US20030230512A1 - Chip tray - Google Patents
Chip tray Download PDFInfo
- Publication number
- US20030230512A1 US20030230512A1 US10/170,643 US17064302A US2003230512A1 US 20030230512 A1 US20030230512 A1 US 20030230512A1 US 17064302 A US17064302 A US 17064302A US 2003230512 A1 US2003230512 A1 US 2003230512A1
- Authority
- US
- United States
- Prior art keywords
- chip
- chips
- chip tray
- compartments
- storage area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D71/00—Bundles of articles held together by packaging elements for convenience of storage or transport, e.g. portable segregating carrier for plural receptacles such as beer cans or pop bottles; Bales of material
- B65D71/70—Trays provided with projections or recesses in order to assemble multiple articles, e.g. intermediate elements for stacking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
Definitions
- the present invention relates to a chip tray, and more specifically to a chip tray that has multiple compartments where IC chips are held safely.
- the chips are rectangular so the chip tray ( 50 ) has multiple rectangular compartments ( 51 ) in which the chips ( 60 ) are held.
- the corners of the chips ( 60 ) in the compartments ( 51 ) ram the sides of the compartments ( 51 ) and are often damaged. Therefore the quality of the chip ( 60 ) is decreased during transportation of the chip tray ( 50 ) filled with chips ( 60 ).
- the present invention provides a chip tray in which the chips can be safely carried and are not damaged to mitigate or obviate the aforementioned problem.
- An objective of the present invention is to provide a chip tray that can carry the chips safely. Therefore more chips are available for use in final products.
- FIG. 1 is a perspective view of a chip tray in accordance with the present invention
- FIG. 2 is a top plan view of the chip tray in the FIG. 1;
- FIG. 3 is a top plan view of the chip tray in the FIG. 1 with chips populating the chip tray;
- FIG. 4 is an enlarged cross sectional side plan view along line 4 - 4 in FIG. 3;
- FIG. 5 is a top plan view of a conventional chip tray with chips populating the chip tray.
- a chip tray in accordance with the present invention comprises a base ( 10 ), a raised storage area ( 20 ), a recess ( 30 ) and multiple chip compartments ( 21 ).
- the base ( 10 ) has a top face and a bottom face.
- the raised storage area ( 20 ) is integrally formed on the top face of the base ( 10 ) and has a top face.
- the recess ( 30 ) is defined in the bottom face of the base to correspond to the raised storage area ( 20 ).
- the chip compartments ( 21 ) are defined on the raised storage area ( 20 ).
- Each chip compartment ( 20 ) is rectangular and has four interior corners (not numbered).
- a notch ( 22 ) is defined in the raised storage area ( 20 ) at each corner of each chip compartment ( 21 ) and communicates with the chip compartment ( 21 ).
- Each notch ( 22 ) has a depth the same as that of the chip compartment ( 21 ).
- each rectangular chip ( 40 ) having four corners ( 41 ) is held in the corresponding rectangular compartment ( 21 ).
- the four corners ( 41 ) of each chip ( 40 ) are positioned in the four notches ( 22 ), as shown in FIG. 4. Therefore the corners ( 41 ) of the chips ( 40 ) do not touch the raised storage area ( 20 ) so they are much less likely to be damaged during transportation of the chip tray to next processing station.
Abstract
A chip tray includes a raised storage area formed integrally on a base. Multiple rectangular chip compartments and multiple notches are defined in the raised storage area. Each notch in each corner of the chip compartment communicates with the compartment. When rectangular chips are placed in the chip compartments, each corner of the chips is positioned in the corresponding notch. Therefore the corners of the chip are positioned in the notches to prevent damage to the corners of the chips from ramming into the chip tray.
Description
- 1. Field of the Invention
- The present invention relates to a chip tray, and more specifically to a chip tray that has multiple compartments where IC chips are held safely.
- 2. Description of Related Art
- The procedures in the IC fabricating industry can be roughly classified in four categories such as integrated circuit design including physical design, semiconductor material fabrication, integrated circuit fabrication on semiconductor material and integrated circuit packaging. Many IC industry plants perform only one of the foregoing groups of activities.
- In the last two categories, multiple chips having the same integrated circuit are cut from a complete wafer having different sizes and then send for packaging. The chips are usually held in a specific chip tray so they can be easily transported to the next location.
- With reference to FIG. 5, the chips are rectangular so the chip tray (50) has multiple rectangular compartments (51) in which the chips (60) are held. However, when the chip tray (50) is transported, the corners of the chips (60) in the compartments (51) ram the sides of the compartments (51) and are often damaged. Therefore the quality of the chip (60) is decreased during transportation of the chip tray (50) filled with chips (60).
- Therefore, the present invention provides a chip tray in which the chips can be safely carried and are not damaged to mitigate or obviate the aforementioned problem.
- An objective of the present invention is to provide a chip tray that can carry the chips safely. Therefore more chips are available for use in final products.
- Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
- FIG. 1 is a perspective view of a chip tray in accordance with the present invention;
- FIG. 2 is a top plan view of the chip tray in the FIG. 1;
- FIG. 3 is a top plan view of the chip tray in the FIG. 1 with chips populating the chip tray;
- FIG. 4 is an enlarged cross sectional side plan view along line4-4 in FIG. 3; and
- FIG. 5 is a top plan view of a conventional chip tray with chips populating the chip tray.
- With reference to FIGS. 1 and 2, a chip tray in accordance with the present invention comprises a base (10), a raised storage area (20), a recess (30) and multiple chip compartments (21). The base (10) has a top face and a bottom face. The raised storage area (20) is integrally formed on the top face of the base (10) and has a top face. The recess (30) is defined in the bottom face of the base to correspond to the raised storage area (20). The chip compartments (21) are defined on the raised storage area (20).
- Each chip compartment (20) is rectangular and has four interior corners (not numbered). A notch (22) is defined in the raised storage area (20) at each corner of each chip compartment (21) and communicates with the chip compartment (21). Each notch (22) has a depth the same as that of the chip compartment (21).
- With reference to the FIG. 3, each rectangular chip (40) having four corners (41) is held in the corresponding rectangular compartment (21). When the chip (40) is retained in the compartment (21), the four corners (41) of each chip (40) are positioned in the four notches (22), as shown in FIG. 4. Therefore the corners (41) of the chips (40) do not touch the raised storage area (20) so they are much less likely to be damaged during transportation of the chip tray to next processing station.
- It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (1)
1. A chip tray for retaining rectangular chips each of which having four corners, comprising:
a base having a top face and a bottom face;
a raised storage area with a top face integrally formed on the top face of the base and multiple rectangular compartments with four corners defined to a depth in the raised storage; and
a recess formed integrally in the bottom face of the base to corresponded to the raised storage area;
wherein the improvement comprises a rectangular notch having a depth the same as the depth of the chip compartments is defined in the raised storage area at each corner of the compartments and communicates with the chip compartment to keep each corner of the rectangular chips from ramming the raised storage.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/170,643 US20030230512A1 (en) | 2002-06-14 | 2002-06-14 | Chip tray |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/170,643 US20030230512A1 (en) | 2002-06-14 | 2002-06-14 | Chip tray |
Publications (1)
Publication Number | Publication Date |
---|---|
US20030230512A1 true US20030230512A1 (en) | 2003-12-18 |
Family
ID=29732547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/170,643 Abandoned US20030230512A1 (en) | 2002-06-14 | 2002-06-14 | Chip tray |
Country Status (1)
Country | Link |
---|---|
US (1) | US20030230512A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102627170A (en) * | 2011-08-18 | 2012-08-08 | 京东方科技集团股份有限公司 | Packaging tray |
USD832103S1 (en) * | 2015-03-09 | 2018-10-30 | Apple Inc. | Packaging |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5131535A (en) * | 1986-06-27 | 1992-07-21 | Symtek Systems, Inc. | Electrical device transport medium |
US5957293A (en) * | 1998-05-04 | 1999-09-28 | Advanced Micro Devices, Inc. | Tray to ship ceramic substrates and ceramic BGA packages |
US6079565A (en) * | 1998-12-28 | 2000-06-27 | Flouroware, Inc. | Clipless tray |
US6488154B1 (en) * | 2000-10-16 | 2002-12-03 | Ming-Chuan Yeh | Chip tray |
-
2002
- 2002-06-14 US US10/170,643 patent/US20030230512A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5131535A (en) * | 1986-06-27 | 1992-07-21 | Symtek Systems, Inc. | Electrical device transport medium |
US5957293A (en) * | 1998-05-04 | 1999-09-28 | Advanced Micro Devices, Inc. | Tray to ship ceramic substrates and ceramic BGA packages |
US6079565A (en) * | 1998-12-28 | 2000-06-27 | Flouroware, Inc. | Clipless tray |
US6488154B1 (en) * | 2000-10-16 | 2002-12-03 | Ming-Chuan Yeh | Chip tray |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102627170A (en) * | 2011-08-18 | 2012-08-08 | 京东方科技集团股份有限公司 | Packaging tray |
USD832103S1 (en) * | 2015-03-09 | 2018-10-30 | Apple Inc. | Packaging |
USD856147S1 (en) | 2015-03-09 | 2019-08-13 | Apple Inc. | Packaging |
USD872578S1 (en) | 2015-03-09 | 2020-01-14 | Apple Inc. | Packaging |
USD893314S1 (en) | 2015-03-09 | 2020-08-18 | Apple Inc. | Packaging with a band |
USD937686S1 (en) | 2015-03-09 | 2021-12-07 | Apple Inc. | Packaging with a band |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |