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Publication numberUS20030030982 A1
Publication typeApplication
Application numberUS 09/925,714
Publication dateFeb 13, 2003
Filing dateAug 8, 2001
Priority dateAug 8, 2001
Also published asUS6519153
Publication number09925714, 925714, US 2003/0030982 A1, US 2003/030982 A1, US 20030030982 A1, US 20030030982A1, US 2003030982 A1, US 2003030982A1, US-A1-20030030982, US-A1-2003030982, US2003/0030982A1, US2003/030982A1, US20030030982 A1, US20030030982A1, US2003030982 A1, US2003030982A1
InventorsDavid Shia, Thomas Wong
Original AssigneeDavid Shia, Wong Thomas J.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat sink retention frame
US 20030030982 A1
Abstract
An assembly is disclosed including a printed circuit board, a single piece heat sink retention frame secured to the printed circuit board, the frame comprising four structural members surrounding an aperture, an integrated circuit chip secured to the printed circuit board and positioned within the aperture and a heat sink secured to the frame, the heat sink positioned above the integrated circuit chip and at least partially within the aperture.
Images(6)
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Claims(26)
What is claimed is:
1. An assembly comprising:
a printed circuit board;
a single-piece heat sink retention frame secured to the printed circuit board, the frame comprising structural members surrounding an aperture;
an integrated circuit chip secured to the printed circuit board and positioned within the aperture; and
a heat sink secured to the frame and positioned above the integrated circuit chip, the heat sink being at least partially within the aperture.
2. The assembly of claim 1 wherein the frame comprises extensions that project from the structural members at least partially into the aperture, the extensions defining an area to receive the integrated circuit chip.
3. The assembly of claim 2 wherein the aperture includes four corners and each extension comprises a protrusion from a corner of the aperture, the protrusions extending at least partially beneath the heat sink.
4. The assembly of claim 2 wherein each extension comprises an upper surface at a distance from the printed circuit board, the distance being less than a distance between an upper surface of the integrated circuit chip and the printed circuit board.
5. The assembly of claim 1 wherein each structural member comprises an upper surface at a distance above the printed circuit board, the distance being larger than a distance between a lower surface of the heat sink and the printed circuit board.
6. The assembly of claim 1 wherein the frame comprises holes for receiving fastening elements to secure the frame to the printed circuit board.
7. The assembly of claim 1 wherein each structural member comprises reinforced portions near corners of the aperture.
8. The assembly of claim 7 wherein each reinforced portion comprises a tab extending toward the aperture from a vertical surface of an associated reinforced portion.
9. The assembly of claim 1 wherein the frame comprises lips extending away from the aperture to securely mate with a heat sink securing strap.
10. The assembly of claim 1 wherein a portion of two parallel structural members are removable.
11. The assembly of claim 1 wherein the frame forms a single integral structure.
12. A method comprising:
securing a single-piece heat sink retention frame to a printed circuit board, the frame comprising structural members surrounding an aperture for receiving an integrated circuit chip;
positioning the integrated circuit chip within the aperture; and
securing a heat sink to the frame, the heat sink being in thermal contact with the integrated circuit chip and being positioned at least partially within the aperture.
13. The method of claim 12 including attaching a removable portion of the structural members to the frame.
14. The method of claim 12 wherein securing the heat sink to the frame comprises attaching a securing strap to the heat sink and to a lip on the frame.
15. A method comprising:
applying a mechanical shock to an electronic assembly comprising a heat sink and a single-piece retention frame for the heat sink; and
confirming that the single-piece retention frame restricts movement of the heat sink to within a predetermined limit defined by the retention frame.
16. The method of claim 15 including confirming that a tab on the frame that extends inward toward the heat sink transfers a force associated with lateral movement of the heat sink to a structurally reinforced portion of the frame.
17. The method of claim 15 wherein applying a mechanical shock comprises applying a laterally oriented mechanical shock; and
confirming that the single-piece retention frame restricts movement of the heat sink comprises confirming that the single-piece retention frame restricts movement in a lateral direction.
18. The method of claim 15 wherein applying a mechanical shock comprises applying a vertically oriented mechanical shock; and
confirming that the single-piece retention frame restricts movement comprises confirming that the single-piece retention frame restricts downward movement of the heat sink to a limit defined by the retention frame.
19. The method of claim 18 wherein confirming that the single-piece retention frame restricts downward movement comprises confirming that an integrated circuit chip positioned beneath the heat sink is not damaged by the downward movement of the heat sink during application of the mechanical shock.
20. An apparatus comprising a single-piece heat sink retention frame comprising substantially coplanar structural members and extensions projecting inward from each of the structural members, the extensions surrounding a first part of an aperture to receive an integrated circuit chip mounted to a printed circuit board, the structural members surrounding a second part of the aperture to at least partially receive a heat sink positioned above the integrated circuit chip.
21. The apparatus of claim 20 wherein each structural member comprises a reinforced portion positioned near an intersection of each set of contingent structural members.
22. The apparatus of claim 21 wherein each reinforced portion comprises a cylindrical tab extending inward toward the first part of the aperture from a vertical surface of the reinforced portion.
23. The apparatus of claim 20 wherein a portion of two parallel structural members is removable.
24. The apparatus of claim 20 wherein the frame is integrally formed.
25. The apparatus of claim 20 comprising a lip to mate with and secure a heat sink securing strap to the frame.
26. The apparatus of claim 20 comprising:
a hole for receiving a fastening element to secure the frame to a printed circuit board; and
a lip positioned near each corner, each lip being configured to securely mate with a heat sink securing strap;
wherein the structural members comprise reinforced portions positioned near each corner of the aperture, the reinforced portions comprising tabs that extend inward toward the aperture from a vertical surface of each reinforced portion.
Description
    BACKGROUND
  • [0001]
    The invention relates to heat sink retention frames.
  • [0002]
    Integrated circuit chips can produce a large amount of heat when operating. A heat sink is a mass of thermally conductive material that can be used, for example, in conjunction with an integrated circuit chip to remove heat associated with the operation of the chip. Retention frames can assist in maintaining a good thermal connection between an integrated circuit chip and an associated heat sink in various environmental conditions, including mechanical shock events. Such mechanical shock events can occur if an electronic assembly is dropped.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0003]
    [0003]FIG. 1A is an exploded view of an assembly including a heat sink retention frame.
  • [0004]
    [0004]FIG. 1B illustrates an assembly including a heat sink retention frame.
  • [0005]
    [0005]FIG. 2 is a perspective view of a heat sink retention frame.
  • [0006]
    [0006]FIG. 3 is a perspective view of another heat sink retention frame.
  • [0007]
    [0007]FIG. 4 is a perspective view of a third heat sink retention frame.
  • DETAILED DESCRIPTION
  • [0008]
    The assembly 100 of FIGS. 1A and 1B includes a single-piece heat sink retention frame 102. The frame 102 includes holes 104 for receiving fastening devices 106 to secure the frame 102 to a printed circuit board 108. The frame 102 includes four substantially coplanar structural members.
  • [0009]
    An integrated circuit chip 112 is secured to the printed circuit board within the frame 102. A heat sink 114 can be secured to the frame 102 by attaching securing straps 116 to the frame 102. Each securing strap 116 can be attached to the frame 102 at both ends by mating the ends with lips 118 positioned at an outer surface of the frame 102. Each securing strap 116 includes a portion configured to mate with a portion of the heat sink 114.
  • [0010]
    Each lip 118 is positioned near one of the four corners of the frame 102. Two lips 118 are arranged on each of two opposite, parallel sides of the frame. The lips 118 protrude a small distance outward from an upper part of the outer surface of the respective sides facing away from the aperture 130.
  • [0011]
    The heat sink 114 includes a thermally conductive base 120 that maintains thermal contact with the integrated circuit chip 112 during operation. The heat sink 114 also has cooling fins 122 and a fan 124.
  • [0012]
    The structural members include vertically oriented members 126 and horizontally oriented members 128. The vertically oriented members 126 define an aperture 130. The horizontally oriented members 128 are structural extensions that project from a lower section of the vertically oriented members 126 inwardly toward the aperture 130 and define an area for receiving the integrated circuit chip 112.
  • [0013]
    The aperture 130 is sized to at least partially receive the base 120 of the heat sink 114. The fit between the base 412 of the heat sink 410 and the vertically oriented members 106 can be either snug or loose, but some tolerance should be allowed.
  • [0014]
    The vertically oriented members 126 have a height that varies around the perimeter of the aperture 130. Each vertically oriented member 126 includes a reinforced portion 132 located near a corner of the aperture 130 and a narrow portion 138 spanning a distance between corners of the aperture 130. As illustrated, the reinforced portions 132 have a greater height than other areas of the vertically oriented members 126 and can improve the mechanical load bearing capability associated with the frame 102. The narrow portions 138 can provide a reduction in size, weight and manufacturing cost associated with the frame 102.
  • [0015]
    The horizontally oriented members 128 include an extension 134 near each corner of the aperture 130 that protrudes inwardly toward the aperture 130. The extensions 134 are positioned so that they pass at least partially beneath the heat sink 114 when assembled. This arrangement may be desirable so that in the event of a mechanical shock event, any movement of the heat sink in a direction toward the printed circuit board can be arrested by one or more extension 134.
  • [0016]
    If, for example, the assembly 100 is dropped onto a surface, the force may cause the heat sink 114 to move in a direction or combination of directions indicated by the arrows 136 (in FIG. 1B). When this happens, the heat sink 114 may move until it contacts a portion of the frame 102 intended to stop the motion.
  • [0017]
    In the event of a laterally oriented mechanical shock event, the vertically oriented members 126 can absorb a resultant lateral force and stop the heat sink from moving in a lateral direction, thereby ensuring that the heat sink 114 does not become dislodged from its corresponding integrated circuit chip 112.
  • [0018]
    In the event of a downwardly oriented mechanical shock event, the extensions 134 can absorb a resultant downward force and prevent the heat sink from crushing or otherwise damaging the integrated circuit chip 112.
  • [0019]
    When assembled, the distance between an upper surface of the reinforced portions 132 and the printed circuit board 108 is at least greater than the distance between an upper surface of an integrated circuit chip 112 and the printed circuit board 108. The distance is also greater than a distance between the bottom surface of the heat sink 114 and the printed circuit board 108. If reinforced portions 132 are not included in the frame 102, then the same relative spatial criteria should apply to an upper surface of the vertically oriented members 126.
  • [0020]
    In the single-piece heat sink retention frame 102A of FIG. 2, the vertically oriented members 126 can have a common height around the entire perimeter of the frame 102A.
  • [0021]
    The extensions 134A project inwardly toward the aperture 130 and have a height that is greater than the height of other areas of the horizontally oriented members 108. This height difference ensures that, when an assembly using the frame 102B is exposed to a downwardly oriented mechanical shock, an associated heat sink (not shown) should contact the extensions 134A and not other areas of the horizontally oriented members 128. The other areas of the horizontally oriented members 128 can provide enhanced structural integrity to the vertically oriented structural members 126.
  • [0022]
    The single-piece frame 100A can be cast as a single integral structure formed, for example, by an injection molding technique, or can be formed by using separate components and securely attaching them to each other using an adhesive or using other fastening techniques. The term single-piece encompasses either an integrally formed structure or multiple components fastened to each other.
  • [0023]
    In the frame 102B of FIG. 3, the reinforced portions 132 of adjacent vertically oriented members 126 define a vertical extension 302A, 302B, 302C, 302D at each corner of the aperture 130. The vertical extensions 302A, 302B, 302C, 302D have greater heights than the narrow portions 138 of the vertically oriented members 126. Vertical extensions 302A, 302B, 302C, 302D are positioned to span a corner of the aperture 130 defined by the intersection of a first vertically oriented member and a second adjacent and perpendicular vertically oriented member. For example, the vertical extension 302B spans a corner defined by the intersection of vertically oriented members 126A and 126B.
  • [0024]
    The vertically oriented members 126A, 126B, 126C, 126D also include cylindrical tabs 304 that extend inward toward the aperture 130 from the reinforced portions 132. The tabs 304 are positioned to transfer an incident force resulting from a mechanical shock to a reinforced portion 132 of an associated vertically oriented member 126A, 126B, 126C, and 126D.
  • [0025]
    The frame 102C of FIG. 4 includes two parallel structural members 400A and 400B that are removable. Structural members 400A and 400B can be securely attached to the other components of the frame with a snap-in connection 402 at four places. Other methods of attachment may be used including, for example, adhesives. An arrangement that includes removable structural members may provide an electronic assembly manufacturer with the option of choosing a frame having either relatively high mechanical load-bearing capabilities or a frame that uses a comparably low amount printed circuit board space.
  • [0026]
    A manufacturer of electronic components utilizing a single-piece heat sink retention frame 102 may subject the assembly to a testing regiment to evaluate the retention frame's 102 performance during exposure to a mechanical shock condition. To accomplish that, the manufacturer can expose the electronic assembly to a laterally oriented mechanical shock and observe that the heat sink retention frame 102 properly restricts lateral movement of the heat sink to within the confines defined by the retention frame. The manufacturer can confirm that the tab 304 properly transfers any resultant force associated with the lateral movement of the heat sink to a structurally reinforced portion 132 of the retention frame 102.
  • [0027]
    The manufacturer also can expose the electronic assembly to a vertically oriented mechanical shock and observe that an extension 134 of the retention frame 102 properly limits the downward movement of the heat sink to a predetermined distance and that the extension 134 properly absorbs the resultant force associated with the downward movement of the heat sink.
  • [0028]
    Electronic assemblies incorporating the foregoing techniques may realize one or more of the following advantages. Dislodging of heat sinks under mechanical shock conditions may be minimized. Also, the reliability of thermal connections between heat sinks and their associated integrated circuit chips may be improved.
  • [0029]
    Modifications of the techniques are possible. For example, various materials such as may be used to manufacture heat sink retention frames. Different shapes and sizes of frames may be implemented in certain situations. The relative positions of various frame features can be varied. For example, fastening device holes may be positioned elsewhere. Also, tabs may be cylindrical, square or other shapes.
  • [0030]
    Other implementations are within the scope of the following claims.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US20050199370 *Mar 15, 2004Sep 15, 2005Huang Ming T.Heat dissipation module for CPU
US20140174705 *Mar 7, 2013Jun 26, 2014Hon Hai Precision Industry Co., Ltd.Heat sink assembly
Classifications
U.S. Classification361/704, 257/E23.101, 165/185, 257/E23.086
International ClassificationH01L23/40, H01L23/36
Cooperative ClassificationY10T24/44026, H01L23/4093, H01L23/36, H01L2924/0002
European ClassificationH01L23/36, H01L23/40S
Legal Events
DateCodeEventDescription
Jan 8, 2002ASAssignment
Aug 4, 2006FPAYFee payment
Year of fee payment: 4
Sep 20, 2010REMIMaintenance fee reminder mailed
Feb 11, 2011LAPSLapse for failure to pay maintenance fees
Apr 5, 2011FPExpired due to failure to pay maintenance fee
Effective date: 20110211