US20040229051A1 - Multilayer coating package on flexible substrates for electro-optical devices - Google Patents

Multilayer coating package on flexible substrates for electro-optical devices Download PDF

Info

Publication number
US20040229051A1
US20040229051A1 US10/439,506 US43950603A US2004229051A1 US 20040229051 A1 US20040229051 A1 US 20040229051A1 US 43950603 A US43950603 A US 43950603A US 2004229051 A1 US2004229051 A1 US 2004229051A1
Authority
US
United States
Prior art keywords
layer
electro
optical device
multilayer coating
coating set
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/439,506
Inventor
Marc Schaepkens
Gregory GILLETTE
Charles Iacovangelo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Priority to US10/439,506 priority Critical patent/US20040229051A1/en
Assigned to GENERAL ELECTRIC COMPANY reassignment GENERAL ELECTRIC COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GILLETTE, GREGORY RONALD, IACOVANGELO, CHARLES DOMINIC, SCHAEPKENS, MARC (NMN)
Priority to PCT/US2004/015018 priority patent/WO2005029601A2/en
Publication of US20040229051A1 publication Critical patent/US20040229051A1/en
Priority to US11/828,543 priority patent/US8691371B2/en
Assigned to CITIBANK, N.A., AS COLLATERAL AGENT reassignment CITIBANK, N.A., AS COLLATERAL AGENT SECURITY AGREEMENT Assignors: SABIC INNOVATIVE PLASTICS IP B.V.
Priority to US12/352,386 priority patent/US8236424B2/en
Assigned to SABIC INNOVATIVE PLASTICS IP B.V. reassignment SABIC INNOVATIVE PLASTICS IP B.V. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: CITIBANK, N.A.
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0203Containers; Encapsulations, e.g. encapsulation of photodiodes
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/021Cleaning or etching treatments
    • C23C14/022Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0216Coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • H01L31/03926Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • H10K50/8445Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/311Flexible OLED
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31507Of polycarbonate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31663As siloxane, silicone or silane
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31855Of addition polymer from unsaturated monomers

Definitions

  • the invention relates to an electro-optical device having a multilayer coating set. More particularly, the invention relates to a multilayer coating set that provides a moisture and gas barrier for the electro-optical device and enhances resistance of the electro-optical device to chemical attack.
  • Electro-optical devices such as electrochromic devices, liquid crystal displays (also referred to hereinafter as “LCDs”), organic light emitting diodes (also referred to hereinafter as “OLEDs”), light emitting diodes (also referred to hereinafter as “LEDs”), photovoltaic devices, radiation detectors, and the like, comprise an electronically or optically active portion—e.g., liquid crystals, a light emitter, or radiation detector—that is frequently disposed on a substrate.
  • an electronically or optically active portion e.g., liquid crystals, a light emitter, or radiation detector—that is frequently disposed on a substrate.
  • a rigid electro-optical device is either preferable or acceptable, either glass or silicon is generally used as the substrate.
  • a polymeric film may serve as the substrate.
  • Various single layer coatings have been used to modify the barrier properties of polymeric substrates for use in flexible electro-optical devices.
  • a single layer coating tends to provide a less than optimum barrier against moisture and oxygen.
  • a single coating cannot meet all of the other requirements, such as mechanical, adhesion, electronically conductive, optical, thermal stability, chemical resistance, and thermal expansion criteria for such electro-optical devices.
  • Multilayer coating composites comprising individually deposited layers have been used to provide the desired moisture and gas barrier properties for such electro-optical devices.
  • such multilayer composites do not typically meet all of the other mechanical, adhesion, electric conductivity, optical absorption and/or reflectivity, thermal stability, and thermal expansion requirements for such electro-optical devices. The necessary combination of vacuum and wet processes complicates the manufacture of electro-optical devices that include such multilayer composites.
  • a multilayer coating set that provides a moisture and oxygen barrier and resistance to chemical attack during processing while simultaneously meeting the mechanical, adhesion, electronically conductive, optical, thermal stability, and thermal expansion requirements for electro-optical devices, such as LCDs, OLEDs, LEDs, photovoltaic devices, radiation detectors, and the like.
  • electro-optical devices such as LCDs, OLEDs, LEDs, photovoltaic devices, radiation detectors, and the like.
  • an electro-optical device having such a multilayer coating set.
  • the present invention meets these and other needs by providing a transparent multilayer coating set comprising a moisture and oxygen barrier, a chemically resistant layer, and a transparent conductive coating.
  • the invention also provides an electro-optical device comprising a polymeric substrate, a multilayer coating set, and an active portion.
  • the multilayer coating set may be deposited using a single vacuum coating chamber.
  • one aspect of the invention is to provide an electro-optical device.
  • the electro-optical device comprises: at least one base, the at least one base comprising a flexible polymeric material; and a multilayer coating set disposed on at least one surface of the base.
  • the multilayer coating set comprises at least one organic layer and at least one inorganic layer.
  • the base and multilayer coating set are transparent.
  • the multilayer coating set provides a barrier to moisture and oxygen and provides chemical resistance.
  • the multilayer coating set is also mechanically flexible and thermally stable up to a glass transition temperature of the base.
  • a second aspect of the invention is to provide a multilayer coating set for an electro-optical device.
  • the multilayer coating set comprises: at least one inorganic layer; and at least one organic layer adjacent to said at least one inorganic layer.
  • the multilayer coating set is transparent and is mechanically flexible and thermally stable.
  • the multilayer coating set provides a barrier to moisture and oxygen for said electro-optical device, resistance to chemical attack for the electro-optical device and the base material during fabrication of the electro-optical device.
  • a third aspect of the invention is to provide an electro-optical device.
  • the electro-optical device comprises at least one substrate.
  • the substrate comprises: at least one base, wherein the at least one base comprising a flexible polymeric material; and a multilayer coating set comprising at least one inorganic layer and at least one organic layer adjacent to the at least one inorganic layer.
  • the multilayer coating set is deposited on said at least one surface by a vacuum deposition technique.
  • the multilayer coating set is transparent and is mechanically flexible and thermally stable up to a glass transition temperature of the base.
  • the multilayer coating set provides a barrier to moisture and oxygen for said electro-optical device and resistance for the electro-optical device to chemical attack.
  • FIG. 1 is a schematic representation of an electro-optical device of the present invention
  • FIG. 2 is a schematic representation of a first LCD substrate structure of the present invention.
  • FIG. 3 is a schematic representation of a second LCD substrate structure of the present invention.
  • Electro-optical devices such as, but not limited to, electrochromic devices, liquid crystal displays (also referred to hereinafter as “LCDs”), organic light emitting diode (also referred to hereinafter as “OLEDs”), light emitting diodes (also referred to hereinafter as “LEDs”), photovoltaic devices, radiation detectors, and the like, comprise an electronically or optically active portion—e.g., liquid crystals, a light emitter, or radiation detector—that is frequently disposed on a substrate.
  • the electro-optical device must include at least one barrier coating.
  • Electro-optical device 100 comprises at least one base 110 , and at least one multilayer coating set 120 disposed on a surface of base 110 . Both base 110 and multilayer coating set 120 are transparent to visible light. Base 110 and multilayer coating set may additionally be transparent in at least one of the infrared (IR) and ultraviolet (UV) regions of the spectrum. Multilayer coating set 120 acts as a barrier to prevent the exposure of active portion 140 of electro-optical device 100 to moisture and oxygen.
  • IR infrared
  • UV ultraviolet
  • multilayer coating set 120 acts as a barrier to chemical attack of the underlying polymeric base 110 during processing or manufacture of electro-optical device 100 .
  • Multilayer coating set 120 is also mechanically flexible. The flexibility of multilayer coating set 120 allows it to adhere and conform to the shape of base 110 during processing and in the final configuration of electro-optical device 100 .
  • Base 110 may comprise at least one of a substrate 130 and an active portion 140 of electro-optical device 100 .
  • base 110 comprises substrate 130 , which is formed from a flexible polymeric material.
  • the flexible polymeric material comprises a polycarbonate.
  • active portion 140 is encapsulated by a first multilayer coating set 120 , which provides a barrier between substrate 130 and active portion 140 , and a second multilayer coating set 120 , which provides an additional barrier for the remainder of active portion 140 .
  • Multilayer coating set 120 may be disposed upon on at least one surface of a base material, such as, but not limited to, a base 110 or the active portion 140 of electro-optical device 100 .
  • Multilayer coating set 120 comprises at least one inorganic layer 122 and at least one organic layer 124 .
  • the multilayer coating set 100 may include a plurality of inorganic layers 122 and organic layers 124 that are alternately arranged.
  • organic layers 124 may be separated by a plurality of consecutively stacked inorganic layers 122
  • inorganic layers 122 may be separated by a plurality of consecutively stacked organic layers 124 .
  • multilayer coating set 120 comprises an inorganic multilayer coating and at least one organic layer.
  • a first inorganic layer having good adhesion and coefficient of thermal expansion (CTE) matching properties is deposited on a smooth polycarbonate surface.
  • a second inorganic layer having intrinsically good gas and moisture barrier properties is deposited on the first inorganic layer.
  • the second inorganic layer differs chemically and physically from the first inorganic layer.
  • the adhesion and CTE matching properties of the first inorganic layer also serve to increase the barrier performance of the second inorganic layer.
  • a polymeric organic layer is next deposited on top of the second inorganic layer. The polymeric organic layer acts as a smoothing layer and also protects the first and second inorganic coatings from chemical attack during processing.
  • a third inorganic layer having good adhesion and CTE matching properties is then deposited on top of the organic layer.
  • a fourth inorganic layer having intrinsically good gas and moisture barrier properties is deposited on top of the third inorganic layer.
  • the fourth inorganic layer differs chemically and physically from the third inorganic layer.
  • the barrier properties of the fourth inorganic layer are enhanced by adhesion and CTE matching properties of the third inorganic layer.
  • multilayer coating set 120 may be designed to simultaneously meet demands on thermal, mechanical, dimensional, and optical performance.
  • Multilayer coating set 120 is transparent to light in the visible portion of the spectrum. In one embodiment, multilayer coating set 120 has a transmission of at least about 85% and a Taber haze value of less than about 5% after 1000 cycles.
  • Multilayer coating set 120 additionally provides a barrier for base 110 against chemical attack during processing.
  • Multilayer coating set 120 may include at least one chemically resistant layer that is resistant to attack by at least one of alkali solutions (non-limiting examples include KOH and NaOH), acids (non-limiting examples include HBr, HCl, and HNO 3 ), and organic solvents, such as but not limited to xylene, NMP, acetone, and the like.
  • Multilayer coating set 120 is also thermally stable up to at least a glass transition temperature of base 110 .
  • multilayer coating set 120 is thermally stable up to at least about 250° C.
  • multilayer coating set 100 is mechanically flexible; i.e., multilayer coating set 120 can be bent around a radius of about 1 inch (2.54 cm) without exhibiting a substantial degradation in overall performance as a barrier against moisture, gas, and chemical attack.
  • Each of the at least one inorganic layer 122 may comprise at least one of silicon, a metal oxide, a metal nitride, and combinations thereof, wherein the metal is one of indium, tin, zinc, titanium, and aluminum.
  • metal nitrides and metal oxides that may comprise the at least one inorganic layer 122 include indium zinc oxide (IZO), indium tin oxide (ITO), silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum oxynitride, zinc oxide, indium oxide, tin oxide, cadmium tin oxide, cadmium oxide, and magnesium oxide.
  • the at least one inorganic layer 122 may, in one embodiment, be deposited on either base material 110 or organic layer 124 by vacuum deposition techniques known in the art. Such vacuum deposition techniques include physical vapor deposition or plasma deposition methods. Plasma based deposition methods are particularly preferred, as they typically permit deposition of the at least one inorganic layer 122 at low substrate temperatures.
  • the deposition of the at least one inorganic layer 122 by other techniques, such as thermal chemical vapor deposition (CVD), requires substrate temperatures that are higher than those at which plastic substrates are thermally stable.
  • Plasma deposition methods that may be used to deposit the at least one inorganic layer 122 include, but are not limited to, plasma enhanced chemical vapor deposition, expanding thermal plasma, microwave plasma, inductively coupled plasma, and high density plasma chemical vapor deposition.
  • Physical vapor deposition methods that may be used to deposit the at least one inorganic layer 122 include, but are not limited to, sputtering, laser ablation, cathodic arc deposition, and electron beam evaporation. The above-referenced plasma and physical vapor deposition techniques may be used either alone or in combination with each other.
  • the at least one inorganic layer 122 serves as at least one of a radiation absorbent layer, a moisture barrier layer, an oxygen barrier layer, an electrically conductive layer, an ant-reflective layer, and combinations thereof.
  • the at least one inorganic layer 122 serves as a moisture barrier layer having a water vapor transmission rate of less than 0.1 g/m 2 -day at 100% relative humidity and 25° C.
  • the at least one inorganic layer 122 may also serve as an oxygen barrier layer, which, in one embodiment, has an oxygen transmission rate of less than 0.1 cc/m 2 -day for oxygen diffusion in a 21% oxygen atmosphere at 25° C.
  • Each of the at least one organic layer 124 comprises at least one of a parylene, an acrylic, a siloxane, xylene, an alkene, styrene, an organosilane, an organosilazane, an organosilicone, and the like.
  • the at least one organic layer 124 includes at least one of an adhesion layer, a stress relief layer, a conformal layer, a chemically resistant layer, an abrasion resistant layer, and combinations thereof.
  • the at least one organic layer 124 may be deposited on either base material 110 or inorganic layer 122 by vacuum deposition techniques known in the art. Such vacuum deposition techniques include physical vapor deposition or plasma deposition methods. Organic layer 124 may also be deposited using polymer monolithic layer (also referred to hereinafter as “PML”) deposition methods that are known in the art.
  • PV polymer monolithic layer
  • One such PML method includes the steps of: flash evaporation of at least one radiation-curable monomer, such as, but not limited to, acrylic monomers, vinyl monomers, epoxy monomers, and the like; condensing the at least one radiation-curable monomer on one of base material 110 , the at least one inorganic layer 122 , or another organic layer 124 ; and radiation cross-linking the at least one radiation-curable monomer by irradiation by one of at lest one electron beam or ultraviolet radiation to form the at least one organic layer 124 .
  • at least one radiation-curable monomer such as, but not limited to, acrylic monomers, vinyl monomers, epoxy monomers, and the like
  • PML deposition is carried out in a vacuum and thus produces organic layers having fewer defects, such as pinholes, due to dust than deposition methods such as spin coating, meniscus coating, dip coating, and extrusion coating, that are performed under atmospheric conditions organic coating techniques.
  • PML methods that may be used to deposit the at least one organic layer 124 are described in U.S. Pat. No. 4,954,371, by Angelo Yializis, entitled “Flash Evaporation of Monomer Fluids,” the contents of which are incorporated herein by reference in their entirety.
  • Plasma deposition methods that may be used to deposit the at least one organic layer 124 include, but are not limited to: plasma enhanced chemical vapor deposition; expanding thermal plasma, described in U.S. Pat. No. 4,871,580, by Daniel C.
  • Multilayer coating set 120 has a thickness in the range from about 0.05micron to about 50 microns. In one embodiment, the thickness of multilayer coating set 120 is in the range from about 0.1 micron to about 10 microns.
  • the thickness of the individual layers in multilayer coating set 120 must be balanced to optimize performance of individual layers while maximizing the multilayer adhesion and flexibility of multilayer coating set 120 .
  • the thickness of the individual layers also depends in part on the function of and the material comprising the individual layer. For example, an ultraviolet absorbing titanium oxide may have a thickness of about 0.2 micron.
  • An inorganic barrier layer may have a thickness ranging from about 20 nm to about 200 nm.
  • PML chemical barrier layers or smoothing/bond layers have thicknesses in a range from about 0.1 micron to about 4 microns.
  • a LCD display typically includes an active layer 140 comprising a liquid crystal suspension sandwiched between two LCD substrate structures. Two such LCD substrate structures are shown in FIGS. 2 and 3.
  • substrate structure 202 comprises a polycarbonate substrate 210 , an inner multi layer coating set 220 , and an outer multilayer coating set 230 .
  • inner multilayer coating set 220 is disposed between substrate 210 and active portion 140 , and comprises an inorganic moisture and oxygen barrier layer 226 , an organic chemical barrier layer 224 , and a transparent conductive inorganic layer 222 .
  • Inorganic moisture and oxygen barrier layer 226 may be deposited by sputtering and, in one embodiment, has a thickness ranging from about 20 nm to about 200 nm and comprises indium tin oxide (ITO).
  • inorganic oxides, nitrides, or oxinitrides such as, but not limited to, silicon oxides, nitrides, and oxynitrides, and aluminum oxides, nitrides, and oxynitrides may be used to form inorganic moisture and oxygen barrier layer 226 .
  • Organic chemical barrier layer 224 which is deposited by PML processing, provides resistance against chemical attack by most chemicals commonly used in display manufacturing.
  • Organic chemical barrier layer 224 has a thickness ranging from about 0.1 micron to about 4 microns.
  • Conductive inorganic layer 226 may be deposited by sputtering and, in one embodiment, has a thickness of about 125 nm and comprises indium tin oxide (ITO).
  • Inner multilayer coating set 220 may optionally include an organic smoothing/bond layer 228 having a thickness ranging from about 0.1 micron to about 4 microns.
  • Outer multilayer coating set 230 comprises inorganic moisture and oxygen barrier layer 232 and organic chemical barrier layer 234 , each comprising the same material as the corresponding inorganic moisture and oxygen barrier layer 224 and organic chemical barrier layer 224 , respectively.
  • LCD substrate structure 202 is prepared in an apparatus having a vacuum chamber that can be pumped down to pressures below 10 ⁇ 4 torr, and, preferably, less than 10 ⁇ 6 torr.
  • the vacuum chamber contains at least one sputtering deposition station and at least one of a flash evaporator and an electron beam system.
  • Polycarbonate substrate 210 is placed within the vacuum chamber, which is then evacuated to a pressure below 10 ⁇ 4 torr and, preferably, less than 10 ⁇ 6 torr.
  • substrate 210 contacts a chilled drum that can be rotated to move polycarbonate substrate 210 from one deposition station to another.
  • An outer surface of polycarbonate substrate 210 is first treated with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species.
  • Outer inorganic moisture and oxygen barrier layer 232 is first deposited on the outer surface of the polycarbonate substrate 210 through a sputtering process. Using the PML process, outer organic chemical barrier layer 234 is then deposited directly onto the outer surface of outer inorganic moisture and oxygen barrier layer 232 to complete outer multilayer coating set 230 .
  • Inner multilayer coating set 220 is then prepared by first treating an inner surface of polycarbonate substrate 210 with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species.
  • Inner inorganic moisture and oxygen barrier layer 226 is first deposited on the outer surface of the polycarbonate substrate 210 through a sputtering process.
  • inner organic chemical barrier layer 224 is then deposited directly onto the outer surface of inner inorganic moisture and oxygen barrier layer 226 .
  • Conductive inorganic layer 222 typically comprising indium oxide doped with 2-15% tin, is then deposited directly onto inner organic chemical barrier layer 224 using a sputtering process to complete inner multilayer coating set 220 .
  • FIG. 3 is a schematic representation of a second LCD substrate structure 302 .
  • inner multilayer coating set 320 further includes an inner organic smoothing/bond layer 228 disposed between substrate 210 and inner inorganic moisture and oxygen barrier layer 226 .
  • Outer multilayer coating set 330 also includes an outer organic smoothing/bond layer 236 disposed between substrate 210 and outer inorganic moisture and oxygen barrier layer 232 , and an outer organic chemical barrier layer 234 disposed on an outer surface of outer inorganic moisture and oxygen barrier layer 232 .
  • Inner and outer organic smoothing/bond layers 228 , 236 promotes bonding and adhesion of both inner multilayer coating set 220 and outer multilayer coating set 220 , respectively, to 210 substrate and decrease the degree of roughness of the interface between the multilayer coating sets and substrate 210 .
  • Each of outer and inner organic smoothing/bond layers 228 , 236 is deposited by PML processing and has a thickness ranging from about 0.1 micron to about 4 microns.
  • LCD substrate structure 302 is prepared in the same apparatus as that used to prepare LCD substrate structure 202 .
  • An outer surface of polycarbonate substrate 210 is first treated with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species.
  • Outer organic bonding/smoothing layer 236 is then deposited on an outer surface of polycarbonate substrate 210 using a PML process.
  • Outer inorganic moisture and oxygen barrier layer 232 is then deposited on outer organic bonding/smoothing layer 236 using a sputtering process.
  • outer organic chemical barrier layer 234 is then deposited directly onto the outer surface of outer inorganic moisture and oxygen barrier layer 232 to complete outer multilayer coating set 330 .
  • Inner multilayer coating set 320 is then prepared by first treating an inner surface of polycarbonate substrate 210 with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species.
  • Inner organic bonding/smoothing layer 228 is then deposited on an outer surface of polycarbonate substrate 210 using a PML process.
  • inner inorganic moisture and oxygen barrier layer 226 is deposited on inner organic bonding/smoothing layer 236 using a sputtering process.
  • inner organic chemical barrier layer 224 is then deposited directly onto the outer surface of inner inorganic moisture and oxygen barrier layer 226 .
  • Conductive inorganic layer 222 is then deposited directly onto inner organic chemical barrier layer 224 using a sputtering process to complete inner multilayer coating set 320 .
  • Another aspect of the invention is to provide a multilayer coating set for an electro-optical device.
  • the multilayer coating set comprises at least one inorganic layer and at least one organic layer adjacent to the at least one inorganic layer.
  • the multilayer coating set is transparent, mechanically flexible, and thermally stable.
  • the multilayer coating set provides a barrier to moisture and oxygen for the electro-optical device, resistance to chemical attack for the electro-optical device and a base or substrate material during fabrication of the electro-optical device.
  • the multilayer coating set 120 which is transparent and comprises at least one inorganic layer and at least one organic layer, is described in detail hereinabove.
  • the multiple layers of multilayer coating set 120 are deposited such that the various barrier properties, chemical resistance, mechanical, adhesion, electronically conductive, optical, thermal stability, and thermal expansion requirements can be independently optimized. Because the various layers are deposited using vacuum deposition techniques, the individual layers of multilayer coating set 120 have fewer defects than corresponding coatings that are produced using either wet or atmospheric coating processes.
  • the barrier layer may have a hybrid inorganic/organic composition comprising either be multilayer barrier of discrete organic and inorganic layers or a single barrier layer having a graded composition that gradually transitions from a pure inorganic layer to a pure organic layer. Accordingly, various modifications, adaptations, and alternatives may occur to one skilled in the art without departing from the spirit and scope of the present invention.

Abstract

An electro-optical device having at least one base and a multilayer coating surface disposed on at least one surface of the base. The at least one base may comprise either an optically or electronically active portion or a flexible polymeric material. The multilayer coating set comprises at least one organic layer and at least one inorganic layer. The base and multilayer coating set are transparent. The multilayer coating set provides a barrier to moisture and oxygen and provides chemical resistance. The multilayer coating set is also mechanically flexible and thermally stable up to a glass transition temperature of the base.

Description

    BACKGROUND OF INVENTION
  • The invention relates to an electro-optical device having a multilayer coating set. More particularly, the invention relates to a multilayer coating set that provides a moisture and gas barrier for the electro-optical device and enhances resistance of the electro-optical device to chemical attack. [0001]
  • Electro-optical devices, such as electrochromic devices, liquid crystal displays (also referred to hereinafter as “LCDs”), organic light emitting diodes (also referred to hereinafter as “OLEDs”), light emitting diodes (also referred to hereinafter as “LEDs”), photovoltaic devices, radiation detectors, and the like, comprise an electronically or optically active portion—e.g., liquid crystals, a light emitter, or radiation detector—that is frequently disposed on a substrate. In those applications where a rigid electro-optical device is either preferable or acceptable, either glass or silicon is generally used as the substrate. In those applications where a flexible electro-optical device is desired, a polymeric film may serve as the substrate. However, moisture and oxygen diffuse rapidly through such polymeric film substrates, thereby causing the performance of the electro-optical devices disposed on the substrate to degrade or even fail. In addition, polymeric substrates are also subject to attack by chemicals used during processing of the electro-optical device. Finally, many electro-optical applications require a substrate that is thermally stable and transparent in at least the visible light range. [0002]
  • Various single layer coatings have been used to modify the barrier properties of polymeric substrates for use in flexible electro-optical devices. A single layer coating, however, tends to provide a less than optimum barrier against moisture and oxygen. In addition, a single coating cannot meet all of the other requirements, such as mechanical, adhesion, electronically conductive, optical, thermal stability, chemical resistance, and thermal expansion criteria for such electro-optical devices. Multilayer coating composites comprising individually deposited layers have been used to provide the desired moisture and gas barrier properties for such electro-optical devices. However, such multilayer composites do not typically meet all of the other mechanical, adhesion, electric conductivity, optical absorption and/or reflectivity, thermal stability, and thermal expansion requirements for such electro-optical devices. The necessary combination of vacuum and wet processes complicates the manufacture of electro-optical devices that include such multilayer composites. [0003]
  • Therefore, what is needed is a multilayer coating set that provides a moisture and oxygen barrier and resistance to chemical attack during processing while simultaneously meeting the mechanical, adhesion, electronically conductive, optical, thermal stability, and thermal expansion requirements for electro-optical devices, such as LCDs, OLEDs, LEDs, photovoltaic devices, radiation detectors, and the like. What is also needed is a method of depositing such a multilayer coating set on a polymeric substrate using only vacuum-based deposition techniques. Finally, what is needed is an electro-optical device having such a multilayer coating set. [0004]
  • SUMMARY OF INVENTION
  • The present invention meets these and other needs by providing a transparent multilayer coating set comprising a moisture and oxygen barrier, a chemically resistant layer, and a transparent conductive coating. The invention also provides an electro-optical device comprising a polymeric substrate, a multilayer coating set, and an active portion. The multilayer coating set may be deposited using a single vacuum coating chamber. [0005]
  • Accordingly, one aspect of the invention is to provide an electro-optical device. The electro-optical device comprises: at least one base, the at least one base comprising a flexible polymeric material; and a multilayer coating set disposed on at least one surface of the base. The multilayer coating set comprises at least one organic layer and at least one inorganic layer. The base and multilayer coating set are transparent. The multilayer coating set provides a barrier to moisture and oxygen and provides chemical resistance. The multilayer coating set is also mechanically flexible and thermally stable up to a glass transition temperature of the base. [0006]
  • A second aspect of the invention is to provide a multilayer coating set for an electro-optical device. The multilayer coating set comprises: at least one inorganic layer; and at least one organic layer adjacent to said at least one inorganic layer. The multilayer coating set is transparent and is mechanically flexible and thermally stable. The multilayer coating set provides a barrier to moisture and oxygen for said electro-optical device, resistance to chemical attack for the electro-optical device and the base material during fabrication of the electro-optical device. [0007]
  • A third aspect of the invention is to provide an electro-optical device. The electro-optical device comprises at least one substrate. The substrate comprises: at least one base, wherein the at least one base comprising a flexible polymeric material; and a multilayer coating set comprising at least one inorganic layer and at least one organic layer adjacent to the at least one inorganic layer. The multilayer coating set is deposited on said at least one surface by a vacuum deposition technique. The multilayer coating set is transparent and is mechanically flexible and thermally stable up to a glass transition temperature of the base. The multilayer coating set provides a barrier to moisture and oxygen for said electro-optical device and resistance for the electro-optical device to chemical attack. [0008]
  • These and other aspects, advantages, and salient features of the present invention will become apparent from the following detailed description, the accompanying drawings, and the appended claims.[0009]
  • BRIEF DESCRIPTION OF DRAWINGS
  • FIG. 1 is a schematic representation of an electro-optical device of the present invention; [0010]
  • FIG. 2 is a schematic representation of a first LCD substrate structure of the present invention; and [0011]
  • FIG. 3 is a schematic representation of a second LCD substrate structure of the present invention. [0012]
  • DETAILED DESCRIPTION
  • In the following description, like reference characters designate like or corresponding parts throughout the several views shown in the figures. It is also understood that terms such as “top,” “bottom,” “outward,” “inward,” and the like are words of convenience and are not to be construed as limiting terms. [0013]
  • Electro-optical devices, such as, but not limited to, electrochromic devices, liquid crystal displays (also referred to hereinafter as “LCDs”), organic light emitting diode (also referred to hereinafter as “OLEDs”), light emitting diodes (also referred to hereinafter as “LEDs”), photovoltaic devices, radiation detectors, and the like, comprise an electronically or optically active portion—e.g., liquid crystals, a light emitter, or radiation detector—that is frequently disposed on a substrate. In order to protect the active portion and the substrate from degradation due to exposure to moisture, oxygen, or corrosive chemical attack, the electro-optical device must include at least one barrier coating. [0014]
  • One aspect of the invention is to provide an electro-optical device, such as, but not limited to, LCDs, OLEDs, LEDs, photovoltaic devices, and radiation detectors. A schematic representation of such an electro-optical device is shown in FIG. 1. Electro-optical device [0015] 100 comprises at least one base 110, and at least one multilayer coating set 120 disposed on a surface of base 110. Both base 110 and multilayer coating set 120 are transparent to visible light. Base 110 and multilayer coating set may additionally be transparent in at least one of the infrared (IR) and ultraviolet (UV) regions of the spectrum. Multilayer coating set 120 acts as a barrier to prevent the exposure of active portion 140 of electro-optical device 100 to moisture and oxygen. Furthermore, multilayer coating set 120 acts as a barrier to chemical attack of the underlying polymeric base 110 during processing or manufacture of electro-optical device 100. Multilayer coating set 120 is also mechanically flexible. The flexibility of multilayer coating set 120 allows it to adhere and conform to the shape of base 110 during processing and in the final configuration of electro-optical device 100.
  • Base [0016] 110 may comprise at least one of a substrate 130 and an active portion 140 of electro-optical device 100. In one embodiment, base 110 comprises substrate 130, which is formed from a flexible polymeric material. In one particular embodiment, the flexible polymeric material comprises a polycarbonate. In another embodiment, shown in FIG. 1, active portion 140 is encapsulated by a first multilayer coating set 120, which provides a barrier between substrate 130 and active portion 140, and a second multilayer coating set 120, which provides an additional barrier for the remainder of active portion 140.
  • [0017] Multilayer coating set 120 may be disposed upon on at least one surface of a base material, such as, but not limited to, a base 110 or the active portion 140 of electro-optical device 100. Multilayer coating set 120 comprises at least one inorganic layer 122 and at least one organic layer 124. The multilayer coating set 100 may include a plurality of inorganic layers 122 and organic layers 124 that are alternately arranged. Alternatively, organic layers 124 may be separated by a plurality of consecutively stacked inorganic layers 122, or inorganic layers 122 may be separated by a plurality of consecutively stacked organic layers 124.
  • In one embodiment, multilayer coating set [0018] 120 comprises an inorganic multilayer coating and at least one organic layer. A first inorganic layer having good adhesion and coefficient of thermal expansion (CTE) matching properties is deposited on a smooth polycarbonate surface. A second inorganic layer having intrinsically good gas and moisture barrier properties is deposited on the first inorganic layer. The second inorganic layer differs chemically and physically from the first inorganic layer. The adhesion and CTE matching properties of the first inorganic layer also serve to increase the barrier performance of the second inorganic layer. A polymeric organic layer is next deposited on top of the second inorganic layer. The polymeric organic layer acts as a smoothing layer and also protects the first and second inorganic coatings from chemical attack during processing. A third inorganic layer having good adhesion and CTE matching properties is then deposited on top of the organic layer. Finally, a fourth inorganic layer having intrinsically good gas and moisture barrier properties is deposited on top of the third inorganic layer. The fourth inorganic layer differs chemically and physically from the third inorganic layer. The barrier properties of the fourth inorganic layer are enhanced by adhesion and CTE matching properties of the third inorganic layer. In addition to simultaneously optimizing barrier and adhesion performance, multilayer coating set 120 may be designed to simultaneously meet demands on thermal, mechanical, dimensional, and optical performance.
  • Multilayer coating set [0019] 120 is transparent to light in the visible portion of the spectrum. In one embodiment, multilayer coating set 120 has a transmission of at least about 85% and a Taber haze value of less than about 5% after 1000 cycles.
  • Multilayer coating set [0020] 120 additionally provides a barrier for base 110 against chemical attack during processing. Multilayer coating set 120 may include at least one chemically resistant layer that is resistant to attack by at least one of alkali solutions (non-limiting examples include KOH and NaOH), acids (non-limiting examples include HBr, HCl, and HNO3), and organic solvents, such as but not limited to xylene, NMP, acetone, and the like.
  • Multilayer coating set [0021] 120 is also thermally stable up to at least a glass transition temperature of base 110. When, for example, multilayer coating set 120 is disposed on a polycarbonate substrate having a glass transition temperature of about 250° C., multilayer coating set 120 is thermally stable up to at least about 250° C. In addition, multilayer coating set 100 is mechanically flexible; i.e., multilayer coating set 120 can be bent around a radius of about 1 inch (2.54 cm) without exhibiting a substantial degradation in overall performance as a barrier against moisture, gas, and chemical attack.
  • Each of the at least one [0022] inorganic layer 122 may comprise at least one of silicon, a metal oxide, a metal nitride, and combinations thereof, wherein the metal is one of indium, tin, zinc, titanium, and aluminum. Non-limiting examples of metal nitrides and metal oxides that may comprise the at least one inorganic layer 122 include indium zinc oxide (IZO), indium tin oxide (ITO), silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum oxynitride, zinc oxide, indium oxide, tin oxide, cadmium tin oxide, cadmium oxide, and magnesium oxide.
  • The at least one [0023] inorganic layer 122 may, in one embodiment, be deposited on either base material 110 or organic layer 124 by vacuum deposition techniques known in the art. Such vacuum deposition techniques include physical vapor deposition or plasma deposition methods. Plasma based deposition methods are particularly preferred, as they typically permit deposition of the at least one inorganic layer 122 at low substrate temperatures. The deposition of the at least one inorganic layer 122 by other techniques, such as thermal chemical vapor deposition (CVD), requires substrate temperatures that are higher than those at which plastic substrates are thermally stable. Plasma deposition methods that may be used to deposit the at least one inorganic layer 122 include, but are not limited to, plasma enhanced chemical vapor deposition, expanding thermal plasma, microwave plasma, inductively coupled plasma, and high density plasma chemical vapor deposition. Physical vapor deposition methods that may be used to deposit the at least one inorganic layer 122 include, but are not limited to, sputtering, laser ablation, cathodic arc deposition, and electron beam evaporation. The above-referenced plasma and physical vapor deposition techniques may be used either alone or in combination with each other.
  • The at least one [0024] inorganic layer 122 serves as at least one of a radiation absorbent layer, a moisture barrier layer, an oxygen barrier layer, an electrically conductive layer, an ant-reflective layer, and combinations thereof. In one embodiment, the at least one inorganic layer 122 serves as a moisture barrier layer having a water vapor transmission rate of less than 0.1 g/m2-day at 100% relative humidity and 25° C. The at least one inorganic layer 122 may also serve as an oxygen barrier layer, which, in one embodiment, has an oxygen transmission rate of less than 0.1 cc/m2 -day for oxygen diffusion in a 21% oxygen atmosphere at 25° C.
  • Each of the at least one [0025] organic layer 124 comprises at least one of a parylene, an acrylic, a siloxane, xylene, an alkene, styrene, an organosilane, an organosilazane, an organosilicone, and the like. The at least one organic layer 124 includes at least one of an adhesion layer, a stress relief layer, a conformal layer, a chemically resistant layer, an abrasion resistant layer, and combinations thereof.
  • The at least one [0026] organic layer 124 may be deposited on either base material 110 or inorganic layer 122 by vacuum deposition techniques known in the art. Such vacuum deposition techniques include physical vapor deposition or plasma deposition methods. Organic layer 124 may also be deposited using polymer monolithic layer (also referred to hereinafter as “PML”) deposition methods that are known in the art. One such PML method includes the steps of: flash evaporation of at least one radiation-curable monomer, such as, but not limited to, acrylic monomers, vinyl monomers, epoxy monomers, and the like; condensing the at least one radiation-curable monomer on one of base material 110, the at least one inorganic layer 122, or another organic layer 124; and radiation cross-linking the at least one radiation-curable monomer by irradiation by one of at lest one electron beam or ultraviolet radiation to form the at least one organic layer 124. PML deposition is carried out in a vacuum and thus produces organic layers having fewer defects, such as pinholes, due to dust than deposition methods such as spin coating, meniscus coating, dip coating, and extrusion coating, that are performed under atmospheric conditions organic coating techniques. PML methods that may be used to deposit the at least one organic layer 124 are described in U.S. Pat. No. 4,954,371, by Angelo Yializis, entitled “Flash Evaporation of Monomer Fluids,” the contents of which are incorporated herein by reference in their entirety. Plasma deposition methods that may be used to deposit the at least one organic layer 124 include, but are not limited to: plasma enhanced chemical vapor deposition; expanding thermal plasma, described in U.S. Pat. No. 4,871,580, by Daniel C. Scham and Gerardus M. W. Kroesen, entitled “Method of Treating Surfaces of Substrates with the Aid of a Plasma,” the contents of which are incorporated herein by reference in their entirety; microwave plasma; inductively coupled plasma; and high density plasma chemical vapor deposition. Among the materials that can be deposited by physical vapor deposition are fluorocarbons and hydrocarbons. Physical vapor deposition methods that may be used to deposit the at least one organic layer 124 include, but are not limited to, sputtering, laser ablation, and electron beam evaporation. The above-referenced deposition techniques may be used either alone or in combination with each other.
  • Multilayer coating set [0027] 120 has a thickness in the range from about 0.05micron to about 50 microns. In one embodiment, the thickness of multilayer coating set 120 is in the range from about 0.1 micron to about 10 microns. The thickness of the individual layers in multilayer coating set 120 must be balanced to optimize performance of individual layers while maximizing the multilayer adhesion and flexibility of multilayer coating set 120. The thickness of the individual layers also depends in part on the function of and the material comprising the individual layer. For example, an ultraviolet absorbing titanium oxide may have a thickness of about 0.2 micron. An inorganic barrier layer may have a thickness ranging from about 20 nm to about 200 nm. PML chemical barrier layers or smoothing/bond layers have thicknesses in a range from about 0.1 micron to about 4 microns.
  • One example of an electro-optical device [0028] 100 of the present invention is a liquid crystal (LCD) display. A LCD display typically includes an active layer 140 comprising a liquid crystal suspension sandwiched between two LCD substrate structures. Two such LCD substrate structures are shown in FIGS. 2 and 3. In FIG. 2, substrate structure 202 comprises a polycarbonate substrate 210, an inner multi layer coating set 220, and an outer multilayer coating set 230.
  • In FIG. 2, inner multilayer coating set [0029] 220 is disposed between substrate 210 and active portion 140, and comprises an inorganic moisture and oxygen barrier layer 226, an organic chemical barrier layer 224, and a transparent conductive inorganic layer 222. Inorganic moisture and oxygen barrier layer 226 may be deposited by sputtering and, in one embodiment, has a thickness ranging from about 20 nm to about 200 nm and comprises indium tin oxide (ITO). Alternatively, other inorganic oxides, nitrides, or oxinitrides, such as, but not limited to, silicon oxides, nitrides, and oxynitrides, and aluminum oxides, nitrides, and oxynitrides may be used to form inorganic moisture and oxygen barrier layer 226. Organic chemical barrier layer 224, which is deposited by PML processing, provides resistance against chemical attack by most chemicals commonly used in display manufacturing. Organic chemical barrier layer 224 has a thickness ranging from about 0.1 micron to about 4 microns. Conductive inorganic layer 226 may be deposited by sputtering and, in one embodiment, has a thickness of about 125 nm and comprises indium tin oxide (ITO). Inner multilayer coating set 220 may optionally include an organic smoothing/bond layer 228 having a thickness ranging from about 0.1 micron to about 4 microns. Outer multilayer coating set 230 comprises inorganic moisture and oxygen barrier layer 232 and organic chemical barrier layer 234, each comprising the same material as the corresponding inorganic moisture and oxygen barrier layer 224 and organic chemical barrier layer 224, respectively.
  • [0030] LCD substrate structure 202 is prepared in an apparatus having a vacuum chamber that can be pumped down to pressures below 10−4 torr, and, preferably, less than 10−6 torr. The vacuum chamber contains at least one sputtering deposition station and at least one of a flash evaporator and an electron beam system. Polycarbonate substrate 210 is placed within the vacuum chamber, which is then evacuated to a pressure below 10−4 torr and, preferably, less than 10−6 torr. In one embodiment, substrate 210 contacts a chilled drum that can be rotated to move polycarbonate substrate 210 from one deposition station to another.
  • An outer surface of [0031] polycarbonate substrate 210 is first treated with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species. Outer inorganic moisture and oxygen barrier layer 232 is first deposited on the outer surface of the polycarbonate substrate 210 through a sputtering process. Using the PML process, outer organic chemical barrier layer 234 is then deposited directly onto the outer surface of outer inorganic moisture and oxygen barrier layer 232 to complete outer multilayer coating set 230.
  • Inner multilayer coating set [0032] 220 is then prepared by first treating an inner surface of polycarbonate substrate 210 with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species. Inner inorganic moisture and oxygen barrier layer 226 is first deposited on the outer surface of the polycarbonate substrate 210 through a sputtering process. Using the PML process, inner organic chemical barrier layer 224 is then deposited directly onto the outer surface of inner inorganic moisture and oxygen barrier layer 226. Conductive inorganic layer 222, typically comprising indium oxide doped with 2-15% tin, is then deposited directly onto inner organic chemical barrier layer 224 using a sputtering process to complete inner multilayer coating set 220.
  • FIG. 3 is a schematic representation of a second [0033] LCD substrate structure 302. In addition to inner inorganic moisture and oxygen barrier layer 226, inner organic chemical barrier layer 224, and conductive inorganic layer 222, inner multilayer coating set 320 further includes an inner organic smoothing/bond layer 228 disposed between substrate 210 and inner inorganic moisture and oxygen barrier layer 226. Outer multilayer coating set 330 also includes an outer organic smoothing/bond layer 236 disposed between substrate 210 and outer inorganic moisture and oxygen barrier layer 232, and an outer organic chemical barrier layer 234 disposed on an outer surface of outer inorganic moisture and oxygen barrier layer 232. Inner and outer organic smoothing/ bond layers 228, 236 promotes bonding and adhesion of both inner multilayer coating set 220 and outer multilayer coating set 220, respectively, to 210 substrate and decrease the degree of roughness of the interface between the multilayer coating sets and substrate 210. Each of outer and inner organic smoothing/ bond layers 228, 236 is deposited by PML processing and has a thickness ranging from about 0.1 micron to about 4 microns.
  • [0034] LCD substrate structure 302 is prepared in the same apparatus as that used to prepare LCD substrate structure 202. An outer surface of polycarbonate substrate 210 is first treated with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species. Outer organic bonding/smoothing layer 236 is then deposited on an outer surface of polycarbonate substrate 210 using a PML process. Outer inorganic moisture and oxygen barrier layer 232 is then deposited on outer organic bonding/smoothing layer 236 using a sputtering process. Using the PML process, outer organic chemical barrier layer 234 is then deposited directly onto the outer surface of outer inorganic moisture and oxygen barrier layer 232 to complete outer multilayer coating set 330.
  • Inner multilayer coating set [0035] 320 is then prepared by first treating an inner surface of polycarbonate substrate 210 with at least one of a plasma, an ion beam, or an electron beam to accelerate outgassing of moisture and to remove low molecular weight species. Inner organic bonding/smoothing layer 228 is then deposited on an outer surface of polycarbonate substrate 210 using a PML process. Next, inner inorganic moisture and oxygen barrier layer 226 is deposited on inner organic bonding/smoothing layer 236 using a sputtering process. Using the PML process, inner organic chemical barrier layer 224 is then deposited directly onto the outer surface of inner inorganic moisture and oxygen barrier layer 226. Conductive inorganic layer 222, typically comprising indium oxide doped with between about 2 weight percent and about 15 weight percent tin, is then deposited directly onto inner organic chemical barrier layer 224 using a sputtering process to complete inner multilayer coating set 320.
  • Another aspect of the invention is to provide a multilayer coating set for an electro-optical device. The multilayer coating set comprises at least one inorganic layer and at least one organic layer adjacent to the at least one inorganic layer. The multilayer coating set is transparent, mechanically flexible, and thermally stable. The multilayer coating set provides a barrier to moisture and oxygen for the electro-optical device, resistance to chemical attack for the electro-optical device and a base or substrate material during fabrication of the electro-optical device. The multilayer coating set [0036] 120, which is transparent and comprises at least one inorganic layer and at least one organic layer, is described in detail hereinabove.
  • The multiple layers of multilayer coating set [0037] 120 are deposited such that the various barrier properties, chemical resistance, mechanical, adhesion, electronically conductive, optical, thermal stability, and thermal expansion requirements can be independently optimized. Because the various layers are deposited using vacuum deposition techniques, the individual layers of multilayer coating set 120 have fewer defects than corresponding coatings that are produced using either wet or atmospheric coating processes.
  • While typical embodiments have been set forth for the purpose of illustration, the foregoing description should not be deemed to be a limitation on the scope of the invention. In one embodiment, for example, the barrier layer may have a hybrid inorganic/organic composition comprising either be multilayer barrier of discrete organic and inorganic layers or a single barrier layer having a graded composition that gradually transitions from a pure inorganic layer to a pure organic layer. Accordingly, various modifications, adaptations, and alternatives may occur to one skilled in the art without departing from the spirit and scope of the present invention. [0038]

Claims (64)

1. An electro-optical device, said electro-optical device comprising:
a) at least one base, said at least one base comprising a flexible polymeric material; and
b) a multilayer coating set disposed on at least one surface of said base, said multilayer coating set comprising at least one organic layer and at least one inorganic layer,
wherein said base and multilayer coating set are transparent, and wherein said multilayer coating set provides a barrier to moisture and oxygen, provides chemical resistance, and wherein said multilayer coating set is mechanically flexible and thermally stable up to a glass transition temperature of said base.
2. The electro-optical device according to claim 1, wherein said multilayer coating set is deposited on said at least one surface by a vacuum deposition technique.
3. The electro-optical device according to claim 2, wherein said at least one inorganic layer is deposited by one of plasma deposition and physical vapor deposition.
4. The electro-optical device according to claim 3, wherein said at least one inorganic layer is deposited by one of plasma enhanced chemical vapor deposition, expanding thermal plasma, microwave plasma, inductively coupled plasma, and high density plasma chemical vapor deposition.
5. The electro-optical device according to claim 3, wherein said at least one inorganic layer is deposited by one of sputtering, laser ablation, cathodic arc deposition, and electron beam evaporation.
6. The electro-optical device according to claim 3, wherein said at least one organic layer is deposited by one of plasma deposition, physical vapor deposition, and polymer monolithic layer deposition.
7. The electro-optical device according to claim 6, wherein said at least one organic layer is deposited by one of plasma enhanced chemical vapor deposition, expanding thermal plasma, microwave plasma, inductively coupled plasma, and high density plasma chemical vapor deposition.
8. The electro-optical device according to claim 6, wherein said at least one organic layer is deposited by one of sputtering, laser ablation, cathodic arc deposition, and electron beam evaporation.
9. The electro-optical device according to claim 6, wherein said at least one organic layer is deposited by polymer monolithic layer deposition, wherein polymer monolithic layer deposition comprises the steps of flash evaporation of at least one radiation-curable acrylic monomer, condensation of said at least one monomer, and radiational cross-linking of said at least one monomer to form said at least one organic layer.
10. The electro-optical device according to claim 1, wherein said flexible polymeric material comprises a polycarbonate.
11. The electro-optical device according to claim 1, wherein said at least one organic layer comprises at least one of a parylene, an acrylic, a siloxane, xylene, an alkene, styrene, an organosilane, an organosilazane, and an organosilicone.
12. The electro-optical device according to claim 1, wherein said at least one organic layer includes at least one of an adhesion layer, a stress relief layer, a conformal layer, a chemically resistant layer, and an abrasion resistant layer, and combinations thereof.
13. The electro-optical device according to claim 12, wherein said chemically resistant layer is resistant to at least one of alkali solutions, acids, and organic solvents.
14. The electro-optical device according to claim 1, wherein said at least one inorganic layer comprises at least one of a metal oxide, a metal nitride, silicon oxide, silicon nitride, and combinations thereof.
15. The electro-optical device according to claim 14, wherein said at least one inorganic layer comprises at least one of indium zinc oxide, indium tin oxide, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, aluminum oxynitride, zinc oxide, indium oxide, tin oxide, cadmium tin oxide, cadmium oxide, and magnesium oxide.
16. The electro-optical device according to claim 1, wherein said at least one inorganic layer includes at least one of an ultraviolet radiation absorbent layer, an infrared radiation absorbent layer, a barrier layer, an electrically conductive layer, an anti-reflective layer, and combinations thereof.
17. The electro-optical device according to claim 16, wherein said moisture barrier layer has a water vapor transmission rate of less than 0.1 g/m2-day at 100% relative humidity and 25° C.
18. The electro-optical device according to claim 16, wherein said oxygen barrier layer has an oxygen transmission rate of less than 0.1 cc/m2-day for oxygen diffusion in a 21% oxygen atmosphere at 25° C.
19. The electro-optical device according to claim 1, wherein said multilayer coating set has a thickness from about 0.05 micron to about 50 microns.
20. The electro-optical device according to claim 19, wherein said multilayer coating set has a thickness from about 0.1 micron to about 10 microns.
21. The electro-optical device according to claim 1, wherein said electro-optical device is one of an electrochromic device, a liquid crystal display, an organic light emitting diode, a light-emitting diode, a photovoltaic device, and an x-ray detector.
22. The electro-optical device according to claim 1, wherein said multilayer coating set further includes a transparent inorganic conductive layer.
23. The electro-optical device according to claim 22, wherein said transparent inorganic conductive layer comprises indium tin oxide.
24. A multilayer coating set for an electro-optical device, said multilayer coating set comprising:
a) at least one inorganic layer; and
b) at least one organic layer adjacent to said at least one inorganic layer,
wherein said multilayer coating set is transparent, and wherein said multilayer coating set provides a barrier to moisture and oxygen for said electro-optical device, provides resistance for said electro-optical device and for said base material during fabrication of said electro-optical device to chemical attack, is mechanically flexible and thermally stable.
25. The multilayer coating set according to claim 24, wherein said multilayer coating set is deposited on said at least one surface of the base material by a vacuum deposition technique.
26. The multilayer coating set according to claim 24, wherein said at least one inorganic layer is deposited by one of plasma deposition and physical vapor deposition.
27. The multilayer coating set according to claim 24, wherein said at least one inorganic layer is deposited by one of plasma enhanced chemical vapor deposition, expanding thermal plasma, microwave plasma, inductively coupled plasma, and high density plasma chemical vapor deposition.
28. The multilayer coating set according to claim 24, wherein said at least one inorganic layer is deposited by one of sputtering, laser ablation, cathodic arc deposition, and electron beam evaporation.
29. The multilayer coating set according to claim 24, wherein said at least one organic layer is deposited by one of plasma deposition, physical vapor deposition, and polymer monolithic layer deposition.
30. The multilayer coating set according to claim 29, wherein said at least one organic layer is deposited by one of plasma enhanced chemical vapor deposition, expanding thermal plasma, microwave plasma, inductively coupled plasma, and high density plasma chemical vapor deposition.
31. The multilayer coating set according to claim 29, wherein said at least one organic layer is deposited by one of sputtering, laser ablation, cathodic arc deposition, and electron beam evaporation.
32. The multilayer coating set according to claim 29, wherein said at least one organic layer is deposited by polymer monolithic layer deposition, wherein polymer monolithic layer deposition comprises the steps of flash evaporation of at least one radiation-curable acrylic monomer, condensation of said at least one monomer, and radiational cross-linking of said at least one monomer to form said at least one organic layer.
33. The multilayer coating set according to claim 24, wherein said at least one organic layer comprises at least one of a parylene, an acrylic, a siloxane, xylene, an alkene, styrene, an organosilane, an organosilazane, and an organosilicone.
34. The multilayer coating set according to claim 24, wherein said at least one organic layer includes at least one of an adhesion layer, a stress relief layer, a conformal layer, a chemically resistant layer, and an abrasion resistant layer, and combinations thereof.
35. The multilayer coating set according to claim 34, wherein said chemically resistant layer is resistant to at least one of alkali solutions, acids, and organic solvents.
36. The multilayer coating set according to claim 24, wherein said at least one inorganic layer comprises at least one of a metal oxide, a metal nitride, silicon oxide, silicon nitride, and combinations thereof.
37. The electro-optical device according to claim 36, wherein said at least one inorganic layer comprises at least one of indium zinc oxide, indium tin oxide, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, aluminum oxynitride, zinc oxide, indium oxide, tin oxide, cadmium tin oxide, cadmium oxide, and magnesium oxide.
38. The multilayer coating set according to claim 24, wherein said at least one inorganic layer includes at least one of an ultraviolet radiation absorbent layer, an infrared radiation absorbent layer, a barrier layer, an electrically conductive layer, an anti-reflective layer, and combinations thereof.
39. The multilayer coating set according to claim 38, wherein said moisture barrier layer has a water vapor transmission rate of less than 0.1 g/m2-day at 100% relative humidity and 25° C.
40. The multilayer coating set according to claim 38, wherein said oxygen barrier layer has an oxygen transmission rate of less than 0.1 cc/m2-day for oxygen diffusion in a 21% oxygen atmosphere at 25° C.
41. The multilayer coating set according to claim 24, wherein said coating set has a thickness from about 0.05 micron to about 50 microns.
42. The multilayer coating set according to claim 41, wherein said coating set has a thickness from about 0.1 micron to about 10 microns.
43. An electro-optical device, said electro-optical device comprising at least one substrate, said substrate comprising:
a) at least one base, said at least one base comprising a flexible polymeric material; and
b) a multilayer coating set comprising at least one inorganic layer and at least one organic layer adjacent to said at least one inorganic layer, wherein said multilayer coating set is deposited on said at least one surface by a vacuum deposition technique, wherein said multilayer coating set is transparent, and wherein said multilayer coating set provides a barrier to moisture and oxygen for said electro-optical device, provides resistance for said electro-optical device to chemical attack, is mechanically flexible and thermally stable up to a glass transition temperature of said base.
44. The electro-optical device according to claim 43, wherein said at least one inorganic layer is deposited by one of plasma deposition and physical vapor deposition.
45. The electro-optical device according to claim 44, wherein said at least one inorganic layer is deposited by one of plasma enhanced chemical vapor deposition, expanding thermal plasma, microwave plasma, inductively coupled plasma, and high density plasma chemical vapor deposition.
46. The electro-optical device according to claim 44, wherein said at least one inorganic layer is deposited by one of sputtering, laser ablation, and electron beam evaporation.
47. The electro-optical device according to claim 44, wherein said at least one organic layer is deposited by one of plasma deposition, physical vapor deposition, and polymer monolithic layer deposition.
48. The electro-optical device according to claim 47, wherein said at least one organic layer is deposited by one of plasma enhanced chemical vapor deposition, expanding thermal plasma, microwave plasma, inductively coupled plasma, and high density plasma chemical vapor deposition.
49. The electro-optical device according to claim 47, wherein said at least one organic layer is deposited by one of sputtering, laser ablation, and electron beam evaporation.
50. The electro-optical device according to claim 47, wherein said at least one organic layer is deposited by polymer monolithic layer deposition, wherein polymer monolithic layer deposition comprises the steps of flash evaporation at least one radiation-curable acrylic monomer, condensation of said at least one monomer, and radiational cross-linking of said at least one monomer to form said at least one organic layer.
51. The electro-optical device according to claim 43, wherein said flexible polymeric material comprises a polycarbonate.
52. The electro-optical device according to claim 43, wherein said at least one organic layer comprises at least one of a parylene, an acrylic, a siloxane, xylene, an alkene, styrene, an organosilane, an organosilazane, and an organosilicone.
53. The electro-optical device according to claim 43, wherein said at least one organic layer includes at least one of an adhesion layer, a stress relief layer, a conformal layer, a chemically resistant layer, and an abrasion resistant layer, and combinations thereof.
54. The electro-optical device according to claim 53, wherein said chemically resistant layer is resistant to at least one of alkali solutions, acids, and organic solvents.
55. The electro-optical device according to claim 43, wherein said at least one inorganic layer comprises at least one of a metal oxide, a metal nitride, silicon oxide, silicon nitride, and combinations thereof.
56. The electro-optical device according to claim 55, wherein said at least one inorganic layer comprises at least one of indium zinc oxide, indium tin oxide, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, aluminum oxynitride, zinc oxide, indium oxide, tin oxide, cadmium tin oxide, cadmium oxide, and magnesium oxide.
57. The electro-optical device according to claim 43, wherein said at least one inorganic layer includes at least one of an ultraviolet radiation absorbent layer, an infrared radiation absorbent layer, a barrier layer, an electrically conductive layer, an anti-reflective layer, and combinations thereof.
58. The electro-optical device according to claim 57, wherein said moisture barrier layer has a water vapor transmission rate of less than 0.1 g/m2-day at 100% relative humidity and 25° C.
59. The electro-optical device according to claim 57, wherein said oxygen barrier layer has an oxygen transmission rate of less than 0.1 cc/m2-day for oxygen diffusion in a 21% oxygen atmosphere at 25° C.
60. The electro-optical device according to claim 43, wherein said multilayer coating set has a thickness from about 0.05 micron to about 50 microns.
61. The electro-optical device according to claim 60, wherein said multilayer coating set has a thickness from about 0.1 micron to about 10 microns.
62. The electro-optical device according to claim 43, wherein said electro-optical device is one of an electrochromic device, a liquid crystal display, an organic light emitting diode, a light emitting diode, a photovoltaic device, and an x-ray detector.
63. The electro-optical device according to claim 43, wherein said multilayer coating set further includes a transparent inorganic conductive layer.
64. The electro-optical device according to claim 63, wherein said transparent inorganic conductive layer comprises indium tin oxide.
US10/439,506 2002-09-11 2003-05-15 Multilayer coating package on flexible substrates for electro-optical devices Abandoned US20040229051A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US10/439,506 US20040229051A1 (en) 2003-05-15 2003-05-15 Multilayer coating package on flexible substrates for electro-optical devices
PCT/US2004/015018 WO2005029601A2 (en) 2003-05-15 2004-05-14 Multilayer coating package on flexible substrates for electro-optical devices
US11/828,543 US8691371B2 (en) 2002-09-11 2007-07-26 Barrier coating and method
US12/352,386 US8236424B2 (en) 2003-05-15 2009-01-12 Multilayer coating package on flexible substrates for electro-optical devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/439,506 US20040229051A1 (en) 2003-05-15 2003-05-15 Multilayer coating package on flexible substrates for electro-optical devices

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US10/779,373 Continuation-In-Part US20050181212A1 (en) 2002-09-11 2004-02-17 Composite articles having diffusion barriers and devices incorporating the same

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10/988,481 Continuation-In-Part US8704211B2 (en) 2002-09-11 2004-11-15 High integrity protective coatings
US12/352,386 Division US8236424B2 (en) 2003-05-15 2009-01-12 Multilayer coating package on flexible substrates for electro-optical devices

Publications (1)

Publication Number Publication Date
US20040229051A1 true US20040229051A1 (en) 2004-11-18

Family

ID=33417820

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/439,506 Abandoned US20040229051A1 (en) 2002-09-11 2003-05-15 Multilayer coating package on flexible substrates for electro-optical devices
US12/352,386 Active 2025-07-05 US8236424B2 (en) 2003-05-15 2009-01-12 Multilayer coating package on flexible substrates for electro-optical devices

Family Applications After (1)

Application Number Title Priority Date Filing Date
US12/352,386 Active 2025-07-05 US8236424B2 (en) 2003-05-15 2009-01-12 Multilayer coating package on flexible substrates for electro-optical devices

Country Status (2)

Country Link
US (2) US20040229051A1 (en)
WO (1) WO2005029601A2 (en)

Cited By (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040238846A1 (en) * 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device
US20050007015A1 (en) * 2003-05-29 2005-01-13 Seiichi Yokoyama Method of manufacturing laminated structure, laminated structure, display device and display unit
US20050118428A1 (en) * 2002-08-07 2005-06-02 Matthias Bicker Rapid process for the production of multilayer barrier layers
US20050133781A1 (en) * 2003-12-19 2005-06-23 General Electric Company Multilayer device and method of making
US20060121639A1 (en) * 2004-11-10 2006-06-08 California Institute Of Technology Microfabricated devices for wireless data and power transfer
US20060271129A1 (en) * 2005-05-27 2006-11-30 California Institute Of Technology Magnetic material-containing microfabricated devices for wireless data and power transfer
US20080006819A1 (en) * 2006-06-19 2008-01-10 3M Innovative Properties Company Moisture barrier coatings for organic light emitting diode devices
WO2008075254A1 (en) * 2006-12-19 2008-06-26 Koninklijke Philips Electronics N.V. Package for protecting a device from ambient substances
US20080182101A1 (en) * 2003-05-16 2008-07-31 Peter Francis Carcia Barrier films for plastic substrates fabricated by atomic layer deposition
US20090121333A1 (en) * 2006-11-30 2009-05-14 Bruce Gardiner Aitken Flexible substrates having a thin-film barrier
US20090169770A1 (en) * 2005-07-20 2009-07-02 3M Innovative Properties Company Moisture barrier coatings
US20090238998A1 (en) * 2008-03-18 2009-09-24 Applied Materials, Inc. Coaxial microwave assisted deposition and etch systems
US20090287733A1 (en) * 2008-05-15 2009-11-19 Chanan Steinhart Method for preparing prepress image data
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
EP2180762A1 (en) * 2007-07-31 2010-04-28 Sumitomo Chemical Company, Limited Organic electroluminescent device and method for manufacturing the same
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US7727601B2 (en) 1999-10-25 2010-06-01 Vitex Systems, Inc. Method for edge sealing barrier films
US20100149272A1 (en) * 2008-12-17 2010-06-17 Robert Lee Cornell Uv-curable coatings and methods for applying uv-curable coatings using thermal micro-fluid ejection heads
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US7829147B2 (en) 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
EP2267818A1 (en) 2009-06-22 2010-12-29 Novaled AG Organic lighting device
US20110038131A1 (en) * 2009-08-12 2011-02-17 Medos International Sarl Packaging with active protection layer
US20110038130A1 (en) * 2009-08-12 2011-02-17 Medos International Sarl Plasma enhanced polymer ultra-thin multi-layer packaging
US20110236674A1 (en) * 2010-03-24 2011-09-29 Satoshi Aiba Barrier laminate, method of manufacturing the laminate, gas barrier film and device
US20110291544A1 (en) * 2010-05-31 2011-12-01 Industrial Technology Research Institute Gas barrier substrate, package of organic electro-luminenscent device and packaging method thereof
CN102275350A (en) * 2011-05-10 2011-12-14 上海交通大学 Namometer SiO2-doped polymer laminated film and preparation method thereof
WO2012010361A1 (en) * 2010-07-22 2012-01-26 Evonik Röhm Gmbh Transparent, weather-resistant barrier film having an improved barrier effect and scratch resistance properties
WO2012010360A1 (en) * 2010-07-22 2012-01-26 Evonik Röhm Gmbh Weather-resistant backing films
US20120045631A1 (en) * 2008-02-20 2012-02-23 Applied Materials, Inc. Index modified coating on polymer substrate
US20120077002A1 (en) * 2010-09-29 2012-03-29 Hon Hai Precision Industry Co., Ltd. Coated article and method for making the same
US20120258295A1 (en) * 2011-04-08 2012-10-11 Saint-Gobain Performance Plastics Corporation Multilayer component for the encapsulation of a sensitive element
CN102781659A (en) * 2010-03-05 2012-11-14 旭硝子株式会社 Layered product and process for producing same
US8313819B2 (en) 2009-08-12 2012-11-20 Medos International S.A.R.L. Ultra-thin multi-layer packaging
US20120301634A1 (en) * 2010-01-27 2012-11-29 Shuji Nakamura Gas barrier film and process for producing the same, and device using the same
US20120313508A1 (en) * 2011-06-10 2012-12-13 Samsung Mobile Display Co., Ltd. Organic light emitting diode display
JPWO2011027619A1 (en) * 2009-09-02 2013-02-04 コニカミノルタホールディングス株式会社 Barrier film and manufacturing method thereof
EP2637231A1 (en) * 2012-03-05 2013-09-11 Samsung Display Co., Ltd. Method of preparing organic light-emitting device
EP2637230A1 (en) * 2012-03-05 2013-09-11 Samsung Display Co., Ltd. Method of preparing organic light-emitting device, substrate for transiting inorganic layer, and organic light-emitting device
US20130292736A1 (en) * 2010-09-08 2013-11-07 Osram Opto Semiconductors Gmbh Thin-film encapsulation, optoelectronic semiconductor body comprising a thin-film encapsulation and method for producing a thin-film encapsulation
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
US20140065739A1 (en) * 2012-09-04 2014-03-06 Jrjyan Jerry Chen Method for hybrid encapsulation of an organic light emitting diode
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
EP2528082A3 (en) * 2008-02-21 2014-11-05 FUJIFILM Manufacturing Europe B.V. Plasma treatment apparatus with an atmospheric pressure glow discharge electrode configuration
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8955217B2 (en) 1999-10-25 2015-02-17 Samsung Display Co., Ltd. Method for edge sealing barrier films
US20150084012A1 (en) * 2013-09-26 2015-03-26 Samsung Display Co., Ltd. Organic light emitting display apparatus and method of manufacturing the same
US9018108B2 (en) 2013-01-25 2015-04-28 Applied Materials, Inc. Low shrinkage dielectric films
US9050622B2 (en) 2005-08-18 2015-06-09 Corning Incorporated Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US20150162506A1 (en) * 2013-12-10 2015-06-11 In Hyung Lee Method of manufacturing light emitting device
CN104733647A (en) * 2015-03-10 2015-06-24 京东方科技集团股份有限公司 Thin film packaging method, thin film packaging structure and display device
CN104752631A (en) * 2013-12-26 2015-07-01 昆山工研院新型平板显示技术中心有限公司 Organic light-emitting device packaging structure and packaging method
US20150219799A1 (en) * 2012-10-17 2015-08-06 Fujifilm Corporation Optical member with antireflection film, and method of manufacturing the same
US9142797B2 (en) 2010-05-31 2015-09-22 Industrial Technology Research Institute Gas barrier substrate and organic electro-luminescent device
US20150297801A1 (en) * 2012-06-07 2015-10-22 Medos International Sarl Three dimensional packaging for medical implants
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
CN105118933A (en) * 2015-09-02 2015-12-02 深圳市华星光电技术有限公司 Thin film encapsulation method and organic light emitting device
US9257673B2 (en) 2011-06-10 2016-02-09 Samsung Display Co., Ltd. Organic light emitting diode display
US20160049610A1 (en) * 2013-03-25 2016-02-18 Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk On-Derzoek Tno Nanocomposite, method to produce the same, a barrier structure for an electronic device and an oled comprising the same
US9285489B2 (en) 2013-08-29 2016-03-15 General Electric Company Organic x-ray detector assembly and method of manufacturing same
EP2882587A4 (en) * 2012-08-08 2016-04-13 3M Innovative Properties Co Barrier film constructions and methods of making same
JP2016066627A (en) * 2010-11-24 2016-04-28 株式会社半導体エネルギー研究所 Light-emitting device
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US9447492B2 (en) 2011-06-03 2016-09-20 Graham J. Hubbard Conductive anti-reflective films
WO2016163215A1 (en) * 2015-04-09 2016-10-13 コニカミノルタ株式会社 Organic electroluminescent element
US9472740B2 (en) 2014-07-28 2016-10-18 Samsung Electronics Co., Ltd. Light emitting diode package and lighting device using the same
US9502686B2 (en) * 2014-07-03 2016-11-22 Applied Materials, Inc. Fluorine-containing polymerized HMDSO applications for OLED thin film encapsulation
GB2539231A (en) * 2015-06-10 2016-12-14 Semblant Ltd Coated electrical assembly
US20160365540A1 (en) * 2015-06-12 2016-12-15 Everdisplay Optronics (Shanghai) Limited Thin film package structure, manufacturing method and organic light emitting apparatus having the structure
US20160365523A1 (en) * 2015-06-12 2016-12-15 Japan Display Inc. Display device
CN106784385A (en) * 2017-01-11 2017-05-31 瑞声科技(南京)有限公司 Oled device
US9806132B2 (en) 2013-11-22 2017-10-31 General Electric Company Organic X-ray detector with barrier layer
EP2768040A3 (en) * 2013-02-14 2017-11-08 Samsung Display Co., Ltd. Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
US9831468B2 (en) 2013-02-14 2017-11-28 Samsung Display Co., Ltd. Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
WO2018037083A1 (en) * 2016-08-26 2018-03-01 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optoelectronic component
US9917133B2 (en) 2013-12-12 2018-03-13 General Electric Company Optoelectronic device with flexible substrate
US9935152B2 (en) 2012-12-27 2018-04-03 General Electric Company X-ray detector having improved noise performance
WO2018098875A1 (en) * 2016-12-02 2018-06-07 武汉华星光电技术有限公司 Method for packaging organic semiconductor device
WO2018109459A1 (en) * 2016-12-13 2018-06-21 Semblant Limited Protective coating
CN110061149A (en) * 2019-04-28 2019-07-26 福州大学 A kind of flexible OLED devices film encapsulation method
WO2019144518A1 (en) * 2018-01-24 2019-08-01 武汉华星光电半导体显示技术有限公司 Thin-film encapsulation method for oled device, and oled device
US20190353805A1 (en) * 2018-05-21 2019-11-21 General Electric Company Digital x-ray detector having polymeric substrate
JP2020073947A (en) * 2014-07-25 2020-05-14 株式会社半導体エネルギー研究所 Display apparatus
US10732131B2 (en) 2014-03-13 2020-08-04 General Electric Company Curved digital X-ray detector for weld inspection
US10950821B2 (en) 2007-01-26 2021-03-16 Samsung Display Co., Ltd. Method of encapsulating an environmentally sensitive device
CN112736204A (en) * 2020-12-30 2021-04-30 山东永聚医药科技有限公司 Metal-induced amorphous crystallization transformation ultrahigh barrier film and preparation method thereof
CN114178551A (en) * 2021-11-29 2022-03-15 华中科技大学 Hot forging die with conformal water channel and arc fuse additive manufacturing method thereof
CN114806328A (en) * 2022-03-28 2022-07-29 武汉华工正源光子技术有限公司 Protective coating for optical module and preparation method thereof

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009000450A1 (en) 2009-01-28 2010-07-29 Evonik Degussa Gmbh Transparent, weather-resistant barrier film, production by lamination, extrusion lamination or extrusion coating
US9007674B2 (en) 2011-09-30 2015-04-14 View, Inc. Defect-mitigation layers in electrochromic devices
US11599003B2 (en) 2011-09-30 2023-03-07 View, Inc. Fabrication of electrochromic devices
DE102009003225A1 (en) 2009-05-19 2010-11-25 Evonik Degussa Gmbh Transparent, weather-resistant barrier film, production by lamination, extrusion lamination or extrusion coating
WO2011006018A2 (en) 2009-07-08 2011-01-13 Plasmasi, Inc. Apparatus and method for plasma processing
WO2012094162A2 (en) * 2011-01-03 2012-07-12 Tufts University Three dimensional metamaterials from conformal polymer coating layers
US8765232B2 (en) 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
KR101844557B1 (en) * 2011-02-08 2018-04-02 어플라이드 머티어리얼스, 인코포레이티드 Method for hybrid encapsulation of an organic light emitting diode
KR101842586B1 (en) * 2011-04-05 2018-03-28 삼성디스플레이 주식회사 Organic light emitting diode display and manufacturing method thereof
KR101873476B1 (en) 2011-04-11 2018-07-03 삼성디스플레이 주식회사 Organic light emitting diode display and manufacturing method thereof
TWI473317B (en) * 2011-11-17 2015-02-11 Au Optronics Corp Flexible active device array substrate and organic electroluminescent device having the same
US10802371B2 (en) 2011-12-12 2020-10-13 View, Inc. Thin-film devices and fabrication
CN102593245B (en) * 2012-02-13 2014-07-23 常州大学 Method for preparing high efficient low cost crystalline silicon solar cell
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
CN104103764A (en) * 2013-04-09 2014-10-15 海洋王照明科技股份有限公司 Organic light-emitting display and manufacturing method thereof
CN104103769A (en) * 2013-04-09 2014-10-15 海洋王照明科技股份有限公司 Organic light-emitting display and manufacturing method thereof
CN104103767A (en) * 2013-04-09 2014-10-15 海洋王照明科技股份有限公司 Organic light-emitting display and preparation method thereof
CN104103773A (en) * 2013-04-09 2014-10-15 海洋王照明科技股份有限公司 Organic light-emitting display and manufacturing method thereof
CN106486601A (en) * 2013-04-30 2017-03-08 成均馆大学校产学协力团 Multilayer encapsulation thin film
CN104183705A (en) * 2013-05-20 2014-12-03 海洋王照明科技股份有限公司 Organic electroluminescent device and preparation method thereof
JP6040140B2 (en) * 2013-12-06 2016-12-07 双葉電子工業株式会社 Organic electroluminescence device
US10361290B2 (en) * 2014-03-14 2019-07-23 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device comprising adding oxygen to buffer film and insulating film
US10712454B2 (en) 2014-07-25 2020-07-14 General Electric Company X-ray detectors supported on a substrate having a metal barrier
US9513380B2 (en) 2014-07-25 2016-12-06 General Electric Company X-ray detectors supported on a substrate having a surrounding metal barrier
KR101562966B1 (en) * 2014-08-27 2015-10-23 코닝정밀소재 주식회사 Substrate for display unit
KR101606172B1 (en) * 2014-09-05 2016-03-24 코닝정밀소재 주식회사 Substrate for display unit
US11054711B2 (en) 2014-11-25 2021-07-06 View, Inc. Electromagnetic-shielding electrochromic windows
CN107533267A (en) * 2015-03-20 2018-01-02 唯景公司 Switch low defect electrochromic more quickly
CN106158901B (en) * 2015-03-24 2020-06-23 上海和辉光电有限公司 Hybrid film, preparation method thereof and flexible OLED display
TW202239275A (en) * 2016-11-11 2022-10-01 日商京瓷股份有限公司 Package for mounting electrical element, array package and electrical device
KR102466811B1 (en) * 2017-12-12 2022-11-11 엘지디스플레이 주식회사 Flexible digital x-ray detector panel and the manufacturing method thereof
CN110047959B (en) * 2019-04-26 2021-08-06 圣晖莱南京能源科技有限公司 Packaging structure, packaging tool and packaging method of flexible solar thin-film battery
KR102120897B1 (en) * 2019-06-27 2020-06-10 삼성디스플레이 주식회사 Organic light emitting device having thin film encapsulation

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US568166A (en) * 1896-09-22 Island
US4871580A (en) * 1987-06-30 1989-10-03 Faculty Of Physics Eidhoven University Of Technology Method of treating surfaces of substrates with the aid of a plasma
US4954371A (en) * 1986-06-23 1990-09-04 Spectrum Control, Inc. Flash evaporation of monomer fluids
US6136444A (en) * 1995-02-02 2000-10-24 Teijin Limited Transparent conductive sheet
US6413645B1 (en) * 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6743524B2 (en) * 2002-05-23 2004-06-01 General Electric Company Barrier layer for an article and method of making said barrier layer by expanding thermal plasma

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5607789A (en) 1995-01-23 1997-03-04 Duracell Inc. Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same
US6593690B1 (en) * 1999-09-03 2003-07-15 3M Innovative Properties Company Large area organic electronic devices having conducting polymer buffer layers and methods of making same
US6492026B1 (en) 2000-04-20 2002-12-10 Battelle Memorial Institute Smoothing and barrier layers on high Tg substrates
EP1423991A4 (en) * 2001-07-27 2009-06-17 Univ Ohio State Methods for fabricating polymer light emitting devices by lamination

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US568166A (en) * 1896-09-22 Island
US4954371A (en) * 1986-06-23 1990-09-04 Spectrum Control, Inc. Flash evaporation of monomer fluids
US4871580A (en) * 1987-06-30 1989-10-03 Faculty Of Physics Eidhoven University Of Technology Method of treating surfaces of substrates with the aid of a plasma
US6136444A (en) * 1995-02-02 2000-10-24 Teijin Limited Transparent conductive sheet
US6413645B1 (en) * 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6743524B2 (en) * 2002-05-23 2004-06-01 General Electric Company Barrier layer for an article and method of making said barrier layer by expanding thermal plasma

Cited By (160)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7727601B2 (en) 1999-10-25 2010-06-01 Vitex Systems, Inc. Method for edge sealing barrier films
US8955217B2 (en) 1999-10-25 2015-02-17 Samsung Display Co., Ltd. Method for edge sealing barrier films
US9839940B2 (en) 2002-04-15 2017-12-12 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US20050118428A1 (en) * 2002-08-07 2005-06-02 Matthias Bicker Rapid process for the production of multilayer barrier layers
US7399500B2 (en) * 2002-08-07 2008-07-15 Schott Ag Rapid process for the production of multilayer barrier layers
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US8445937B2 (en) * 2003-05-16 2013-05-21 E I Du Pont De Nemours And Company Barrier films for plastic substrates fabricated by atomic layer deposition
US20080182101A1 (en) * 2003-05-16 2008-07-31 Peter Francis Carcia Barrier films for plastic substrates fabricated by atomic layer deposition
US20050007015A1 (en) * 2003-05-29 2005-01-13 Seiichi Yokoyama Method of manufacturing laminated structure, laminated structure, display device and display unit
US20040238846A1 (en) * 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device
US7595105B2 (en) * 2003-12-19 2009-09-29 General Electric Company Multilayer device and method of making
US20070069233A1 (en) * 2003-12-19 2007-03-29 Min Yan Multilayer device and method of making
US20050133781A1 (en) * 2003-12-19 2005-06-23 General Electric Company Multilayer device and method of making
US7075103B2 (en) * 2003-12-19 2006-07-11 General Electric Company Multilayer device and method of making
US7684868B2 (en) 2004-11-10 2010-03-23 California Institute Of Technology Microfabricated devices for wireless data and power transfer
US20060121639A1 (en) * 2004-11-10 2006-06-08 California Institute Of Technology Microfabricated devices for wireless data and power transfer
US20060271129A1 (en) * 2005-05-27 2006-11-30 California Institute Of Technology Magnetic material-containing microfabricated devices for wireless data and power transfer
US8112157B2 (en) 2005-05-27 2012-02-07 California Institute Of Technology Magnetic material-containing microfabricated devices for wireless data and power transfer
US20090186209A1 (en) * 2005-07-20 2009-07-23 3M Innovative Properties Company Moisture barrier coatings
US20090169770A1 (en) * 2005-07-20 2009-07-02 3M Innovative Properties Company Moisture barrier coatings
US20110143129A1 (en) * 2005-07-20 2011-06-16 3M Innovative Properties Company Moisture barrier coatings
US8034452B2 (en) 2005-07-20 2011-10-11 3M Innovative Properties Company Moisture barrier coatings
US9050622B2 (en) 2005-08-18 2015-06-09 Corning Incorporated Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US8435604B2 (en) 2005-08-18 2013-05-07 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US8304990B2 (en) 2005-08-18 2012-11-06 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US7829147B2 (en) 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US20080006819A1 (en) * 2006-06-19 2008-01-10 3M Innovative Properties Company Moisture barrier coatings for organic light emitting diode devices
US20090252894A1 (en) * 2006-06-19 2009-10-08 3M Innovative Properties Company Moisture barrier coatings for organic light emitting diode devices
US8435605B2 (en) 2006-11-30 2013-05-07 Corning Incorporated Flexible substrates having a thin-film barrier
US20090121333A1 (en) * 2006-11-30 2009-05-14 Bruce Gardiner Aitken Flexible substrates having a thin-film barrier
US8115326B2 (en) 2006-11-30 2012-02-14 Corning Incorporated Flexible substrates having a thin-film barrier
WO2008075254A1 (en) * 2006-12-19 2008-06-26 Koninklijke Philips Electronics N.V. Package for protecting a device from ambient substances
US8395177B2 (en) 2006-12-19 2013-03-12 Koninklijke Philips Electronics N.V. Package for protecting a device from ambient substances
US20100025723A1 (en) * 2006-12-19 2010-02-04 Koninklijke Philips Electronics N.V. Package for protecting a device from ambient substances
US10950821B2 (en) 2007-01-26 2021-03-16 Samsung Display Co., Ltd. Method of encapsulating an environmentally sensitive device
US20100244073A1 (en) * 2007-07-31 2010-09-30 Sumitomo Chemical Company, Limited Organic electroluminescent device and method for manufacturing the same
EP2180762A4 (en) * 2007-07-31 2011-01-19 Sumitomo Chemical Co Organic electroluminescent device and method for manufacturing the same
EP2180762A1 (en) * 2007-07-31 2010-04-28 Sumitomo Chemical Company, Limited Organic electroluminescent device and method for manufacturing the same
US20120045631A1 (en) * 2008-02-20 2012-02-23 Applied Materials, Inc. Index modified coating on polymer substrate
US8679594B2 (en) * 2008-02-20 2014-03-25 Applied Materials, Inc. Index modified coating on polymer substrate
EP2528082A3 (en) * 2008-02-21 2014-11-05 FUJIFILM Manufacturing Europe B.V. Plasma treatment apparatus with an atmospheric pressure glow discharge electrode configuration
US20090238998A1 (en) * 2008-03-18 2009-09-24 Applied Materials, Inc. Coaxial microwave assisted deposition and etch systems
US20090287733A1 (en) * 2008-05-15 2009-11-19 Chanan Steinhart Method for preparing prepress image data
US20100149272A1 (en) * 2008-12-17 2010-06-17 Robert Lee Cornell Uv-curable coatings and methods for applying uv-curable coatings using thermal micro-fluid ejection heads
US8191987B2 (en) * 2008-12-17 2012-06-05 Lexmark International, Inc. UV-curable coatings and methods for applying UV-curable coatings using thermal micro-fluid ejection heads
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US9362530B2 (en) 2008-12-22 2016-06-07 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
EP2267818A1 (en) 2009-06-22 2010-12-29 Novaled AG Organic lighting device
US8361591B2 (en) 2009-08-12 2013-01-29 Medos International Sarl Packaging with active protection layer
US20110038131A1 (en) * 2009-08-12 2011-02-17 Medos International Sarl Packaging with active protection layer
US8313819B2 (en) 2009-08-12 2012-11-20 Medos International S.A.R.L. Ultra-thin multi-layer packaging
US8313811B2 (en) 2009-08-12 2012-11-20 Medos International S.A.R.L. Plasma enhanced polymer ultra-thin multi-layer packaging
US20110038130A1 (en) * 2009-08-12 2011-02-17 Medos International Sarl Plasma enhanced polymer ultra-thin multi-layer packaging
JPWO2011027619A1 (en) * 2009-09-02 2013-02-04 コニカミノルタホールディングス株式会社 Barrier film and manufacturing method thereof
US8904819B2 (en) 2009-12-31 2014-12-09 Samsung Display Co., Ltd. Evaporator with internal restriction
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
US20120301634A1 (en) * 2010-01-27 2012-11-29 Shuji Nakamura Gas barrier film and process for producing the same, and device using the same
EP2543508A1 (en) * 2010-03-05 2013-01-09 Asahi Glass Company, Limited Layered product and process for producing same
CN102781659A (en) * 2010-03-05 2012-11-14 旭硝子株式会社 Layered product and process for producing same
EP2543508A4 (en) * 2010-03-05 2013-09-25 Asahi Glass Co Ltd Layered product and process for producing same
US20110236674A1 (en) * 2010-03-24 2011-09-29 Satoshi Aiba Barrier laminate, method of manufacturing the laminate, gas barrier film and device
US8864540B2 (en) 2010-05-31 2014-10-21 Industrial Technology Research Institute Fabricating method of gas barrier substrate, organic electro-luminescent device and packaging method thereof
US20110291544A1 (en) * 2010-05-31 2011-12-01 Industrial Technology Research Institute Gas barrier substrate, package of organic electro-luminenscent device and packaging method thereof
US9142797B2 (en) 2010-05-31 2015-09-22 Industrial Technology Research Institute Gas barrier substrate and organic electro-luminescent device
WO2012010361A1 (en) * 2010-07-22 2012-01-26 Evonik Röhm Gmbh Transparent, weather-resistant barrier film having an improved barrier effect and scratch resistance properties
WO2012010360A1 (en) * 2010-07-22 2012-01-26 Evonik Röhm Gmbh Weather-resistant backing films
US20130292736A1 (en) * 2010-09-08 2013-11-07 Osram Opto Semiconductors Gmbh Thin-film encapsulation, optoelectronic semiconductor body comprising a thin-film encapsulation and method for producing a thin-film encapsulation
US8896019B2 (en) * 2010-09-08 2014-11-25 Osram Opto Semiconductors Gmbh Thin-film encapsulation, optoelectronic semiconductor body comprising a thin-film encapsulation and method for producing a thin-film encapsulation
US20120077002A1 (en) * 2010-09-29 2012-03-29 Hon Hai Precision Industry Co., Ltd. Coated article and method for making the same
JP2016066627A (en) * 2010-11-24 2016-04-28 株式会社半導体エネルギー研究所 Light-emitting device
US10036832B2 (en) * 2011-04-08 2018-07-31 Saint-Gobain Performance Plastics Corporation Multilayer component for the encapsulation of a sensitive element
US20120258295A1 (en) * 2011-04-08 2012-10-11 Saint-Gobain Performance Plastics Corporation Multilayer component for the encapsulation of a sensitive element
CN102275350A (en) * 2011-05-10 2011-12-14 上海交通大学 Namometer SiO2-doped polymer laminated film and preparation method thereof
CN102275350B (en) * 2011-05-10 2013-11-06 上海交通大学 Namometer SiO2-doped polymer laminated film and preparation method thereof
US9447492B2 (en) 2011-06-03 2016-09-20 Graham J. Hubbard Conductive anti-reflective films
US8786186B2 (en) * 2011-06-10 2014-07-22 Samsung Display Co., Ltd. Organic light emitting diode display with adhesive layer
US10636971B2 (en) 2011-06-10 2020-04-28 Samsung Display Co., Ltd. Organic light emitting diode display
US11600778B2 (en) 2011-06-10 2023-03-07 Samsung Display Co., Ltd. Organic light emitting diode display
US11349077B2 (en) 2011-06-10 2022-05-31 Samsung Display Co., Ltd. Organic light emitting diode display
US9806261B2 (en) 2011-06-10 2017-10-31 Samsung Display Co., Ltd. Organic light emitting diode display
US20120313508A1 (en) * 2011-06-10 2012-12-13 Samsung Mobile Display Co., Ltd. Organic light emitting diode display
US10461255B2 (en) 2011-06-10 2019-10-29 Samsung Display Co., Ltd. Organic light emitting diode display
US9257673B2 (en) 2011-06-10 2016-02-09 Samsung Display Co., Ltd. Organic light emitting diode display
EP2637231A1 (en) * 2012-03-05 2013-09-11 Samsung Display Co., Ltd. Method of preparing organic light-emitting device
CN103311458A (en) * 2012-03-05 2013-09-18 三星显示有限公司 Method of preparing organic light-emitting device
KR101503401B1 (en) * 2012-03-05 2015-03-17 삼성디스플레이 주식회사 Method for preparing organic light emitting device
US8791452B2 (en) 2012-03-05 2014-07-29 Samsung Display Co., Ltd. Method of preparing organic light-emitting device, substrate for transiting inorganic layer, and organic light-emitting device
JP2017063064A (en) * 2012-03-05 2017-03-30 三星ディスプレイ株式會社Samsung Display Co.,Ltd. Method for manufacturing organic light-emitting device, substrate for inorganic film transfer, and organic light-emitting device
US9343703B2 (en) 2012-03-05 2016-05-17 Samsung Display Co., Ltd. Organic light-emitting device having low temperature viscosity transition (LVT) inorganic material
EP2682998A1 (en) * 2012-03-05 2014-01-08 Samsung Display Co., Ltd. Method of preparing organic light-emitting device, substrate for transiting inorganic layer, and organic light-emitting device
EP2637230A1 (en) * 2012-03-05 2013-09-11 Samsung Display Co., Ltd. Method of preparing organic light-emitting device, substrate for transiting inorganic layer, and organic light-emitting device
US10279085B2 (en) * 2012-06-07 2019-05-07 Coat-X Sa Three dimensional packaging for medical implants
US20150297801A1 (en) * 2012-06-07 2015-10-22 Medos International Sarl Three dimensional packaging for medical implants
EP2882587A4 (en) * 2012-08-08 2016-04-13 3M Innovative Properties Co Barrier film constructions and methods of making same
US10947618B2 (en) 2012-08-08 2021-03-16 3M Innovative Properties Company Barrier film constructions and methods of making same
US20140065739A1 (en) * 2012-09-04 2014-03-06 Jrjyan Jerry Chen Method for hybrid encapsulation of an organic light emitting diode
CN104584256A (en) * 2012-09-04 2015-04-29 应用材料公司 Method for hybrid encapsulation of an organic light emitting diode
US9397318B2 (en) * 2012-09-04 2016-07-19 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
CN107665959A (en) * 2012-09-04 2018-02-06 应用材料公司 Method for forming encapsulated layer on Organic Light Emitting Diode substrate
US20160308166A1 (en) * 2012-09-04 2016-10-20 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
US9741966B2 (en) * 2012-09-04 2017-08-22 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
US20150219799A1 (en) * 2012-10-17 2015-08-06 Fujifilm Corporation Optical member with antireflection film, and method of manufacturing the same
US9935152B2 (en) 2012-12-27 2018-04-03 General Electric Company X-ray detector having improved noise performance
US9018108B2 (en) 2013-01-25 2015-04-28 Applied Materials, Inc. Low shrinkage dielectric films
EP2768040A3 (en) * 2013-02-14 2017-11-08 Samsung Display Co., Ltd. Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
US10944076B2 (en) 2013-02-14 2021-03-09 Samsung Display Co., Ltd. Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
EP4092775A3 (en) * 2013-02-14 2023-03-15 Samsung Display Co., Ltd. Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
US10297791B2 (en) 2013-02-14 2019-05-21 Samsung Display Co., Ltd. Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
US11489142B2 (en) 2013-02-14 2022-11-01 Samsung Display Co., Ltd. Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
US11245098B2 (en) 2013-02-14 2022-02-08 Samsung Display Co., Ltd. Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
US11778854B2 (en) 2013-02-14 2023-10-03 Samsung Display Co., Ltd. Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
US9831468B2 (en) 2013-02-14 2017-11-28 Samsung Display Co., Ltd. Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
US10644264B2 (en) 2013-02-14 2020-05-05 Samsung Display Co., Ltd. Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
US10128464B2 (en) 2013-02-14 2018-11-13 Samsung Display Co., Ltd. Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
US20160049610A1 (en) * 2013-03-25 2016-02-18 Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk On-Derzoek Tno Nanocomposite, method to produce the same, a barrier structure for an electronic device and an oled comprising the same
US9285489B2 (en) 2013-08-29 2016-03-15 General Electric Company Organic x-ray detector assembly and method of manufacturing same
US20150084012A1 (en) * 2013-09-26 2015-03-26 Samsung Display Co., Ltd. Organic light emitting display apparatus and method of manufacturing the same
US9806132B2 (en) 2013-11-22 2017-10-31 General Electric Company Organic X-ray detector with barrier layer
US9490401B2 (en) * 2013-12-10 2016-11-08 Samsung Electronics Co., Ltd. Method of manufacturing light emitting device
US9293666B2 (en) * 2013-12-10 2016-03-22 Samsung Electronics Co., Ltd. Method of manufacturing light emitting device
US20150162506A1 (en) * 2013-12-10 2015-06-11 In Hyung Lee Method of manufacturing light emitting device
US9917133B2 (en) 2013-12-12 2018-03-13 General Electric Company Optoelectronic device with flexible substrate
CN104752631A (en) * 2013-12-26 2015-07-01 昆山工研院新型平板显示技术中心有限公司 Organic light-emitting device packaging structure and packaging method
US10732131B2 (en) 2014-03-13 2020-08-04 General Electric Company Curved digital X-ray detector for weld inspection
US9502686B2 (en) * 2014-07-03 2016-11-22 Applied Materials, Inc. Fluorine-containing polymerized HMDSO applications for OLED thin film encapsulation
US10224507B2 (en) 2014-07-03 2019-03-05 Applied Materials, Inc. Fluorine-containing polymerized HMDSO applications for OLED thin film encapsulation
US11063094B2 (en) 2014-07-25 2021-07-13 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
US11800747B2 (en) 2014-07-25 2023-10-24 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
JP2020073947A (en) * 2014-07-25 2020-05-14 株式会社半導体エネルギー研究所 Display apparatus
US9472740B2 (en) 2014-07-28 2016-10-18 Samsung Electronics Co., Ltd. Light emitting diode package and lighting device using the same
CN104733647A (en) * 2015-03-10 2015-06-24 京东方科技集团股份有限公司 Thin film packaging method, thin film packaging structure and display device
US9761833B2 (en) 2015-03-10 2017-09-12 Boe Technology Group Co., Ltd. Packaging method with films, film package structure and display device
WO2016163215A1 (en) * 2015-04-09 2016-10-13 コニカミノルタ株式会社 Organic electroluminescent element
GB2539231B (en) * 2015-06-10 2017-08-23 Semblant Ltd Coated electrical assembly
GB2539231A (en) * 2015-06-10 2016-12-14 Semblant Ltd Coated electrical assembly
RU2717842C2 (en) * 2015-06-10 2020-03-26 Семблант Лимитед Coated electrical assembly
WO2016198870A1 (en) * 2015-06-10 2016-12-15 Semblant Limited Coated electrical assembly
US20160365523A1 (en) * 2015-06-12 2016-12-15 Japan Display Inc. Display device
US9831450B2 (en) * 2015-06-12 2017-11-28 Japan Display Inc. Display device
US20160365540A1 (en) * 2015-06-12 2016-12-15 Everdisplay Optronics (Shanghai) Limited Thin film package structure, manufacturing method and organic light emitting apparatus having the structure
CN105118933A (en) * 2015-09-02 2015-12-02 深圳市华星光电技术有限公司 Thin film encapsulation method and organic light emitting device
WO2018037083A1 (en) * 2016-08-26 2018-03-01 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optoelectronic component
US10840413B2 (en) 2016-08-26 2020-11-17 Osram Oled Gmbh Optoelectronic device and method of producing an optoelectronic device
WO2018098875A1 (en) * 2016-12-02 2018-06-07 武汉华星光电技术有限公司 Method for packaging organic semiconductor device
US10205123B2 (en) 2016-12-02 2019-02-12 Wuhan China Star Optoelectronics Technology Co., Ltd. Packaging method for organic semiconductor device
CN110268810A (en) * 2016-12-13 2019-09-20 赛姆布兰特有限公司 Protective coating
US11786930B2 (en) 2016-12-13 2023-10-17 Hzo, Inc. Protective coating
WO2018109459A1 (en) * 2016-12-13 2018-06-21 Semblant Limited Protective coating
CN106784385A (en) * 2017-01-11 2017-05-31 瑞声科技(南京)有限公司 Oled device
WO2019144518A1 (en) * 2018-01-24 2019-08-01 武汉华星光电半导体显示技术有限公司 Thin-film encapsulation method for oled device, and oled device
US20190353805A1 (en) * 2018-05-21 2019-11-21 General Electric Company Digital x-ray detector having polymeric substrate
CN110061149A (en) * 2019-04-28 2019-07-26 福州大学 A kind of flexible OLED devices film encapsulation method
CN112736204A (en) * 2020-12-30 2021-04-30 山东永聚医药科技有限公司 Metal-induced amorphous crystallization transformation ultrahigh barrier film and preparation method thereof
CN114178551A (en) * 2021-11-29 2022-03-15 华中科技大学 Hot forging die with conformal water channel and arc fuse additive manufacturing method thereof
CN114806328A (en) * 2022-03-28 2022-07-29 武汉华工正源光子技术有限公司 Protective coating for optical module and preparation method thereof

Also Published As

Publication number Publication date
US20090202743A1 (en) 2009-08-13
WO2005029601A2 (en) 2005-03-31
US8236424B2 (en) 2012-08-07
WO2005029601A3 (en) 2005-12-15

Similar Documents

Publication Publication Date Title
US8236424B2 (en) Multilayer coating package on flexible substrates for electro-optical devices
CA2457791C (en) Coatings with low permeation of gases and vapors
EP2882591B1 (en) Barrier film, method of making the barrier film, and articles including the barrier film
JP5367531B2 (en) Smooth layer and barrier layer on Tg substrate
EP1127381B1 (en) Transparent conductive oxides for plastic flat panel displays
JP5190525B2 (en) Environmental barrier material for organic light emitting device and method of manufacturing the same
JP4750339B2 (en) Encapsulated microelectronic device
US8241713B2 (en) Moisture barrier coatings for organic light emitting diode devices
TWI462358B (en) Protected polymeric film
EP1859496B1 (en) High integrity protective coating
US20070105473A1 (en) Method of encapsulating an organic light-emitting device
CN101228217A (en) Moisture barrier coatings
MXPA01010917A (en) Flexible organic electronic device with improved resistance to oxygen and moisture degradation.
US20070054149A1 (en) Substrate assembly of a display device and method of manufacturing the same
JP2004244606A (en) Transparent barrier film
US20170100926A1 (en) Method of manufacturing electronic device and composite film
JP2005235743A (en) Composite material article having diffusion barrier and element incorporating it
JP2010055894A (en) Sealing film for light-emitting element
US20190198807A1 (en) Barrier film and barrier structure including the same
WO2017033823A1 (en) Electronic device
JP6026331B2 (en) Organic EL laminate
JP2003231198A (en) Transparent gas-barrier film, transparent conductive electrode base material using the film, display element, and solar cell or face light emitter
WO2019021616A1 (en) Gas barrier laminate and electronic device
US20030209978A1 (en) Organic electro-luminescence device
WO2010037925A2 (en) Method for encapsulating an organic optoelectronic device

Legal Events

Date Code Title Description
AS Assignment

Owner name: GENERAL ELECTRIC COMPANY, NEW YORK

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SCHAEPKENS, MARC (NMN);GILLETTE, GREGORY RONALD;IACOVANGELO, CHARLES DOMINIC;REEL/FRAME:014092/0254

Effective date: 20030514

AS Assignment

Owner name: CITIBANK, N.A., AS COLLATERAL AGENT, NEW YORK

Free format text: SECURITY AGREEMENT;ASSIGNOR:SABIC INNOVATIVE PLASTICS IP B.V.;REEL/FRAME:021423/0001

Effective date: 20080307

Owner name: CITIBANK, N.A., AS COLLATERAL AGENT,NEW YORK

Free format text: SECURITY AGREEMENT;ASSIGNOR:SABIC INNOVATIVE PLASTICS IP B.V.;REEL/FRAME:021423/0001

Effective date: 20080307

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

AS Assignment

Owner name: SABIC INNOVATIVE PLASTICS IP B.V., MASSACHUSETTS

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:CITIBANK, N.A.;REEL/FRAME:022846/0411

Effective date: 20090615

Owner name: SABIC INNOVATIVE PLASTICS IP B.V.,MASSACHUSETTS

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:CITIBANK, N.A.;REEL/FRAME:022846/0411

Effective date: 20090615