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Publication numberUS20040250959 A1
Publication typeApplication
Application numberUS 10/462,160
Publication dateDec 16, 2004
Filing dateJun 16, 2003
Priority dateJun 16, 2003
Also published asUS6837293
Publication number10462160, 462160, US 2004/0250959 A1, US 2004/250959 A1, US 20040250959 A1, US 20040250959A1, US 2004250959 A1, US 2004250959A1, US-A1-20040250959, US-A1-2004250959, US2004/0250959A1, US2004/250959A1, US20040250959 A1, US20040250959A1, US2004250959 A1, US2004250959A1
InventorsSwee Mok, Janice Danvir, Chi-haur Wu
Original AssigneeMotorola, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heated nozzle assembly
US 20040250959 A1
Abstract
An interface block (300) carries a removable electrical connection (310, 312) that can be quickly connected and removed from a high speed machine for picking and placing electronic components. The interface block is attached to a vacuum ported tool changer (200) which further couples to a heated end effector (100) to create a removable heated nozzle assembly (50). The entire assembly can be easily plugged into and removed from a high speed placement machine.
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Claims(15)
What is claimed is:
1. In a high speed machine for picking and placing electronic components, a heated nozzle assembly, comprising:
a vacuum ported tool changer, a replaceable heated end effector, and an interface block; and
the interface block mechanically mounted on the vacuum ported tool changer and electrically connected to the replaceable heated end effector, and having one or more electrical contacts arranged to be removably connected to the high speed machine.
2. The heated nozzle assembly as described in claim 1, wherein the one or more electrical contacts comprise pluggable connections.
3. The heated nozzle assembly as described in claim 1, wherein the one or more electrical contacts comprise surface mount connections.
4. The heated nozzle assembly as described in claim 1, wherein the one or more electrical contacts are selected from the group consisting of power, ground, temperature measurement, pressure sensing, and optical sensors.
5. The heated nozzle assembly as described in claim 4, wherein the power and ground connections are a male connector, and wherein the temperature measurement connection is a female connector.
6. The heated nozzle assembly as described in claim 1, further comprising a force compliant electrical contact assembly between the interface block and the replaceable heated end effector
7. In a high speed machine for picking and placing electronic components, a heated nozzle assembly, comprising:
a vacuum ported tool changer, a replaceable heated end effector, and an interface block;
the interface block mechanically mounted on the vacuum ported tool changer and electrically connected to the replaceable heated end effector; and
the interface block having power and ground electrical contacts and temperature measuring contacts arranged to provide pluggable connections to the high speed machine.
8. The heated nozzle assembly as described in claim 7, wherein the power and ground contacts are a male connector, and wherein the temperature measuring contacts are a female connector.
9. The heated nozzle assembly as described in claim 7, further comprising a force compliant electrical contact assembly between the interface block and the replaceable heated end effector
10. In a high speed machine for picking and placing electronic components, a heated nozzle assembly, comprising:
a vacuum ported tool changer, a replaceable heated end effector, and an interface block;
the interface block mechanically mounted on the vacuum ported tool changer and electrically connected to the replaceable heated end effector, and having one or more electrical contacts arranged to be removably connected to the high speed machine.
the replaceable heated end effector comprising an adapter flange, a heater plate and a heated tip;
said heater plate having one or more heating elements disposed thereon and arranged to thermally communicate with said heated tip;
said adapter flange having an upper side arranged to removably couple to said vacuum ported tool changer, and having one or more electrical contacts arranged to communicate with said heating elements;
said heated tip having a vacuum pickup portion for picking up said electronic components;
wherein apertures in each of said adapter flange said heater plate and said heated tip are arranged so as to communicate a vacuum from said vacuum ported tool changer to said vacuum pickup portion; and
fastening means to connect said adapter flange, said heater plate and said heated tip together.
11. The heated nozzle assembly as described in claim 10, wherein the one or more electrical contacts comprise pluggable connections.
12. The heated nozzle assembly as described in claim 10, wherein the one or more electrical contacts comprise surface mount connections.
13. The heated nozzle assembly as described in claim 10, wherein the one or more electrical contacts are selected from the group consisting of power, ground, temperature measurement, pressure sensing, and optical sensors.
14. The heated nozzle assembly as described in claim 13, wherein the power and ground connections are a male connector, and wherein the temperature measurement connection is a female connector.
15. The heated nozzle assembly as described in claim 10, further comprising a force compliant electrical contact assembly between the interface block and the replaceable heated end effector
Description
    CROSS REFERENCE TO RELATED APPLICATIONS
  • [0001]
    This application is related to pending U.S. application Ser. No. 10/328231, filed Dec. 8, 2002, by Becher et al., entitled “REMOVABLE HEATED END EFFECTOR,” and assigned to Motorola, Inc.
  • [0002] The U.S. Government has a paid-up license in this invention and the right in limited circumstances to require the patent owner to license others on reasonable terms as provided for by the terms of Grant No. 70NANB8H4007 awarded by NIST.
  • FIELD OF THE INVENTION
  • [0003]
    This invention relates generally to automated placement of small electronic components. More particularly, this invention relates to the use of a easily removable heated end effector on placement systems to preheat an adhesive on electronic components.
  • BACKGROUND OF THE INVENTION
  • [0004]
    “Chip shooters” or “Pick-and-Place” machines rapidly place small electronic components such as resistors, capacitors and integrated circuit packages on a printed circuit board. The placement of components on the board can reach rates of more than 40,000 chips per hour. These machines pick up and accurately locate the component on the end of a vacuum nozzle. Chip shooters use one of two basic designs to place components. The most common is a turret drive with multiple heads around the outside of the turret. A feeder carriage is placed in the back of the machine that moves back and forth to put the correct component under the turret. As the turret spins, the component is picked up from the feeder carriage and is brought to the front for placement. The advantage of the turret design is speed since many components can be on the turret in process at the same time. The circuit board being assembled moves around under the front of the turret to position the component correctly. A second type of chip shooter is a gantry system. The circuit board is held stationary, or moved in only one axis, and the head goes to the feeder to get the component and moves to the proper location for placement.
  • [0005]
    When placing flip chip integrated circuits that are pre-coated with an underfill adhesive, solder flux or solder paste is not used to hold the chip in place during reflow, as with typical surface mount components. Instead the pre-applied underfill material is heated to soften it and create a tacky surface to hold the chip in place as the board is transported into the reflow oven. Novel techniques such as a soft beam laser, radiant or ultraviolet heating for the softening step after component pick and placement are being discussed as a potential techniques for heating up the flip chip. However, these techniques have not been proven to be effective for mass production. An alternative approach is to heat the board with infra-red energy prior to entering the placement cell. While this technique can easily be integrated in an existing pick and place platform, it causes the solder paste on the printed circuit boards to dry out. Therefore a method of heating the die during the pick and place step is highly desirable to provide a complete solution for the implementation of the precoated chip in high volume manufacturing.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0006]
    The accompanying figures, where like reference numerals refer to identical or functionally similar elements throughout the separate views and which together with the detailed description below are incorporated in and form part of the specification, serve to further illustrate various embodiments and to explain various principles and advantages all in accordance with the present invention.
  • [0007]
    [0007]FIG. 1 is an isometric view showing an assembled heated end effector ready to mate with a tool changer for a placement machine in accordance with the present invention.
  • [0008]
    [0008]FIG. 2 is an exploded isometric view of the heated nozzle assembly of the present invention.
  • DETAILED DESCRIPTION OF THE INVENTION
  • [0009]
    As required, detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the invention, which can be embodied in various forms. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present invention in virtually any appropriately detailed structure. Further, the terms and phrases used herein are not intended to be limiting; but rather, to provide an understandable description of the invention. The terms a or an, as used herein, are defined as one or more than one. The term plurality, as used herein, is defined as two or more than two. The term another, as used herein, is defined as at least a second or more. The terms including, and/or having, as used herein, are defined as comprising (i.e., open language).
  • [0010]
    A replaceable heated end effector can be quickly connected and disconnected to a vacuum ported tool changer on a high speed machine to create a heated nozzle assembly for picking and placing electronic components. The heated end effector is made up of an adapter flange, a heater plate and a heated tip. The heater plate contains one or more heating elements to heat up the tip. The upper side of the adapter flange mates with the vacuum ported tool changer so as to be easily removable. The adapted flange also has electrical contacts to supply power to the heating elements on the heater plate. The heated tip has a vacuum pickup portion that is designed to pick up the electronic components and heat them while they are being transported to the placement location. There are holes or apertures in the adapter flange, the heater plate and the heated tip that port the vacuum from the tool changer to the vacuum pickup tip. The adapter flange, the heater plate and the heated tip are all fastened together in close proximity to form a modular unit that can be easily and removably connected to the tool changer. An interface block is mounted on the tool changer to make the entire assembly easily removable from the high speed placement machine. The interface block carries one or more connectors that establish removable electrical connections between the heated nozzle assembly and the high speed placement machine. The connectors mate with respective connectors on the high speed placement machine so that the entire heated nozzle assembly (including the tool changer) can be quickly and easily removed and replaced.
  • [0011]
    Referring now to FIG. 1, in which our preferred embodiment is displayed, the heated nozzle assembly 50 contains three main parts: a heated end effector 100, a vacuum ported tool changer 200, and an interface block 300. The vacuum ported tool changer 200 is a conventional component of any of a number of commercial robotic placement machines or high speed pick and place machines. Since the tool changer is intended by the placement machine manufacturer to be removable and replaceable in the event of damage or normal wear, it is advantageous to configure the heated nozzle assembly 50 to likewise be easily removable. Since the heated end effector 100 is heated by an electrical heating element, one or more electrical connections between the heated nozzle assembly 50 and the placement machine are required. The interface block 300 is mounted on the tool changer 200 and provides mechanical support for one or more removable connectors 310 that plug or otherwise removably mate with a respective connector (not shown) on the component placement machine. Although the drawings depict two spade terminal plugs, one of ordinary skill in the art will understand a single plug can be used, and that other types of mating connectors can also be used, such as flush mount connections, surface mount connectors, conductive elastomeric connectors, co-axial connectors, as well as pin jacks such as RCA connectors, phono plugs, etc. All of the above connectors, as well as others, enable the entire heated nozzle assembly 50 to be quickly, easily, and safely removed from the robot or placement machine when wear or damage has occurred, or when other types of conventional nozzles are used in the placement machine. The interface block 300 also provides mechanical support for routing of the electrical circuitry between the connectors 310 and a force compliant electrical contact assembly 142 in the heated end effector. Routing the circuits is accomplished by, for example, discrete hard wiring, printed circuit boards, or flexible circuitry. An alternate embodiment for providing electrical connections is to couple a discrete plug module 312 on the top or sides of the interface block, and rout wires 314 to their destination. The various types of removable electrical connections can be used to provide, for example, AC or DC power and ground to the heating elements, temperature measurement via thermocouple or thermister probes, pressure or vacuum sensing, and optical sensing. Although the drawing depicts coaxial and parallel connectors, one can also employ a single style of connectors, and in this case, to aid a human operator in making the proper connections, one would employ, for example a male plug for power and ground and a female plug for temperature measuring.
  • [0012]
    Referring now to FIG. 2, the replaceable heated end effector 100 contains three main parts: an adapter plate or flange 110, a heater plate 120 and a heated vacuum tip 130. The aluminum adapter flange 110 is arranged such that an upper side 112 mates with a corresponding portion of the vacuum ported tool changer 200. A heater plate 120 is situated directly below the adapter flange 110 and arranged so that it mates with the flange. The heater plate 120 contains one or more heating elements that are electrically coupled to a force compliant electrical contact assembly 142 located in the adapter flange 110. The force compliant electrical contact assembly 142 includes two telescoping electrically conductive pins surrounded by a coil spring, the entire assembly captured in an insulative housing. The force compliant electrical contact assembly provides constant force to both the heating element and the power/ground contacts in the interface block even when they do not maintain a constant distance from each other, that is, the assembly is tolerant of mechanical inaccuracies in the heated nozzle assembly. The adapter flange 110 and the heater plate 120 both mate with and are attached to a heated tip 130 that has a vacuum pickup portion 132 that is designed in the manner of conventional vacuum pickup tool tips, to apply a vacuum force to pick up the electronic components 198. A vacuum is transmitted to the tip via a port or aperture 135 in the tip. This port is arranged to communicate with a corresponding aperture 125 in the heater plate 120, and the heater aperture 125 is also arranged to communicate with a corresponding aperture 115 in the adapter flange 110. All three apertures 135, 125 and 115 also are arranged to communicate with the vacuum that is ported to the tool changer 200. The heated tip 130 is preferably made of aluminum or other material that is light and highly thermally conductive, so as to quickly conduct heat to the electronic component 198 that is being picked up. A thermocouple (not shown) embedded in the end effector assembly monitors the temperature of the heated tip. When the heated tip 132 makes contact with the electronic component 198 such as a flip chip that has been pre-coated with an underfill material and vacuum is applied through the apertures 115, 125 and 135, the component is held against the vacuum pickup portion 132 by vacuum force. While in intimate contact with the heated tip, a finite amount of heat is transferred to the flip chip and the pre-applied underfill material on the flip chip softens to become tacky. This, in turn, secures the chip when it is placed on the printed circuit board, to maintain alignment as the board is transported into the reflow oven. Referring back to FIG. 1, the three main parts of the end effector 100 are held together, for example, by fastening means 150, such as rivets, screws, adhesives, welds, etc.
  • [0013]
    In summary, and without intending to limit the scope of the invention, a replaceable heated nozzle assembly can be quickly and easily connected and removed from a conventional high speed machine for picking and placing electronic components. Plugs or other type of connectors that provide a temporary and removable electrical connection are carried by an interface block that is coupled to the nozzle assembly. Our invention adds an additional degree of flexibility and robustness to prior art end effectors that were hard wired into the placement machines. Those skilled in the art will recognize that the present invention has been described in terms of exemplary embodiments based upon one type of tool changer used in a high speed placement machine or chip shooter. However, the invention should not be so limited, since other variations will occur to those skilled in the art upon consideration of the teachings herein. For example, while we have described and shown in the drawings the use of a cubic ‘interface block’, other configurations of this element can of course be visualized by those skilled in the art, such as miniature connectors, a ‘block’ that is integral to the tool changer, etc.. Accordingly, it is intended that the present invention embrace any and all alternatives, modifications and variations as fall within the scope of the appended claims.
Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US4890241 *Oct 26, 1987Dec 26, 1989Megamation IncorporatedRobotic system
US4980971 *Dec 14, 1989Jan 1, 1991At&T Bell LaboratoriesMethod and apparatus for chip placement
US5033783 *Oct 19, 1989Jul 23, 1991Matsushita Electric Industrial Co., Ltd.Parts mounting apparatus
US5164037 *May 8, 1991Nov 17, 1992Hughes Aircraft CompanyApparatus for removing semiconductor devices from high density multichip modules
US5172949 *Aug 2, 1991Dec 22, 1992Smc Kabushiki KaishaSuction pad with temperature control mechanism
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Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8906001 *Oct 10, 2012Dec 9, 2014Covidien LpElectromechanical surgical apparatus including wire routing clock spring
US20140100554 *Oct 10, 2012Apr 10, 2014Covidien LpElectromechanical Surgical Apparatus Including Wire Routing Clock Spring
Classifications
U.S. Classification156/556, 156/574, 156/571
International ClassificationH05K13/04
Cooperative ClassificationY10T156/1783, Y10T156/178, Y10T156/1744, Y10T29/53191, Y10T156/19, Y10T156/1788, Y10S156/941, H05K13/0408, H05K13/0465
European ClassificationH05K13/04A2, H05K13/04G2
Legal Events
DateCodeEventDescription
Jun 16, 2003ASAssignment
Owner name: MOTOROLA INC., ILLINOIS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MOK, SWEE M.;DANVIR, JANICE M.;WU, CHI-HAUR;REEL/FRAME:014183/0408;SIGNING DATES FROM 20030604 TO 20030612
May 7, 2004ASAssignment
Owner name: FREESCALE SEMICONDUCTOR, INC., TEXAS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MOTOROLA, INC;REEL/FRAME:015360/0718
Effective date: 20040404
Owner name: FREESCALE SEMICONDUCTOR, INC.,TEXAS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MOTOROLA, INC;REEL/FRAME:015360/0718
Effective date: 20040404
May 13, 2005ASAssignment
Owner name: FREESCALE SEMICONDUCTOR, INC., TEXAS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MOK, SWEE M.;DANVIR, JANICE M.;WU, CHI-HUAR;REEL/FRAME:016557/0757;SIGNING DATES FROM 20030604 TO 20030612
Feb 2, 2007ASAssignment
Owner name: CITIBANK, N.A. AS COLLATERAL AGENT, NEW YORK
Free format text: SECURITY AGREEMENT;ASSIGNORS:FREESCALE SEMICONDUCTOR, INC.;FREESCALE ACQUISITION CORPORATION;FREESCALE ACQUISITION HOLDINGS CORP.;AND OTHERS;REEL/FRAME:018855/0129
Effective date: 20061201
Owner name: CITIBANK, N.A. AS COLLATERAL AGENT,NEW YORK
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Jun 19, 2008FPAYFee payment
Year of fee payment: 4
May 13, 2010ASAssignment
Owner name: CITIBANK, N.A., AS COLLATERAL AGENT,NEW YORK
Free format text: SECURITY AGREEMENT;ASSIGNOR:FREESCALE SEMICONDUCTOR, INC.;REEL/FRAME:024397/0001
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Effective date: 20100413
May 17, 2011CCCertificate of correction
Aug 20, 2012REMIMaintenance fee reminder mailed
Jan 4, 2013LAPSLapse for failure to pay maintenance fees
Feb 26, 2013FPExpired due to failure to pay maintenance fee
Effective date: 20130104
Dec 21, 2015ASAssignment
Owner name: FREESCALE SEMICONDUCTOR, INC., TEXAS
Free format text: PATENT RELEASE;ASSIGNOR:CITIBANK, N.A., AS COLLATERAL AGENT;REEL/FRAME:037356/0553
Effective date: 20151207
Owner name: FREESCALE SEMICONDUCTOR, INC., TEXAS
Free format text: PATENT RELEASE;ASSIGNOR:CITIBANK, N.A., AS COLLATERAL AGENT;REEL/FRAME:037354/0225
Effective date: 20151207
Owner name: FREESCALE SEMICONDUCTOR, INC., TEXAS
Free format text: PATENT RELEASE;ASSIGNOR:CITIBANK, N.A., AS COLLATERAL AGENT;REEL/FRAME:037356/0143
Effective date: 20151207