US20030178174A1 - Thermal pouch interface - Google Patents

Thermal pouch interface Download PDF

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Publication number
US20030178174A1
US20030178174A1 US10/104,730 US10473002A US2003178174A1 US 20030178174 A1 US20030178174 A1 US 20030178174A1 US 10473002 A US10473002 A US 10473002A US 2003178174 A1 US2003178174 A1 US 2003178174A1
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United States
Prior art keywords
thermal pouch
recited
thermal
pouch
thermally conductive
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Abandoned
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US10/104,730
Inventor
Christian Belady
Eric Peterson
Brent Boudreaux
Shaun Harris
Roy Zeighami
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Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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Priority to US10/104,730 priority Critical patent/US20030178174A1/en
Assigned to HEWLETT-PACKARD COMPANY reassignment HEWLETT-PACKARD COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HARRIS, SHAUN L., PETERSON, ERIC C., ZEIGHAMI, ROY M., BELADY, CHRISTIAN L., BOUDREAUX, BRENT A.
Assigned to HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. reassignment HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HEWLETT-PACKARD COMPANY
Publication of US20030178174A1 publication Critical patent/US20030178174A1/en
Priority to US10/831,059 priority patent/US7096926B2/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F23/00—Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Definitions

  • the present invention relates generally to the field of heat transfer and more specifically to the field of heat transfer between irregularly shaped objects.
  • Modem electronics have benefited from the ability to fabricate devices on a smaller and smaller scale. As the ability to shrink devices has improved, so has their performance. Unfortunately, this improvement in performance is accompanied by an increase in power as well as power density in devices. In order to maintain the reliability of these devices, the industry must find new methods to remove this heat efficiently.
  • heat sinking means that one attaches a cooling device to a heat-generating component and thereby removes the heat to some cooling medium, such as air or water.
  • some cooling medium such as air or water.
  • thermal interface is characterized by a thermal contact impedance.
  • Thermal contact impedance is a function of contact pressure and the absence or presence of material filling small gaps or surface variations in the interface.
  • the heat-sinking problem is particularly difficult in devices such as multi-chip modules (“MCMs”) where multiple components need to have topside cooling into a single cold plate or heat sink.
  • MCMs multi-chip modules
  • the various components within the multi-chip module may not be of equal thickness, creating a non-coplanar surface that often must be contacted to a single planar surface of the cold plate or heat sink.
  • Engineers have developed a variety of approaches to solving the non-coplanar surface problem, such as, gap fillers comprising thick thermal pads capable of absorbing 10 to 20 mils of stack up differences.
  • the thickness and composition of these thermal pads often results in a relatively high thermal resistance making them suitable only for low power devices.
  • thermal grease or phase change materials such as paraffin
  • phase change materials such as paraffin
  • a sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components.
  • the sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications.
  • FIG. 1 is a cross-section of the interface between two surfaces.
  • FIG. 2 is a graph of temperature versus position through an interface between two thermal conductors.
  • FIG. 3A is a cross-section of an example embodiment of a thermal pouch interface according to the present invention during construction.
  • FIG. 3B is a cross-section of the example embodiment of a thermal pouch interface from FIG. 3A after construction.
  • FIG. 4 is a cross-section of an example embodiment of a thermal pouch interface according to the present invention prior to use between two components.
  • FIG. 5 is a cross-section of the example embodiment of a thermal pouch interface from FIG. 4 during use between two components.
  • FIG. 6A is a cross-section of an example embodiment of a thermal pouch interface according to the present invention including a single spring.
  • FIG. 6B is a cross-section of an example embodiment of a thermal pouch interface according to the present invention including a plurality of springs.
  • FIG. 7 is a flow chart of an example method for the construction of a thermal pouch according to the present invention.
  • FIG. 1 is a cross-section of the interface between two surfaces.
  • a first object 100 having a first surface 102 is brought into contact with a second object 104 having a second surface 106 .
  • Neither surface is perfectly flat resulting in an imperfect mating of the two surfaces. This imperfect interface contributes to a thermal contact resistance at the interface between the two objects.
  • FIG. 2 is a graph of temperature versus position through an interface between two thermal conductors.
  • a graph of temperature versus position is shown below a cross-sectional view of the two objects including the thermal interface 210 between them.
  • a first object 200 is joined with a second object 202 producing a thermal interface 210 at the point where the objects join. As shown in FIG. 1, this interface between the two objects is not a perfect joint and contributes to a thermal contact resistance at the thermal interface 210 .
  • thermal energy as heat 204 enters the first object 200 passes through it to the second object 202 , before exiting the second object as heat 206 , the thermal energy must pass through the thermal interface 210 between the two objects.
  • the thermal energy enters the first object 200 at a position 208 and a temperature T 1 214 , and decreases to a temperature T 2 216 as it passes through the first object 200 .
  • the thermal energy must overcome a thermal contact resistance and the temperature decreases to a temperature T 3 218 as it enters the second object 202 .
  • the temperature decreases to a temperature T 4 220 as it passes through the second object 202 where it is radiated as heat 206 at a position 212 .
  • FIG. 3A is a cross-section of an example embodiment of a thermal pouch interface according to the present invention during construction.
  • a top sheet 300 and a bottom sheet 302 of a flexible, thermally conductive material are constructed to enclose a quantity of low melting point, thermally conductive material 306 , such as low melting point solder or liquid metal.
  • the low melting point, thermally conductive material 306 will be in liquid form as the thermal pouch is compressed. Therefore, the melting point of the low melting point, thermally conductive material 306 must be lower than the melting point of the materials used in the devices that are to be thermally joined by the thermal pouch.
  • top sheet and bottom sheet may be used to create the top sheet and bottom sheet within the scope of the present invention.
  • Some example materials include, copper, aluminum, and mylar.
  • Those skilled in the art will also recognize that there are many different methods of creating a top sheet and a bottom sheet from flexible, thermally conductive material within the scope of the present invention. Some example methods include, creating two separate sheets of material, folding a single sheet of material to form a top sheet and a bottom sheet and sealing three edges, or forming a cylinder of the material to create a top sheet and a bottom sheet.
  • Other embodiments of the present invention may use a thermally conductive liquid, such as mercury, as the low melting point, thermally conductive material 306 .
  • a springy material 304 may be included in the construction if needed to help maintain contact pressure between the thermal pouch and the two components it will be sandwiched between.
  • the springy material 304 may comprise a metal or solder compatible plastic or organic that has sufficient springy properties to resist deformation to some extent.
  • the low melting point, thermally conductive material 306 once melted, will fill the interstices within the springy material 304 but not penetrate the individual wires or fibers of the springy material 304 .
  • Other embodiments of the present invention may use one or more springs as the springy material 304 as shown in FIGS. 6A and 6B.
  • Still other embodiments may use metal wool as the springy material 304 .
  • Steel wool and copper wool are two examples of metal wool.
  • Other embodiments of the present invention may not require any springy material 304 and be constructed containing only a low melting point, thermally conductive material 306 .
  • FIG. 3B is a cross-section of the example embodiment of a thermal pouch interface from FIG. 3A after construction.
  • a thermal pouch filled with a low melting point, thermally conductive material 306 , and optionally a quantity of springy material 304 is created.
  • the final thermal pouch will be completely filled with the low melting point, thermally conductive material 306 and springy material 304 with all air (or other gases) expelled from the pouch during construction. This eliminates any air pockets within the thermal pouch that may cause a reduction in thermal conductivity of the thermal pouch.
  • thermal pouch will be flexible enough to conform to non-planar surfaces of the devices it is used to thermally join.
  • Other embodiments of the present invention may include a coating 308 such as thermal grease, phase change material, or solder on the outer surfaces of the thermal pouch to fill in the very small irregularities in the interface between the thermal pouch and any components it contacts. Note that some embodiments of the present invention may use a different coating 308 on the top surface of the thermal pouch, than the coating 308 on the bottom surface of the thermal pouch. Also, some embodiments of the present invention may use a coating 308 on only one surface of the thermal pouch, or not use any coating 308 at all.
  • FIG. 4 is a cross-section of an example embodiment of a thermal pouch interface according to the present invention prior to use between two components.
  • a completed thermal pouch is placed between a top component 400 and a bottom component 402 having non-coplanar surfaces.
  • the thermal pouch comprises a top sheet 300 , a bottom sheet 302 , a quantity of low melting point, thermally conductive material 306 and a quantity of springy material 304 , as shown in FIGS. 3A and 3B.
  • the bottom component 402 may be a multi-chip module and the top component 400 may be a heat sink.
  • One embodiment of the present invention may use a single thermal pouch interface between the multi-chip module and the heat sink, while another embodiment may use a plurality of small thermal pouch interfaces between the individual components on the multi-chip module and the heat sink.
  • FIG. 5 is a cross-section of the example embodiment of a thermal pouch interface from FIG. 4 during use between two components.
  • the temperature of the thermal pouch is raised above the melting point of the low melting point, thermally conductive material 306 , yet below the melting point of materials within the two components 400 and 402 .
  • the two components 400 and 402 from FIG. 4 are now moved to their final positions, compressing the thermal pouch between them. Since the low melting point, thermally conductive material 306 is in a liquid state during this compression of the thermal pouch, the pouch flexes to conform to any non-planarity in the surfaces of the two components 400 and 402 .
  • the thermal pouch comprises a top sheet 300 , a bottom sheet 302 , a quantity of low melting point, thermally conductive material 306 and a quantity of springy material 304 , as shown in FIGS. 3A and 3B. Note that the thermal pouch has deformed to match the non-coplanar shapes of the two components 400 and 402 creating a low thermal resistance thermal contact between the two components 400 and 402 .
  • FIG. 6A is a cross-section of an example embodiment of a thermal pouch interface according to the present invention including a single spring.
  • FIG. 6A shows an example embodiment of the present invention similar to that of FIG. 3B where the springy material 304 comprises a single spring 600 .
  • FIG. 6B is a cross-section of an example embodiment of a thermal pouch interface according to the present invention including a plurality of springs.
  • FIG. 6B shows an example embodiment of the present invention similar to that of FIG. 3B where the springy material 304 comprises a plurality of springs 602 .
  • FIG. 7 is a flow chart of an example method for the construction of a thermal pouch according to the present invention.
  • a top sheet 300 of a thermal pouch is created.
  • a bottom sheet 302 of a thermal pouch is created.
  • a quantity of springy material 304 is placed between the top sheet 300 and the bottom sheet 302 .
  • a quantity of low melting point, thermally conductive material is placed surrounding the springy material 304 .
  • the top sheet 300 and bottom sheet 302 are affixed to each other forming a thermal pouch.
  • one or more surfaces of the thermal pouch are coated with thermal grease, phase change material, or solder 308 .

Abstract

A sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components. The sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications.

Description

    FIELD OF THE INVENTION
  • The present invention relates generally to the field of heat transfer and more specifically to the field of heat transfer between irregularly shaped objects. [0001]
    • BACKGROUND OF THE INVENTION
  • Modem electronics have benefited from the ability to fabricate devices on a smaller and smaller scale. As the ability to shrink devices has improved, so has their performance. Unfortunately, this improvement in performance is accompanied by an increase in power as well as power density in devices. In order to maintain the reliability of these devices, the industry must find new methods to remove this heat efficiently. [0002]
  • By definition, heat sinking means that one attaches a cooling device to a heat-generating component and thereby removes the heat to some cooling medium, such as air or water. Unfortunately, one of the major problems in joining two devices to transfer heat is that a thermal interface is created at the junction. This thermal interface is characterized by a thermal contact impedance. Thermal contact impedance is a function of contact pressure and the absence or presence of material filling small gaps or surface variations in the interface. [0003]
  • The heat-sinking problem is particularly difficult in devices such as multi-chip modules (“MCMs”) where multiple components need to have topside cooling into a single cold plate or heat sink. The various components within the multi-chip module may not be of equal thickness, creating a non-coplanar surface that often must be contacted to a single planar surface of the cold plate or heat sink. Engineers have developed a variety of approaches to solving the non-coplanar surface problem, such as, gap fillers comprising thick thermal pads capable of absorbing 10 to 20 mils of stack up differences. However, the thickness and composition of these thermal pads often results in a relatively high thermal resistance making them suitable only for low power devices. Others have used pistons with springs attached to them attached to a plurality of small cold plates or heat sinks to account for the irregularity of the stack up. However, this can become an expensive solution to the problem. Still others have used an array of small cold plates connected together by flexible tubing allowing some flexibility between the plates to account for the variations in height of the components. However, once again, this solution may become too expensive for many products. [0004]
  • Other solutions include the use of thermal grease or phase change materials, such as paraffin, to fill in small gaps, such as the microscopic roughness between two surfaces. However, thermal grease and phase change materials are unable to fill larger gaps such as those present in multi-chip modules. [0005]
    • SUMMARY OF THE INVENTION
  • A sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components. The sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications. [0006]
  • Other aspects and advantages of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.[0007]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a cross-section of the interface between two surfaces. [0008]
  • FIG. 2 is a graph of temperature versus position through an interface between two thermal conductors. [0009]
  • FIG. 3A is a cross-section of an example embodiment of a thermal pouch interface according to the present invention during construction. [0010]
  • FIG. 3B is a cross-section of the example embodiment of a thermal pouch interface from FIG. 3A after construction. [0011]
  • FIG. 4 is a cross-section of an example embodiment of a thermal pouch interface according to the present invention prior to use between two components. [0012]
  • FIG. 5 is a cross-section of the example embodiment of a thermal pouch interface from FIG. 4 during use between two components. [0013]
  • FIG. 6A is a cross-section of an example embodiment of a thermal pouch interface according to the present invention including a single spring. [0014]
  • FIG. 6B is a cross-section of an example embodiment of a thermal pouch interface according to the present invention including a plurality of springs. [0015]
  • FIG. 7 is a flow chart of an example method for the construction of a thermal pouch according to the present invention.[0016]
    • DETAILED DESCRIPTION
  • FIG. 1 is a cross-section of the interface between two surfaces. In this greatly magnified view of the interface between two surfaces, a [0017] first object 100 having a first surface 102 is brought into contact with a second object 104 having a second surface 106. Neither surface is perfectly flat resulting in an imperfect mating of the two surfaces. This imperfect interface contributes to a thermal contact resistance at the interface between the two objects.
  • FIG. 2 is a graph of temperature versus position through an interface between two thermal conductors. In this view of two thermally conductive objects joined together, a graph of temperature versus position is shown below a cross-sectional view of the two objects including the [0018] thermal interface 210 between them. A first object 200 is joined with a second object 202 producing a thermal interface 210 at the point where the objects join. As shown in FIG. 1, this interface between the two objects is not a perfect joint and contributes to a thermal contact resistance at the thermal interface 210. When thermal energy as heat 204 enters the first object 200, passes through it to the second object 202, before exiting the second object as heat 206, the thermal energy must pass through the thermal interface 210 between the two objects. The thermal energy enters the first object 200 at a position 208 and a temperature T1 214, and decreases to a temperature T2 216 as it passes through the first object 200. At the thermal interface 210 between the two objects the thermal energy must overcome a thermal contact resistance and the temperature decreases to a temperature T3 218 as it enters the second object 202. The temperature decreases to a temperature T4 220 as it passes through the second object 202 where it is radiated as heat 206 at a position 212.
  • FIG. 3A is a cross-section of an example embodiment of a thermal pouch interface according to the present invention during construction. A [0019] top sheet 300 and a bottom sheet 302 of a flexible, thermally conductive material are constructed to enclose a quantity of low melting point, thermally conductive material 306, such as low melting point solder or liquid metal. As discussed in more detail below, the low melting point, thermally conductive material 306 will be in liquid form as the thermal pouch is compressed. Therefore, the melting point of the low melting point, thermally conductive material 306 must be lower than the melting point of the materials used in the devices that are to be thermally joined by the thermal pouch. Those skilled in the art will recognize that many different flexible, thermally conductive materials may be used to create the top sheet and bottom sheet within the scope of the present invention. Some example materials include, copper, aluminum, and mylar. Those skilled in the art will also recognize that there are many different methods of creating a top sheet and a bottom sheet from flexible, thermally conductive material within the scope of the present invention. Some example methods include, creating two separate sheets of material, folding a single sheet of material to form a top sheet and a bottom sheet and sealing three edges, or forming a cylinder of the material to create a top sheet and a bottom sheet. Other embodiments of the present invention may use a thermally conductive liquid, such as mercury, as the low melting point, thermally conductive material 306. While mercury is toxic, if kept sealed within a thermal pouch, it may pose little risk. Optionally, a springy material 304 may be included in the construction if needed to help maintain contact pressure between the thermal pouch and the two components it will be sandwiched between. The springy material 304 may comprise a metal or solder compatible plastic or organic that has sufficient springy properties to resist deformation to some extent. In a preferred embodiment of the present invention, the low melting point, thermally conductive material 306, once melted, will fill the interstices within the springy material 304 but not penetrate the individual wires or fibers of the springy material 304. Other embodiments of the present invention may use one or more springs as the springy material 304 as shown in FIGS. 6A and 6B. Still other embodiments may use metal wool as the springy material 304. Steel wool and copper wool are two examples of metal wool. Other embodiments of the present invention may not require any springy material 304 and be constructed containing only a low melting point, thermally conductive material 306.
  • FIG. 3B is a cross-section of the example embodiment of a thermal pouch interface from FIG. 3A after construction. After the [0020] top sheet 300 and bottom sheet 302 have been sealed together, a thermal pouch filled with a low melting point, thermally conductive material 306, and optionally a quantity of springy material 304 is created. In a preferred embodiment of the present invention, the final thermal pouch will be completely filled with the low melting point, thermally conductive material 306 and springy material 304 with all air (or other gases) expelled from the pouch during construction. This eliminates any air pockets within the thermal pouch that may cause a reduction in thermal conductivity of the thermal pouch. Thus, once the thermal pouch is sealed, and the temperature raised above the melting point of the low melting point, thermally conductive material 306, the thermal pouch will be flexible enough to conform to non-planar surfaces of the devices it is used to thermally join. Other embodiments of the present invention may include a coating 308 such as thermal grease, phase change material, or solder on the outer surfaces of the thermal pouch to fill in the very small irregularities in the interface between the thermal pouch and any components it contacts. Note that some embodiments of the present invention may use a different coating 308 on the top surface of the thermal pouch, than the coating 308 on the bottom surface of the thermal pouch. Also, some embodiments of the present invention may use a coating 308 on only one surface of the thermal pouch, or not use any coating 308 at all.
  • FIG. 4 is a cross-section of an example embodiment of a thermal pouch interface according to the present invention prior to use between two components. A completed thermal pouch is placed between a [0021] top component 400 and a bottom component 402 having non-coplanar surfaces. The thermal pouch comprises a top sheet 300, a bottom sheet 302, a quantity of low melting point, thermally conductive material 306 and a quantity of springy material 304, as shown in FIGS. 3A and 3B. In an example use of the present invention, the bottom component 402 may be a multi-chip module and the top component 400 may be a heat sink. One embodiment of the present invention may use a single thermal pouch interface between the multi-chip module and the heat sink, while another embodiment may use a plurality of small thermal pouch interfaces between the individual components on the multi-chip module and the heat sink.
  • FIG. 5 is a cross-section of the example embodiment of a thermal pouch interface from FIG. 4 during use between two components. The temperature of the thermal pouch is raised above the melting point of the low melting point, thermally [0022] conductive material 306, yet below the melting point of materials within the two components 400 and 402. The two components 400 and 402 from FIG. 4 are now moved to their final positions, compressing the thermal pouch between them. Since the low melting point, thermally conductive material 306 is in a liquid state during this compression of the thermal pouch, the pouch flexes to conform to any non-planarity in the surfaces of the two components 400 and 402. The thermal pouch comprises a top sheet 300, a bottom sheet 302, a quantity of low melting point, thermally conductive material 306 and a quantity of springy material 304, as shown in FIGS. 3A and 3B. Note that the thermal pouch has deformed to match the non-coplanar shapes of the two components 400 and 402 creating a low thermal resistance thermal contact between the two components 400 and 402.
  • FIG. 6A is a cross-section of an example embodiment of a thermal pouch interface according to the present invention including a single spring. FIG. 6A shows an example embodiment of the present invention similar to that of FIG. 3B where the [0023] springy material 304 comprises a single spring 600.
  • FIG. 6B is a cross-section of an example embodiment of a thermal pouch interface according to the present invention including a plurality of springs. FIG. 6B shows an example embodiment of the present invention similar to that of FIG. 3B where the [0024] springy material 304 comprises a plurality of springs 602.
  • FIG. 7 is a flow chart of an example method for the construction of a thermal pouch according to the present invention. In a step [0025] 700 a top sheet 300 of a thermal pouch is created. In a step 702 a bottom sheet 302 of a thermal pouch is created. In an optional step 704 a quantity of springy material 304 is placed between the top sheet 300 and the bottom sheet 302. In a step 706 a quantity of low melting point, thermally conductive material is placed surrounding the springy material 304. In a step 708 the top sheet 300 and bottom sheet 302 are affixed to each other forming a thermal pouch. In an optional step 710 one or more surfaces of the thermal pouch are coated with thermal grease, phase change material, or solder 308.
  • The foregoing description of the present invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed, and other modifications and variations may be possible in light of the above teachings. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application to thereby enable others skilled in the art to best utilize the invention in various embodiments and various modifications as are suited to the particular use contemplated. It is intended that the appended claims be construed to include other alternative embodiments of the invention except insofar as limited by the prior art. [0026]

Claims (35)

What is claimed is:
1. A thermal pouch comprising:
a quantity of low melting point, thermally conductive material;
a top sheet of flexible, thermally conductive material; and
a bottom sheet of flexible, thermally conductive material, sealed with said top sheet forming a thermal pouch surrounding said quantity of low melting point, thermally conductive material.
2. The thermal pouch recited in claim 1, wherein said low melting point, thermally conductive material has a melting point below a melting point of solder used to attach electrical components in an assembly.
3. The thermal pouch recited in claim 1, wherein said low melting point, thermally conductive material comprises solder.
4. The thermal pouch recited in claim 1, wherein said low melting point, thermally conductive material comprises mercury.
5. The thermal pouch recited in claim 1, further comprising:
a quantity of springy material within said top sheet and bottom sheet substantially surrounded by said quantity of low melting point, thermally conductive material after melting of said quantity of low melting point, thermally conductive material.
6. The thermal pouch recited in claim 5, wherein said springy material is one or more springs.
7. The thermal pouch recited in claim 5, wherein said springy material is metal wool.
8. The thermal pouch recited in claim 7, wherein said metal wool is steel wool.
9. The thermal pouch recited in claim 7, wherein said metal wool is copper wool.
10. The thermal pouch recited in claim 5, wherein said springy material is solder compatible plastic.
11. The thermal pouch recited in claim 1, wherein said top sheet and said bottom sheet are mylar.
12. The thermal pouch recited in claim 1, wherein said top sheet and said bottom sheet are thin metal foil.
13. The thermal pouch recited in claim 12, wherein said thin metal foil is aluminum.
14. The thermal pouch recited in claim 12, wherein said thin metal foil is copper.
15. The thermal pouch recited in claim 1, wherein said top sheet and said bottom sheet are soldered to each other forming said thermal pouch.
16. The thermal pouch recited in claim 1, wherein said top sheet and said bottom sheet are glued to each other forming said thermal pouch.
17. The thermal pouch recited in claim 1, wherein said top sheet and said bottom sheet are welded to each other forming said thermal pouch.
18. The thermal pouch recited in claim 1, wherein an outer surface of said thermal pouch is coated with thermal grease.
19. The thermal pouch recited in claim 1, wherein an outer surface of said thermal pouch is coated with a phase change material.
20. The thermal pouch recited in claim 1, wherein an outer surface of said thermal pouch is coated with solder.
21. A method for constructing a thermal pouch, comprising the steps of:
a) creating a top sheet of flexible, thermally conductive material;
b) creating a bottom sheet of flexible, thermally conductive material;
c) placing a quantity of low melting point, thermally conductive material between said top sheet and said bottom sheet; and
d) affixing said top sheet to said bottom sheet, forming a thermal pouch.
22. The method for constructing a thermal pouch recited in claim 21, wherein said low melting point, thermally conductive material is solder.
23. The method for constructing a thermal pouch recited in claim 21, wherein said low melting point, thermally conductive material is mercury.
24. The method for constructing a thermal pouch recited in claim 21, wherein said flexible, thermally conductive material is aluminum.
25. The method for constructing a thermal pouch recited in claim 21, wherein said flexible, thermally conductive material is copper.
26. The method for constructing a thermal pouch recited in claim 21, wherein said flexible, thermally conductive material is mylar.
27. The method for constructing a thermal pouch recited in claim 21, further comprising the step of:
e) placing a quantity of springy material between said top sheet and said bottom sheet.
28. The method for constructing a thermal pouch recited in claim 27, wherein said springy material is at least one spring.
29. The method for constructing a thermal pouch recited in claim 27, wherein said springy material is metal wool.
30. The method for constructing a thermal pouch recited in claim 29, wherein said metal wool is steel wool.
31. The method for constructing a thermal pouch recited in claim 29, wherein said metal wool is copper wool.
32. The method for constructing a thermal pouch recited in claim 21, further comprising the step of:
e) coating an outer surface of said thermal pouch with thermal grease.
33. The method for constructing a thermal pouch recited in claim 21, further comprising the step of:
e) coating an outer surface of said thermal pouch with phase change material.
34. The method for constructing a thermal pouch recited in claim 21, further comprising the step of:
e) coating an outer surface of said thermal pouch with solder.
35. The method for constructing a thermal pouch recited in claim 21, further comprising the steps of:
e) heating said thermal pouch to a temperature above a melting point of said low melting point, thermally conductive material; and
f) compressing said thermal pouch between at least two components while said low melting point, thermally conductive material is a liquid.
US10/104,730 2002-03-21 2002-03-21 Thermal pouch interface Abandoned US20030178174A1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070262976A1 (en) * 2004-10-14 2007-11-15 Eiji Matsuda Level Shifter Circuit, Driving Circuit, and Display Device
US20080225484A1 (en) * 2007-03-16 2008-09-18 International Business Machines Corporation Thermal pillow
WO2013122734A1 (en) * 2012-02-15 2013-08-22 General Electric Company Flexible metallic heat connector
EP2924726A1 (en) * 2014-03-26 2015-09-30 General Electric Company Thermal interface devices

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4439441B2 (en) * 2005-07-01 2010-03-24 富士通株式会社 Heat exchanger
US8176972B2 (en) * 2006-08-31 2012-05-15 International Business Machines Corporation Compliant vapor chamber chip packaging
EP2232968A1 (en) * 2007-12-19 2010-09-29 Clustered Systems Company A cooling system for contact cooled electronic modules
US8257417B2 (en) * 2008-05-12 2012-09-04 Embrace System and method to regulate temperature
CN102112840A (en) * 2008-08-04 2011-06-29 集群系统公司 Contact cooled electronic enclosure
TW201241603A (en) * 2011-04-08 2012-10-16 Asustek Comp Inc Motherboard
US20130153187A1 (en) * 2011-12-14 2013-06-20 International Business Machines Corporation Dual Heat Sinks For Distributing A Thermal Load
WO2014144072A2 (en) 2013-03-15 2014-09-18 Warmilu, Llc Phase change heat packs
US10980151B2 (en) * 2018-07-31 2021-04-13 Hewlett Packard Enterprise Development Lp Flexible heat transfer mechanism configurations
US10806054B1 (en) * 2019-08-06 2020-10-13 Honeywell International Inc. Flexible elastic thermal bridge for electronic subassemblies with variable gaps between components and enclosures
US20220236019A1 (en) * 2021-01-22 2022-07-28 DTEN, Inc. Flexible thermal connection structure
KR102497950B1 (en) * 2021-02-04 2023-02-10 제엠제코(주) System for cooling semiconductor component, method for manufacturing the same, and semiconductor package having the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2515753A1 (en) * 1975-04-10 1976-10-14 Siemens Ag WARM PIPE
DE2658720C3 (en) * 1976-12-24 1982-01-28 Deutsche Forschungs- und Versuchsanstalt für Luft- und Raumfahrt e.V., 5300 Bonn Latent heat storage for holding a heat-storing medium
EP0059581A3 (en) 1981-03-04 1983-03-16 National Research Development Corporation Improvements in heat pipes
US4756311A (en) * 1985-05-15 1988-07-12 Jack Frost Laboratories, Inc. Microwavable thermal compress and method of use thereof
US4601331A (en) * 1985-08-23 1986-07-22 Varian Associates, Inc. Multiple heat pipes for linear beam tubes having common coolant and vaporizing surface area enhancement
US5245508A (en) * 1990-08-21 1993-09-14 International Business Machines Corporation Close card cooling method
IL100806A (en) 1991-02-01 1997-02-18 Commw Scient Ind Res Org Heat transfer device
US5205348A (en) * 1991-05-31 1993-04-27 Minnesota Mining And Manufacturing Company Semi-rigid heat transfer devices
US5603376A (en) * 1994-08-31 1997-02-18 Fujitsu Network Communications, Inc. Heat exchanger for electronics cabinet
US5642776A (en) * 1996-02-27 1997-07-01 Thermacore, Inc. Electrically insulated envelope heat pipe

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070262976A1 (en) * 2004-10-14 2007-11-15 Eiji Matsuda Level Shifter Circuit, Driving Circuit, and Display Device
US20080225484A1 (en) * 2007-03-16 2008-09-18 International Business Machines Corporation Thermal pillow
US7709951B2 (en) 2007-03-16 2010-05-04 International Business Machines Corporation Thermal pillow
WO2013122734A1 (en) * 2012-02-15 2013-08-22 General Electric Company Flexible metallic heat connector
US9658000B2 (en) 2012-02-15 2017-05-23 Abaco Systems, Inc. Flexible metallic heat connector
EP2924726A1 (en) * 2014-03-26 2015-09-30 General Electric Company Thermal interface devices
US20150282380A1 (en) * 2014-03-26 2015-10-01 General Electric Company Thermal interface devices
US9615486B2 (en) * 2014-03-26 2017-04-04 General Electric Company Thermal interface devices

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