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Publication numberUS20050037611 A1
Publication typeApplication
Application numberUS 10/938,768
Publication dateFeb 17, 2005
Filing dateSep 10, 2004
Priority dateApr 18, 2001
Also published asUS6800918, US7390736, US20020155655
Publication number10938768, 938768, US 2005/0037611 A1, US 2005/037611 A1, US 20050037611 A1, US 20050037611A1, US 2005037611 A1, US 2005037611A1, US-A1-20050037611, US-A1-2005037611, US2005/0037611A1, US2005/037611A1, US20050037611 A1, US20050037611A1, US2005037611 A1, US2005037611A1
InventorsHarry Pon
Original AssigneePon Harry Q.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
EMI and noise shielding for multi-metal layer high frequency integrated circuit processes
US 20050037611 A1
Abstract
A circuit element that may generate or be affected by noise or electromagnetic interference may be substantially surrounded by one or more encircling plugs. The encircling plug may be closed by an interconnection layer. The plug may be grounded to reduce the electromagnetic interference or noise generated by or coupled to said passive circuit element.
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Claims(16)
1. A method comprising:
forming a trench around an electrical component;
filling said trench with a conductive material; and
forming an interconnection layer coupled to said conductive material.
2. The method of claim 1 including forming said trench between said interconnection layer and a semiconductor structure.
3. The method of claim 1 including forming said trench between a pair of interconnection layers.
4. The method of claim 3 including forming a first trench between a first pair of interconnection layers and a second trench between a second pair of interconnection layers and positioning a passive circuit element between said trenches.
5. The method of claim 1 including grounding said material.
6. The method of claim 1 including positioning a passive circuit element within an enclosure formed by said material and layer.
7. The method of claim 6 including forming an opening in said material to allow an electrical connection to said passive circuit element.
8. The method of claim 6 including connecting said passive circuit element to other devices through a buried contact.
9. The method of claim 1 including electrically coupling said material and said interconnection layer.
10. The method of claim 6 including forming a flat spiral inductor to act as said passive circuit element over said semiconductor structure.
11. The method of claim 10 including forming a resistor and capacitor.
12. The method of claim 1 including forming said material over a guard ring.
13-21. (Canceled)
22. A method comprising:
forming an integrated passive circuit element; and
substantially enclosing said element using a trench filled with a conductive material.
23. The method of claim 22 including forming an interconnection layer coupled to said material.
24-30. (Canceled)
Description
    BACKGROUND
  • [0001]
    This invention relates generally to integrated circuits including integrated circuits with passive components such as inductors or capacitors and integrated circuits with active elements such as transistors.
  • [0002]
    A variety of integrated circuits may include passive components such as inductors or capacitors. For example, radio frequency circuits utilized in connection with radio transceivers or cellular telephones may include both logic elements, mixed signal elements and analog elements.
  • [0003]
    In some cases, noise or electromagnetic interference produced by the passive or active components may interfere with the operation of other passive or active components or components formed in the same substrate with the passive components. For example, complementary metal oxide semiconductor structures may be formed that define logic elements as well as radio frequency elements having passive components. Integrated capacitors or inductors may be formed over the same substrate that includes logic elements. The substrate may be formed of silicon or germanium material as examples.
  • [0004]
    In many cases, the high frequency radio frequency devices may be formed on separate integrated circuits to avoid interference between logic devices and components that operate in radio frequency range. This avoids the problem of noise being coupled through the substrate. However, using separate integrated circuits significantly increases the cost of the combined circuitry. Integration of more components into the same integrated circuit generally reduces costs. Moreover, integration into the same circuit normally also results in higher performance.
  • [0005]
    Thus, there is a need for techniques that facilitate the formation of active and passive circuit components, operating for example a high frequencies, on the same semiconductor substrate that also includes other components such as logic devices.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0006]
    FIG. 1 is a greatly enlarged, partial cross-sectional view through one embodiment of the present invention;
  • [0007]
    FIG. 2 is an enlarged cross-sectional view taken generally along the line 2-2 in FIG. 1;
  • [0008]
    FIG. 3 is an enlarged, partial cross-sectional view illustrating the fabrication process for the structure shown in FIG. 1 in accordance with one embodiment of the present invention;
  • [0009]
    FIG. 4 shows a cross-sectional view of a subsequent step in the fabrication process shown in FIG. 3;
  • [0010]
    FIG. 5 shows a subsequent step in the fabrication process also shown in FIGS. 3 and 4;
  • [0011]
    FIG. 6 shows a subsequent step in the fabrication process also shown in FIGS. 3 through 5;
  • [0012]
    FIG. 7 is a greatly enlarged, partial cross-sectional view through another embodiment of the present invention;
  • [0013]
    FIG. 8 is an enlarged, cross-sectional view taken generally along the line 8-8 in FIG. 7;
  • [0014]
    FIG. 9 is an enlarged top plan view of another embodiment of the present invention;
  • [0015]
    FIG. 10 is an enlarged cross-sectional view taken generally along the line 10-10 in FIG. 9; and
  • [0016]
    FIG. 11 is a schematic depiction of one embodiment of the present invention.
  • DETAILED DESCRIPTION
  • [0017]
    Referring to FIG. 1, an integrated circuit 10 may include a semiconductor substrate or structure 12 formed from a wafer of semiconductor material. The semiconductor material may include silicon as one example or silicon and germanium, germanium, or gallium arsenide, as additional examples. The circuit 10 may use a bipolar, complementary metal oxide semiconductor (CMOS), silicon or insulator (SOI), or biCMOS technology.
  • [0018]
    Over the semiconductor structure 12, one or more interconnection layers such as the interconnection layers 20, 22 and 24 may be defined. Interconnection layers are also sometimes called metal layers, metallizations or polysilicon layers. The layers 20, 22 and 24 are conventionally formed as part of an existing process involving the deposition of a conductive material, such as a metal, polysilicon or a silicide, and patterning the deposited conductive material. As a result, interconnections may be made between interconnection layers and the structure 12 or between devices coupled through a single interconnection layer. Thus, the use of interconnection layers such as the layers 20, 22 and 24 facilitates the interconnection of circuit devices that may be formed on or above the semiconductor structure 12.
  • [0019]
    While the illustrated embodiment shows three interconnection layers 20, 22 and 24, additional layers may be included either above or below the layers depicted. The interconnection layers 20, 22 and 24 are separated by insulation layers 14, 16 and 18 which conventionally are formed of a dielectric such as oxide.
  • [0020]
    The resulting integrated circuit 10 includes one or more interconnection layers such as the layer 20 positioned over the semiconductor structure 12. Vertical conductive elements or plugs 26 and 28 may be formed between successive pairs of overlaying interconnection layers such as the layers 20 and 22 and the layers 22 and 24, in one embodiment of the present invention. In other embodiments, a plug 26 may be formed between the semiconductor structure 12 and an overlaying interconnection layer 20.
  • [0021]
    The concept of the enclosure formed by layers 20 and 22 and plugs 26 and 28 is further illustrated in connection with FIG. 11, which shows a structure removed from the substrate in three dimensions. An upper plate 24A may be formed of a metallization layer, a polysilicon layer, or even a doped semiconductor layer. The bottom layer 20A can be formed of any of the above possibilities. The intervening wall of the resulting structure, 26A, 28A may be formed of vertically disposed plugs, as one example. The component, active or passive, to be isolated is generally defined within the enclosure depicted in FIG. 11. Thus, effectively an enclosure may be formed, which completely surrounds and thereby isolates the enclosed active or passive component.
  • [0022]
    As shown in FIG. 2, a passive circuit element 30 may be formed in an interconnection layer 22 in one embodiment of the present invention. In the illustrated example, the passive circuit element 30 includes a spiral, flat inductor with a contact 32. The element 30 may develop inductance when current is conducted between the contact 32 and a conductive line 33 that extends through an opening 35 a defined in the plug 28. The contact 32 may be coupled, for example by a buried layer 31 and a line 36, to other circuit elements (not shown). The term buried layer is intended to refer to a doped layer that extends through a semiconductor substrate.
  • [0023]
    Where plugs 28 or 26 extend both above and below the passive circuit element 30, the enclosure formed by the encircling or surrounding plugs 26 and 28 may be substantially closed by underlying interconnection layer 20 and overlying interconnection layer 24. The layers 20 and 24 may be horizontal plates in one embodiment. A passive circuit element 30 may be effectively shielded from other circuit elements also provided on the integrated circuit 10 and vice versa. That is, the layers 20, 22 and 24 as well as the plugs 26 and 28 may be formed of a material that reduces either or both of the noise or electromagnetic interference (EMI) arising from the passive or active circuit elements 30 or from surrounding devices coupled to the element 30. In one embodiment the enclosure may be bounded on a lower side by a well such as a P or N well.
  • [0024]
    In one embodiment of the present invention, the plugs 26 and 28 are coupled by a conductive line 37 in one of the interconnection layers 20, 22, 24 to a ground connection so that the overall surrounding structure is grounded. In one embodiment, the material utilized to form the plugs 26 and 28 may be a metallic material such as tungsten or aluminum as two examples. The plugs 26, 28 may be coupled to the ground, Vcc, or some other potential or they may float.
  • [0025]
    Referring to FIG. 3, a process for forming the semiconductor device 10, in accordance with one embodiment of the present invention, begins by forming an insulation layer 16 over a layer 20. Thereafter, as shown in FIG. 4, a trench 38 may be formed in the insulation layer 16 using conventional patterning techniques. The trench 38 may then be filled with metallic material to create a plug 26 that substantially surrounds a portion of the interconnection layer 20 containing the passive or active circuit element 30 as shown in FIG. 5.
  • [0026]
    Thereafter, referring to FIG. 6, an overlying interconnection layer 22 may be formed over and electrically coupled to the plug 26. In one embodiment of the present invention, the layer 22 may be patterned to define a passive circuit element 30 such as an inductor or a capacitor. In some embodiments, an inductor may be formed from one or more interconnection layers and an appropriate surrounding shield formed from plugs 26 and 28 may be defined between a plurality of overlying interconnection layers.
  • [0027]
    Advantageously, the plugs 26 and 28 substantially surround the passive circuit element 30 to prevent the coupling of noise or other signals. However, in some cases, relatively small openings, such as the opening 35, may be permitted for interconnection purposes. As one example, the opening may be a zigzag opening to reduce the noise coupling.
  • [0028]
    Referring to FIG. 7, in accordance with another embodiment of the present invention, a plug 26 may extend from the semiconductor structure 12 to an interconnection layer 20 through an insulation layer 14. A passive circuit element (not shown in FIG. 7) may be formed over or on the semiconductor structure 12. The inverted U-shaped structure defined by the interconnection layer 20 and the plug 26 may substantially or completely enclose the passive circuit element. For example, the passive circuit element may be formed with an active device on the structure 12 or may be formed in connection with a polysilicon layer associated with the structure 12.
  • [0029]
    Referring to FIG. 8, a passive circuit element 30 such as a flat spiral inductor, may be formed with contacts 32 and 34. The contacts 32 and 34 may make contact with overlying or other passive components such as underlying circuit elements such as active components included on the semiconductor structure 12. Thus, inductive effects may be provided by the spiral shape of the element 30 when current passes between the contacts 34 and 32. The contacts 32 and 34 may be coupled to lines 36 through vias (not shown) or buried contacts 31 that may extend vertically under the plug 26 and through the integrated circuit 10 in accordance with one embodiment of the present invention. The plug 26 may be grounded through a line (not shown) in the layer 20.
  • [0030]
    Referring to FIG. 9, the semiconductor structure 40 may integrate not only passive components but also active components such as active areas 44 including metal oxide semiconductor field effect transistors (MOSFETs) formed from doped regions on diffusions 50 and gates 46. The active regions 44 are surrounded by a guard ring 42 that extends into the structure 40 and may be formed as a substrate diffusion. Thus, the guard ring 42 may provide intrasubstrate isolation from EMI and other spurious signals.
  • [0031]
    Referring to FIG. 10, the structure 40 may include the intrasubstrate guard ring 42. The guard ring 42 may completely encircle the active areas 44 including the source and drain diffusions 50, the gate 46 and the gate dielectric 66. The guard ring 42 and the source and drain diffusions 50 may all be formed in the substrate 52. Field oxide isolation 60 may be formed over the substrate 52.
  • [0032]
    Extending upwardly from the guard ring 42 is a metallic or conductive plug 58. Like the guard ring 42, the plug 58 may extend completely around the areas 44 that include the transistors formed from diffusions 50 and gates 46. As a result, the upstanding plug 58 provides isolation for components situated over the substrate 52 from noise from surrounding components and shields surrounding components from noise generated by devices within the plug 58 enclosed region.
  • [0033]
    In one embodiment of the present invention, an electrical connection may be from the plug 58 to a guard ring connection 54. The guard ring connection 54 may be a metal line, for example formed in a metal one layer, in one embodiment of the present invention, that connects to ground or other suitable potential for appropriately biasing the guard ring 42. In other embodiments of the present invention, an intermediate metal layer may be formed between the substrate 52 and the metal one layer to act as a cap over the top of the active areas 44.
  • [0034]
    Thus, with the embodiment shown in FIGS. 9 and 10, both active and passive components may be isolated from spurious signals such as EMI noise or external components. The protection may be provided in the region between metal layers and the substrate, between metal layers themselves and beneath the substrate by virtue of the guard ring 42.
  • [0035]
    While the present invention has been described with respect to a limited number of embodiments, those skilled in the art will appreciate numerous modifications and variations therefrom. It is intended that the appended claims cover all such modifications and variations as fall within the true spirit and scope of this present invention.
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Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US9082638 *Aug 10, 2012Jul 14, 2015Stats Chippac, Ltd.Semiconductor device with cross-talk isolation using M-cap
US9324700 *Sep 5, 2008Apr 26, 2016Stats Chippac, Ltd.Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels
US20100059853 *Sep 5, 2008Mar 11, 2010Stats Chippac, Ltd.Semiconductor Device and Method of Forming Shielding Layer over Integrated Passive Device Using Conductive Channels
US20120299149 *Aug 10, 2012Nov 29, 2012Stats Chippac, Ltd.Semicinductor Device with Cross-Talk Isolation Using M-CAP and Method Thereof
CN100452399CSep 21, 2005Jan 14, 2009台湾积体电路制造股份有限公司Integrated circuit structure
Classifications
U.S. Classification438/637, 257/E23.114, 257/E21.54, 257/E21.582, 257/E27.112, 257/E21.022
International ClassificationH01L23/552, H01L21/768, H01L21/02, H01L27/12, H01L23/58, H01L23/522, H01L21/76
Cooperative ClassificationH01L21/76838, H01L21/76, H01L23/5225, H01L2924/0002, H01L28/10, H01L27/1203, H01L23/585, H01L23/552
European ClassificationH01L28/10, H01L23/58B, H01L23/522C6, H01L23/552, H01L21/768C, H01L21/76
Legal Events
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Sep 21, 2011FPAYFee payment
Year of fee payment: 4
Dec 9, 2015FPAYFee payment
Year of fee payment: 8