102 and cathodes 112 which are formed on the front and rear substrates 101 and 111, respectively, in a striped pattern such that the anodes 102 cross the cathodes 112. Carbon nanotubes 112 a are fused to the cathodes 112 using a metal fuser element 112 b. An insulating layer 113 is provided on the rear surface 111 and the part of the cathodes 112 other than the part of the cathodes 112 to which the carbon nanotubes 112 a are fused. Gates 114 are formed on the insulating layer 113 in a striped pattern. Each of the anodes 102 is formed of an ITO film, and the entire surface of each anode 102 is coated with phosphor 103.

[0041] In fabricating a carbon nanotube field emission array having such structure, first, the cathodes 112 are formed on the rear substrate 111 in a striped pattern, as shown in FIG. 4A (referred to as step X). Next, as shown in FIG. 4B, the insulating layer 113 is formed on the exposed rear substrate 111 and the part of the cathodes 112 other than the part to which carbon nanotubes are fixed. Next, as shown in FIG. 4C, a mixture 112 a and 112 b of carbon nanotubes, metal powder and organic binder is printed on predetermined areas of the cathodes 112 through insulating layer opening portions 112 c over the cathodes 112 (referred to as step Y). In the case of the diode, the insulating layer 113 may be formed, but does not need to be formed. Subsequently, as shown in FIG. 4D, the mixture 112 a and 112 b is sintered to evaporate the organic binder, and the metal powder is melted or diffused to adhere the carbon nanotubes 112 a to the cathodes 112 (referred to as step Z). Thereafter, the front substrate 101, on which the anodes 102 are formed in a striped pattern, is combined with the rear substrate 111 having the cathodes 112, to which the carbon nanotubes 112 a are fused, spaced apart by a predetermined distance, thereby completing the array.

[0042] In a method of fabricating such field emission device, the step Y of self-aligning carbon nanotubes is particularly difficult. To over this difficulty, the present invention proposes two methods of aligning carbon nanotubes. In a first method, as shown in FIG. 5 or FIGS. 6A through 6C, after diffusing carbon nanotubes, a mixture 120 of an organic binder and powder of a low-melting point metal such as aluminum, silver, zinc or copper is squeezed into holes 130 a in a filter formed of glass such that the mixture 120 is injected into the holes 112 c in the insulating layer 113, which are aligned with a predetermined pixel size. Thereafter, the organic binder is heated to be evaporated, and the metal powder is melted to fix the carbon nanotubes. In a second method, as shown in FIGS. 7A through 7E, after diffusing carbon nanotubes, a mixture of low-melting point metal powder and an organic binder is pressed on electrodes by a screen printing method using a metal mesh screen 160 a which is patterned on a substrate of an insulating material, so that the carbon nanotubes can be aligned and fixed.

[0043] It is advantageous in printing to use metal powder in which the diameters of the particles are about 0.1-10 μm when making a mixture for adhering carbon nanotubes. When fabricating a multi-electrode tube other than a diode, an insulating layer is essential. To prevent damage on an insulating layer during sintering after printing of the mixture, metal must easily melt at low temperature. Accordingly, a low-melting point metal powder, which is melted at a lower temperature than a temperature at which the insulating layer is formed, should be used. Since the insulating layer is generally formed at about 450-570 C., it is preferable to use a metal which is diffused at 250-500 C. or melted at 100-350 C. for metal powder. Silver (Ag), aluminum (Al), nickel (Ni), copper (Cu) and zinc (Zn) can be used as the metal which is diffused at 250-500 C. Pb, In, InSn, PbSn and AuSn can be used as the metal which is melted at 100-350 C.

[0044] For an organic binder used in making a mixture for printing, α-terpineol, ethyl cellulose or butyl carbitol acetate may be used. In mixing, the mixture is completely mixed by grinding source materials.

[0045] When using an extrusion technique in the printing step Y in which the alignment of carbon nanotubes is determined, an apparatus with a filter 130 for alignment of carbon nanotubes, as shown in FIG. 5, is used. When a mixture 120 for printing is injected into a cylinder 140 with the filter 130 and firmly pressed with a piston 150, the mixture 120 passes through the holes 130 a on the filter 130 and is applied to the cathodes 112 exposed by the opening portions 112 c on the insulating layer 113 while vertically aligning carbon nanotubes contained in the mixture 120. In other words, a mixed paste is extruded through a ceramic (or glass) filter with holes of a pixel size, and thus aligned on cathodes. Thereafter, an organic binder is evaporated by heat treatment at low temperature (200-500 C.), and metal powder is sintered to fix carbon nanotubes in the holes of an insulating layer.

[0046] Unlike FIG. 5, FIGS. 6A through 6C show a process of pressing carbon nanotubes through a filter formed of ceramic (alumina) when an insulating layer is not formed. Carbon nanotubes, which are extruded through holes on the filter and aligned, are pressed on patterned metal films (cathodes) to be fixed. FIG. 6A shows a state in which a mixture for printing is injected into the holes 130 a of the ceramic (alumina) filter 130. FIG. 6B shows a state in which the holes 130 a of the filter 130 are aligned on the cathode 112 lines on the rear substrate 111 without an insulating layer. FIG. 6C shows a state in which carbon nanotubes 112 a are adhered by printing the mixture on predetermined areas of the cathodes 112 through pressing and sintering.

[0047] When using a screen printing technique in the printing step Y in which the alignment of carbon nanotubes is determined, as shown in FIGS. 7A through 7E, a screen printer 160, in which a mesh screen 160 a formed of stainless steel wires is combined with a mask 160 b, is used. More specifically, as shown in FIG. 7A, after laying the screen printer 160 on the rear substrate 111 having the cathodes 112, a roller (not shown) to which a mixture for printing is applied is rolled on the screen printer 160. Then, the mixture on the roller sequentially passes through the mask 160 b and the screen 160 a of the screen printer 160 and is applied to the top of each of the cathodes 112 through the holes of the insulating layer 113 on the rear substrate 111. Since the mixture passes through the mesh screen 160 a in printing, carbon nanotubes contained in the mixture are vertically aligned on the cathodes 112. FIG. 7B is a plan view of the mesh screen 160 a woven with stainless steel wires in the screen printer 160. FIG. 7C is an enlarged view of the mesh structure of part A of FIG. 7B. FIG. 7D is a sectional view of FIG. 7C taken along the line B-B′. Referring to FIG. 7D, the screen printer 160 includes the screen which is made by weaving a mesh comprising warp threads 161 and weft threads 162 and the mask 160 b for making the mixture injected only into predetermined areas. FIG. 7E shows the structure of the completed rear substrate 111, on which the carbon nanotubes 112 a are fused to the cathodes 112 by melted metal powder and gates 114 are formed on the insulating layer 113, after finishing the printing of the mixture by the screen printing scheme. The gates 114 are formed by depositing a metal on the SiO2 insulating layer 113 and patterning the deposited metal using a photolithography method. Alternatively, after screen printing and firing has been completed, a gate plate 170 which is prepared in advance, as shown in FIG. 8A, may be bonded onto the insulating layer 113 to complete a device. FIG. 8B is a perspective view illustrating the whole appearance of the gate plate 170. The gate plate 170 is formed by depositing a gate 170 b formed of a conductor on a substrate 170 a formed of an insulating material.

[0048] It is preferable to perform the sintering at a temperature of 200-500 C. in the heat treatment process of the step Z.

[0049] The functions of carbon nanotubes in such field emission array are shown through FIGS. 9 through 12. FIG. 9 is a photograph (4080 mm) showing the electron emission characteristic of carbon nanotubes which are fabricated by screen printing. FIG. 10 is a current-electric field graph showing the electron emission characteristic of the carbon nanotubes. FIG. 11 is a luminance-electric field graph showing the electron emission luminance characteristic of the carbon nanotubes. FIG. 12 is a photograph showing the electron emission of the carbon nanotubes.

[0050] After finishing the fabrication of the rear substrate, the front substrate is coated with phosphor in such a manner that each anode of a pixel size is coated with red, green or blue phosphor. Thereafter, the front and rear substrates are packaged in vacuum to constitute a display.

[0051] A cathode structure to which carbon nanotubes are fused according to the present invention can be used as a cathode for super high frequency microwave.

[0052] As described above, a field emission array according to the present invention uses carbon nanotubes as electron emission sources, thereby lowering a work function and dropping driving voltage. Consequently, the present invention allows a device to be driven at low voltage. In addition, the present invention improves resistance to gases, which are generated during the operation of a device, thereby increasing the lifetime of an emitter, and substantially discharging heat, which is generated during the operation, thereby making epoch-making improvement in the performance of the filed emitter. Moreover, the present invention allows emission of high density electrons by using an extremely microscopic electron emission source. Consequently, the present invention can be widely adopted, for example, in high frequency electron oscillators and displays driven at low voltage, as a next generation high density electron emission source.

[0053] Furthermore, the present invention uses room temperature deposition and low temperature heat treatment for fabricating an electron emission source emitter of carbon nanotubes, and uses screen printer as a fabricating apparatus, thereby simplifying the fabrication process.

Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US2151733May 4, 1936Mar 28, 1939American Box Board CoContainer
CH283612A * Title not available
FR1392029A * Title not available
FR2166276A1 * Title not available
GB533718A Title not available
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7112472Jun 25, 2003Sep 26, 2006Intel CorporationMethods of fabricating a composite carbon nanotube thermal interface device
US7118941Jun 25, 2003Oct 10, 2006Intel CorporationMethod of fabricating a composite carbon nanotube thermal interface device
US7156715 *Apr 19, 2005Jan 2, 2007Industrial Technology Research InstituteTriode structure of field emission display and fabrication method thereof
US7161289 *May 13, 2003Jan 9, 2007Industrial Technology Research InstituteTriode structure of field emission display and fabrication method thereof
US7264978 *Jun 18, 2002Sep 4, 2007Nec CorporationField emission type cold cathode and method of manufacturing the cold cathode
US7476967Feb 22, 2006Jan 13, 2009Intel CorporationComposite carbon nanotube thermal interface device
US7518247 *Dec 1, 2003Apr 14, 2009Nec CorporationSemiconductor device and its manufacturing method
US7847273 *Jun 11, 2007Dec 7, 2010Eloret CorporationCarbon nanotube electron gun
US7847394Dec 20, 2005Dec 7, 2010Intel CorporationPackaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface
US7876035 *Dec 14, 2007Jan 25, 2011Tsinghua UniversityPixel tube for field-emission display device
US8598689 *Jul 8, 2011Dec 3, 2013Micron Technology, Inc.Methods of manufacturing semiconductor structures and devices including nanotubes, and semiconductor structures, devices, and systems fabricated using such methods
US8993448Nov 26, 2013Mar 31, 2015Micron Technology, Inc.Methods of manufacturing semiconductor structures and devices including nanotubes, and semiconductor structures, devices, and systems fabricated using such methods
US20040104668 *May 13, 2003Jun 3, 2004Industrial Technology Research InstituteTriode structure of field emission display and fabrication method thereof
US20040174110 *Jun 18, 2002Sep 9, 2004Fuminori ItoField emission type cold cathode and method of manufacturing the cold cathode
US20040265489 *Jun 25, 2003Dec 30, 2004Dubin Valery M.Methods of fabricating a composite carbon nanotube thermal interface device
US20040266065 *Jun 25, 2003Dec 30, 2004Yuegang ZhangMethod of fabricating a composite carbon nanotube thermal interface device
US20050104506 *Nov 18, 2003May 19, 2005Youh Meng-JeyTriode Field Emission Cold Cathode Devices with Random Distribution and Method
US20050197032 *Apr 19, 2005Sep 8, 2005Industrial Technology Research InstituteTriode structure of field emission display and fabrication method thereof
US20110266694 *Nov 3, 2011Micron Technology, Inc.Methods of manufacturing semiconductor structures and devices including nanotubes, and semiconductor structures, devices, and systems fabricated using such methods
EP1768212A1 *Sep 22, 2006Mar 28, 2007Commissariat A L'energie AtomiqueVariable frequency conductive structure
Classifications
U.S. Classification438/20, 257/10
International ClassificationH01J31/15, H01J9/02
Cooperative ClassificationY10S977/833, Y10S977/743, Y10S977/842, H01J9/025, B82Y10/00, H01J2201/30469
European ClassificationB82Y10/00, H01J9/02B2