US20040229051A1 - Multilayer coating package on flexible substrates for electro-optical devices - Google Patents
Multilayer coating package on flexible substrates for electro-optical devices Download PDFInfo
- Publication number
- US20040229051A1 US20040229051A1 US10/439,506 US43950603A US2004229051A1 US 20040229051 A1 US20040229051 A1 US 20040229051A1 US 43950603 A US43950603 A US 43950603A US 2004229051 A1 US2004229051 A1 US 2004229051A1
- Authority
- US
- United States
- Prior art keywords
- layer
- electro
- optical device
- multilayer coating
- coating set
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 48
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- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 150000001282 organosilanes Chemical class 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical class [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
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- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
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- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
Definitions
- the invention relates to an electro-optical device having a multilayer coating set. More particularly, the invention relates to a multilayer coating set that provides a moisture and gas barrier for the electro-optical device and enhances resistance of the electro-optical device to chemical attack.
- Electro-optical devices such as electrochromic devices, liquid crystal displays (also referred to hereinafter as “LCDs”), organic light emitting diodes (also referred to hereinafter as “OLEDs”), light emitting diodes (also referred to hereinafter as “LEDs”), photovoltaic devices, radiation detectors, and the like, comprise an electronically or optically active portion—e.g., liquid crystals, a light emitter, or radiation detector—that is frequently disposed on a substrate.
- an electronically or optically active portion e.g., liquid crystals, a light emitter, or radiation detector—that is frequently disposed on a substrate.
- a rigid electro-optical device is either preferable or acceptable, either glass or silicon is generally used as the substrate.
- a polymeric film may serve as the substrate.
- Various single layer coatings have been used to modify the barrier properties of polymeric substrates for use in flexible electro-optical devices.
- a single layer coating tends to provide a less than optimum barrier against moisture and oxygen.
- a single coating cannot meet all of the other requirements, such as mechanical, adhesion, electronically conductive, optical, thermal stability, chemical resistance, and thermal expansion criteria for such electro-optical devices.
- Multilayer coating composites comprising individually deposited layers have been used to provide the desired moisture and gas barrier properties for such electro-optical devices.
- such multilayer composites do not typically meet all of the other mechanical, adhesion, electric conductivity, optical absorption and/or reflectivity, thermal stability, and thermal expansion requirements for such electro-optical devices. The necessary combination of vacuum and wet processes complicates the manufacture of electro-optical devices that include such multilayer composites.
- a multilayer coating set that provides a moisture and oxygen barrier and resistance to chemical attack during processing while simultaneously meeting the mechanical, adhesion, electronically conductive, optical, thermal stability, and thermal expansion requirements for electro-optical devices, such as LCDs, OLEDs, LEDs, photovoltaic devices, radiation detectors, and the like.
- electro-optical devices such as LCDs, OLEDs, LEDs, photovoltaic devices, radiation detectors, and the like.
- an electro-optical device having such a multilayer coating set.
- the present invention meets these and other needs by providing a transparent multilayer coating set comprising a moisture and oxygen barrier, a chemically resistant layer, and a transparent conductive coating.
- the invention also provides an electro-optical device comprising a polymeric substrate, a multilayer coating set, and an active portion.
- the multilayer coating set may be deposited using a single vacuum coating chamber.
- one aspect of the invention is to provide an electro-optical device.
- the electro-optical device comprises: at least one base, the at least one base comprising a flexible polymeric material; and a multilayer coating set disposed on at least one surface of the base.
- the multilayer coating set comprises at least one organic layer and at least one inorganic layer.
- the base and multilayer coating set are transparent.
- the multilayer coating set provides a barrier to moisture and oxygen and provides chemical resistance.
- the multilayer coating set is also mechanically flexible and thermally stable up to a glass transition temperature of the base.
- a second aspect of the invention is to provide a multilayer coating set for an electro-optical device.
- the multilayer coating set comprises: at least one inorganic layer; and at least one organic layer adjacent to said at least one inorganic layer.
- the multilayer coating set is transparent and is mechanically flexible and thermally stable.
- the multilayer coating set provides a barrier to moisture and oxygen for said electro-optical device, resistance to chemical attack for the electro-optical device and the base material during fabrication of the electro-optical device.
- a third aspect of the invention is to provide an electro-optical device.
- the electro-optical device comprises at least one substrate.
- the substrate comprises: at least one base, wherein the at least one base comprising a flexible polymeric material; and a multilayer coating set comprising at least one inorganic layer and at least one organic layer adjacent to the at least one inorganic layer.
- the multilayer coating set is deposited on said at least one surface by a vacuum deposition technique.
- the multilayer coating set is transparent and is mechanically flexible and thermally stable up to a glass transition temperature of the base.
- the multilayer coating set provides a barrier to moisture and oxygen for said electro-optical device and resistance for the electro-optical device to chemical attack.
- FIG. 1 is a schematic representation of an electro-optical device of the present invention
- FIG. 2 is a schematic representation of a first LCD substrate structure of the present invention.
- FIG. 3 is a schematic representation of a second LCD substrate structure of the present invention.
- Electro-optical devices such as, but not limited to, electrochromic devices, liquid crystal displays (also referred to hereinafter as “LCDs”), organic light emitting diode (also referred to hereinafter as “OLEDs”), light emitting diodes (also referred to hereinafter as “LEDs”), photovoltaic devices, radiation detectors, and the like, comprise an electronically or optically active portion—e.g., liquid crystals, a light emitter, or radiation detector—that is frequently disposed on a substrate.
- the electro-optical device must include at least one barrier coating.
- Electro-optical device 100 comprises at least one base 110 , and at least one multilayer coating set 120 disposed on a surface of base 110 . Both base 110 and multilayer coating set 120 are transparent to visible light. Base 110 and multilayer coating set may additionally be transparent in at least one of the infrared (IR) and ultraviolet (UV) regions of the spectrum. Multilayer coating set 120 acts as a barrier to prevent the exposure of active portion 140 of electro-optical device 100 to moisture and oxygen.
- IR infrared
- UV ultraviolet
- multilayer coating set 120 acts as a barrier to chemical attack of the underlying polymeric base 110 during processing or manufacture of electro-optical device 100 .
- Multilayer coating set 120 is also mechanically flexible. The flexibility of multilayer coating set 120 allows it to adhere and conform to the shape of base 110 during processing and in the final configuration of electro-optical device 100 .
- Base 110 may comprise at least one of a substrate 130 and an active portion 140 of electro-optical device 100 .
- base 110 comprises substrate 130 , which is formed from a flexible polymeric material.
- the flexible polymeric material comprises a polycarbonate.
- active portion 140 is encapsulated by a first multilayer coating set 120 , which provides a barrier between substrate 130 and active portion 140 , and a second multilayer coating set 120 , which provides an additional barrier for the remainder of active portion 140 .
- Multilayer coating set 120 may be disposed upon on at least one surface of a base material, such as, but not limited to, a base 110 or the active portion 140 of electro-optical device 100 .
- Multilayer coating set 120 comprises at least one inorganic layer 122 and at least one organic layer 124 .
- the multilayer coating set 100 may include a plurality of inorganic layers 122 and organic layers 124 that are alternately arranged.
- organic layers 124 may be separated by a plurality of consecutively stacked inorganic layers 122
- inorganic layers 122 may be separated by a plurality of consecutively stacked organic layers 124 .
- multilayer coating set 120 comprises an inorganic multilayer coating and at least one organic layer.
- a first inorganic layer having good adhesion and coefficient of thermal expansion (CTE) matching properties is deposited on a smooth polycarbonate surface.
- a second inorganic layer having intrinsically good gas and moisture barrier properties is deposited on the first inorganic layer.
- the second inorganic layer differs chemically and physically from the first inorganic layer.
- the adhesion and CTE matching properties of the first inorganic layer also serve to increase the barrier performance of the second inorganic layer.
- a polymeric organic layer is next deposited on top of the second inorganic layer. The polymeric organic layer acts as a smoothing layer and also protects the first and second inorganic coatings from chemical attack during processing.
- a third inorganic layer having good adhesion and CTE matching properties is then deposited on top of the organic layer.
- a fourth inorganic layer having intrinsically good gas and moisture barrier properties is deposited on top of the third inorganic layer.
- the fourth inorganic layer differs chemically and physically from the third inorganic layer.
- the barrier properties of the fourth inorganic layer are enhanced by adhesion and CTE matching properties of the third inorganic layer.
- multilayer coating set 120 may be designed to simultaneously meet demands on thermal, mechanical, dimensional, and optical performance.
- Multilayer coating set 120 is transparent to light in the visible portion of the spectrum. In one embodiment, multilayer coating set 120 has a transmission of at least about 85% and a Taber haze value of less than about 5% after 1000 cycles.
- Multilayer coating set 120 additionally provides a barrier for base 110 against chemical attack during processing.
- Multilayer coating set 120 may include at least one chemically resistant layer that is resistant to attack by at least one of alkali solutions (non-limiting examples include KOH and NaOH), acids (non-limiting examples include HBr, HCl, and HNO 3 ), and organic solvents, such as but not limited to xylene, NMP, acetone, and the like.
- Multilayer coating set 120 is also thermally stable up to at least a glass transition temperature of base 110 .
- multilayer coating set 120 is thermally stable up to at least about 250° C.
- multilayer coating set 100 is mechanically flexible; i.e., multilayer coating set 120 can be bent around a radius of about 1 inch (2.54 cm) without exhibiting a substantial degradation in overall performance as a barrier against moisture, gas, and chemical attack.
- Each of the at least one inorganic layer 122 may comprise at least one of silicon, a metal oxide, a metal nitride, and combinations thereof, wherein the metal is one of indium, tin, zinc, titanium, and aluminum.
- metal nitrides and metal oxides that may comprise the at least one inorganic layer 122 include indium zinc oxide (IZO), indium tin oxide (ITO), silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum oxynitride, zinc oxide, indium oxide, tin oxide, cadmium tin oxide, cadmium oxide, and magnesium oxide.
- the at least one inorganic layer 122 may, in one embodiment, be deposited on either base material 110 or organic layer 124 by vacuum deposition techniques known in the art. Such vacuum deposition techniques include physical vapor deposition or plasma deposition methods. Plasma based deposition methods are particularly preferred, as they typically permit deposition of the at least one inorganic layer 122 at low substrate temperatures.
- the deposition of the at least one inorganic layer 122 by other techniques, such as thermal chemical vapor deposition (CVD), requires substrate temperatures that are higher than those at which plastic substrates are thermally stable.
- Plasma deposition methods that may be used to deposit the at least one inorganic layer 122 include, but are not limited to, plasma enhanced chemical vapor deposition, expanding thermal plasma, microwave plasma, inductively coupled plasma, and high density plasma chemical vapor deposition.
- Physical vapor deposition methods that may be used to deposit the at least one inorganic layer 122 include, but are not limited to, sputtering, laser ablation, cathodic arc deposition, and electron beam evaporation. The above-referenced plasma and physical vapor deposition techniques may be used either alone or in combination with each other.
- the at least one inorganic layer 122 serves as at least one of a radiation absorbent layer, a moisture barrier layer, an oxygen barrier layer, an electrically conductive layer, an ant-reflective layer, and combinations thereof.
- the at least one inorganic layer 122 serves as a moisture barrier layer having a water vapor transmission rate of less than 0.1 g/m 2 -day at 100% relative humidity and 25° C.
- the at least one inorganic layer 122 may also serve as an oxygen barrier layer, which, in one embodiment, has an oxygen transmission rate of less than 0.1 cc/m 2 -day for oxygen diffusion in a 21% oxygen atmosphere at 25° C.
- Each of the at least one organic layer 124 comprises at least one of a parylene, an acrylic, a siloxane, xylene, an alkene, styrene, an organosilane, an organosilazane, an organosilicone, and the like.
- the at least one organic layer 124 includes at least one of an adhesion layer, a stress relief layer, a conformal layer, a chemically resistant layer, an abrasion resistant layer, and combinations thereof.
- the at least one organic layer 124 may be deposited on either base material 110 or inorganic layer 122 by vacuum deposition techniques known in the art. Such vacuum deposition techniques include physical vapor deposition or plasma deposition methods. Organic layer 124 may also be deposited using polymer monolithic layer (also referred to hereinafter as “PML”) deposition methods that are known in the art.
- PV polymer monolithic layer
- One such PML method includes the steps of: flash evaporation of at least one radiation-curable monomer, such as, but not limited to, acrylic monomers, vinyl monomers, epoxy monomers, and the like; condensing the at least one radiation-curable monomer on one of base material 110 , the at least one inorganic layer 122 , or another organic layer 124 ; and radiation cross-linking the at least one radiation-curable monomer by irradiation by one of at lest one electron beam or ultraviolet radiation to form the at least one organic layer 124 .
- at least one radiation-curable monomer such as, but not limited to, acrylic monomers, vinyl monomers, epoxy monomers, and the like
- PML deposition is carried out in a vacuum and thus produces organic layers having fewer defects, such as pinholes, due to dust than deposition methods such as spin coating, meniscus coating, dip coating, and extrusion coating, that are performed under atmospheric conditions organic coating techniques.
- PML methods that may be used to deposit the at least one organic layer 124 are described in U.S. Pat. No. 4,954,371, by Angelo Yializis, entitled “Flash Evaporation of Monomer Fluids,” the contents of which are incorporated herein by reference in their entirety.
- Plasma deposition methods that may be used to deposit the at least one organic layer 124 include, but are not limited to: plasma enhanced chemical vapor deposition; expanding thermal plasma, described in U.S. Pat. No. 4,871,580, by Daniel C.
- Multilayer coating set 120 has a thickness in the range from about 0.05micron to about 50 microns. In one embodiment, the thickness of multilayer coating set 120 is in the range from about 0.1 micron to about 10 microns.
- the thickness of the individual layers in multilayer coating set 120 must be balanced to optimize performance of individual layers while maximizing the multilayer adhesion and flexibility of multilayer coating set 120 .
- the thickness of the individual layers also depends in part on the function of and the material comprising the individual layer. For example, an ultraviolet absorbing titanium oxide may have a thickness of about 0.2 micron.
- An inorganic barrier layer may have a thickness ranging from about 20 nm to about 200 nm.
- PML chemical barrier layers or smoothing/bond layers have thicknesses in a range from about 0.1 micron to about 4 microns.
- a LCD display typically includes an active layer 140 comprising a liquid crystal suspension sandwiched between two LCD substrate structures. Two such LCD substrate structures are shown in FIGS. 2 and 3.
- substrate structure 202 comprises a polycarbonate substrate 210 , an inner multi layer coating set 220 , and an outer multilayer coating set 230 .
- inner multilayer coating set 220 is disposed between substrate 210 and active portion 140 , and comprises an inorganic moisture and oxygen barrier layer 226 , an organic chemical barrier layer 224 , and a transparent conductive inorganic layer 222 .
- Inorganic moisture and oxygen barrier layer 226 may be deposited by sputtering and, in one embodiment, has a thickness ranging from about 20 nm to about 200 nm and comprises indium tin oxide (ITO).
- inorganic oxides, nitrides, or oxinitrides such as, but not limited to, silicon oxides, nitrides, and oxynitrides, and aluminum oxides, nitrides, and oxynitrides may be used to form inorganic moisture and oxygen barrier layer 226 .
- Organic chemical barrier layer 224 which is deposited by PML processing, provides resistance against chemical attack by most chemicals commonly used in display manufacturing.
- Organic chemical barrier layer 224 has a thickness ranging from about 0.1 micron to about 4 microns.
- Conductive inorganic layer 226 may be deposited by sputtering and, in one embodiment, has a thickness of about 125 nm and comprises indium tin oxide (ITO).
- Inner multilayer coating set 220 may optionally include an organic smoothing/bond layer 228 having a thickness ranging from about 0.1 micron to about 4 microns.
- Outer multilayer coating set 230 comprises inorganic moisture and oxygen barrier layer 232 and organic chemical barrier layer 234 , each comprising the same material as the corresponding inorganic moisture and oxygen barrier layer 224 and organic chemical barrier layer 224 , respectively.
- LCD substrate structure 202 is prepared in an apparatus having a vacuum chamber that can be pumped down to pressures below 10 ⁇ 4 torr, and, preferably, less than 10 ⁇ 6 torr.
- the vacuum chamber contains at least one sputtering deposition station and at least one of a flash evaporator and an electron beam system.
- Polycarbonate substrate 210 is placed within the vacuum chamber, which is then evacuated to a pressure below 10 ⁇ 4 torr and, preferably, less than 10 ⁇ 6 torr.
- substrate 210 contacts a chilled drum that can be rotated to move polycarbonate substrate 210 from one deposition station to another.
- An outer surface of polycarbonate substrate 210 is first treated with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species.
- Outer inorganic moisture and oxygen barrier layer 232 is first deposited on the outer surface of the polycarbonate substrate 210 through a sputtering process. Using the PML process, outer organic chemical barrier layer 234 is then deposited directly onto the outer surface of outer inorganic moisture and oxygen barrier layer 232 to complete outer multilayer coating set 230 .
- Inner multilayer coating set 220 is then prepared by first treating an inner surface of polycarbonate substrate 210 with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species.
- Inner inorganic moisture and oxygen barrier layer 226 is first deposited on the outer surface of the polycarbonate substrate 210 through a sputtering process.
- inner organic chemical barrier layer 224 is then deposited directly onto the outer surface of inner inorganic moisture and oxygen barrier layer 226 .
- Conductive inorganic layer 222 typically comprising indium oxide doped with 2-15% tin, is then deposited directly onto inner organic chemical barrier layer 224 using a sputtering process to complete inner multilayer coating set 220 .
- FIG. 3 is a schematic representation of a second LCD substrate structure 302 .
- inner multilayer coating set 320 further includes an inner organic smoothing/bond layer 228 disposed between substrate 210 and inner inorganic moisture and oxygen barrier layer 226 .
- Outer multilayer coating set 330 also includes an outer organic smoothing/bond layer 236 disposed between substrate 210 and outer inorganic moisture and oxygen barrier layer 232 , and an outer organic chemical barrier layer 234 disposed on an outer surface of outer inorganic moisture and oxygen barrier layer 232 .
- Inner and outer organic smoothing/bond layers 228 , 236 promotes bonding and adhesion of both inner multilayer coating set 220 and outer multilayer coating set 220 , respectively, to 210 substrate and decrease the degree of roughness of the interface between the multilayer coating sets and substrate 210 .
- Each of outer and inner organic smoothing/bond layers 228 , 236 is deposited by PML processing and has a thickness ranging from about 0.1 micron to about 4 microns.
- LCD substrate structure 302 is prepared in the same apparatus as that used to prepare LCD substrate structure 202 .
- An outer surface of polycarbonate substrate 210 is first treated with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species.
- Outer organic bonding/smoothing layer 236 is then deposited on an outer surface of polycarbonate substrate 210 using a PML process.
- Outer inorganic moisture and oxygen barrier layer 232 is then deposited on outer organic bonding/smoothing layer 236 using a sputtering process.
- outer organic chemical barrier layer 234 is then deposited directly onto the outer surface of outer inorganic moisture and oxygen barrier layer 232 to complete outer multilayer coating set 330 .
- Inner multilayer coating set 320 is then prepared by first treating an inner surface of polycarbonate substrate 210 with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species.
- Inner organic bonding/smoothing layer 228 is then deposited on an outer surface of polycarbonate substrate 210 using a PML process.
- inner inorganic moisture and oxygen barrier layer 226 is deposited on inner organic bonding/smoothing layer 236 using a sputtering process.
- inner organic chemical barrier layer 224 is then deposited directly onto the outer surface of inner inorganic moisture and oxygen barrier layer 226 .
- Conductive inorganic layer 222 is then deposited directly onto inner organic chemical barrier layer 224 using a sputtering process to complete inner multilayer coating set 320 .
- Another aspect of the invention is to provide a multilayer coating set for an electro-optical device.
- the multilayer coating set comprises at least one inorganic layer and at least one organic layer adjacent to the at least one inorganic layer.
- the multilayer coating set is transparent, mechanically flexible, and thermally stable.
- the multilayer coating set provides a barrier to moisture and oxygen for the electro-optical device, resistance to chemical attack for the electro-optical device and a base or substrate material during fabrication of the electro-optical device.
- the multilayer coating set 120 which is transparent and comprises at least one inorganic layer and at least one organic layer, is described in detail hereinabove.
- the multiple layers of multilayer coating set 120 are deposited such that the various barrier properties, chemical resistance, mechanical, adhesion, electronically conductive, optical, thermal stability, and thermal expansion requirements can be independently optimized. Because the various layers are deposited using vacuum deposition techniques, the individual layers of multilayer coating set 120 have fewer defects than corresponding coatings that are produced using either wet or atmospheric coating processes.
- the barrier layer may have a hybrid inorganic/organic composition comprising either be multilayer barrier of discrete organic and inorganic layers or a single barrier layer having a graded composition that gradually transitions from a pure inorganic layer to a pure organic layer. Accordingly, various modifications, adaptations, and alternatives may occur to one skilled in the art without departing from the spirit and scope of the present invention.
Abstract
Description
- The invention relates to an electro-optical device having a multilayer coating set. More particularly, the invention relates to a multilayer coating set that provides a moisture and gas barrier for the electro-optical device and enhances resistance of the electro-optical device to chemical attack.
- Electro-optical devices, such as electrochromic devices, liquid crystal displays (also referred to hereinafter as “LCDs”), organic light emitting diodes (also referred to hereinafter as “OLEDs”), light emitting diodes (also referred to hereinafter as “LEDs”), photovoltaic devices, radiation detectors, and the like, comprise an electronically or optically active portion—e.g., liquid crystals, a light emitter, or radiation detector—that is frequently disposed on a substrate. In those applications where a rigid electro-optical device is either preferable or acceptable, either glass or silicon is generally used as the substrate. In those applications where a flexible electro-optical device is desired, a polymeric film may serve as the substrate. However, moisture and oxygen diffuse rapidly through such polymeric film substrates, thereby causing the performance of the electro-optical devices disposed on the substrate to degrade or even fail. In addition, polymeric substrates are also subject to attack by chemicals used during processing of the electro-optical device. Finally, many electro-optical applications require a substrate that is thermally stable and transparent in at least the visible light range.
- Various single layer coatings have been used to modify the barrier properties of polymeric substrates for use in flexible electro-optical devices. A single layer coating, however, tends to provide a less than optimum barrier against moisture and oxygen. In addition, a single coating cannot meet all of the other requirements, such as mechanical, adhesion, electronically conductive, optical, thermal stability, chemical resistance, and thermal expansion criteria for such electro-optical devices. Multilayer coating composites comprising individually deposited layers have been used to provide the desired moisture and gas barrier properties for such electro-optical devices. However, such multilayer composites do not typically meet all of the other mechanical, adhesion, electric conductivity, optical absorption and/or reflectivity, thermal stability, and thermal expansion requirements for such electro-optical devices. The necessary combination of vacuum and wet processes complicates the manufacture of electro-optical devices that include such multilayer composites.
- Therefore, what is needed is a multilayer coating set that provides a moisture and oxygen barrier and resistance to chemical attack during processing while simultaneously meeting the mechanical, adhesion, electronically conductive, optical, thermal stability, and thermal expansion requirements for electro-optical devices, such as LCDs, OLEDs, LEDs, photovoltaic devices, radiation detectors, and the like. What is also needed is a method of depositing such a multilayer coating set on a polymeric substrate using only vacuum-based deposition techniques. Finally, what is needed is an electro-optical device having such a multilayer coating set.
- The present invention meets these and other needs by providing a transparent multilayer coating set comprising a moisture and oxygen barrier, a chemically resistant layer, and a transparent conductive coating. The invention also provides an electro-optical device comprising a polymeric substrate, a multilayer coating set, and an active portion. The multilayer coating set may be deposited using a single vacuum coating chamber.
- Accordingly, one aspect of the invention is to provide an electro-optical device. The electro-optical device comprises: at least one base, the at least one base comprising a flexible polymeric material; and a multilayer coating set disposed on at least one surface of the base. The multilayer coating set comprises at least one organic layer and at least one inorganic layer. The base and multilayer coating set are transparent. The multilayer coating set provides a barrier to moisture and oxygen and provides chemical resistance. The multilayer coating set is also mechanically flexible and thermally stable up to a glass transition temperature of the base.
- A second aspect of the invention is to provide a multilayer coating set for an electro-optical device. The multilayer coating set comprises: at least one inorganic layer; and at least one organic layer adjacent to said at least one inorganic layer. The multilayer coating set is transparent and is mechanically flexible and thermally stable. The multilayer coating set provides a barrier to moisture and oxygen for said electro-optical device, resistance to chemical attack for the electro-optical device and the base material during fabrication of the electro-optical device.
- A third aspect of the invention is to provide an electro-optical device. The electro-optical device comprises at least one substrate. The substrate comprises: at least one base, wherein the at least one base comprising a flexible polymeric material; and a multilayer coating set comprising at least one inorganic layer and at least one organic layer adjacent to the at least one inorganic layer. The multilayer coating set is deposited on said at least one surface by a vacuum deposition technique. The multilayer coating set is transparent and is mechanically flexible and thermally stable up to a glass transition temperature of the base. The multilayer coating set provides a barrier to moisture and oxygen for said electro-optical device and resistance for the electro-optical device to chemical attack.
- These and other aspects, advantages, and salient features of the present invention will become apparent from the following detailed description, the accompanying drawings, and the appended claims.
- FIG. 1 is a schematic representation of an electro-optical device of the present invention;
- FIG. 2 is a schematic representation of a first LCD substrate structure of the present invention; and
- FIG. 3 is a schematic representation of a second LCD substrate structure of the present invention.
- In the following description, like reference characters designate like or corresponding parts throughout the several views shown in the figures. It is also understood that terms such as “top,” “bottom,” “outward,” “inward,” and the like are words of convenience and are not to be construed as limiting terms.
- Electro-optical devices, such as, but not limited to, electrochromic devices, liquid crystal displays (also referred to hereinafter as “LCDs”), organic light emitting diode (also referred to hereinafter as “OLEDs”), light emitting diodes (also referred to hereinafter as “LEDs”), photovoltaic devices, radiation detectors, and the like, comprise an electronically or optically active portion—e.g., liquid crystals, a light emitter, or radiation detector—that is frequently disposed on a substrate. In order to protect the active portion and the substrate from degradation due to exposure to moisture, oxygen, or corrosive chemical attack, the electro-optical device must include at least one barrier coating.
- One aspect of the invention is to provide an electro-optical device, such as, but not limited to, LCDs, OLEDs, LEDs, photovoltaic devices, and radiation detectors. A schematic representation of such an electro-optical device is shown in FIG. 1. Electro-optical device100 comprises at least one base 110, and at least one
multilayer coating set 120 disposed on a surface of base 110. Both base 110 andmultilayer coating set 120 are transparent to visible light. Base 110 and multilayer coating set may additionally be transparent in at least one of the infrared (IR) and ultraviolet (UV) regions of the spectrum.Multilayer coating set 120 acts as a barrier to prevent the exposure ofactive portion 140 of electro-optical device 100 to moisture and oxygen. Furthermore, multilayer coating set 120 acts as a barrier to chemical attack of the underlying polymeric base 110 during processing or manufacture of electro-optical device 100.Multilayer coating set 120 is also mechanically flexible. The flexibility ofmultilayer coating set 120 allows it to adhere and conform to the shape of base 110 during processing and in the final configuration of electro-optical device 100. - Base110 may comprise at least one of a
substrate 130 and anactive portion 140 of electro-optical device 100. In one embodiment, base 110 comprisessubstrate 130, which is formed from a flexible polymeric material. In one particular embodiment, the flexible polymeric material comprises a polycarbonate. In another embodiment, shown in FIG. 1,active portion 140 is encapsulated by a firstmultilayer coating set 120, which provides a barrier betweensubstrate 130 andactive portion 140, and a secondmultilayer coating set 120, which provides an additional barrier for the remainder ofactive portion 140. -
Multilayer coating set 120 may be disposed upon on at least one surface of a base material, such as, but not limited to, a base 110 or theactive portion 140 of electro-optical device 100.Multilayer coating set 120 comprises at least oneinorganic layer 122 and at least oneorganic layer 124. The multilayer coating set 100 may include a plurality ofinorganic layers 122 andorganic layers 124 that are alternately arranged. Alternatively,organic layers 124 may be separated by a plurality of consecutively stackedinorganic layers 122, orinorganic layers 122 may be separated by a plurality of consecutively stackedorganic layers 124. - In one embodiment, multilayer coating set120 comprises an inorganic multilayer coating and at least one organic layer. A first inorganic layer having good adhesion and coefficient of thermal expansion (CTE) matching properties is deposited on a smooth polycarbonate surface. A second inorganic layer having intrinsically good gas and moisture barrier properties is deposited on the first inorganic layer. The second inorganic layer differs chemically and physically from the first inorganic layer. The adhesion and CTE matching properties of the first inorganic layer also serve to increase the barrier performance of the second inorganic layer. A polymeric organic layer is next deposited on top of the second inorganic layer. The polymeric organic layer acts as a smoothing layer and also protects the first and second inorganic coatings from chemical attack during processing. A third inorganic layer having good adhesion and CTE matching properties is then deposited on top of the organic layer. Finally, a fourth inorganic layer having intrinsically good gas and moisture barrier properties is deposited on top of the third inorganic layer. The fourth inorganic layer differs chemically and physically from the third inorganic layer. The barrier properties of the fourth inorganic layer are enhanced by adhesion and CTE matching properties of the third inorganic layer. In addition to simultaneously optimizing barrier and adhesion performance, multilayer coating set 120 may be designed to simultaneously meet demands on thermal, mechanical, dimensional, and optical performance.
- Multilayer coating set120 is transparent to light in the visible portion of the spectrum. In one embodiment, multilayer coating set 120 has a transmission of at least about 85% and a Taber haze value of less than about 5% after 1000 cycles.
- Multilayer coating set120 additionally provides a barrier for base 110 against chemical attack during processing. Multilayer coating set 120 may include at least one chemically resistant layer that is resistant to attack by at least one of alkali solutions (non-limiting examples include KOH and NaOH), acids (non-limiting examples include HBr, HCl, and HNO3), and organic solvents, such as but not limited to xylene, NMP, acetone, and the like.
- Multilayer coating set120 is also thermally stable up to at least a glass transition temperature of base 110. When, for example, multilayer coating set 120 is disposed on a polycarbonate substrate having a glass transition temperature of about 250° C., multilayer coating set 120 is thermally stable up to at least about 250° C. In addition, multilayer coating set 100 is mechanically flexible; i.e., multilayer coating set 120 can be bent around a radius of about 1 inch (2.54 cm) without exhibiting a substantial degradation in overall performance as a barrier against moisture, gas, and chemical attack.
- Each of the at least one
inorganic layer 122 may comprise at least one of silicon, a metal oxide, a metal nitride, and combinations thereof, wherein the metal is one of indium, tin, zinc, titanium, and aluminum. Non-limiting examples of metal nitrides and metal oxides that may comprise the at least oneinorganic layer 122 include indium zinc oxide (IZO), indium tin oxide (ITO), silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum oxynitride, zinc oxide, indium oxide, tin oxide, cadmium tin oxide, cadmium oxide, and magnesium oxide. - The at least one
inorganic layer 122 may, in one embodiment, be deposited on either base material 110 ororganic layer 124 by vacuum deposition techniques known in the art. Such vacuum deposition techniques include physical vapor deposition or plasma deposition methods. Plasma based deposition methods are particularly preferred, as they typically permit deposition of the at least oneinorganic layer 122 at low substrate temperatures. The deposition of the at least oneinorganic layer 122 by other techniques, such as thermal chemical vapor deposition (CVD), requires substrate temperatures that are higher than those at which plastic substrates are thermally stable. Plasma deposition methods that may be used to deposit the at least oneinorganic layer 122 include, but are not limited to, plasma enhanced chemical vapor deposition, expanding thermal plasma, microwave plasma, inductively coupled plasma, and high density plasma chemical vapor deposition. Physical vapor deposition methods that may be used to deposit the at least oneinorganic layer 122 include, but are not limited to, sputtering, laser ablation, cathodic arc deposition, and electron beam evaporation. The above-referenced plasma and physical vapor deposition techniques may be used either alone or in combination with each other. - The at least one
inorganic layer 122 serves as at least one of a radiation absorbent layer, a moisture barrier layer, an oxygen barrier layer, an electrically conductive layer, an ant-reflective layer, and combinations thereof. In one embodiment, the at least oneinorganic layer 122 serves as a moisture barrier layer having a water vapor transmission rate of less than 0.1 g/m2-day at 100% relative humidity and 25° C. The at least oneinorganic layer 122 may also serve as an oxygen barrier layer, which, in one embodiment, has an oxygen transmission rate of less than 0.1 cc/m2 -day for oxygen diffusion in a 21% oxygen atmosphere at 25° C. - Each of the at least one
organic layer 124 comprises at least one of a parylene, an acrylic, a siloxane, xylene, an alkene, styrene, an organosilane, an organosilazane, an organosilicone, and the like. The at least oneorganic layer 124 includes at least one of an adhesion layer, a stress relief layer, a conformal layer, a chemically resistant layer, an abrasion resistant layer, and combinations thereof. - The at least one
organic layer 124 may be deposited on either base material 110 orinorganic layer 122 by vacuum deposition techniques known in the art. Such vacuum deposition techniques include physical vapor deposition or plasma deposition methods.Organic layer 124 may also be deposited using polymer monolithic layer (also referred to hereinafter as “PML”) deposition methods that are known in the art. One such PML method includes the steps of: flash evaporation of at least one radiation-curable monomer, such as, but not limited to, acrylic monomers, vinyl monomers, epoxy monomers, and the like; condensing the at least one radiation-curable monomer on one of base material 110, the at least oneinorganic layer 122, or anotherorganic layer 124; and radiation cross-linking the at least one radiation-curable monomer by irradiation by one of at lest one electron beam or ultraviolet radiation to form the at least oneorganic layer 124. PML deposition is carried out in a vacuum and thus produces organic layers having fewer defects, such as pinholes, due to dust than deposition methods such as spin coating, meniscus coating, dip coating, and extrusion coating, that are performed under atmospheric conditions organic coating techniques. PML methods that may be used to deposit the at least oneorganic layer 124 are described in U.S. Pat. No. 4,954,371, by Angelo Yializis, entitled “Flash Evaporation of Monomer Fluids,” the contents of which are incorporated herein by reference in their entirety. Plasma deposition methods that may be used to deposit the at least oneorganic layer 124 include, but are not limited to: plasma enhanced chemical vapor deposition; expanding thermal plasma, described in U.S. Pat. No. 4,871,580, by Daniel C. Scham and Gerardus M. W. Kroesen, entitled “Method of Treating Surfaces of Substrates with the Aid of a Plasma,” the contents of which are incorporated herein by reference in their entirety; microwave plasma; inductively coupled plasma; and high density plasma chemical vapor deposition. Among the materials that can be deposited by physical vapor deposition are fluorocarbons and hydrocarbons. Physical vapor deposition methods that may be used to deposit the at least oneorganic layer 124 include, but are not limited to, sputtering, laser ablation, and electron beam evaporation. The above-referenced deposition techniques may be used either alone or in combination with each other. - Multilayer coating set120 has a thickness in the range from about 0.05micron to about 50 microns. In one embodiment, the thickness of multilayer coating set 120 is in the range from about 0.1 micron to about 10 microns. The thickness of the individual layers in multilayer coating set 120 must be balanced to optimize performance of individual layers while maximizing the multilayer adhesion and flexibility of
multilayer coating set 120. The thickness of the individual layers also depends in part on the function of and the material comprising the individual layer. For example, an ultraviolet absorbing titanium oxide may have a thickness of about 0.2 micron. An inorganic barrier layer may have a thickness ranging from about 20 nm to about 200 nm. PML chemical barrier layers or smoothing/bond layers have thicknesses in a range from about 0.1 micron to about 4 microns. - One example of an electro-optical device100 of the present invention is a liquid crystal (LCD) display. A LCD display typically includes an
active layer 140 comprising a liquid crystal suspension sandwiched between two LCD substrate structures. Two such LCD substrate structures are shown in FIGS. 2 and 3. In FIG. 2,substrate structure 202 comprises apolycarbonate substrate 210, an inner multi layer coating set 220, and an outermultilayer coating set 230. - In FIG. 2, inner multilayer coating set220 is disposed between
substrate 210 andactive portion 140, and comprises an inorganic moisture andoxygen barrier layer 226, an organicchemical barrier layer 224, and a transparent conductiveinorganic layer 222. Inorganic moisture andoxygen barrier layer 226 may be deposited by sputtering and, in one embodiment, has a thickness ranging from about 20 nm to about 200 nm and comprises indium tin oxide (ITO). Alternatively, other inorganic oxides, nitrides, or oxinitrides, such as, but not limited to, silicon oxides, nitrides, and oxynitrides, and aluminum oxides, nitrides, and oxynitrides may be used to form inorganic moisture andoxygen barrier layer 226. Organicchemical barrier layer 224, which is deposited by PML processing, provides resistance against chemical attack by most chemicals commonly used in display manufacturing. Organicchemical barrier layer 224 has a thickness ranging from about 0.1 micron to about 4 microns. Conductiveinorganic layer 226 may be deposited by sputtering and, in one embodiment, has a thickness of about 125 nm and comprises indium tin oxide (ITO). Inner multilayer coating set 220 may optionally include an organic smoothing/bond layer 228 having a thickness ranging from about 0.1 micron to about 4 microns. Outer multilayer coating set 230 comprises inorganic moisture andoxygen barrier layer 232 and organicchemical barrier layer 234, each comprising the same material as the corresponding inorganic moisture andoxygen barrier layer 224 and organicchemical barrier layer 224, respectively. -
LCD substrate structure 202 is prepared in an apparatus having a vacuum chamber that can be pumped down to pressures below 10−4 torr, and, preferably, less than 10−6 torr. The vacuum chamber contains at least one sputtering deposition station and at least one of a flash evaporator and an electron beam system.Polycarbonate substrate 210 is placed within the vacuum chamber, which is then evacuated to a pressure below 10−4 torr and, preferably, less than 10−6 torr. In one embodiment,substrate 210 contacts a chilled drum that can be rotated to movepolycarbonate substrate 210 from one deposition station to another. - An outer surface of
polycarbonate substrate 210 is first treated with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species. Outer inorganic moisture andoxygen barrier layer 232 is first deposited on the outer surface of thepolycarbonate substrate 210 through a sputtering process. Using the PML process, outer organicchemical barrier layer 234 is then deposited directly onto the outer surface of outer inorganic moisture andoxygen barrier layer 232 to complete outermultilayer coating set 230. - Inner multilayer coating set220 is then prepared by first treating an inner surface of
polycarbonate substrate 210 with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species. Inner inorganic moisture andoxygen barrier layer 226 is first deposited on the outer surface of thepolycarbonate substrate 210 through a sputtering process. Using the PML process, inner organicchemical barrier layer 224 is then deposited directly onto the outer surface of inner inorganic moisture andoxygen barrier layer 226. Conductiveinorganic layer 222, typically comprising indium oxide doped with 2-15% tin, is then deposited directly onto inner organicchemical barrier layer 224 using a sputtering process to complete innermultilayer coating set 220. - FIG. 3 is a schematic representation of a second
LCD substrate structure 302. In addition to inner inorganic moisture andoxygen barrier layer 226, inner organicchemical barrier layer 224, and conductiveinorganic layer 222, inner multilayer coating set 320 further includes an inner organic smoothing/bond layer 228 disposed betweensubstrate 210 and inner inorganic moisture andoxygen barrier layer 226. Outer multilayer coating set 330 also includes an outer organic smoothing/bond layer 236 disposed betweensubstrate 210 and outer inorganic moisture andoxygen barrier layer 232, and an outer organicchemical barrier layer 234 disposed on an outer surface of outer inorganic moisture andoxygen barrier layer 232. Inner and outer organic smoothing/bond layers substrate 210. Each of outer and inner organic smoothing/bond layers -
LCD substrate structure 302 is prepared in the same apparatus as that used to prepareLCD substrate structure 202. An outer surface ofpolycarbonate substrate 210 is first treated with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species. Outer organic bonding/smoothing layer 236 is then deposited on an outer surface ofpolycarbonate substrate 210 using a PML process. Outer inorganic moisture andoxygen barrier layer 232 is then deposited on outer organic bonding/smoothing layer 236 using a sputtering process. Using the PML process, outer organicchemical barrier layer 234 is then deposited directly onto the outer surface of outer inorganic moisture andoxygen barrier layer 232 to complete outermultilayer coating set 330. - Inner multilayer coating set320 is then prepared by first treating an inner surface of
polycarbonate substrate 210 with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species. Inner organic bonding/smoothing layer 228 is then deposited on an outer surface ofpolycarbonate substrate 210 using a PML process. Next, inner inorganic moisture andoxygen barrier layer 226 is deposited on inner organic bonding/smoothing layer 236 using a sputtering process. Using the PML process, inner organicchemical barrier layer 224 is then deposited directly onto the outer surface of inner inorganic moisture andoxygen barrier layer 226. Conductiveinorganic layer 222, typically comprising indium oxide doped with between about 2 weight percent and about 15 weight percent tin, is then deposited directly onto inner organicchemical barrier layer 224 using a sputtering process to complete innermultilayer coating set 320. - Another aspect of the invention is to provide a multilayer coating set for an electro-optical device. The multilayer coating set comprises at least one inorganic layer and at least one organic layer adjacent to the at least one inorganic layer. The multilayer coating set is transparent, mechanically flexible, and thermally stable. The multilayer coating set provides a barrier to moisture and oxygen for the electro-optical device, resistance to chemical attack for the electro-optical device and a base or substrate material during fabrication of the electro-optical device. The multilayer coating set120, which is transparent and comprises at least one inorganic layer and at least one organic layer, is described in detail hereinabove.
- The multiple layers of multilayer coating set120 are deposited such that the various barrier properties, chemical resistance, mechanical, adhesion, electronically conductive, optical, thermal stability, and thermal expansion requirements can be independently optimized. Because the various layers are deposited using vacuum deposition techniques, the individual layers of multilayer coating set 120 have fewer defects than corresponding coatings that are produced using either wet or atmospheric coating processes.
- While typical embodiments have been set forth for the purpose of illustration, the foregoing description should not be deemed to be a limitation on the scope of the invention. In one embodiment, for example, the barrier layer may have a hybrid inorganic/organic composition comprising either be multilayer barrier of discrete organic and inorganic layers or a single barrier layer having a graded composition that gradually transitions from a pure inorganic layer to a pure organic layer. Accordingly, various modifications, adaptations, and alternatives may occur to one skilled in the art without departing from the spirit and scope of the present invention.
Claims (64)
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Cited By (87)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040238846A1 (en) * | 2003-05-30 | 2004-12-02 | Georg Wittmann | Organic electronic device |
US20050007015A1 (en) * | 2003-05-29 | 2005-01-13 | Seiichi Yokoyama | Method of manufacturing laminated structure, laminated structure, display device and display unit |
US20050118428A1 (en) * | 2002-08-07 | 2005-06-02 | Matthias Bicker | Rapid process for the production of multilayer barrier layers |
US20050133781A1 (en) * | 2003-12-19 | 2005-06-23 | General Electric Company | Multilayer device and method of making |
US20060121639A1 (en) * | 2004-11-10 | 2006-06-08 | California Institute Of Technology | Microfabricated devices for wireless data and power transfer |
US20060271129A1 (en) * | 2005-05-27 | 2006-11-30 | California Institute Of Technology | Magnetic material-containing microfabricated devices for wireless data and power transfer |
US20080006819A1 (en) * | 2006-06-19 | 2008-01-10 | 3M Innovative Properties Company | Moisture barrier coatings for organic light emitting diode devices |
WO2008075254A1 (en) * | 2006-12-19 | 2008-06-26 | Koninklijke Philips Electronics N.V. | Package for protecting a device from ambient substances |
US20080182101A1 (en) * | 2003-05-16 | 2008-07-31 | Peter Francis Carcia | Barrier films for plastic substrates fabricated by atomic layer deposition |
US20090121333A1 (en) * | 2006-11-30 | 2009-05-14 | Bruce Gardiner Aitken | Flexible substrates having a thin-film barrier |
US20090169770A1 (en) * | 2005-07-20 | 2009-07-02 | 3M Innovative Properties Company | Moisture barrier coatings |
US20090238998A1 (en) * | 2008-03-18 | 2009-09-24 | Applied Materials, Inc. | Coaxial microwave assisted deposition and etch systems |
US20090287733A1 (en) * | 2008-05-15 | 2009-11-19 | Chanan Steinhart | Method for preparing prepress image data |
US7648925B2 (en) | 2003-04-11 | 2010-01-19 | Vitex Systems, Inc. | Multilayer barrier stacks and methods of making multilayer barrier stacks |
EP2180762A1 (en) * | 2007-07-31 | 2010-04-28 | Sumitomo Chemical Company, Limited | Organic electroluminescent device and method for manufacturing the same |
US7722929B2 (en) | 2005-08-18 | 2010-05-25 | Corning Incorporated | Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device |
US7727601B2 (en) | 1999-10-25 | 2010-06-01 | Vitex Systems, Inc. | Method for edge sealing barrier films |
US20100149272A1 (en) * | 2008-12-17 | 2010-06-17 | Robert Lee Cornell | Uv-curable coatings and methods for applying uv-curable coatings using thermal micro-fluid ejection heads |
US7767498B2 (en) | 2005-08-25 | 2010-08-03 | Vitex Systems, Inc. | Encapsulated devices and method of making |
US7829147B2 (en) | 2005-08-18 | 2010-11-09 | Corning Incorporated | Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device |
EP2267818A1 (en) | 2009-06-22 | 2010-12-29 | Novaled AG | Organic lighting device |
US20110038131A1 (en) * | 2009-08-12 | 2011-02-17 | Medos International Sarl | Packaging with active protection layer |
US20110038130A1 (en) * | 2009-08-12 | 2011-02-17 | Medos International Sarl | Plasma enhanced polymer ultra-thin multi-layer packaging |
US20110236674A1 (en) * | 2010-03-24 | 2011-09-29 | Satoshi Aiba | Barrier laminate, method of manufacturing the laminate, gas barrier film and device |
US20110291544A1 (en) * | 2010-05-31 | 2011-12-01 | Industrial Technology Research Institute | Gas barrier substrate, package of organic electro-luminenscent device and packaging method thereof |
CN102275350A (en) * | 2011-05-10 | 2011-12-14 | 上海交通大学 | Namometer SiO2-doped polymer laminated film and preparation method thereof |
WO2012010361A1 (en) * | 2010-07-22 | 2012-01-26 | Evonik Röhm Gmbh | Transparent, weather-resistant barrier film having an improved barrier effect and scratch resistance properties |
WO2012010360A1 (en) * | 2010-07-22 | 2012-01-26 | Evonik Röhm Gmbh | Weather-resistant backing films |
US20120045631A1 (en) * | 2008-02-20 | 2012-02-23 | Applied Materials, Inc. | Index modified coating on polymer substrate |
US20120077002A1 (en) * | 2010-09-29 | 2012-03-29 | Hon Hai Precision Industry Co., Ltd. | Coated article and method for making the same |
US20120258295A1 (en) * | 2011-04-08 | 2012-10-11 | Saint-Gobain Performance Plastics Corporation | Multilayer component for the encapsulation of a sensitive element |
CN102781659A (en) * | 2010-03-05 | 2012-11-14 | 旭硝子株式会社 | Layered product and process for producing same |
US8313819B2 (en) | 2009-08-12 | 2012-11-20 | Medos International S.A.R.L. | Ultra-thin multi-layer packaging |
US20120301634A1 (en) * | 2010-01-27 | 2012-11-29 | Shuji Nakamura | Gas barrier film and process for producing the same, and device using the same |
US20120313508A1 (en) * | 2011-06-10 | 2012-12-13 | Samsung Mobile Display Co., Ltd. | Organic light emitting diode display |
JPWO2011027619A1 (en) * | 2009-09-02 | 2013-02-04 | コニカミノルタホールディングス株式会社 | Barrier film and manufacturing method thereof |
EP2637231A1 (en) * | 2012-03-05 | 2013-09-11 | Samsung Display Co., Ltd. | Method of preparing organic light-emitting device |
EP2637230A1 (en) * | 2012-03-05 | 2013-09-11 | Samsung Display Co., Ltd. | Method of preparing organic light-emitting device, substrate for transiting inorganic layer, and organic light-emitting device |
US20130292736A1 (en) * | 2010-09-08 | 2013-11-07 | Osram Opto Semiconductors Gmbh | Thin-film encapsulation, optoelectronic semiconductor body comprising a thin-film encapsulation and method for producing a thin-film encapsulation |
US8590338B2 (en) | 2009-12-31 | 2013-11-26 | Samsung Mobile Display Co., Ltd. | Evaporator with internal restriction |
US20140065739A1 (en) * | 2012-09-04 | 2014-03-06 | Jrjyan Jerry Chen | Method for hybrid encapsulation of an organic light emitting diode |
US8808457B2 (en) | 2002-04-15 | 2014-08-19 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
EP2528082A3 (en) * | 2008-02-21 | 2014-11-05 | FUJIFILM Manufacturing Europe B.V. | Plasma treatment apparatus with an atmospheric pressure glow discharge electrode configuration |
US8900366B2 (en) | 2002-04-15 | 2014-12-02 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
US8955217B2 (en) | 1999-10-25 | 2015-02-17 | Samsung Display Co., Ltd. | Method for edge sealing barrier films |
US20150084012A1 (en) * | 2013-09-26 | 2015-03-26 | Samsung Display Co., Ltd. | Organic light emitting display apparatus and method of manufacturing the same |
US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
US9050622B2 (en) | 2005-08-18 | 2015-06-09 | Corning Incorporated | Method for inhibiting oxygen and moisture degradation of a device and the resulting device |
US20150162506A1 (en) * | 2013-12-10 | 2015-06-11 | In Hyung Lee | Method of manufacturing light emitting device |
CN104733647A (en) * | 2015-03-10 | 2015-06-24 | 京东方科技集团股份有限公司 | Thin film packaging method, thin film packaging structure and display device |
CN104752631A (en) * | 2013-12-26 | 2015-07-01 | 昆山工研院新型平板显示技术中心有限公司 | Organic light-emitting device packaging structure and packaging method |
US20150219799A1 (en) * | 2012-10-17 | 2015-08-06 | Fujifilm Corporation | Optical member with antireflection film, and method of manufacturing the same |
US9142797B2 (en) | 2010-05-31 | 2015-09-22 | Industrial Technology Research Institute | Gas barrier substrate and organic electro-luminescent device |
US20150297801A1 (en) * | 2012-06-07 | 2015-10-22 | Medos International Sarl | Three dimensional packaging for medical implants |
US9184410B2 (en) | 2008-12-22 | 2015-11-10 | Samsung Display Co., Ltd. | Encapsulated white OLEDs having enhanced optical output |
CN105118933A (en) * | 2015-09-02 | 2015-12-02 | 深圳市华星光电技术有限公司 | Thin film encapsulation method and organic light emitting device |
US9257673B2 (en) | 2011-06-10 | 2016-02-09 | Samsung Display Co., Ltd. | Organic light emitting diode display |
US20160049610A1 (en) * | 2013-03-25 | 2016-02-18 | Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk On-Derzoek Tno | Nanocomposite, method to produce the same, a barrier structure for an electronic device and an oled comprising the same |
US9285489B2 (en) | 2013-08-29 | 2016-03-15 | General Electric Company | Organic x-ray detector assembly and method of manufacturing same |
EP2882587A4 (en) * | 2012-08-08 | 2016-04-13 | 3M Innovative Properties Co | Barrier film constructions and methods of making same |
JP2016066627A (en) * | 2010-11-24 | 2016-04-28 | 株式会社半導体エネルギー研究所 | Light-emitting device |
US9337446B2 (en) | 2008-12-22 | 2016-05-10 | Samsung Display Co., Ltd. | Encapsulated RGB OLEDs having enhanced optical output |
US9447492B2 (en) | 2011-06-03 | 2016-09-20 | Graham J. Hubbard | Conductive anti-reflective films |
WO2016163215A1 (en) * | 2015-04-09 | 2016-10-13 | コニカミノルタ株式会社 | Organic electroluminescent element |
US9472740B2 (en) | 2014-07-28 | 2016-10-18 | Samsung Electronics Co., Ltd. | Light emitting diode package and lighting device using the same |
US9502686B2 (en) * | 2014-07-03 | 2016-11-22 | Applied Materials, Inc. | Fluorine-containing polymerized HMDSO applications for OLED thin film encapsulation |
GB2539231A (en) * | 2015-06-10 | 2016-12-14 | Semblant Ltd | Coated electrical assembly |
US20160365540A1 (en) * | 2015-06-12 | 2016-12-15 | Everdisplay Optronics (Shanghai) Limited | Thin film package structure, manufacturing method and organic light emitting apparatus having the structure |
US20160365523A1 (en) * | 2015-06-12 | 2016-12-15 | Japan Display Inc. | Display device |
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US9806132B2 (en) | 2013-11-22 | 2017-10-31 | General Electric Company | Organic X-ray detector with barrier layer |
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US9831468B2 (en) | 2013-02-14 | 2017-11-28 | Samsung Display Co., Ltd. | Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same |
WO2018037083A1 (en) * | 2016-08-26 | 2018-03-01 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing an optoelectronic component |
US9917133B2 (en) | 2013-12-12 | 2018-03-13 | General Electric Company | Optoelectronic device with flexible substrate |
US9935152B2 (en) | 2012-12-27 | 2018-04-03 | General Electric Company | X-ray detector having improved noise performance |
WO2018098875A1 (en) * | 2016-12-02 | 2018-06-07 | 武汉华星光电技术有限公司 | Method for packaging organic semiconductor device |
WO2018109459A1 (en) * | 2016-12-13 | 2018-06-21 | Semblant Limited | Protective coating |
CN110061149A (en) * | 2019-04-28 | 2019-07-26 | 福州大学 | A kind of flexible OLED devices film encapsulation method |
WO2019144518A1 (en) * | 2018-01-24 | 2019-08-01 | 武汉华星光电半导体显示技术有限公司 | Thin-film encapsulation method for oled device, and oled device |
US20190353805A1 (en) * | 2018-05-21 | 2019-11-21 | General Electric Company | Digital x-ray detector having polymeric substrate |
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US10732131B2 (en) | 2014-03-13 | 2020-08-04 | General Electric Company | Curved digital X-ray detector for weld inspection |
US10950821B2 (en) | 2007-01-26 | 2021-03-16 | Samsung Display Co., Ltd. | Method of encapsulating an environmentally sensitive device |
CN112736204A (en) * | 2020-12-30 | 2021-04-30 | 山东永聚医药科技有限公司 | Metal-induced amorphous crystallization transformation ultrahigh barrier film and preparation method thereof |
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Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009000450A1 (en) | 2009-01-28 | 2010-07-29 | Evonik Degussa Gmbh | Transparent, weather-resistant barrier film, production by lamination, extrusion lamination or extrusion coating |
US9007674B2 (en) | 2011-09-30 | 2015-04-14 | View, Inc. | Defect-mitigation layers in electrochromic devices |
US11599003B2 (en) | 2011-09-30 | 2023-03-07 | View, Inc. | Fabrication of electrochromic devices |
DE102009003225A1 (en) | 2009-05-19 | 2010-11-25 | Evonik Degussa Gmbh | Transparent, weather-resistant barrier film, production by lamination, extrusion lamination or extrusion coating |
WO2011006018A2 (en) | 2009-07-08 | 2011-01-13 | Plasmasi, Inc. | Apparatus and method for plasma processing |
WO2012094162A2 (en) * | 2011-01-03 | 2012-07-12 | Tufts University | Three dimensional metamaterials from conformal polymer coating layers |
US8765232B2 (en) | 2011-01-10 | 2014-07-01 | Plasmasi, Inc. | Apparatus and method for dielectric deposition |
KR101844557B1 (en) * | 2011-02-08 | 2018-04-02 | 어플라이드 머티어리얼스, 인코포레이티드 | Method for hybrid encapsulation of an organic light emitting diode |
KR101842586B1 (en) * | 2011-04-05 | 2018-03-28 | 삼성디스플레이 주식회사 | Organic light emitting diode display and manufacturing method thereof |
KR101873476B1 (en) | 2011-04-11 | 2018-07-03 | 삼성디스플레이 주식회사 | Organic light emitting diode display and manufacturing method thereof |
TWI473317B (en) * | 2011-11-17 | 2015-02-11 | Au Optronics Corp | Flexible active device array substrate and organic electroluminescent device having the same |
US10802371B2 (en) | 2011-12-12 | 2020-10-13 | View, Inc. | Thin-film devices and fabrication |
CN102593245B (en) * | 2012-02-13 | 2014-07-23 | 常州大学 | Method for preparing high efficient low cost crystalline silicon solar cell |
US9299956B2 (en) | 2012-06-13 | 2016-03-29 | Aixtron, Inc. | Method for deposition of high-performance coatings and encapsulated electronic devices |
US10526708B2 (en) | 2012-06-19 | 2020-01-07 | Aixtron Se | Methods for forming thin protective and optical layers on substrates |
CN104103764A (en) * | 2013-04-09 | 2014-10-15 | 海洋王照明科技股份有限公司 | Organic light-emitting display and manufacturing method thereof |
CN104103769A (en) * | 2013-04-09 | 2014-10-15 | 海洋王照明科技股份有限公司 | Organic light-emitting display and manufacturing method thereof |
CN104103767A (en) * | 2013-04-09 | 2014-10-15 | 海洋王照明科技股份有限公司 | Organic light-emitting display and preparation method thereof |
CN104103773A (en) * | 2013-04-09 | 2014-10-15 | 海洋王照明科技股份有限公司 | Organic light-emitting display and manufacturing method thereof |
CN106486601A (en) * | 2013-04-30 | 2017-03-08 | 成均馆大学校产学协力团 | Multilayer encapsulation thin film |
CN104183705A (en) * | 2013-05-20 | 2014-12-03 | 海洋王照明科技股份有限公司 | Organic electroluminescent device and preparation method thereof |
JP6040140B2 (en) * | 2013-12-06 | 2016-12-07 | 双葉電子工業株式会社 | Organic electroluminescence device |
US10361290B2 (en) * | 2014-03-14 | 2019-07-23 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device comprising adding oxygen to buffer film and insulating film |
US10712454B2 (en) | 2014-07-25 | 2020-07-14 | General Electric Company | X-ray detectors supported on a substrate having a metal barrier |
US9513380B2 (en) | 2014-07-25 | 2016-12-06 | General Electric Company | X-ray detectors supported on a substrate having a surrounding metal barrier |
KR101562966B1 (en) * | 2014-08-27 | 2015-10-23 | 코닝정밀소재 주식회사 | Substrate for display unit |
KR101606172B1 (en) * | 2014-09-05 | 2016-03-24 | 코닝정밀소재 주식회사 | Substrate for display unit |
US11054711B2 (en) | 2014-11-25 | 2021-07-06 | View, Inc. | Electromagnetic-shielding electrochromic windows |
CN107533267A (en) * | 2015-03-20 | 2018-01-02 | 唯景公司 | Switch low defect electrochromic more quickly |
CN106158901B (en) * | 2015-03-24 | 2020-06-23 | 上海和辉光电有限公司 | Hybrid film, preparation method thereof and flexible OLED display |
TW202239275A (en) * | 2016-11-11 | 2022-10-01 | 日商京瓷股份有限公司 | Package for mounting electrical element, array package and electrical device |
KR102466811B1 (en) * | 2017-12-12 | 2022-11-11 | 엘지디스플레이 주식회사 | Flexible digital x-ray detector panel and the manufacturing method thereof |
CN110047959B (en) * | 2019-04-26 | 2021-08-06 | 圣晖莱南京能源科技有限公司 | Packaging structure, packaging tool and packaging method of flexible solar thin-film battery |
KR102120897B1 (en) * | 2019-06-27 | 2020-06-10 | 삼성디스플레이 주식회사 | Organic light emitting device having thin film encapsulation |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US568166A (en) * | 1896-09-22 | Island | ||
US4871580A (en) * | 1987-06-30 | 1989-10-03 | Faculty Of Physics Eidhoven University Of Technology | Method of treating surfaces of substrates with the aid of a plasma |
US4954371A (en) * | 1986-06-23 | 1990-09-04 | Spectrum Control, Inc. | Flash evaporation of monomer fluids |
US6136444A (en) * | 1995-02-02 | 2000-10-24 | Teijin Limited | Transparent conductive sheet |
US6413645B1 (en) * | 2000-04-20 | 2002-07-02 | Battelle Memorial Institute | Ultrabarrier substrates |
US6743524B2 (en) * | 2002-05-23 | 2004-06-01 | General Electric Company | Barrier layer for an article and method of making said barrier layer by expanding thermal plasma |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5607789A (en) | 1995-01-23 | 1997-03-04 | Duracell Inc. | Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same |
US6593690B1 (en) * | 1999-09-03 | 2003-07-15 | 3M Innovative Properties Company | Large area organic electronic devices having conducting polymer buffer layers and methods of making same |
US6492026B1 (en) | 2000-04-20 | 2002-12-10 | Battelle Memorial Institute | Smoothing and barrier layers on high Tg substrates |
EP1423991A4 (en) * | 2001-07-27 | 2009-06-17 | Univ Ohio State | Methods for fabricating polymer light emitting devices by lamination |
-
2003
- 2003-05-15 US US10/439,506 patent/US20040229051A1/en not_active Abandoned
-
2004
- 2004-05-14 WO PCT/US2004/015018 patent/WO2005029601A2/en active Application Filing
-
2009
- 2009-01-12 US US12/352,386 patent/US8236424B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US568166A (en) * | 1896-09-22 | Island | ||
US4954371A (en) * | 1986-06-23 | 1990-09-04 | Spectrum Control, Inc. | Flash evaporation of monomer fluids |
US4871580A (en) * | 1987-06-30 | 1989-10-03 | Faculty Of Physics Eidhoven University Of Technology | Method of treating surfaces of substrates with the aid of a plasma |
US6136444A (en) * | 1995-02-02 | 2000-10-24 | Teijin Limited | Transparent conductive sheet |
US6413645B1 (en) * | 2000-04-20 | 2002-07-02 | Battelle Memorial Institute | Ultrabarrier substrates |
US6743524B2 (en) * | 2002-05-23 | 2004-06-01 | General Electric Company | Barrier layer for an article and method of making said barrier layer by expanding thermal plasma |
Cited By (160)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7727601B2 (en) | 1999-10-25 | 2010-06-01 | Vitex Systems, Inc. | Method for edge sealing barrier films |
US8955217B2 (en) | 1999-10-25 | 2015-02-17 | Samsung Display Co., Ltd. | Method for edge sealing barrier films |
US9839940B2 (en) | 2002-04-15 | 2017-12-12 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
US8900366B2 (en) | 2002-04-15 | 2014-12-02 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
US8808457B2 (en) | 2002-04-15 | 2014-08-19 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
US20050118428A1 (en) * | 2002-08-07 | 2005-06-02 | Matthias Bicker | Rapid process for the production of multilayer barrier layers |
US7399500B2 (en) * | 2002-08-07 | 2008-07-15 | Schott Ag | Rapid process for the production of multilayer barrier layers |
US7648925B2 (en) | 2003-04-11 | 2010-01-19 | Vitex Systems, Inc. | Multilayer barrier stacks and methods of making multilayer barrier stacks |
US8445937B2 (en) * | 2003-05-16 | 2013-05-21 | E I Du Pont De Nemours And Company | Barrier films for plastic substrates fabricated by atomic layer deposition |
US20080182101A1 (en) * | 2003-05-16 | 2008-07-31 | Peter Francis Carcia | Barrier films for plastic substrates fabricated by atomic layer deposition |
US20050007015A1 (en) * | 2003-05-29 | 2005-01-13 | Seiichi Yokoyama | Method of manufacturing laminated structure, laminated structure, display device and display unit |
US20040238846A1 (en) * | 2003-05-30 | 2004-12-02 | Georg Wittmann | Organic electronic device |
US7595105B2 (en) * | 2003-12-19 | 2009-09-29 | General Electric Company | Multilayer device and method of making |
US20070069233A1 (en) * | 2003-12-19 | 2007-03-29 | Min Yan | Multilayer device and method of making |
US20050133781A1 (en) * | 2003-12-19 | 2005-06-23 | General Electric Company | Multilayer device and method of making |
US7075103B2 (en) * | 2003-12-19 | 2006-07-11 | General Electric Company | Multilayer device and method of making |
US7684868B2 (en) | 2004-11-10 | 2010-03-23 | California Institute Of Technology | Microfabricated devices for wireless data and power transfer |
US20060121639A1 (en) * | 2004-11-10 | 2006-06-08 | California Institute Of Technology | Microfabricated devices for wireless data and power transfer |
US20060271129A1 (en) * | 2005-05-27 | 2006-11-30 | California Institute Of Technology | Magnetic material-containing microfabricated devices for wireless data and power transfer |
US8112157B2 (en) | 2005-05-27 | 2012-02-07 | California Institute Of Technology | Magnetic material-containing microfabricated devices for wireless data and power transfer |
US20090186209A1 (en) * | 2005-07-20 | 2009-07-23 | 3M Innovative Properties Company | Moisture barrier coatings |
US20090169770A1 (en) * | 2005-07-20 | 2009-07-02 | 3M Innovative Properties Company | Moisture barrier coatings |
US20110143129A1 (en) * | 2005-07-20 | 2011-06-16 | 3M Innovative Properties Company | Moisture barrier coatings |
US8034452B2 (en) | 2005-07-20 | 2011-10-11 | 3M Innovative Properties Company | Moisture barrier coatings |
US9050622B2 (en) | 2005-08-18 | 2015-06-09 | Corning Incorporated | Method for inhibiting oxygen and moisture degradation of a device and the resulting device |
US8435604B2 (en) | 2005-08-18 | 2013-05-07 | Corning Incorporated | Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device |
US7722929B2 (en) | 2005-08-18 | 2010-05-25 | Corning Incorporated | Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device |
US8304990B2 (en) | 2005-08-18 | 2012-11-06 | Corning Incorporated | Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device |
US7829147B2 (en) | 2005-08-18 | 2010-11-09 | Corning Incorporated | Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device |
US7767498B2 (en) | 2005-08-25 | 2010-08-03 | Vitex Systems, Inc. | Encapsulated devices and method of making |
US20080006819A1 (en) * | 2006-06-19 | 2008-01-10 | 3M Innovative Properties Company | Moisture barrier coatings for organic light emitting diode devices |
US20090252894A1 (en) * | 2006-06-19 | 2009-10-08 | 3M Innovative Properties Company | Moisture barrier coatings for organic light emitting diode devices |
US8435605B2 (en) | 2006-11-30 | 2013-05-07 | Corning Incorporated | Flexible substrates having a thin-film barrier |
US20090121333A1 (en) * | 2006-11-30 | 2009-05-14 | Bruce Gardiner Aitken | Flexible substrates having a thin-film barrier |
US8115326B2 (en) | 2006-11-30 | 2012-02-14 | Corning Incorporated | Flexible substrates having a thin-film barrier |
WO2008075254A1 (en) * | 2006-12-19 | 2008-06-26 | Koninklijke Philips Electronics N.V. | Package for protecting a device from ambient substances |
US8395177B2 (en) | 2006-12-19 | 2013-03-12 | Koninklijke Philips Electronics N.V. | Package for protecting a device from ambient substances |
US20100025723A1 (en) * | 2006-12-19 | 2010-02-04 | Koninklijke Philips Electronics N.V. | Package for protecting a device from ambient substances |
US10950821B2 (en) | 2007-01-26 | 2021-03-16 | Samsung Display Co., Ltd. | Method of encapsulating an environmentally sensitive device |
US20100244073A1 (en) * | 2007-07-31 | 2010-09-30 | Sumitomo Chemical Company, Limited | Organic electroluminescent device and method for manufacturing the same |
EP2180762A4 (en) * | 2007-07-31 | 2011-01-19 | Sumitomo Chemical Co | Organic electroluminescent device and method for manufacturing the same |
EP2180762A1 (en) * | 2007-07-31 | 2010-04-28 | Sumitomo Chemical Company, Limited | Organic electroluminescent device and method for manufacturing the same |
US20120045631A1 (en) * | 2008-02-20 | 2012-02-23 | Applied Materials, Inc. | Index modified coating on polymer substrate |
US8679594B2 (en) * | 2008-02-20 | 2014-03-25 | Applied Materials, Inc. | Index modified coating on polymer substrate |
EP2528082A3 (en) * | 2008-02-21 | 2014-11-05 | FUJIFILM Manufacturing Europe B.V. | Plasma treatment apparatus with an atmospheric pressure glow discharge electrode configuration |
US20090238998A1 (en) * | 2008-03-18 | 2009-09-24 | Applied Materials, Inc. | Coaxial microwave assisted deposition and etch systems |
US20090287733A1 (en) * | 2008-05-15 | 2009-11-19 | Chanan Steinhart | Method for preparing prepress image data |
US20100149272A1 (en) * | 2008-12-17 | 2010-06-17 | Robert Lee Cornell | Uv-curable coatings and methods for applying uv-curable coatings using thermal micro-fluid ejection heads |
US8191987B2 (en) * | 2008-12-17 | 2012-06-05 | Lexmark International, Inc. | UV-curable coatings and methods for applying UV-curable coatings using thermal micro-fluid ejection heads |
US9184410B2 (en) | 2008-12-22 | 2015-11-10 | Samsung Display Co., Ltd. | Encapsulated white OLEDs having enhanced optical output |
US9337446B2 (en) | 2008-12-22 | 2016-05-10 | Samsung Display Co., Ltd. | Encapsulated RGB OLEDs having enhanced optical output |
US9362530B2 (en) | 2008-12-22 | 2016-06-07 | Samsung Display Co., Ltd. | Encapsulated white OLEDs having enhanced optical output |
EP2267818A1 (en) | 2009-06-22 | 2010-12-29 | Novaled AG | Organic lighting device |
US8361591B2 (en) | 2009-08-12 | 2013-01-29 | Medos International Sarl | Packaging with active protection layer |
US20110038131A1 (en) * | 2009-08-12 | 2011-02-17 | Medos International Sarl | Packaging with active protection layer |
US8313819B2 (en) | 2009-08-12 | 2012-11-20 | Medos International S.A.R.L. | Ultra-thin multi-layer packaging |
US8313811B2 (en) | 2009-08-12 | 2012-11-20 | Medos International S.A.R.L. | Plasma enhanced polymer ultra-thin multi-layer packaging |
US20110038130A1 (en) * | 2009-08-12 | 2011-02-17 | Medos International Sarl | Plasma enhanced polymer ultra-thin multi-layer packaging |
JPWO2011027619A1 (en) * | 2009-09-02 | 2013-02-04 | コニカミノルタホールディングス株式会社 | Barrier film and manufacturing method thereof |
US8904819B2 (en) | 2009-12-31 | 2014-12-09 | Samsung Display Co., Ltd. | Evaporator with internal restriction |
US8590338B2 (en) | 2009-12-31 | 2013-11-26 | Samsung Mobile Display Co., Ltd. | Evaporator with internal restriction |
US20120301634A1 (en) * | 2010-01-27 | 2012-11-29 | Shuji Nakamura | Gas barrier film and process for producing the same, and device using the same |
EP2543508A1 (en) * | 2010-03-05 | 2013-01-09 | Asahi Glass Company, Limited | Layered product and process for producing same |
CN102781659A (en) * | 2010-03-05 | 2012-11-14 | 旭硝子株式会社 | Layered product and process for producing same |
EP2543508A4 (en) * | 2010-03-05 | 2013-09-25 | Asahi Glass Co Ltd | Layered product and process for producing same |
US20110236674A1 (en) * | 2010-03-24 | 2011-09-29 | Satoshi Aiba | Barrier laminate, method of manufacturing the laminate, gas barrier film and device |
US8864540B2 (en) | 2010-05-31 | 2014-10-21 | Industrial Technology Research Institute | Fabricating method of gas barrier substrate, organic electro-luminescent device and packaging method thereof |
US20110291544A1 (en) * | 2010-05-31 | 2011-12-01 | Industrial Technology Research Institute | Gas barrier substrate, package of organic electro-luminenscent device and packaging method thereof |
US9142797B2 (en) | 2010-05-31 | 2015-09-22 | Industrial Technology Research Institute | Gas barrier substrate and organic electro-luminescent device |
WO2012010361A1 (en) * | 2010-07-22 | 2012-01-26 | Evonik Röhm Gmbh | Transparent, weather-resistant barrier film having an improved barrier effect and scratch resistance properties |
WO2012010360A1 (en) * | 2010-07-22 | 2012-01-26 | Evonik Röhm Gmbh | Weather-resistant backing films |
US20130292736A1 (en) * | 2010-09-08 | 2013-11-07 | Osram Opto Semiconductors Gmbh | Thin-film encapsulation, optoelectronic semiconductor body comprising a thin-film encapsulation and method for producing a thin-film encapsulation |
US8896019B2 (en) * | 2010-09-08 | 2014-11-25 | Osram Opto Semiconductors Gmbh | Thin-film encapsulation, optoelectronic semiconductor body comprising a thin-film encapsulation and method for producing a thin-film encapsulation |
US20120077002A1 (en) * | 2010-09-29 | 2012-03-29 | Hon Hai Precision Industry Co., Ltd. | Coated article and method for making the same |
JP2016066627A (en) * | 2010-11-24 | 2016-04-28 | 株式会社半導体エネルギー研究所 | Light-emitting device |
US10036832B2 (en) * | 2011-04-08 | 2018-07-31 | Saint-Gobain Performance Plastics Corporation | Multilayer component for the encapsulation of a sensitive element |
US20120258295A1 (en) * | 2011-04-08 | 2012-10-11 | Saint-Gobain Performance Plastics Corporation | Multilayer component for the encapsulation of a sensitive element |
CN102275350A (en) * | 2011-05-10 | 2011-12-14 | 上海交通大学 | Namometer SiO2-doped polymer laminated film and preparation method thereof |
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US9447492B2 (en) | 2011-06-03 | 2016-09-20 | Graham J. Hubbard | Conductive anti-reflective films |
US8786186B2 (en) * | 2011-06-10 | 2014-07-22 | Samsung Display Co., Ltd. | Organic light emitting diode display with adhesive layer |
US10636971B2 (en) | 2011-06-10 | 2020-04-28 | Samsung Display Co., Ltd. | Organic light emitting diode display |
US11600778B2 (en) | 2011-06-10 | 2023-03-07 | Samsung Display Co., Ltd. | Organic light emitting diode display |
US11349077B2 (en) | 2011-06-10 | 2022-05-31 | Samsung Display Co., Ltd. | Organic light emitting diode display |
US9806261B2 (en) | 2011-06-10 | 2017-10-31 | Samsung Display Co., Ltd. | Organic light emitting diode display |
US20120313508A1 (en) * | 2011-06-10 | 2012-12-13 | Samsung Mobile Display Co., Ltd. | Organic light emitting diode display |
US10461255B2 (en) | 2011-06-10 | 2019-10-29 | Samsung Display Co., Ltd. | Organic light emitting diode display |
US9257673B2 (en) | 2011-06-10 | 2016-02-09 | Samsung Display Co., Ltd. | Organic light emitting diode display |
EP2637231A1 (en) * | 2012-03-05 | 2013-09-11 | Samsung Display Co., Ltd. | Method of preparing organic light-emitting device |
CN103311458A (en) * | 2012-03-05 | 2013-09-18 | 三星显示有限公司 | Method of preparing organic light-emitting device |
KR101503401B1 (en) * | 2012-03-05 | 2015-03-17 | 삼성디스플레이 주식회사 | Method for preparing organic light emitting device |
US8791452B2 (en) | 2012-03-05 | 2014-07-29 | Samsung Display Co., Ltd. | Method of preparing organic light-emitting device, substrate for transiting inorganic layer, and organic light-emitting device |
JP2017063064A (en) * | 2012-03-05 | 2017-03-30 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | Method for manufacturing organic light-emitting device, substrate for inorganic film transfer, and organic light-emitting device |
US9343703B2 (en) | 2012-03-05 | 2016-05-17 | Samsung Display Co., Ltd. | Organic light-emitting device having low temperature viscosity transition (LVT) inorganic material |
EP2682998A1 (en) * | 2012-03-05 | 2014-01-08 | Samsung Display Co., Ltd. | Method of preparing organic light-emitting device, substrate for transiting inorganic layer, and organic light-emitting device |
EP2637230A1 (en) * | 2012-03-05 | 2013-09-11 | Samsung Display Co., Ltd. | Method of preparing organic light-emitting device, substrate for transiting inorganic layer, and organic light-emitting device |
US10279085B2 (en) * | 2012-06-07 | 2019-05-07 | Coat-X Sa | Three dimensional packaging for medical implants |
US20150297801A1 (en) * | 2012-06-07 | 2015-10-22 | Medos International Sarl | Three dimensional packaging for medical implants |
EP2882587A4 (en) * | 2012-08-08 | 2016-04-13 | 3M Innovative Properties Co | Barrier film constructions and methods of making same |
US10947618B2 (en) | 2012-08-08 | 2021-03-16 | 3M Innovative Properties Company | Barrier film constructions and methods of making same |
US20140065739A1 (en) * | 2012-09-04 | 2014-03-06 | Jrjyan Jerry Chen | Method for hybrid encapsulation of an organic light emitting diode |
CN104584256A (en) * | 2012-09-04 | 2015-04-29 | 应用材料公司 | Method for hybrid encapsulation of an organic light emitting diode |
US9397318B2 (en) * | 2012-09-04 | 2016-07-19 | Applied Materials, Inc. | Method for hybrid encapsulation of an organic light emitting diode |
CN107665959A (en) * | 2012-09-04 | 2018-02-06 | 应用材料公司 | Method for forming encapsulated layer on Organic Light Emitting Diode substrate |
US20160308166A1 (en) * | 2012-09-04 | 2016-10-20 | Applied Materials, Inc. | Method for hybrid encapsulation of an organic light emitting diode |
US9741966B2 (en) * | 2012-09-04 | 2017-08-22 | Applied Materials, Inc. | Method for hybrid encapsulation of an organic light emitting diode |
US20150219799A1 (en) * | 2012-10-17 | 2015-08-06 | Fujifilm Corporation | Optical member with antireflection film, and method of manufacturing the same |
US9935152B2 (en) | 2012-12-27 | 2018-04-03 | General Electric Company | X-ray detector having improved noise performance |
US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
EP2768040A3 (en) * | 2013-02-14 | 2017-11-08 | Samsung Display Co., Ltd. | Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same |
US10944076B2 (en) | 2013-02-14 | 2021-03-09 | Samsung Display Co., Ltd. | Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same |
EP4092775A3 (en) * | 2013-02-14 | 2023-03-15 | Samsung Display Co., Ltd. | Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same |
US10297791B2 (en) | 2013-02-14 | 2019-05-21 | Samsung Display Co., Ltd. | Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same |
US11489142B2 (en) | 2013-02-14 | 2022-11-01 | Samsung Display Co., Ltd. | Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same |
US11245098B2 (en) | 2013-02-14 | 2022-02-08 | Samsung Display Co., Ltd. | Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same |
US11778854B2 (en) | 2013-02-14 | 2023-10-03 | Samsung Display Co., Ltd. | Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same |
US9831468B2 (en) | 2013-02-14 | 2017-11-28 | Samsung Display Co., Ltd. | Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same |
US10644264B2 (en) | 2013-02-14 | 2020-05-05 | Samsung Display Co., Ltd. | Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same |
US10128464B2 (en) | 2013-02-14 | 2018-11-13 | Samsung Display Co., Ltd. | Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same |
US20160049610A1 (en) * | 2013-03-25 | 2016-02-18 | Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk On-Derzoek Tno | Nanocomposite, method to produce the same, a barrier structure for an electronic device and an oled comprising the same |
US9285489B2 (en) | 2013-08-29 | 2016-03-15 | General Electric Company | Organic x-ray detector assembly and method of manufacturing same |
US20150084012A1 (en) * | 2013-09-26 | 2015-03-26 | Samsung Display Co., Ltd. | Organic light emitting display apparatus and method of manufacturing the same |
US9806132B2 (en) | 2013-11-22 | 2017-10-31 | General Electric Company | Organic X-ray detector with barrier layer |
US9490401B2 (en) * | 2013-12-10 | 2016-11-08 | Samsung Electronics Co., Ltd. | Method of manufacturing light emitting device |
US9293666B2 (en) * | 2013-12-10 | 2016-03-22 | Samsung Electronics Co., Ltd. | Method of manufacturing light emitting device |
US20150162506A1 (en) * | 2013-12-10 | 2015-06-11 | In Hyung Lee | Method of manufacturing light emitting device |
US9917133B2 (en) | 2013-12-12 | 2018-03-13 | General Electric Company | Optoelectronic device with flexible substrate |
CN104752631A (en) * | 2013-12-26 | 2015-07-01 | 昆山工研院新型平板显示技术中心有限公司 | Organic light-emitting device packaging structure and packaging method |
US10732131B2 (en) | 2014-03-13 | 2020-08-04 | General Electric Company | Curved digital X-ray detector for weld inspection |
US9502686B2 (en) * | 2014-07-03 | 2016-11-22 | Applied Materials, Inc. | Fluorine-containing polymerized HMDSO applications for OLED thin film encapsulation |
US10224507B2 (en) | 2014-07-03 | 2019-03-05 | Applied Materials, Inc. | Fluorine-containing polymerized HMDSO applications for OLED thin film encapsulation |
US11063094B2 (en) | 2014-07-25 | 2021-07-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
US11800747B2 (en) | 2014-07-25 | 2023-10-24 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
JP2020073947A (en) * | 2014-07-25 | 2020-05-14 | 株式会社半導体エネルギー研究所 | Display apparatus |
US9472740B2 (en) | 2014-07-28 | 2016-10-18 | Samsung Electronics Co., Ltd. | Light emitting diode package and lighting device using the same |
CN104733647A (en) * | 2015-03-10 | 2015-06-24 | 京东方科技集团股份有限公司 | Thin film packaging method, thin film packaging structure and display device |
US9761833B2 (en) | 2015-03-10 | 2017-09-12 | Boe Technology Group Co., Ltd. | Packaging method with films, film package structure and display device |
WO2016163215A1 (en) * | 2015-04-09 | 2016-10-13 | コニカミノルタ株式会社 | Organic electroluminescent element |
GB2539231B (en) * | 2015-06-10 | 2017-08-23 | Semblant Ltd | Coated electrical assembly |
GB2539231A (en) * | 2015-06-10 | 2016-12-14 | Semblant Ltd | Coated electrical assembly |
RU2717842C2 (en) * | 2015-06-10 | 2020-03-26 | Семблант Лимитед | Coated electrical assembly |
WO2016198870A1 (en) * | 2015-06-10 | 2016-12-15 | Semblant Limited | Coated electrical assembly |
US20160365523A1 (en) * | 2015-06-12 | 2016-12-15 | Japan Display Inc. | Display device |
US9831450B2 (en) * | 2015-06-12 | 2017-11-28 | Japan Display Inc. | Display device |
US20160365540A1 (en) * | 2015-06-12 | 2016-12-15 | Everdisplay Optronics (Shanghai) Limited | Thin film package structure, manufacturing method and organic light emitting apparatus having the structure |
CN105118933A (en) * | 2015-09-02 | 2015-12-02 | 深圳市华星光电技术有限公司 | Thin film encapsulation method and organic light emitting device |
WO2018037083A1 (en) * | 2016-08-26 | 2018-03-01 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing an optoelectronic component |
US10840413B2 (en) | 2016-08-26 | 2020-11-17 | Osram Oled Gmbh | Optoelectronic device and method of producing an optoelectronic device |
WO2018098875A1 (en) * | 2016-12-02 | 2018-06-07 | 武汉华星光电技术有限公司 | Method for packaging organic semiconductor device |
US10205123B2 (en) | 2016-12-02 | 2019-02-12 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Packaging method for organic semiconductor device |
CN110268810A (en) * | 2016-12-13 | 2019-09-20 | 赛姆布兰特有限公司 | Protective coating |
US11786930B2 (en) | 2016-12-13 | 2023-10-17 | Hzo, Inc. | Protective coating |
WO2018109459A1 (en) * | 2016-12-13 | 2018-06-21 | Semblant Limited | Protective coating |
CN106784385A (en) * | 2017-01-11 | 2017-05-31 | 瑞声科技(南京)有限公司 | Oled device |
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US20190353805A1 (en) * | 2018-05-21 | 2019-11-21 | General Electric Company | Digital x-ray detector having polymeric substrate |
CN110061149A (en) * | 2019-04-28 | 2019-07-26 | 福州大学 | A kind of flexible OLED devices film encapsulation method |
CN112736204A (en) * | 2020-12-30 | 2021-04-30 | 山东永聚医药科技有限公司 | Metal-induced amorphous crystallization transformation ultrahigh barrier film and preparation method thereof |
CN114178551A (en) * | 2021-11-29 | 2022-03-15 | 华中科技大学 | Hot forging die with conformal water channel and arc fuse additive manufacturing method thereof |
CN114806328A (en) * | 2022-03-28 | 2022-07-29 | 武汉华工正源光子技术有限公司 | Protective coating for optical module and preparation method thereof |
Also Published As
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US20090202743A1 (en) | 2009-08-13 |
WO2005029601A2 (en) | 2005-03-31 |
US8236424B2 (en) | 2012-08-07 |
WO2005029601A3 (en) | 2005-12-15 |
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