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Publication numberUS20030136545 A1
Publication typeApplication
Application numberUS 10/050,817
Publication dateJul 24, 2003
Filing dateJan 18, 2002
Priority dateJan 18, 2002
Publication number050817, 10050817, US 2003/0136545 A1, US 2003/136545 A1, US 20030136545 A1, US 20030136545A1, US 2003136545 A1, US 2003136545A1, US-A1-20030136545, US-A1-2003136545, US2003/0136545A1, US2003/136545A1, US20030136545 A1, US20030136545A1, US2003136545 A1, US2003136545A1
InventorsYu-sen Lin, Pei-Ching Lin, Chun-ming Shih
Original AssigneeLin Yu-Sen, Pei-Ching Lin, Shih Chun-Ming
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat sink for heat-susceptible electronic devices
US 20030136545 A1
Abstract
A heat-sink for heat-liable electronic devices provides multiples of lateral holes in each vertical fin to separately create a lateral passage in relation with longitudinal troughs to guide air currents flowing in various directions to boost the air conduction thus to improve heat dissipation effects.
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Claims(3)
I claim,
1. A heat sink for heat-liable electronic devices comprising multiples of vertical fins separating from one another for a certain spacing being provided on a body of the heat sink characterized by that:
multiples of holes being laterally provided in each of said fins provided on the body of the heat sink to separately define a lateral passage in related to longitudinally troughs formed between abutted fins for guiding air currents flowing in various directions.
2. A heat sink for heat-liable electronic devices as claimed in claim 1, wherein, a flange is formed by punching on one side of each of said lateral holes provided in each of said fins.
3. A heat sink for heat-liable electronic devices as claimed in claim 1, wherein, each said lateral hole is formed an opening at an upper end of each of said fins.
Description
    BACKGROUND OF THE INVENTION
  • [0001]
    (a) Field of the Invention
  • [0002]
    The present invention relates to a heat sink for heat-liable electronic devices, and more particularly, to one having provided multiples of lateral holes in each vertical fin to guide air currents for better heat dissipation effects.
  • [0003]
    (b) Description of the Prior Art
  • [0004]
    More compact CPU and faster operation rate have led to significantly reduced operation rate time required to yield better application efficiency of the computer thanks to advanced development of IC process. However, as a result of faster operation rate, more heat is generated due to upgraded time clock, and faster heat dissipation for the CPU is required. Accordingly, the performance of the adapted heat sink becomes more important as the CPU chip is smaller and the process rate is faster, or the computer is vulnerable to break down since the CPU may become unreliable if the heat fails to be dissipated in time. In such case, the faster process rate of the CPU means nothing at all. Generally, a heat sink is provided to the CPU chip to guide and to dissipate the heat generated by the CPU. Therefore, better heat sinking capability becomes crucial to cope with the much higher temperature rise resulted from upgraded time clock of the CPU to help secure a reliable operation of the CPU.
  • [0005]
    The prior art of a heat sink as illustrated in FIG. 7 is essentially composed of a base (B) made of aluminum with excellent heat conduction performance that holds flush with the top surface of a chip (A), multiples of fins (B1) vertically provided with a certain spacing on and integrated with the base (B), and a mini fan (C) provided over the fins (B1) to force the heat transferred by the base (B) from the chip (A) and preliminarily dissipated by the large area of the fins (B1) that contacts the air.
  • [0006]
    However, heat transfer and air current guidance structures are two critical elements that determine the efficiency of the heat sink. The fins (B) in the prior art are arranged in one direction and there is the absence of mutually communicated longitudinal troughs. Therefore, the air current is guided only in one direction. In general, such heat sink is not an ideal design as it provides only one-way air current guidance thus to restrict improvement of heat dissipation efficiency.
  • SUMMARY OF THE INVENTION
  • [0007]
    The primary purpose of the present invention is to provide a heat sink with improved heat dissipation efficiency for heat-liable electronic devices. To achieve the purpose, lateral holes are provided in each fin vertically disposed on the heat sink to separately form a lateral passage in relation with longitudinal troughs to guide air currents in various directions.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0008]
    [0008]FIG. 1 is a perspective view showing a structure of the present invention;
  • [0009]
    [0009]FIG. 2 is a view showing an appearance of the present invention in use;
  • [0010]
    [0010]FIG. 3 is a sectional view and air current flowing direction of the present invention;
  • [0011]
    [0011]FIG. 4 is a schematic view showing a preferred embodiment derived from the holes provided in heat sink fins of the present invention;
  • [0012]
    [0012]FIG. 5 is a schematic view showing another preferred embodiment varied from the holes provided in heat sink fins of the present invention;
  • [0013]
    [0013]FIG. 6 is a view of another preferred embodiment of the present invention; and
  • [0014]
    [0014]FIG. 7 is a perspective view showing a prior art.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • [0015]
    Referring to FIG. 1, a heat sink of the present invention comprises multiples of vertical heat sink fins (2) separating from one another for a certain spacing on a body (1) of the heat sink. The fins (2) are fixed to the body (1) of the heat sink by having a dovetail (21) provided to the lower end of each fin (2) inserted into a dovetail groove (11) on the body (1) of the heat sink.
  • [0016]
    Multiples of holes (22) are provided laterally in each of the fins (2) disposed on the body (1) of the heat sink to separately form a lateral passage in relation with a longitudinal trough defined by abutted fins to guide air currents flowing in various directions.
  • [0017]
    To dissipate the heat generated from a CPU chip (3) as illustrated in FIGS. 2 and 3, a mini fan (4) is provided at the top of the fins (2) of the heat sink. Bolts (5) used to fasten the mini fan (4) penetrate into where between two abutted fins (2) for the bolts (5) to bite the fins to hold the mini fan (4) in position. Once the mini fan (4) operates, air current flows upward due to the forced heat dissipating wind velocity. The heat is carried away through longitudinal troughs defined by the longitudinally disposed fins (2). Furthermore, the lateral passages formed by the lateral holes (22) provided in each of the fins (2) in relation to the longitudinal troughs also guide air currents in various directions to expand the range of heat dissipation, thus to improve the heat dissipation efficiency of the heat sink.
  • [0018]
    In another feasible pattern derived from the present invention as illustrated in FIG. 4, a flange (23) by punching is formed on one side of each of the lateral holes (22) in each fin (2) so to increase the area of the fin (2) to contact the air for further improvement of the heating dissipation effects.
  • [0019]
    Furthermore, in another preferred embodiment as illustrated in FIG. 5, multiples of lateral holes (22A) are made with opening upper ends (22A) at the top of each fin (2) and each lateral hole (22A) is punched to form a flange (23A) at its one side.
  • [0020]
    Now referring to FIG. 6, an abutting end (24) horizontally extends from the lower end of each of the fins (2) is provided to hold against the side surface at the top of the body (1) of the heat sink. Then the abutting end (24) is welded to the top of the body (1) of the heat sink so to fix the fins (2) to the body (1) of the heat sink. Provided, however, that the abutting end (24) is not necessarily provided since the lower end of each of the fins (2) can be forthwith welded to the body (1) of the heat sink.
  • [0021]
    It is to be noted that the lateral holes (22) and (22A) disclosed in the foresaid preferred embodiments shall not restrict the feasible shape of the lateral holes within the teaching of the present invention. A lateral hole with any other geometric form can be used in the preferred embodiment of the present invention.
  • [0022]
    As disclosed above, the present invention by providing an additional passage defined by multiples of lateral holes provided in each fin of a heat sink and longitudinally disposed fins to allow expanded conduction of air currents in various directions for increasing heat dissipation effects, thus for improved heat dissipation efficiency in general of the heat sink compared with the prior art, relates to a progressive, practical and innovative structure of the heat sink.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7269010 *Aug 15, 2005Sep 11, 2007Fu Zhun Precision Industry (Shenzhen) Co., Ltd.Heat dissipation device
US7330353 *Jun 26, 2006Feb 12, 2008International Business Machines CorporationModular heat sink fin modules for CPU
US7352582 *Oct 12, 2004Apr 1, 2008Seiko Epson CorporationReinforcing structure, display device, and electronic apparatus
US7442882 *May 8, 2006Oct 28, 2008International Business Machines Corporation3D checkerboard perforation pattern for increased shielding effectiveness
US7593230 *Jul 14, 2005Sep 22, 2009Sensys Medical, Inc.Apparatus for absorbing and dissipating excess heat generated by a system
US8371367Aug 11, 2005Feb 12, 2013Mitsubishi Denki Kabushiki KaishaHeat sink and fabricating method of the same
US8479806Feb 20, 2008Jul 9, 2013University Of HawaiiTwo-phase cross-connected micro-channel heat sink
US20040244959 *May 5, 2004Dec 9, 2004Chao-Nan ChienCooling fin structure and fin assembly
US20050072563 *Oct 3, 2003Apr 7, 2005Wang Chin WenHeat sink structure
US20050117293 *Oct 12, 2004Jun 2, 2005Seiko Epson CorporationReinforcing structure, display device, and electronic apparatus
US20050199368 *Mar 11, 2004Sep 15, 2005Gonzales Christopher A.Laminated fin heat sink for electronic devices
US20060120046 *Aug 15, 2005Jun 8, 2006Foxconn Technology Co., Ltd.Heat dissipation device
US20060237166 *Apr 21, 2006Oct 26, 2006Otey Robert WHigh Efficiency Fluid Heat Exchanger and Method of Manufacture
US20060250776 *Jul 14, 2005Nov 9, 2006Abul-Haj Roxanne EHeatsink method and apparatus
US20070272438 *May 8, 2006Nov 29, 2007Gilliland Don A3D checkerboard perforation pattern for increased shielding effectiveness
US20070297140 *Jun 26, 2006Dec 27, 2007International Business Machines CorporationModular heat sink fin modules for cpu
US20090139693 *Nov 21, 2008Jun 4, 2009University Of HawaiiTwo phase micro-channel heat sink
US20090139701 *Feb 20, 2008Jun 4, 2009Qu WeilinTwo-phase cross-connected micro-channel heat sink
US20100193162 *Aug 5, 2010Wistron CorporationHeat dissipation device
US20110232885 *Sep 29, 2011Kaslusky Scott FHeat transfer device with fins defining air flow channels
US20120211214 *Aug 23, 2012Panasonic Avionics CorporationHeatsink Device and Method
US20120216996 *Aug 30, 2012Asia Vital Components Co., Ltd.Thermal module and method of manufacturing same
EP1923914A1 *Aug 11, 2005May 21, 2008Mitsubishi Denki Kabushiki KaishaHeat sink and method of producing the same
Classifications
U.S. Classification165/80.3, 257/E23.103, 257/E23.099
International ClassificationH01L23/367, F28F3/06, H01L23/467
Cooperative ClassificationF28F3/06, H01L23/467, H01L23/3672, H01L2924/0002
European ClassificationH01L23/467, F28F3/06, H01L23/367F