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Publication numberUS20040226697 A1
Publication typeApplication
Application numberUS 10/459,581
Publication dateNov 18, 2004
Filing dateJun 12, 2003
Priority dateMay 14, 2003
Publication number10459581, 459581, US 2004/0226697 A1, US 2004/226697 A1, US 20040226697 A1, US 20040226697A1, US 2004226697 A1, US 2004226697A1, US-A1-20040226697, US-A1-2004226697, US2004/0226697A1, US2004/226697A1, US20040226697 A1, US20040226697A1, US2004226697 A1, US2004226697A1
InventorsKo-Pin Liu
Original AssigneeTai-Sol Electronics Co., Ltd
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat-dissipating module
US 20040226697 A1
Abstract
A heat-dissipating module is composed of two base plates, a plurality of fins, at least one heat pipe, and a cooling fan. The two base plates are made of a heat-conductive material and each include at least one tunnel. The fins are made of a heat-conductive material and disposed between the two base plates. The heat pipe which is U-shaped includes two distal sections inserted into the tunnels and a body portion exposed outside the fins.
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Claims(5)
What is claimed is:
1. A heat-dissipating module comprising:
two base plates made of a heat-conductive material and having at least one tunnel therein;
a plurality of fins made of heat-conductive material and mounted between said two base plates;
at least one heat pipe having two distal sections inserted into said tunnels and a body portion exposed outside said fins; and
a cooling fan mounted outside said fins.
2. The heat-dissipating module as defined in claim 1, wherein said heat pipe is three in numbers; each of said two base plates has three tunnels; each of said heat pipes is U-shaped to enable said two distal sections respectively to be inserted into said tunnels.
3. The heat-dissipating module as defined in claim 1, wherein said cooling fan is positioned at a side of said fins; said body portion of said heat pipe is positioned at another side of said fins.
4. The heat-dissipating module as defined in claim 1, wherein said cooling fan is positioned at a side of said fins; said body portion of said heat pipe is positioned at an opposite side of said fins.
5. The heat-dissipating module as defined in claim 1, wherein said cooling fan and said body portion of said heat pipe are positioned at the same side of said fins.
Description
BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates generally to heat-dissipating technology, and more particularly, to a heat-dissipating module composed of multiple heat pipes and heat sinks to have high heat-dissipative performance.

[0003] 2. Description of the Related Art

[0004] Referring to FIGS. 5-6, a conventional heat-dissipating device 70 is composed of three heat sinks 71 and 73, two of which parallel face to each other and the other of which is positioned above the two heat sinks 71, four U-shaped heat pipes 75, and a cooling fan 77. The two opposite heat sinks 71 are stacked upon each other and each include a base 72 having elongated ditches 721 recessed thereon, and fins 722 facing to the others. The heat pipes 75 are received in the ditches 721 for conducting the heat from the bottom of the lower heat sink 71 to the upper heat sinks 71. The cooling fan 77 is mounted at a lateral side of the heat sinks 71 and 73 for enhancing the heat-dissipative performance of the heat sinks 71 and 73.

[0005] However, the aforementioned conventional heat-dissipating device 70 needs to be improved in structure and heat-dissipative performance as stated below.

[0006] 1. Although the heat pipes 75 conduct the heat to the base 72 of each heat sink 71, the fins 722 of the two opposite heat sinks 71 are not connected or in contact with each other, such that the heat in the fins 722 of the lower heat sink 71 can not be directly conducted to the fins 722 of the upper heat sink 71, thereby causing uneven and low heat-dissipative performance.

[0007] 2. In order to keep the two opposite heat sinks 71 firmly stacked upon each other, the fins 722 having more thickness are required. Relatively, the fins 722 having more thickness will be less disposed on the base 72 of the heat sink 71, which has fixed area, thereby causing lower heat-dissipative performance due to less heat-dissipative area.

[0008] 3. The heat pipes 75 contact the two heat sinks 71 with half of the outer periphery thereof, such that the conventional heat-dissipating device 70 has worse heat-dissipative performance.

SUMMARY OF THE INVENTION

[0009] The primary objective of the present invention is to provide a heat-dissipating module which has higher heat-dissipative performance than the prior art.

[0010] The foregoing objective of the present invention is attained by the heat-dissipating module which is composed of two base plates, a plurality of fins, at least one heat pipe, and a cooling fan. The two base plates are made of a heat-conductive material and each include at least one tunnel. The fins are made of a heat-conductive material and disposed between the two base plates. The heat pipe, which is U-shaped, includes two distal sections inserted into the tunnels and a body portion exposed outside the fins.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011]FIG. 1 is a perspective view of a first preferred embodiment of the present invention;

[0012]FIG. 2 is an exploded view of the first preferred embodiment of the present invention;

[0013]FIG. 3 is a perspective view of a second preferred embodiment of the present invention;

[0014]FIG. 4 is a perspective view of a third preferred embodiment of the present invention;

[0015]FIG. 5 is a perspective view of a prior art; and

[0016]FIG. 6 is an exploded view of the prior art.

DETAILED DESCRIPTION OF THE INVENTION

[0017] Referring to FIGS. 1-2, a heat-dissipating module 10 of a first preferred embodiment of the present invention is composed of two base plates 11, a plurality of fins 21, three heat pipes 31, and a cooling fan 41.

[0018] The two base plates 11, which are in positions parallel to each other and defined an upper base plate and a lower base plate, is made of a metallic heat-conductive material, like aluminum, copper, etc. and each include three tunnels 12 therethrough.

[0019] The fins 21 are disposed between the two base plates 11 and parallel to and spaced from one another.

[0020] Each of the three heat pipes 31, which are respectively U-shaped, includes two distal sections inserted into the tunnels 12 and a body portion exposed outside the fins 21. Please be noted that the heat pipes 31 are not restricted to three in numbers and can be any.

[0021] The cooling fan 41 is mounted at a side of the fins 21. The body portions of the heat pipes 31 are positioned at another side of the fins 21.

[0022] Referring to FIG. 1, the present invention is operated by rapidly conducting the heat from the lower base plate 11 via the fins 21 to the upper base plate 11. In addition, the heat in the two base plates 11 is conducted to the center of the fins 21 and dissipated outside by that the cooling fan blows towards the fins 21 to enable the flowing air to bring the heat outside. Accordingly, the heat-dissipating module 10 of the first preferred embodiment of the present invention evenly dissipates the heat by the whole structure, thereby causing excellent heat-dissipative performance.

[0023] Referring to FIG. 3, the heat-dissipating module 10′ of a second preferred. embodiment of the present invention is different from the heat-dissipating module 10 of the first preferred embodiment by that the cooling fan 41′ is mounted at a side of the fins 21′ and the body portions of the heat pipes 31′ are positioned at an opposite side of the fins 21′. In addition, the flowing air generated by the cooling fan 41′ passes through the heat pipes 31′ to partially dissipate the heat out of the heat pipes 31′, thereby causing more excellent heat-dissipative performance.

[0024] Referring to FIG. 4, the heat-dissipating module 10″ of a third preferred embodiment of the present invention is different from those of the aforementioned embodiment by that the cooling fan 41″ and the body portions of the heat pipes 31′ are mounted at the same side of the fins 21″. In addition, the cooling fan 41″ and the heat pipes 31″ are positioned very adjacently, such that the flowing air dissipates the heat out of the heat pipes 31″ and the fins 21″ at the same time, thereby causing more excellent heat-dissipative performance.

[0025] In conclusion, the present invention includes advantages as follow.

[0026] 1. Excellent Heat-Dissipative Performance:

[0027] The fins of the present invention are connected between the two base plates such that the heat can be conducted from one of the base plates to the other. The fins of the present invention are integrally connected to have larger heat-dissipative area, thereby causing higher heat-dissipative performance.

[0028] 2. Strengthened Structure:

[0029] The fins are connected between the two base plates rather than the fins of the two heat sinks of the prior art stacked upon each other, such that the fins are not subject to random movement, thereby rendering the strengthened structure of the present invention. In addition, the fins having less thickness can be more mounted between the two base plates to enlarge the heat-dissipative area, thereby enhancing the heat-dissipative performance.

[0030] 3. Completely Heat-Dissipative:

[0031] The heat pipes are completely received in the tunnels to have an external periphery contacting the internal periphery of the tunnels, thereby causing complete heat-dissipative effect.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6918429 *Nov 5, 2003Jul 19, 2005Cpumate Inc.Dual-layer heat dissipating structure
US6964295 *Nov 16, 2004Nov 15, 2005Hon Hai Precision Industry Co., Ltd.Heat dissipation device
US7013960 *Sep 30, 2004Mar 21, 2006Hon Hai Precision Industry Co., Ltd.Heat dissipation device
US7073568 *Oct 29, 2004Jul 11, 2006Hon Hai Precision Industry Co., Ltd.Heat dissipation device
US7296617 *Sep 7, 2005Nov 20, 2007Fu Zhun Precision Industry (Shenzhen) Co., Ltd.Heat sink
US7298620 *Dec 8, 2005Nov 20, 2007Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device
US7347251 *Dec 21, 2005Mar 25, 2008International Business Machines CorporationHeat sink for distributing a thermal load
US7401642 *Sep 22, 2004Jul 22, 2008Hon Hai Precision Industry Co., Ltd.Heat sink with heat pipes
US7440279 *Mar 14, 2006Oct 21, 2008Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device
US7447027 *Dec 19, 2005Nov 4, 2008Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Hybrid heat dissipation device
US7448437 *Jun 24, 2005Nov 11, 2008Fu Zhun Precision Industry (Shenzhen) Co., Ltd.Heat dissipating device with heat reservoir
US7448438 *Sep 1, 2006Nov 11, 2008Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat pipe type heat dissipation device
US7537046 *Apr 2, 2007May 26, 2009Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device with heat pipe
US7565925Jun 24, 2005Jul 28, 2009Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device
US7753110 *Dec 10, 2007Jul 13, 2010Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device
US7891411 *Jun 22, 2007Feb 22, 2011Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device having a fan for dissipating heat generated by at least two electronic components
Classifications
U.S. Classification165/104.33, 257/E23.099, 165/121, 257/E23.088
International ClassificationH01L23/467, H01L23/427, F28D15/02
Cooperative ClassificationH01L23/427, F28D15/0275, H01L23/467
European ClassificationF28D15/02N, H01L23/467, H01L23/427
Legal Events
DateCodeEventDescription
Jun 12, 2003ASAssignment
Owner name: TAI-SOL ELECTRONICS CO., LTD., TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIU, KO-PIN;REEL/FRAME:014179/0277
Effective date: 20030531