|Publication number||US20030007867 A1|
|Application number||US 09/898,052|
|Publication date||Jan 9, 2003|
|Filing date||Jul 5, 2001|
|Priority date||Jul 5, 2001|
|Also published as||DE20111953U1|
|Publication number||09898052, 898052, US 2003/0007867 A1, US 2003/007867 A1, US 20030007867 A1, US 20030007867A1, US 2003007867 A1, US 2003007867A1, US-A1-20030007867, US-A1-2003007867, US2003/0007867A1, US2003/007867A1, US20030007867 A1, US20030007867A1, US2003007867 A1, US2003007867A1|
|Original Assignee||Enlight Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (5), Referenced by (23), Classifications (6), Legal Events (1)|
|External Links: USPTO, USPTO Assignment, Espacenet|
 The present invention relates to a CPU cooling structure and, more particularly, to such a CPU cooling structure, which comprises a heat sink, a cooling fan mounted on the heat sink at the top, and a ventilation hood suspended from the bottom side of the cooling fan and fitted into a conical receiving space in the heat sink to guide downward currents of air from the cooling fan toward the center area of the heat sink to quick dissipate heat energy from the heat sink.
 Conventional heat sinks for CPU commonly have upright radiation fins disposed at the top for dissipation of heat energy transmitted from the CPU below. The formation of the upright radiation fins is complicated, resulting in high cost. When a heat sink is used, a cooling fan is matched and mounted on the upright radiation fins of the heat sink. When started, the cooling fan causes upward currents of air to carry heat energy from the heat sink. Because cooling currents of air flow from the bottom side toward the top side, heat energy tends to be accumulated at the center area of the CPU. Therefore, the cooling efficiency of conventional heat sinks is low.
 The present invention has been accomplished to provide a CPU cooling structure, which eliminates the aforesaid drawbacks. According to one aspect of the present invention, the CPU cooling structure comprises a heat sink, a cooling fan, and a ventilation hood adapted to guide currents of air downwards from the cooling fan toward the center of the heat sink, enabling heat energy to be quickly dissipated carried away from the heat sink. According to another aspect of the present invention, the ventilation hood comprises a flat mounting base, a conical outer hood shell and a conical inner hood shell concentrically formed integral with a bottom surface of the flat mounting base and fitted into a conical top receiving space of the heat sink, and radial partition ribs connected between the conical outer hood shell and the conical inner hood shell and separating the space between the conical outer hood shell and the conical inner hood shell into multiple wind passages adapted to guide currents of air from the cooling fan downwards toward the center of the heat sink.
FIG. 1 is an elevational view of a ventilation hood for a CPU cooling structure according to the present invention.
FIG. 2 is a bottom plain view of the ventilation hood shown in FIG. 1.
FIG. 3 is a top plain view of the ventilation hood shown in FIG. 1.
FIG. 4 is an elevational view of the CPU cooling structure according to the present invention.
FIG. 5 is an exploded view of the CPU cooling structure according to the present invention.
FIG. 6 is a sectional view showing the flowing direction of currents of air according to the present invention.
 Referring to FIGS. From 1 through 6, a CPU cooling structure in accordance with the present invention is generally comprised of a ventilation hood 1, a cooling fan 2, and a heat sink 3. The cooling fan 2 is supported above the heat sink 3. The ventilation hood 1 is fitted into the heat sink 3 and supported between the heat sink 3 and the cooling fan 2.
 The heat sink 3 comprises a plurality of radially extended upright radiation fins 31, and a plurality of top mounting holes 32. The upright radiation fins 31 have a respective curved top edge, defining a conical receiving space at the center of the top side of the heat sink 3. The ventilation hood 1 comprises a flat mounting base 11, a conical outer hood shell 12 and a conical inner hood shell 13 concentrically formed integral with the bottom surface of the flat mounting base 11 and fitted into the conical receiving space defined by the curved top edge of each of the upright radiation fins 31, and radial partition ribs 14 connected between the conical outer hood shell 12 and the conical inner hood shell 13 and separating the holding space between the conical outer hood shell 12 and the conical inner hood shell 13 into separated wind passages 15. The conical inner hood shell 13 has an inner diameter gradually downwardly reduced from the flat mounting base 11. The radial partition ribs 14 also reinforce the structural strength of the ventilation hood 1. The flat mounting base 11 comprises a plurality of mounting holes 111 disposed in the four corners thereof and respectively connected between the respective mounting holes 21 of the cooling fan 2 and the respective mounting holes 32 of the heat sink 3 by fastening elements, for example, screws 4.
 During the operation of the cooling fan 2, currents of air flow downwards through the wind passages 15 toward the center area of the heat sink 3, and then flow out of the heat sink 3 radially through the gaps in between the upright radiation fins 31 of the heat sink 3 to carry heat energy away from the heat sink 3 efficiently. Because the outer hood shell 12 and inner hood shell 13 have a conical shape, the ventilation hood 1 effectively prevents reverse flow of air.
 A prototype of CPU cooling structure has been constructed with the features of FIGS. 1˜6. The CPU cooling structure functions smoothly to provide all of the features discussed earlier.
 Although a particular embodiment of the invention has been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US2151733||May 4, 1936||Mar 28, 1939||American Box Board Co||Container|
|CH283612A *||Title not available|
|FR1392029A *||Title not available|
|FR2166276A1 *||Title not available|
|GB533718A||Title not available|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US6924980 *||Jun 27, 2003||Aug 2, 2005||International Business Machines Corporation||Vibration isolation of computing device heat sink fans from attached fan shrouds and heat sinks|
|US7059388 *||Dec 19, 2003||Jun 13, 2006||Kuo Ta Chang||Heat dissipating device|
|US7120019 *||Aug 18, 2004||Oct 10, 2006||International Business Machines Corporation||Coaxial air ducts and fans for cooling and electronic component|
|US7163050 *||Jun 29, 2005||Jan 16, 2007||Fu Zhun Precision Industry (Shenzhen) Co., Ltd.||Heat dissipating device|
|US7304844 *||Sep 26, 2005||Dec 4, 2007||Foxconn Technology Co., Ltd.||Cooling fan assembly|
|US7408777 *||May 24, 2006||Aug 5, 2008||Samsung Sdi Co., Ltd.||Plasma display device|
|US7539017 *||Mar 27, 2003||May 26, 2009||Kuo Ta Chang||Heat dissipating device for central processor|
|US7778032 *||Dec 1, 2008||Aug 17, 2010||Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.||Fan impeller and heat dissipating device incorporating the same|
|US7821789 *||Aug 12, 2009||Oct 26, 2010||Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.||Heat dissipating apparatus for chips|
|US7907403 *||Oct 25, 2005||Mar 15, 2011||Hewlett-Packard Development Company, L.P.||Active heat sink with multiple fans|
|US7947218||May 29, 2007||May 24, 2011||Novelis Inc.||Apparatus and method for coil cooling|
|US8035967 *||Oct 3, 2006||Oct 11, 2011||Samsung Electronics Co., Ltd.||Cooling fan assembly|
|US8721275 *||Aug 31, 2011||May 13, 2014||Delta Electronics, Inc.||Heat dissipation device|
|US20040190257 *||Mar 27, 2003||Sep 30, 2004||Chang Kuo Ta||Heat dissipating device for central processor|
|US20040264129 *||Jun 27, 2003||Dec 30, 2004||Lehman Bret W.||Vibration isolation of computing device heat sink fans from attached fan shrouds and heat sinks|
|US20050133197 *||Dec 19, 2003||Jun 23, 2005||Chang Kuo T.||Heat dissipating device|
|US20120168134 *||Jul 5, 2012||Delta Electronics, Inc.||Heat dissipation device|
|US20120171012 *||Jul 20, 2011||Jul 5, 2012||Hon Hai Precision Industry Co., Ltd.||Fan module|
|US20130064679 *||Sep 14, 2011||Mar 14, 2013||Yi-Yi Tsai||Fan grill for a mosquito trap|
|CN102536852A *||Dec 31, 2010||Jul 4, 2012||台达电子工业股份有限公司||Radiator|
|EP2051299A1 *||Oct 7, 2008||Apr 22, 2009||Liang-Ho Cheng||Turbo-guiding type cooling apparatus|
|WO2006050285A1 *||Oct 27, 2005||May 11, 2006||Intel Corp||Fan stator|
|WO2007140607A1 *||Jun 6, 2007||Dec 13, 2007||Novelis Inc||Apparatus and method for coil cooling|
|U.S. Classification||415/220, 257/E23.099|
|Cooperative Classification||H01L23/467, H01L2924/0002|
|Jul 5, 2001||AS||Assignment|
Owner name: ENLIGHT CORPORATION, TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHANG, HSIAO LIANG;REEL/FRAME:011968/0740
Effective date: 20010529