US 20050061674 A1
Method for process control of electro-processes is provided. In one embodiment, the method includes processing a conductive layer formed on a wafer using a target endpoint, detecting breakthrough of the conductive layer to expose portions of an underlying layer, and adjusting the target endpoint in response to the detected breakthrough. In another embodiment, the target endpoint is adjusted relative to an amount of underlying layer exposed through the conductive layer.
1. A method for producing a desired profile on a wafer by electro-processing, comprising:
electro-processing a conductive layer formed on the wafer;
detecting breakthrough of the conductive layer to expose portions of an underlying layer; and
adjusting a target endpoint of the electro-processing process in response to the detected breakthrough.
2. The method of
determining a pre-processing profile of the wafer;
providing a target profile; and
determining a difference between the pre-processing profile and the target profile.
3. The method of
determining an amount of charge removed from the wafer; and
terminating the electro-processing process when the desired profile is substantially achieved according to the determined amount of charge removed.
4. The method of
determining an amount of charge removed from the wafer by each of a plurality of electrodes biased relative to the wafer; and
terminating the electro-processing process at electrodes when the desired profile is substantially achieved according to the determined amount of charge removed for the respective electrode.
5. The method of
sensing a discontinuity in a metric of electro-processing.
6. The method of
7. The method of
8. The method of
updating a target endpoint in response to an amount of the underlying layer exposed through the conductive layer.
9. The method of
comparing an sensed current to a projected current of a non-breakthrough electro-processing condition.
10. The method of
11. The method of
determining, for the wafer, a removal profile in order to obtain the desired profile;
establishing a current path between the wafer and an electrolyte solution;
contacting the wafer to a processing pad;
applying a bias between to the wafer and at least a first electrode; and
electro-processing the wafer under the influence of the bias to selectively change a thickness of a conductive material of the wafer.
12. The method of
applying at least a second bias between the wafer and at least a second electrode, the second bias being different from the first bias; and
determining an amount of charge removed from the wafer by each electrode.
13. The method of
14. The method of
15. A method for removing a desired amount of material from a wafer by electropolishing, comprising:
determining, for the wafer, a target charge required to achieve a desired removal profile;
electropolishing the wafer to selectively remove different amounts of conductive material from the wafer according to the desired removal profile;
determining an amount of charge removed from a plurality of locations on the wafer;
detecting breakthrough of the conductive material;
adjusting the target charge required in response to the breakthrough of the conductive material; and
terminating the electropolishing when the desired removal profile is substantially achieved.
16. The method of
determining a pre-processing profile of the wafer;
providing a target profile; and
determining a difference between the pre-processing profile and the target profile.
17. The method of
18. The method of
sensing a discontinuity of current passing between the wafer and the electrode.
19. The method of
sensing a discontinuity of voltage measured between the wafer and the electrode.
20. The method of
updating the target charge in response to a charge in area of an underlying layer exposed through the conductive material.
21. The method of
determining the exposed area from a sensed current.
22. The method of
23. The method of
24. The method of
25. The method of
26. The method of
27. A method for producing a desired profile on a wafer by electro-processing, comprising:
determining a target endpoint for a plurality of zones on a wafer;
processing a conductive layer of the wafer; and
adjusting the target endpoint for each zone in-situ.
28. The method of
detecting breakthrough of the conductive layer.
29. The method of
determining an amount of an underlying layer exposed through the conductive layer.
30. The method of
This application is a continuation-in-part of co-pending U.S. patent application Ser. No. 10/456,851, filed Jun. 6, 2002, entitled “ALGORITHM FOR REAL TIME PROCESS CONTROL OF ELECTRO-POLISHING” (Attorney Docket No. 7187P1), which is a continuation-in-part of co-pending U.S. patent application Ser. No. 10/244,688, filed Sep. 16, 2002, entitled PROCESS CONTROL IN ELECTROCHEMICALLY ASSISTED PLANARIZATION (Attorney Docket No. 7187) and U.S. patent application Ser. No. 10/391,324, filed Mar. 18, 2003, entitled PROCESS CONTROL IN ELECTRO-CHEMICAL MECHANICAL POLISHING (Attorney Docket No. 7661), all of which are incorporated by reference herein in their entireties.
1. Field of the Invention
The present invention generally relates to polishing, planarization, plating and combinations thereof. More particularly, the invention relates to the monitoring and control of electro-processing, polishing and plating.
2. Description of the Related Art
Sub-quarter micron multi-level metallization is one of the key technologies for the next generation of ultra large-scale integration (ULSI). The multilevel interconnects that lie at the heart of this technology require planarization of interconnect features formed in high aspect ratio apertures, including contacts, vias, trenches and other features. Reliable formation of these interconnect features is very important to the success of ULSI and to the continued effort to increase circuit density and quality on individual wafers and die.
In the fabrication of integrated circuits and other electronic devices, multiple layers of conducting, semiconducting, and dielectric materials are deposited on or removed from a surface of a wafer. Thin layers of conducting, semiconducting, and dielectric materials may be deposited by a number of deposition techniques. Common deposition techniques in modern processing include physical vapor deposition (PVD), also known as sputtering, chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), and electrochemical plating (ECP).
As layers of materials are sequentially deposited and removed, the uppermost surface of the wafer may become non-planar across its surface and require planarization. An example of a non-planar process is the deposition of copper films with the ECP process in which the copper topography simply follows the already existing non-planar topography of the wafer surface, especially for lines wider than 10 microns. Planarizing a surface, or “polishing” a surface, is a process where material is removed from the surface of the wafer to form a generally even, planar surface. Planarization is useful in removing undesired surface topography and surface defects, such as rough surfaces, agglomerated materials, crystal lattice damage, scratches, and contaminated layers or materials. Planarization is also useful in forming features on a wafer by removing excess deposited material used to fill the features and to provide an even surface for subsequent levels of metallization and processing.
Chemical Mechanical Planarization, or Chemical Mechanical Polishing (CMP), is a common technique used to planarize wafers. CMP utilizes a chemical composition, typically a slurry or other fluid medium, for selective removal of materials from wafers. In conventional CMP techniques, a wafer carrier or polishing head is mounted on a carrier assembly and positioned in contact with a polishing pad in a CMP apparatus. The carrier assembly provides a controllable pressure to the wafer, thereby pressing the wafer against the polishing pad. The pad is moved relative to the wafer by an external driving force. The CMP apparatus effects polishing or rubbing movements between the surface of the wafer and the polishing pad while dispersing a polishing composition to affect chemical activities and/or mechanical activities and consequential removal of materials from the surface of the wafer.
Another planarization technique is Electro Chemical Mechanical Polishing (ECMP). ECMP techniques remove conductive materials from a wafer surface by electrochemical dissolution while concurrently polishing the wafer with reduced mechanical abrasion compared to conventional CMP processes. The electrochemical dissolution is performed by applying a bias between a cathode and a wafer surface to remove conductive materials from the wafer surface into a surrounding electrolyte. Typically, the bias is applied by a ring of conductive contacts to the wafer surface in a wafer support device, such as a wafer carrier head. Mechanical abrasion is performed by positioning the wafer in contact with conventional polishing pads and providing relative motion therebetween.
An objective of polishing is to remove a predictable amount of material to achieve a desired profile. Accordingly, any polishing technique requires an endpoint detection to determine when the appropriate amount of material has been removed for various regions of the wafer. However, the progress of the polishing operation is not easily viewable because of the contact between the wafer and the pad.
In addition, variations in the polishing conditions impede an accurate determination of the polishing endpoint. Variations in the slurry/electrolyte composition, pad condition, relative speed between the pad and the wafer, and the load of the wafer on the pad, etc, cause variations in the material removal rate, which change the time needed to reach the polishing endpoint. Therefore, the polishing endpoint cannot be estimated merely as a function of polishing time.
One approach to predict the polishing endpoint is to remove the wafer from the polishing apparatus and measure the thickness of the remaining film on the wafer. Doing so periodically during polishing, the quantity of material being removed from the wafer may be determined. As such, a linear approximation of the material removal rate may be used to determine the polishing endpoint. However, this method is time consuming, and does not account for sudden changes in the removal rate that may occur between measurement intervals.
Several non-invasive methods of endpoint detection are known. One type of endpoint detection typically requires access to at least a portion of the wafer surface being polished, such as by sliding a portion of the wafer over the edge of the polishing pad or through a window in the pad, and simultaneously analyzing the exposed portion of the wafer. For example, where polishing is used to expose metal lines embedded in a dielectric layer, the overall or composite reflectivity of the surface being polished changes as the lines are exposed. By monitoring the reflectivity of the polished surface or the wavelength of light reflected from the surface, the exposure of the lines through the dielectric layer, and thus the polishing endpoint, can be detected. However, this method does not provide a way of determining the polishing endpoint unless an underlying layer is exposed during polishing. Additionally, this approach is somewhat erratic in predicting the polishing endpoint unless all of the underlying lines are simultaneously exposed. Furthermore, the detection apparatus is delicate and subject to frequent breakdown caused by the exposure of the measuring or detecting apparatus to the slurry or electrolytic fluid.
A second type of method for determining the polishing endpoint monitors various process parameters, and indicates an endpoint when one or more of the parameters abruptly change. For example, the coefficient of friction at the interface of the polishing pad and the wafer is a function of the surface condition of the wafer. Where an underlying material different from the film being polished is exposed, the coefficient of friction will change also. This affects the torque necessary to provide the desired polishing pad speed. By monitoring this change, the endpoint may be detected.
In an ideal system, where no parameter other than the wafer surface changes, process parameter endpoint detection is acceptable. However, as the wafer is being polished, the pad condition and the slurry/electrolyte composition at the pad-wafer interface also change. Such changes may mask the exposure of the underlying metal layer, or they may imitate an endpoint condition, leading to a premature stop of polishing.
Finally, ECMP presents a chemically, electrically and physically unique environment, with respect to conventional CMP. Thus, while the endpoint detection techniques (including those described above) exist for CMP, the techniques may not be readily extendible to ECMP. Even where the techniques are extendible to ECMP, doing so may require retrofitting existing processing systems with expensive equipment. A preferred approach would mitigate or avoid the challenges with retrofitting existing systems.
Therefore, there is a need for polishing control, and in particular there is a need for endpoint detection, which accurately and reliably determines when to cease polishing during electro-processing.
In general, embodiments are relating to process control of electro-processing. Some aspects of the invention are generally directed to determining removal of material from a wafer during polishing, to determining an endpoint of a polishing cycle, and to adjusting the endpoint in-situ. Other aspects are directed to determining target charge (current integrated over time) values for a plurality of electrode zones (e.g., two or more) which can be independently biased.
In one embodiment, the method includes processing a conductive layer formed on a wafer using a target endpoint, detecting breakthrough of the conductive layer to expose portions of an underlying layer, and adjusting the target endpoint in response to the detected breakthrough. In another embodiment, the target endpoint is adjusted relative to an amount of underlying layer exposed through the conductive layer.
So that the manner in which the above recited embodiments are attained and can be understood in detail, a more particular description may be had by reference to the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
FIGS. 2A-B are side cross-sectional views of exemplary embodiments of an electro-polishing station.
To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures.
It is to be noted, however, that the appended drawings illustrate only exemplary embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
The present invention provides systems and methods for electro-processing wafers. Generally, electro-processing is performed to remove or deposit material on the wafer. Embodiments are provided for determining a profile for a wafer, calculating charge values and detecting an endpoint of an electro-processing cycle. In one embodiment, an electro-processing system is provided with a plurality of power supplies each connected to a different zone of an electrode. The power supplies are independently controlled to provide a desired voltage/current signal to a respective zone. The current is monitored and related to the total removal/deposition of material from a wafer to determine the endpoint of the process.
The words and phrases used herein should be given their ordinary and customary meaning in the art by one skilled in the art unless otherwise further defined. A wafer refers to a workpiece which is typically disc-shaped, but may be otherwise (e.g., rectangular or square). The wafer is typically a substrate having one or more layers formed thereon, at least one of which is conductive (typically the upper-most layer). The layer(s) of the wafer may or may not be patterned. Chemical-mechanical polishing should be broadly construed and includes, but is not limited to, abrading a wafer surface (e.g., an upper-most conductive layer) by chemical activities, mechanical activities, or a combination of both chemical and mechanical activities. Electro-processing refers to any process using electrical activity to remove or deposit material on a wafer. Particular examples of electro-processing for removing material from a wafer include electro-polishing, electrochemical mechanical polishing, and electrochemical mechanical plating process. Electro-polishing should be broadly construed and includes, but is not limited to, planarizing a wafer by the application of electrical and/or electrochemical activity and a particular example includes electrochemical mechanical polishing. Electrochemical mechanical polishing (ECMPY should be broadly construed and includes, but is not limited to, planarizing a wafer by the application of electrochemical activity, mechanical activity, or a combination of both electrochemical and mechanical activity to remove materials from a wafer surface. Electrochemical mechanical plating process (ECMPP) should be broadly construed and includes, but is not limited to, electrochemically depositing material on a wafer and concurrently planarizing the deposited material by the application of electrochemical activity, mechanical activity, or a combination of both electrochemical and mechanical activity.
Embodiments of the invention broadly provide for real-time removal monitoring and endpoint detection in a electro-processing system. In general, any of the above-defined techniques may be used, individually or in combination. Further, it is contemplated that polishing and plating may occur simultaneously or alternately. The foregoing embodiments are broadly, collectively characterized as electro-processing. While embodiments are described primarily with reference to a form of electro-polishing, it is understood that the invention is not so limited. Rather, embodiments include any form of the electro-processing. Thus, any reference to particular embodiments of electro-polishing are merely for purposes of illustration.
The polishing platform 104 may be any apparatus adapted for polishing wafers by electro-processes. One polishing platform that may be adapted to benefit from the invention is a REFLEXTION LK ECMP™ available from Applied Materials, Inc. located in Santa Clara, Calif.
Illustratively, the polishing platform 104 includes a plurality of polishing stations 110A-C. By way of example three polishing stations (P1, P2, P3) are shown. More generally, the polishing platform 104 may include any number of polishing stations (i.e., one or more). The polishing platform 104 may also include other process stations, such as rinse stations.
The processes performed on wafers by the polishing platform 104 are generally controlled by the computer 106. The computer 106 may be representative of, or include, any programmable device configured to carry out embodiments of the invention. Thus, in one embodiment, the computer 106 is representative of a controller or a plurality of controllers configured with code which, when executed, performs polishing operations. In other embodiments, the computer 106 may be characterized as a client computer, a server computer, a portable computer, an embedded controller, a PC-based server, a minicomputer, a midrange computer, a mainframe computer, and other computers adapted to support the methods, apparatus, and article of manufacture of the invention.
To implement desired polishing processes the computer 106 is configured with a process control unit 112. In one embodiment, the process control unit 112 is implemented in software, but may also be implemented in hardware. In either case, the code of the process control unit 112 defines functions of the preferred embodiment and can be contained on a variety of signal-bearing media (or computer readable media). The code (or the instructions implemented by such code) includes, but is not limited to, (i) information permanently stored on non-writable storage media, (e.g., read-only memory devices within a computer such as CD-ROM disks readable by a CD-ROM drive); (ii) alterable information stored on writable storage media (e.g., floppy disks within a diskette drive or hard-disk drive); or (iii) information conveyed to a computer by a communications medium, such as through a computer or telephone network, including wireless communications. The latter embodiment specifically includes information downloaded from the Internet and other networks. Such signal-bearing media, when carrying computer-readable instructions that direct the functions of the present invention, represent embodiments of the present invention.
In various embodiments, the process control unit 112 is capable of profile determination, real-time process monitoring and endpoint detection. These functions may be performed on the basis of various input, including the initial profile received from the profile measurement station 102. The process control unit 112 then causes the computer 106 to issue control signals 114 to each of the power supplies 108. In response to the control signals 114, the power supplies 108 each issue a separate electrical signal, collectively referred to as the electrical signals 116. Each of the electrical signals 116 provides a current/voltage to a separate one of a plurality of electrodes (e.g., two or more) of a given one of the polishing stations 110A-C. The individual electrodes receiving the control signals 114 are also referred to herein as “zones” of a single electrode. Accordingly, in one embodiment, each electrode/zone has an associated one of the power supplies 108. It is noted, however, that while separate power supplies may be used, a single unit capable of producing multiple electrical signals of different voltage/current may also be used. Therefore, the term “power supplies” as used herein does not necessarily denote physically separate power supplies. Also, the number of power supplies and respective electrodes/zones may be varied.
In one embodiment, during processing of a given wafer on one of the polishing stations 110A-C, removal of material from the wafer is measured as charge. In one embodiment, charge is calculated by integrating current with respect to time. As such, each of the power supplies 108 may be configured with an integration unit 118 which integrates the current being provided by the respective power supply to an electrode/zone of the polishing station. The output 120 (i.e., the charge per electrode/zone) of the integration units 118 is provided to the process control unit 112. Although shown as part of the power supplies 108, the integration units 118 may alternatively be part of the process control unit 112, or be separate units altogether. Each of the foregoing aspects will be described in more detail below.
Referring now to
The process cell 200 generally includes a basin 204 and a polishing head 202. A substrate 208 is retained in the polishing head 202 and lowered into the basin 204 during processing in a face-down (e.g., backside up) orientation. An electrolyte is flowed into the basin 204 and in contact with the substrate's surface while the polishing head 202 places the substrate 208 in contact with a polishing article 203. In one embodiment, the substrate 208 and the polishing article 203 disposed in the basin 204 are moved relative to each other to provide a polishing motion (or motion that enhances plating uniformity). The polishing motion generally comprises at least one motion defined by an orbital, rotary, linear or curvilinear (e.g., sweep) motion, or combinations thereof, among other motions. The polishing motion may be achieved by moving either or both of the polishing head 202 and the basin 204. The polishing head 202 may be stationary or driven to provide at least a portion of the relative motion between the basin 204 and the substrate 208 held by the polishing head 202. In the embodiment depicted in
The polishing head 202 generally retains the substrate 208 during processing. In one embodiment, the polishing head 202 includes a housing 214 enclosing a bladder 218. The bladder 218 may be deflated when contacting the substrate to create a vacuum therebetween, thus securing the substrate to the polishing head 202. The bladder 216 may additionally be inflated to press the substrate in contact with the polishing article 203. A retaining ring 238 is coupled to the housing 214 and circumscribes the substrate 208 to prevent the substrate from slipping out from the polishing head 202 while processing. One polishing head that may be adapted to benefit from the invention is a TITAN HEAD™ carrier head available from Applied Materials, Inc., located in Santa Clara, Calif.
The basin 204 is generally fabricated from a plastic such as fluoropolymers, TEFLON® polymers, perfluoroalkoxy resin, PFA, polyethylene-based plastics, PE, sulfonated polyphenylether sulfones, PES, or other materials that are compatible or non-reactive with electrolyte compositions that may be used in electroplating or electropolishing. The basin 204 includes a bottom 244 and sidewalls 246. The sidewalls 246 of the basin 204 include a port 218 formed therethrough to allow removal of electrolyte from the basin 204. The port 218 is coupled to a valve 220 to selectively drain or retain the electrolyte in the basin 204.
The basin 204 is rotationally supported above a base 206 by bearings 234. A drive system 236 is coupled to the basin 204 and rotates the basin 204 during processing. A catch basin 228 is disposed on the base 206 and circumscribes the basin 204 to collect processing fluids, such as an electrolyte, that flow out of port 218 disposed through the basin 204 during and/or after processing.
The basin 204 defines a housing for the polishing article 203 and an electrode assembly 209 which is disposed between the bottom 244 and the polishing article 203. In one embodiment, the polishing article 203 and the electrode 209 may be secured together forming a unitary body that facilitates removal and replacement. In one embodiment, the polishing article 203 and the electrode 209 are secured to one another by permanent means such as bonding. Alternatively, the polishing article 203 and the electrode 209 may be coupled by other techniques or combination thereof, including sewing, binding, heat staking, riveting, screwing and clamping among others. In still another embodiment the polishing article 203 is secured to a belt assembly which dispenses new (i.e., clean) pad material and takes up old (i.e., worn or contaminated) pad material.
As will be described in more detail with reference to
In order to operate as an electrode, the polishing article 203 is made at least partially conductive by the provision of conductive material disposed in the polishing article 203. In general, the base material of the polishing article 203 may itself be made conductive, or conductive elements may be disposed in a non-conductive base material such as polyurethane. Particular embodiments of the polishing article 203 are described below.
In one embodiment, the electrode assembly 209 communicates electrically with the substrate 208 via perforations 205 formed in the polishing article 203. Thus, in one embodiment, the ability of the electrode assembly 209 to effect electro-processing is determined, in part, by the presence and location of the perforations 205. Specifically, it is contemplated that, in at least one embodiment, electro-processing is effected substantially only in those locations of the wafer 208 “visible” to the electrode assembly 209 through the perforations 205. Relatedly, it is contemplated that the proximity of the electrode assembly 209 to the wafer 208 affects processing. Generally, a closer proximity is preferred. Accordingly, in the illustrative embodiment of
An electrolyte delivery system 232 is generally disposed adjacent the basin 204. The electrolyte delivery system 232 includes a nozzle or outlet 230 coupled to an electrolyte source 242. The outlet 230 flows electrolyte or other processing fluid from the electrolyte source 242 into the basin 204. During processing, the electrolyte generally provides an electrical path for biasing the substrate 208 and driving an electrochemical process to remove and/or deposit material on the substrate 208. Alternatively, the electrolyte delivery system may provide electrolyte through the bottom 244 of the process cell and flow electrolyte through the electrode assembly 209 and the perforations 205 of the polishing article 203 into contact with the substrate 208, as shown in the embodiment of
In operation, electrolyte is flowed into the basin 204 from the electrolyte delivery system 232. The electrolyte fills the basin 204 and is thus brought into contact with the wafer 208 and polishing article 203. To initiate electrochemical mechanical processing, potential differences are applied between the electrode assembly 209 and the conductive portion of the polishing article 203. The wafer 208 being in direct contact with the conductive portion of the polishing article 203 will then be at the same potential as the conductive portion. The current loop is then completed in the polishing station by transforming atomic wafer materials into ions in the electrolyte. Concurrent mechanical polishing of the wafer 208 is achieved by relative movement between the wafer and the polishing article 203. In one embodiment, polishing continues until reaching an endpoint, as determined by the process control unit 112. In at least one embodiment, “endpoint” refers to a point in time during a polishing cycle at which sufficient bulk metal has been removed from a wafer. Following detection of the endpoint, it may be necessary to continue polishing for a period of time in order to remove residual metal.
As noted above, the polishing article 203 is at least partially conductive. The conductivity of the polishing article may be accomplished in a variety of ways. Referring now to
The conductive elements 304 are shown disposed in a symmetrical pattern at a central region of the polishing pad 302. The pattern shown in
Alternatively or additionally, the polishing article 203 is made conductive by making the polishing material itself of conductive material. The conductive polishing material may include conductive polymers, polymer composites with conductive materials, conductive metals, conductive fillers or conductive doping materials, or combinations thereof. Conductive polymers include polymeric materials that are intrinsically conductive, such as polyacetylene, polyethylenedioxythiophene (PEDT), polyaniline, polypyrrole, and combinations thereof. The polymer composites with conductive materials may include polymer-noble metal hybrid materials. Polymer-noble metal hybrid materials that may be used as the conductive polishing material described herein are preferably chemically inert with a surrounding electrolyte, such as those with noble metals that are resistant to oxidation. An example of a polymer-noble metal hybrid material is a platinum-polymer hybrid material. The invention also contemplates the use of polymer-noble metal hybrid materials, which are chemically reactive with a surrounding electrolyte, when the polymer-noble metal hybrid material is insulated from a surrounding electrolyte by another material. Conductive metals that may be used as the polishing material are those metals that are preferably relatively inert to chemical reactions with the surrounding electrolyte. Platinum is an example of a conductive metal that may be used as the polishing material. The conductive metals may form a portion or the entire polishing surface of the polishing material. When forming a portion of the polishing surface, the conductive metals are typically disposed in a conventional polishing material.
The conductive polishing materials may further include conductive fillers or conductive doping materials disposed in a binder material, such as the conductive polymers described above or a conventional polishing material. Examples of conductive fillers include carbon powder, carbon fibers, carbon nanotubes, carbon nanofoam, carbon aerogels, and combinations thereof. Carbon nanotubes are conductive hollow filaments of carbon material having a diameter in the nanometer size range. The conductive fillers or conductive doping materials are disposed in the binding material in an amount sufficient to provide a polishing medium having a desired conductivity. The binder material is typically a conventional polishing material.
Alternatively or additionally, the polishing article 203 may comprise a metal mesh disposed in the polishing material. The metal mesh may comprise a chemically inert conductive material, such as platinum. The metal mesh may also include materials, such as copper, that have been observed to react with the surrounding electrolyte if the metal mesh is chemically insulated from the electrolyte such as by a conformal layer of conventional material.
Other embodiments of conductive polishing pads which may be used to advantage are further described in U.S. patent application Ser. No. 10/033,732, filed Dec. 27, 2001, entitled CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING, Ser. No. 10/140,010, filed May 7, 2002, entitled CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING, Ser. No. 10/455,941 filed Jun. 6, 2003, entitled CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING, Ser. No. 10/455,895, filed Jun. 6, 2003, entitled CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING, Ser. No. 10/642,128, filed Aug. 15, 2003, entitled CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING and Ser. No. 60/516,680, filed Nov. 3, 2003, entitled COMPOSITE POLISHING PAD ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL POLISHING (ECMP), each of which is hereby incorporated by reference in their entireties.
In any case, where the polishing article 203 is at least partially conductive, the polishing article 203 acts as an electrode in combination with a wafer during electro-processes. The electrode assembly 209 provides a plurality of counter-electrodes to the polishing article 203. One embodiment of the electrode assembly 209 is shown in
It is noted that for simplicity some features of embodiments of the electrode assembly 209 are not shown. For example, in one embodiment, the contact elements 304 are disposed through the innermost electrode 402A. The openings to receive the contact elements 304 are not shown in
Referring now to
The target charge values 618 calculated by the process model 602 are provided as input to the control algorithm 604. In one embodiment, the control algorithm 604 receives additional control inputs 620, which may be operator selected. Illustrative control inputs include the total process time, the number of process steps and the like. The control algorithm 604 then generates a control signal (collectively, control signals 114) for each zone defined by the electrode assembly 209. The control signals 114 are provided to the respective ones of the power supplies 108. The control signals 114 may be configured to, for example, control current or voltage for the respective zone. Accordingly, the power supplies 108 produce corresponding electrical signals 622 for the respective zones. In addition, the charge removed per zone is calculated by each integration unit 118 of the power supplies 108. The calculated charge per zone values 624 are fed back to the control algorithm 604. The control algorithm 604 then compares the calculated charge per zone values 624 to the respective target charge values 618. That is, the control algorithm 604 compares a calculated charge value for a particular zone to the corresponding target charge value for that zone. When the calculated charge value exceeds the corresponding target charge value, the bias for that zone is terminated. When each of the biases has been terminated, the electro-process is complete. Thus, in one aspect, the process control unit 112 provides for endpoint detection. In another aspect, the calculated charge values for each zone can be used to generate and display the profile of a wafer in real time.
It is noted that the control algorithm 604 can implement the control signals 114 according to any variety of functions depending, at least in part, on the control inputs 620. In one embodiment, the voltage in each zone is fixed. The voltage in each zone is then independently terminated once the target charge is achieved. The voltage in each zone may be selected according to parameters which include removal rate, planarization capability, surface roughness, defect count, etc. In another embodiment, the polishing time is fixed. In this case, the voltage for each zone is modulated (i.e. changed with respect to time) so that the target charge is met for each zone when the predefined polishing time expires. While the former embodiment provides simplicity, the latter embodiment allows better control of the step time. In some embodiments, a zone voltage may be zero or negative, while other contemporaneous zone voltages are positive. It is also contemplated that the voltages may be applied prior to any mechanical polishing, during mechanical polishing and/or after mechanical polishing. Persons skilled in the art will recognize other embodiments.
By way of example only,
As noted above, the process model 602 receives as an input a charge-removal relationship. In one embodiment, the charge-removal relationship is determined empirically, by periodically measuring (e.g., by sheet resistance measurements) the amount of material removed from a wafer being polished. Alternatively, the current may be measured for a series of wafers processed at different conditions (e.g., slightly different polishing times, voltage biases, etc.). In this manner, a calibration curve can be acquired. One such calibration curve 1100 is shown in
In a particular embodiment, a charge-removal relationship may be determined by polishing a plurality of test material layers using a process cell such as the process cells of FIGS. 2A-B. The test material layers may be polished according to a specific set of instructions that may include a relative motion between a polishing pad and a wafer. The relative motion may be, for example, linear, curvilinear, rotational, orbital, or combinations thereof. A test bias, Vt is then applied between the test material layer and the counter electrodes of the electrode assembly 209. The test bias, Vt, may be applied such that a substantially uniform potential is generated across the counter electrodes with respect to the surface to be polished. The bias may be applied to the test material layer using, for example, a pad such as the pad 302 described above in
Referring now to
After polishing the test material layer 1205 for a pre-determined period of time (a first polishing time), the substrate 1204 is, for example, removed from the process cell 100 and an amount of material removed from the test material layer 1205 is then measured. The amount of material removed may be determined, for example, using conventional methods of measuring layer thicknesses, such as sheet resistance (Rs) measurements. Alternatively, the amount of material removed may be measured using electron microscopy, or similar methods for analyzing thickness and composition of material layers. The material removal may be determined by measuring a thickness 1280 of the test material layer 1205 before polishing and the thickness 1280 after polishing. The thickness 1280 may be measured at a first point 1220. Additional thickness measurements of the first test material layer 1205 may be taken at one or more additional points 1222 in order to obtain a statistically representative value for material removal. Alternatively, a property other than thickness may be measured. For example, a mass of material removed or a material removal rate may be measured directly or indirectly. The one or more additional points 1222 on the test material layer 1205 may be chosen such that the points lie within a region or zone of the test material layer 1205 that experiences a relatively uniform rate of polishing (material removal). For example, the first point 1222 and the additional points 1222 may be chosen such that they all lie in an intermediate region 1216 of the test material layer 1205. Alternatively, the first point 1222 and the additional points 1222 may be chosen such that they each are a distance from a center 1230 of the test material layer 1205 that is substantially the same. A first rate of material removal may be determined by, for example, dividing mass or thickness of the material removed by the first polishing time.
The second test material layer 1305 may be polished using the same geometry and configuration of the process cell as for the polishing of the first test material layer 1205. The second test material layer 1305 may be polished to a thickness 1380 by applying a second bias applied to the second test material layer 1305. Thereafter, the step of determining material removal may be performed for one or more points 1320 on the second test material layer 1305. Furthermore, the process of determining removal rate may be repeated for additional test material layers (not shown), if desired.
The one or more points 1320 on the test material layer 1305 may lie, for example, within an intermediate region 1316. The intermediate region 1316 may have a similar shape and define a similar range of distances from a center 1330 of the material layer 1305 as is defined by the intermediate region 1216 with respect to the center 1230.
By matching the material removal from each test material layer 1205, 1305 with the corresponding charge (current integrated over time) removed from the test material layer, a relationship between material removed and charge may be determined. The relationship thus determined may be relevant for a specific configuration of the process cell, including a specific polishing composition as well as specific composition of material layer. The relationship may be a linear relationship, an exponential relationship, or any other relationship. Further, it is recognized that blanket wafers will exhibit a different charge-removal relationship than patterned wafers.
As noted above, the process model 602 also receives as input operations/cell parameters 612, which may include process parameters, electrode geometry (i.e., the geometry of the various electrodes 402 which make up the electrode assembly 209 as illustrated in
Referring now to
One graphical representation of the time spent in the various zones is given in
Process Model Generation
The empirically determined charge-removal relationship and the trajectory simulation are combined to relate charge in each zone to the removal at each wafer point. Based on the trajectory simulation, the average area of the wafer, Ai, affected by the ith counter-electrode can be determined. Assuming that the current density is uniform across a zone, i.e., that the voltage drop across the wafer is negligible, the charge-removal relationship in any given zone, Ri, can be computed as follows:
The removal at each point becomes the average of the removal of each zone weighted by the amount of time the point spent in front of each zone, as given by:
The process model described above can be summarized in the form of a transfer function taking as input the charge in each zone, C, and generating as output the removal profile R (i.e., the profile of the material to be removed). The charge in each zone, C, is represented by a vector with N components, where N is the number of zones. The removal profile, R, is represented by a vector with n components, where n is the number of sample points chosen on the wafer. Based on the process model described above, the transfer function is essentially linear and can be written as:
It is noted that the process model described above is a “physical” model in that the model accounts for physical parameters in a simulation. However, the process model 602 may be generated in a variety of ways. For example, the model 602 may be a statistical model based on calibration wafers (i.e., the best fit based on x charges, where x is the number of zones).
In any case, the process model 602 calculates a target charge per zone. If Pin is the incoming profile (provided by the profile measurement station 102) and the Pdes is the desired profile, the process model 602 can implement an optimization with respect to the achievable profile. In one embodiment the optimization is a least squares interpolation. Although the optimization may not be uniquely described, specific implementations are contemplated. For example, one optimization is to minimize the standard deviation between the final profile, Pfin, and the desired profile, Pdes. This optimization may be described as: minimize stddev(Pin-(AC+B)-Pdes). Another optimization is to minimize the maximum deviation between Pfin and Pdes. This optimization may be described as minimize maxdevPin-(AC+B)-Pdes). Using such approaches (and others which will be recognized by those skilled in the art) the optimal values for the target charges per zone can be determined prior to processing a wafer. The power supplies for the respective zones are then controlled to ensure that the target charges are reached.
A counter-electrode assembly, such as the counter-electrode assembly 209 was divided into five zones: an inner zone, an inner-central zone, a central zone, an outer-central zone and an outer zone (Z1, Z2, Z3, Z4 and Z5) respectively. The zones were arranged in a concentric circular manner similar to the zones depicted for the electrode assembly 209 shown in
Based upon the program to be used to polish the material layer, the algorithm determined that a first point in the center of the material layer was associated with Z2 for 1080 time steps (i.e. 45% of the total number of time steps), associated with Z1, Z3, Z4, Z5 for 0 time steps, and associated with none of the zones (i.e., the point was not under a perforation in the pad and/or the point was under a contact element, and therefore zero bias was experienced by the point) for the remaining 1320 time steps. Therefore, for 45% of time, point A was associated with Z2, and the expected removal would be 0.45×R2, where R2 is the total removal contributed by Z2.
From the algorithm it was further determined that a second point B, away from the center of the material layer) was associated with Z2 for 570 time steps (or 23.75% of the total number of time steps), associated with Z3 for 774 time steps (or 32.35% of the total number of time steps), and associated with no zones for 1056 time steps. The expected removal for point B is therefore given by an average of the removals for Z1, Z2, Z3, Z4, and Z5, weighted by the percentage of the time spent in each zone. Expressed in mathematical terms, the expected removal for point B is given by the mathematical expression, [0.2375×R2]+[0.3235×R3], where R3 is the total removal contributed by Z3.
The algorithm further calculated the expected removal rate for the remainder of the 121 points on the material layer in a similar manner. Specifically, for each point an expected removal rate was calculated as [P1×R1]+[P2×R2]+[P3×R3]+[P4×R4]+[P5×R5]. P1, P2, P3, P4, and P5 are the percentages of time that the particular point was associated with the zones Z1, Z2, Z3, Z4, and Z5 respectively.
The material layer to be polished had a non-uniform initial profile, Pin. A desired removal profile, Rdes, was calculated as Pin−Pdes, where Pdes is the selected desired profile. A least-squares regression was performed to optimize the values for R1, R2, R3, R4, and R5 such that the actual removal profile, Ract, of the material layer after polishing would closely match the desired removal profile, Rdes. The optimal biases to be applied to each of the zones was then determined using a pre-determined (linear) relationship between removal and charge. The resultant removal profile was similar to the desired removal profile.
Breakthrough Detection and Compensation for Endpoint Detection
Since the removal rate of the conductive film being processed is not uniform across the diameter of the substrate, the underlying film becomes exposed through the polished film in disparate locations. For example, during processing of copper layer having a thickness of about 8000 Å at a rate of about 6000 Å per minute, the layer underlying the copper film begins to be exposed when the remaining copper layer is about 2000-1000 Å thick. As the copper (or other conductive film being removed) no longer completely covers the original plated area, the input AW begins to diminish rapidly as more and more of the underlying layer is exposed. In other words, the value AW remains a constant until the underlying film begins to break through the conductive layer being process at time(break), at which time, the value AW and R become variables over time and can be expressed as AW(t) and R(t). Thus, to maintain accurate endpoint control, the target endpoint, herein expressed as a summation of charge R removed from the wafer, AW(t) is substituted for the value AW in the calculator of R(t) is adjusted to compensate for the actual remaining film area.
By monitoring the film removal process to determine the incidence of breakthrough at time(break), the removal target profile R may be dynamically adjusted to accurately arrive at the process endpoint by determining AW(t) at process times greater than time(break). The value of AW(t) may be provided by empirical data, known correlation to process indicators or metric, or by other means. For example, the remaining area AW(t) may be determined by empirically, and stored in a database for retrieval by the process control unit 112 during processing. In one embodiment, the database for AW(t) may include values for AW(t) correlated to time, current, voltage or other metric which varies with AW(t).
In another embodiment, a metric such as voltage or current may be sensed as indicator or metric indicative of breakthrough and/or AW(t). Since the electro-process is typically driven by holding one of current or voltage constant, fluctuations in the other attribute (e.g., current in a voltage driven process or voltage in a current driven process) which is normally sensed during processing, may be utilized without additional system hardware to detect breakthrough and provide an indicator for appropriate adjustment of the target endpoint.
A portion 1616 of the current trace 1604 between the time(break) and time(clear) may be correlated to a theoretical continuation 1618 of the current trace 1602 extending from the trace 1602 at time(break). The continuation 1618 represents the current amplitude which would be present if the conductive layer was removed uniformly until completely gone (e.g., would clear completely from the underlying layer at the same time across the substrate diameter). In one embodiment where features, such as lines, vias and/or other structure, are uniformly distributed across the substrate, the area AW(t) of the remaining conductive layer is proportional to the ratio of the amplitudes of the portion 1616 and continuation 1618 of the current trace 1602 for process times between the time(break) and time(clear). In other embodiments where the features on the substrate do not allow the relation between the portion 1616 and the continuation portion 1618 of the trace to remain linear, the relationship may be calculated or determined empirically.
Thus, once the relationship between the ratio is correlated to the AW(t), AW(t) may be determined by measuring or sensing the current to the electrode during processing. As AW(t) is now available after breakthrough of the conductive layer on the substrate, the target charge profile R for determining the arrival at the process endpoint may be dynamically updated after breakthrough of the conductive material as R(t) by the process control unit 112, such that arrival at the process endpoint is accurately determined.
In various embodiments, advantages in electro-processing may be achieved. In some cases, these advantages may be substantial improvements over the prior art. Some of these advantages are now described. However, whether or not an embodiment achieves an advantage and whether or not such an advantage may be considered a substantial improvement is not limiting of the invention. Therefore, the advantages described below do not define or limit the invention, which is limited only by the claims that follow.
In one aspect, calibration requirements are eliminated. Conventionally, thickness measurement is performed by eddy current probes. The eddy current probe measures a current and then correlates the measured value to thickness. In order to ensure accurate measurements the probe must be calibrated for pad wear and changes between different wafer types. Such calibration requirements may be eliminated by some embodiments of the invention. As a result, successful process monitoring and endpoint detection according to embodiments of the invention are independent of pad wear.
In another aspect, good spatial resolution is achieved. Spatial resolution using eddy current probes is limited to the width of the probe (e.g., ¼ inch). Because embodiments of the invention do not rely on such intrusive devices, superior resolution is achieved.
In another aspect, embodiments of the invention are not restricted to wafers having a minimal thickness. In contrast, eddy current probes are limited in their ability to provide accurate measurements for thicknesses less than, for example, 2000 angstroms.
In another aspect, thickness measurements are not corrupted by interference from other metal levels on a wafer. In contrast, adjacent metal levels can interfere with measurements taken by eddy current probes.
While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.