US20050011541A1 - Error-preventing device and method for semiconductor fabrication equipment - Google Patents
Error-preventing device and method for semiconductor fabrication equipment Download PDFInfo
- Publication number
- US20050011541A1 US20050011541A1 US10/918,728 US91872804A US2005011541A1 US 20050011541 A1 US20050011541 A1 US 20050011541A1 US 91872804 A US91872804 A US 91872804A US 2005011541 A1 US2005011541 A1 US 2005011541A1
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- US
- United States
- Prior art keywords
- optical sensor
- sensor unit
- gas supply
- fixing guide
- pure water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Definitions
- the present invention relates to semiconductor fabrication equipment. More particularly, the invention relates to a device and method for preventing errors in a sensing operation during a wafer cleaning process.
- a wet clean station supplies N 2 gas and pure water (DI) to wafers to remove wafer impurities such as polymer particles. Wafers are cleaned in a pure water bath (DI Water Bath) of the wet station.
- DI Water Bath pure water bath
- a quartz wet station includes an optical fiber sensor attached to the outside of the pure water bath. The optical fiber sensor detects whether a wafer is present in the pure water bath.
- FIG. 1 is a cross sectional view of a conventional wet clean station having optical fiber sensors 20 a , 20 b disposed on the outside of the pure water bath 10 .
- a conventional wet clean station includes a pure water bath 10 .
- the pure water bath 10 receives a wafer. Pure water is supplied to the pure water bath 10 to clean the wafer.
- First and second fixing guides 12 a , 12 b are disposed at the upper and lower portions of the pure water bath 10 , respectively, to fix an optical fiber sensor thereto.
- First and second gas supply pipes 14 a , 14 b are respectively inserted into the fixing guides 12 a , 12 b to supply nitrogen (N 2 ) gas to the inner side of the fixing guides 12 a , 12 b .
- First and second gas supply boxes 22 a , 22 b supply the N 2 gas through a gas inlet (N 2 Input) to a respective one of the first and second gas supply pipes 14 a , 14 b .
- the gas supply boxes 22 a , 22 b discharge the gas from the respective one of the first and second supply pipes 14 a , 14 b through a gas outlet (N 2 Output).
- the first gas supply pipe 14 a is provided with first and second O-rings 16 a , 18 a around its outer circumference.
- the second gas supply pipe 14 b is provided with third and fourth O-rings 16 b , 18 b around its outer circumference.
- the first and second gas supply pipes 14 a , 14 b respectively include first and second optical fibers 20 a , 20 b .
- the first through fourth O-rings 16 a , 18 a , 16 b , 18 b serve to prevent pure water from flowing into the first and second fixing guides 12 a , 12 b from the outside.
- the first through fourth O-rings 16 a , 18 a , 16 b , 18 b also serve to prevent N 2 gas from being discharged from the first and second fixing guides 12 a , 12 b .
- the first and second O-rings 16 a , 18 a , and the third and fourth O-rings 16 b , 18 b further serve to secure the first and second gas supply pipes 14 a , 14 b into the first and second fixing guides 12 a , 12 b , respectively.
- the pure water bath 10 of the wet station is supplied with pure water having a temperature of approximately 70° C. After cleaning the wafer, the waste water is then discharged, and a robot transfers the wafers from the pure water bath 10 to the next pure water bath.
- the first and second optical fibers 20 a , 20 b detect whether a wafer is present in the pure water bath 10 .
- the first fiber 20 a emits light and the second fiber 20 b receives the emitted light when no wafers are present.
- the temperature difference between the pure water (approximately 70° C.) and the outside room temperature (approximately 25° C.) results in dew forming on the outside surface of the pure water bath 10 .
- Dew also forms inside the first and second fixing guides 12 a , 12 b .
- the presence of dew in the fixing guides 12 a , 12 b prevents the optical sensors 20 a , 20 b from transmitting and receiving light therethrough. This can result in errors in equipment operation because the system may operate as if wafers are present in the pure water bath 10 even when no wafers are present. If the first and second sensing fibers 20 a , 20 b experience errors in operation, the robot will stop transferring the wafers into the wet station, resulting in the wafers being dried in air. This causes inferior wafer quality.
- N 2 gas is supplied to the first and second gas supply boxes 22 a , 22 b through the N 2 Inputs.
- Gas from the gas supply boxes 22 a , 22 b is supplied to the gas supply pipes 14 a , 14 b .
- Gas pressure (for example, 0.2 to 1 Kgf/m 2 ) builds up in the inner side of the first and second fixing guides 12 a , 12 b .
- Dew that is formed on the outside of the pure water bath 10 is discharged through the N 2 Output due to the pressure created by the N 2 gas. In this way, dew formed on the outside of the pure water bath 10 can be removed to prevent sensing errors.
- the gas pressure built up in the fixing guides 12 a , 12 b may cause the gas supply pipes 14 a , 14 b to become separated from the first and second fixing guides 12 a , 12 b . It would be desirable to have a device and method that prevented sensing errors. It would further be desirable to have a device and method that prevented unwanted pipe separation while preventing sensing errors.
- an object of the present invention is to provide an error-preventing device that prevents errors in the operation of optical sensor units for semiconductor fabrication equipment.
- Another object of the present invention is to provide a method for preventing errors in the operation of the optical fiber sensors of the fabrication equipment.
- a wet clean station includes a pure water bath for receiving pure water or chemicals to remove particles from a wafer.
- the pure water bath can be further configured to discharge waste water after removing the particles.
- Gas supply pipes are provided having optical fiber sensors inserted into the gas supply pipes.
- Fixing guides are disposed on the outside of the pure water bath to fix the optical fiber sensors thereto. Purge output holes are formed at predetermined locations along the fixing guides.
- the fabrication equipment preferably includes a cleaning station and an optical sensor unit.
- the cleaning station may be pure water bath.
- the optical sensor unit can include gas supply pipes, fixing guides, and optical sensors.
- the method includes discharging excess pressure and/or moisture from the optical sensor unit. This can be done, for instance, by forming purge output holes in the fixing guides to permit the expulsion of excess pressure and moisture therefrom.
- FIG. 1 is a cross sectional view of a conventional wet station pure water bath showing the position of optical fiber sensors
- FIG. 2 is a cross sectional view of a wet station according to a preferred embodiment of the present invention, also showing the position of optical fiber sensors provided on the outside the pure water bath and further showing the location of purge holes provided in fixing guides to reduce sensing errors.
- FIG. 2 is a cross sectional view of a wet station pure water bath according to a preferred embodiment of the present invention.
- a wet station according to this preferred embodiment includes a pure water bath 10 for loading and cleaning wafers.
- First and second fixing guides 12 a , 12 b are disposed at each of the upper and lower portions of the pure water bath 10 , respectively to fix an optical fiber sensor thereto.
- First and second gas supply pipes 14 a , 14 b are inserted into the fixing guides 12 a , 12 b and are configured to supply N 2 gas to the inner side of the fixing guides 12 a , 12 b .
- Gas supply boxes 22 a , 22 b are provided to supply the N 2 gas to the first and second gas supply pipes 14 a , 14 b through gas inlets (N 2 Input) and to discharge the N 2 gas from the first and second supply pipes 14 a , 14 b through gas outlets (N 2 Output).
- the first gas supply pipe 14 a is provided with first and second O-rings 16 a , 18 a around the outer circumference thereof.
- the second gas supply pipe 14 b is provided with third and fourth O-rings 16 b , 18 b around its outer circumference.
- the first and second gas supply pipes 14 a , 14 b are provided therein with first and second optical fibers 20 a , 20 b , respectively.
- the first through fourth O-rings 16 a , 18 a , 16 b , 18 b serve to prevent pure water from flowing into the first and second fixing guides 12 a , 12 b from the outside.
- the first through fourth O-rings 16 a , 18 a , 16 b , 18 b also prevent N 2 gas from being discharged from ends of the first and second fixing guides 12 a , 12 b .
- the first and second O-rings 16 a , 18 a and the third and fourth O-rings 16 b , 18 b respectively, further aid in securing the first and second gas supply pipes 14 a , 14 b into a respective one of the first and second fixing guides 12 a , 12 b.
- the fixing guides 12 a , 12 b are further provided with purge output holes 24 a , 24 b at predetermined locations thereon.
- the purge holes 24 a , 24 b permit the discharge of dew formed therein.
- N 2 gas that is supplied through the first and second gas supply pipes 14 a , 14 b to the fixing guides 12 a , 12 b is released through the purge holes 24 a , 24 b , thereby expelling dew and preventing N 2 pressure build-up that could cause the first and second gas supply pipes 14 a , 14 b to separate from the first and second fixing guides 12 a , 12 b .
- the first and second gas supply pipes 14 a , 14 b , the gas supply boxes 22 a , 22 b , and first and second optical fibers 20 a , 20 b can be considered to collectively form an optical sensor unit.
- the wet station pure water bath 10 is supplied with hot pure water having a temperature of approximately 70° C. to clean a wafer. After cleaning the wafer, the waste water is discharged, and a robot transfers the wafers from the pure water bath 10 to another pure water bath. When the wafers are transferred to the next pure water bath, the first and second optical fibers 20 a , 20 b detect whether a wafer is present in the pure water bath 10 .
- the first and second optical fibers preferably have a light emitting part and a light receiving part.
- the first fiber 20 a can be configured to emit light and the second fiber 20 b can be configured to receive light.
- the temperature difference results in dew formation on the outside surface of the pure water bath 10 as well as in the first and second fixing guides 12 a , 12 b .
- the dew build-up prevents the first and second optical fibers 20 a , 20 b from transmitting and receiving light and can thereby result in a false detection of a wafer.
- This error in a sensing operation causes the unit to operate as if wafers are present in the pure water bath 10 of the wet station, even though no wafers are present therein.
- these sensing errors are prevented.
- gas pressure for example, from between 0.2 to 1 Kgf/m 2
- the N 2 gas pressure causes dew formed outside the pure water bath 10 in the fixing guides 12 a , 12 b to be discharged through the purge output holes 24 a , 24 b .
Abstract
A device for preventing errors during semiconductor wafer fabrication can be configured to prevent separation of optical sensor unit components, such as a gas supply pipe and a fixing guide, that could be caused by excess N2 gas pressure. The device can also be configured to prevent excess moisture build-up that can lead to wafer sensing errors. The device includes a bath for receiving pure water or chemicals to remove particles. The bath can be further configured to discharge waste water after removal of the particles. Fixing guides are disposed at the outside of the bath to fix optical fiber sensors thereto. Optical fiber sensors are inserted into gas supply pipes, partially secured within the fixing guides. Purge output holes are formed at predetermined locations along the fixing guides to release N2 gas pressure. A method for releasing excess pressure and a method for discharging excess moisture from an optical sensor unit are also provided.
Description
- This application is a divisional of U.S. patent Ser. No. 09/995,295, filed on Nov. 27, 2001, now pending, which is herein incorporated by reference in its entirety.
- 1. Field of the Invention
- The present invention relates to semiconductor fabrication equipment. More particularly, the invention relates to a device and method for preventing errors in a sensing operation during a wafer cleaning process.
- 2. Description of Related Art
- A wet clean station supplies N2 gas and pure water (DI) to wafers to remove wafer impurities such as polymer particles. Wafers are cleaned in a pure water bath (DI Water Bath) of the wet station. A quartz wet station (Quartz DI Water Bath) includes an optical fiber sensor attached to the outside of the pure water bath. The optical fiber sensor detects whether a wafer is present in the pure water bath.
-
FIG. 1 is a cross sectional view of a conventional wet clean station havingoptical fiber sensors pure water bath 10. Referring toFIG. 1 , a conventional wet clean station includes apure water bath 10. Thepure water bath 10 receives a wafer. Pure water is supplied to thepure water bath 10 to clean the wafer. First andsecond fixing guides pure water bath 10, respectively, to fix an optical fiber sensor thereto. First and secondgas supply pipes fixing guides fixing guides gas supply boxes gas supply pipes gas supply boxes second supply pipes - The first
gas supply pipe 14 a is provided with first and second O-rings 16 a, 18 a around its outer circumference. The secondgas supply pipe 14 b is provided with third and fourth O-rings gas supply pipes optical fibers rings second fixing guides rings second fixing guides rings 16 a, 18 a, and the third and fourth O-rings gas supply pipes second fixing guides - The
pure water bath 10 of the wet station is supplied with pure water having a temperature of approximately 70° C. After cleaning the wafer, the waste water is then discharged, and a robot transfers the wafers from thepure water bath 10 to the next pure water bath. When the wafers are transferred to the next pure water bath of the wet station, the first and secondoptical fibers pure water bath 10. During normal operation, thefirst fiber 20 a emits light and thesecond fiber 20 b receives the emitted light when no wafers are present. - Unfortunately, the temperature difference between the pure water (approximately 70° C.) and the outside room temperature (approximately 25° C.) results in dew forming on the outside surface of the
pure water bath 10. Dew also forms inside the first andsecond fixing guides fixing guides optical sensors pure water bath 10 even when no wafers are present. If the first andsecond sensing fibers - To prevent operation error, N2 gas is supplied to the first and second
gas supply boxes gas supply boxes gas supply pipes second fixing guides pure water bath 10 is discharged through the N2 Output due to the pressure created by the N2 gas. In this way, dew formed on the outside of thepure water bath 10 can be removed to prevent sensing errors. - Unfortunately, however, the gas pressure built up in the
fixing guides gas supply pipes second fixing guides - Accordingly, an object of the present invention is to provide an error-preventing device that prevents errors in the operation of optical sensor units for semiconductor fabrication equipment.
- Another object of the present invention is to provide a method for preventing errors in the operation of the optical fiber sensors of the fabrication equipment.
- In order to achieve the foregoing objects, a wet clean station according to a preferred embodiment of the present invention includes a pure water bath for receiving pure water or chemicals to remove particles from a wafer. The pure water bath can be further configured to discharge waste water after removing the particles. Gas supply pipes are provided having optical fiber sensors inserted into the gas supply pipes. Fixing guides are disposed on the outside of the pure water bath to fix the optical fiber sensors thereto. Purge output holes are formed at predetermined locations along the fixing guides.
- A method for preventing errors in the operation of fabrication equipment is also provided. The fabrication equipment preferably includes a cleaning station and an optical sensor unit. The cleaning station may be pure water bath. The optical sensor unit can include gas supply pipes, fixing guides, and optical sensors. The method includes discharging excess pressure and/or moisture from the optical sensor unit. This can be done, for instance, by forming purge output holes in the fixing guides to permit the expulsion of excess pressure and moisture therefrom.
- Preferred embodiments of the present invention will now be explained with reference to the accompanying drawings, in which:
-
FIG. 1 is a cross sectional view of a conventional wet station pure water bath showing the position of optical fiber sensors; and -
FIG. 2 is a cross sectional view of a wet station according to a preferred embodiment of the present invention, also showing the position of optical fiber sensors provided on the outside the pure water bath and further showing the location of purge holes provided in fixing guides to reduce sensing errors. - As noted above,
FIG. 2 is a cross sectional view of a wet station pure water bath according to a preferred embodiment of the present invention. Referring toFIG. 2 , a wet station according to this preferred embodiment includes apure water bath 10 for loading and cleaning wafers. First and second fixing guides 12 a, 12 b are disposed at each of the upper and lower portions of thepure water bath 10, respectively to fix an optical fiber sensor thereto. First and secondgas supply pipes Gas supply boxes gas supply pipes second supply pipes - The first
gas supply pipe 14 a is provided with first and second O-rings 16 a, 18 a around the outer circumference thereof. The secondgas supply pipe 14 b is provided with third and fourth O-rings gas supply pipes optical fibers rings rings rings 16 a, 18 a and the third and fourth O-rings gas supply pipes - The fixing guides 12 a, 12 b according to this embodiment of the invention are further provided with purge output holes 24 a, 24 b at predetermined locations thereon. The purge holes 24 a, 24 b permit the discharge of dew formed therein. N2 gas that is supplied through the first and second
gas supply pipes gas supply pipes gas supply pipes gas supply boxes optical fibers - The wet station
pure water bath 10 is supplied with hot pure water having a temperature of approximately 70° C. to clean a wafer. After cleaning the wafer, the waste water is discharged, and a robot transfers the wafers from thepure water bath 10 to another pure water bath. When the wafers are transferred to the next pure water bath, the first and secondoptical fibers pure water bath 10. The first and second optical fibers preferably have a light emitting part and a light receiving part. For example, thefirst fiber 20 a can be configured to emit light and thesecond fiber 20 b can be configured to receive light. - Since the pure water is at about 70° C. and the outside temperature is around 25° C., the temperature difference results in dew formation on the outside surface of the
pure water bath 10 as well as in the first and second fixing guides 12 a, 12 b. The dew build-up prevents the first and secondoptical fibers pure water bath 10 of the wet station, even though no wafers are present therein. - According to the preferred embodiment of this invention, these sensing errors are prevented. Specifically, when N2 gas is supplied to the first and second
gas supply boxes pure water bath 10, gas pressure (for example, from between 0.2 to 1 Kgf/m2) starts to build up in the inner side of the first and second fixing guides 12 a, 12 b. The N2 gas pressure causes dew formed outside thepure water bath 10 in the fixing guides 12 a, 12 b to be discharged through the purge output holes 24 a, 24 b. Additionally, since the N2 gas from the fixing guides 12 a, 12 b is discharged through the purge output holes 24 a, 24 b, excessive pressure build up is avoided and the first and secondgas supply pipes - As described above, by forming purge holes 24 a, 24 b at predetermined locations on the fixing guides 12 a, 12 b, dew formed inside the fixing guides 12 a, 12 b can be discharged. Also, the
fiber sensors fiber sensors
Claims (12)
1. A method for preventing operation errors in a semiconductor fabrication system, said method comprising:
providing a cleaning station comprising an optical sensor unit;
arranging the optical sensor unit to detect the presence of a wafer in the cleaning station;
discharging excess moisture from the optical sensor unit to prevent errors in a sensing operation.
2. A method according to claim 1 , wherein the optical sensor unit comprises a fixing guide attached to the outside of the cleaning station, a gas supply pipe disposed at least partially within the fixing guide, and an optical sensor disposed at least partially within the gas supply pipe.
3. A method according to claim 2 , wherein the fixing guide further comprises one or more purge output holes configured to discharge excess moisture.
4. A method according to claim 1 , further comprising discharging excess pressure from the optical sensor unit to prevent unwanted separation of optical sensor unit components.
5. A method according to claim 4 , wherein the optical sensor unit comprises a fixing guide attached to the outside of the cleaning station, a gas supply pipe disposed at least partially within the fixing guide, and an optical sensor disposed at least partially within the gas supply pipe.
6. A method according to claim 5 , wherein the fixing guide comprises one or more purge output holes configured to discharge excess pressure from the optical sensor unit to prevent unwanted separation of the fixing guide and the gas supply pipe.
7. A method for preventing operation errors in a semiconductor fabrication system, said method comprising:
providing a cleaning station comprising an optical sensor unit;
arranging the optical sensor unit to detect the presence of a wafer in the cleaning station;
discharging excess pressure from the optical sensor unit to prevent unwanted separation of optical sensor unit components.
8. A method according to claim 7 , wherein the optical sensor unit comprises a fixing guide attached to the outside of the cleaning station, a gas supply pipe disposed at least partially within the fixing guide, and an optical sensor disposed at least partially within the gas supply pipe.
9. A method according to claim 8 , wherein the fixing guide further comprises one or more purge output holes configured to discharge excess pressure.
10. A method according to claim 7 , further comprising discharging excess moisture from the optical sensor unit to prevent errors in a sensing operation.
11. A method according to claim 10 , wherein the optical sensor unit comprises a fixing guide attached to the outside of the cleaning station, a gas supply pipe disposed at least partially within the fixing guide, and an optical sensor disposed at least partially within the gas supply pipe.
12. A method according to claim 11 , wherein the fixing guide comprises one or more purge output holes configured to discharge excess moisture from the optical sensor unit to prevent sensing errors of the optical sensor unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/918,728 US20050011541A1 (en) | 2001-02-07 | 2004-08-12 | Error-preventing device and method for semiconductor fabrication equipment |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0005800A KR100387526B1 (en) | 2001-02-07 | 2001-02-07 | Device for preventing error of wafer sensing in semiconductor manufacture equipment |
KR2001-5800 | 2001-02-07 | ||
US09/995,295 US6799590B2 (en) | 2001-02-07 | 2001-11-27 | Error-preventing device and method for semiconductor fabrication equipment |
US10/918,728 US20050011541A1 (en) | 2001-02-07 | 2004-08-12 | Error-preventing device and method for semiconductor fabrication equipment |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/995,295 Division US6799590B2 (en) | 2001-02-07 | 2001-11-27 | Error-preventing device and method for semiconductor fabrication equipment |
Publications (1)
Publication Number | Publication Date |
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US20050011541A1 true US20050011541A1 (en) | 2005-01-20 |
Family
ID=19705425
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Application Number | Title | Priority Date | Filing Date |
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US09/995,295 Expired - Fee Related US6799590B2 (en) | 2001-02-07 | 2001-11-27 | Error-preventing device and method for semiconductor fabrication equipment |
US10/918,728 Abandoned US20050011541A1 (en) | 2001-02-07 | 2004-08-12 | Error-preventing device and method for semiconductor fabrication equipment |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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US09/995,295 Expired - Fee Related US6799590B2 (en) | 2001-02-07 | 2001-11-27 | Error-preventing device and method for semiconductor fabrication equipment |
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US (2) | US6799590B2 (en) |
KR (1) | KR100387526B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170135364A1 (en) * | 2012-07-06 | 2017-05-18 | Conopco, Inc., D/B/A Unilever | Method, device and capsule for brewing a beverage |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100560661B1 (en) | 2003-06-19 | 2006-03-16 | 삼성전자주식회사 | Reading Scheme Of Magnetic Memory |
KR101448442B1 (en) * | 2013-06-13 | 2014-10-13 | 주식회사 케이씨텍 | Apparatus of detecting slip-out of wafer in chemical mechanical polishing apparatus |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4696712A (en) * | 1983-11-07 | 1987-09-29 | Disco Abrasive Systems, Ltd. | Semiconductor wafer mounting and cutting system |
US5421056A (en) * | 1993-04-19 | 1995-06-06 | Tokyo Electron Limited | Spin chuck and treatment apparatus using same |
US5529638A (en) * | 1992-11-30 | 1996-06-25 | Ontrak Systems, Inc. | Method for wafer scrubbing |
US5830277A (en) * | 1995-05-26 | 1998-11-03 | Mattson Technology, Inc. | Thermal processing system with supplemental resistive heater and shielded optical pyrometry |
US20020117188A1 (en) * | 2001-02-28 | 2002-08-29 | Vladimir Galburt | Wafer presence sensor for detecting quartz wafers |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2877216B2 (en) * | 1992-10-02 | 1999-03-31 | 東京エレクトロン株式会社 | Cleaning equipment |
KR100193733B1 (en) * | 1996-06-08 | 1999-06-15 | 윤종용 | Semiconductor Wafer Cleaning Equipment |
JP3232443B2 (en) * | 1996-08-12 | 2001-11-26 | 東京エレクトロン株式会社 | Liquid treatment method and apparatus |
JP2000124293A (en) * | 1998-10-16 | 2000-04-28 | Hitachi Plant Eng & Constr Co Ltd | Wafer detecting device for wafer washing vessel |
-
2001
- 2001-02-07 KR KR10-2001-0005800A patent/KR100387526B1/en not_active IP Right Cessation
- 2001-11-27 US US09/995,295 patent/US6799590B2/en not_active Expired - Fee Related
-
2004
- 2004-08-12 US US10/918,728 patent/US20050011541A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4696712A (en) * | 1983-11-07 | 1987-09-29 | Disco Abrasive Systems, Ltd. | Semiconductor wafer mounting and cutting system |
US5529638A (en) * | 1992-11-30 | 1996-06-25 | Ontrak Systems, Inc. | Method for wafer scrubbing |
US5421056A (en) * | 1993-04-19 | 1995-06-06 | Tokyo Electron Limited | Spin chuck and treatment apparatus using same |
US5830277A (en) * | 1995-05-26 | 1998-11-03 | Mattson Technology, Inc. | Thermal processing system with supplemental resistive heater and shielded optical pyrometry |
US20020117188A1 (en) * | 2001-02-28 | 2002-08-29 | Vladimir Galburt | Wafer presence sensor for detecting quartz wafers |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170135364A1 (en) * | 2012-07-06 | 2017-05-18 | Conopco, Inc., D/B/A Unilever | Method, device and capsule for brewing a beverage |
Also Published As
Publication number | Publication date |
---|---|
KR100387526B1 (en) | 2003-06-18 |
US20020104553A1 (en) | 2002-08-08 |
US6799590B2 (en) | 2004-10-05 |
KR20020065669A (en) | 2002-08-14 |
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