|Publication number||US20050073827 A1|
|Application number||US 10/676,023|
|Publication date||Apr 7, 2005|
|Filing date||Oct 2, 2003|
|Priority date||Oct 2, 2003|
|Also published as||US6874901|
|Publication number||10676023, 676023, US 2005/0073827 A1, US 2005/073827 A1, US 20050073827 A1, US 20050073827A1, US 2005073827 A1, US 2005073827A1, US-A1-20050073827, US-A1-2005073827, US2005/0073827A1, US2005/073827A1, US20050073827 A1, US20050073827A1, US2005073827 A1, US2005073827A1|
|Original Assignee||Joinscan Electronics Co., Ltd.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (5), Referenced by (4), Classifications (14), Legal Events (5)|
|External Links: USPTO, USPTO Assignment, Espacenet|
1. The Field of the Invention
The present invention generally relates to a structure of surface-adhered the light emitting diode display device, and more particularly, to a light emitting diode display device having a lower circuit board and an upper circuit board stacked on the lower circuit board forming a protruded circuit board, wherein the protruded circuit board is covered by a frame which securely joints with the upper and lower circuit board for effectively preventing the sidewall of the frame of the display device flit outwardly, as well as to reinforce the structure to resist an external force.
2. Description of the Related Art
With the rapid advances in high-tech electronic information industry, several valuable electronic products have advanced functions to provide users prompt service and convenience, leading to a high-tech civilization. When enjoying the pleasure brought such high-tech products, at work or in daily activities, the high-tech products have become a part of users' life. Among these valuable high-tech products, only few of them comprise light-emitting diode display for displaying the execution of speed, time, channel and other operational information.
The general light-emitting diode display has a light-emitting diode crystal and IC on the circuit board, and the arrangement of circuit board may be a single layer or a double layer. The single layer circuit board has copper foil loop or IC, and light-emitting diode crystal positioned on its upper and lower side, with an outer frame covering directly onto the circuit board, or alternatively, a resin is injected to joint the outer frame with the circuit board. For the double layer circuit board, after stacking the two boards, the copper foil loop or IC, and light-emitting diode crystal are set on the circuit board. Next, a frame is directly covered onto the resulting structure or alternatively, a resin is injected to joint the outer frame with the circuit board. Referring to
The frame C is jointed with the circuit board B (single or double layer) only with one side. Because the joint surface thereof is small, and therefore the jointing cannot be substantially secure.
Because of the small joint surface, the transfiguration or loss of original shape could easily occur due to change of the surrounding temperature, and may result in flitting up of the frame on the sidewall or the frame may come loose.
Because of the weak structure of the sidewall of the frame, the frame could easily flit up or become loose causing loose contact between the IC B1 and the light-emitting diode crystal and thereby adversely affecting the display function of the light-emitting diode display A.
Accordingly, it is highly desirable to improve the structure of the conventional light emitting diode display to overcome the above defects.
Accordingly, in the view of the foregoing, the present inventor makes a detailed study of related art to evaluate and consider, and uses years of accumulated experience in this field, and through several experiments, to create a new light emitting diode display in order to substantially improve the jointing efficiency of the frame with the circuit board. The present invention provides a novel and cost effective light emitting diode display device.
According to one aspect of the present invention, the light emitting diode display device comprises a circuit module and a frame. An upper and a lower layer of circuit board, forming a protruded circuit board, constitute the circuit module. The protruded circuit board has at least two sides having differential length and thereby forming an indention. Each button flange of the frame is fit into the indention to enable the sidewall of the frame come in contact with the upper and the lower circuit board, thus the welding efficiency can be substantially increased. Further, conductive glue or a metallic pin is used to fit the frame onto the protruded circuit board, or a tin solder material is used to weld the elements for jointing elements thereof. Accordingly, the sidewall of the frame will not flit up or become loose easily. Thus, due to the steady assembly, the structure of the display device is not only reinforced but also resin-leakage problem can be resolved.
According to another aspect of the present invention, the sidewalls of the frame of the light emitting diode display device is welded to the indention of the upper and the lower circuit board of the protruded circuit board. Because the upper circuit board is slightly smaller than the lower circuit board, and the upper circuit board is covered and supported by the sidewall of the frame, thus the frame of the display device is securely joint to the indentation of the upper and the lower circuit boards and will not be shaky.
According to another aspect of the present invention, the indentions of the upper and lower circuit board are designed for the sidewalls of the frame for support, and also as welding points forming a strong assembly, and therefore when the upper and lower circuit boards are covered and jointed by the frame and resin, the sidewall of the frame will not flit up. Thus, the work life of the light emitting diode display device can be prolonged.
For a more complete understanding of the present invention, reference will now be made to the following detailed description of preferred embodiments taken in conjunction with the accompanying drawings, in which:
Reference will be made in detail to the preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
The circuit module 2 comprises an upper circuit board 21 and a lower circuit board 22. The upper circuit board 21 comprises a light-emitting diode crystal 211 and an IC 212, and an upper positioning hole 213 is positioned at a suitable location. The lower circuit board 22 comprises a lower positioning hole 221 corresponding to the upper positioning hole 213. The upper circuit board 21 is slightly smaller than the lower one 22, and the length of sides of these two circuit boards 21, 22 are different so that indentions 23 are formed. To fit the upper and lower circuit boards 21, 22 together, conductive glue or metallic pin or a tin solder material, is used for substantially securing the upper and lower circuit boards 21, 22 to form a protruded circuit board 24.
The light emitting diode display device of the present invention further comprises a display face 31 is for showing variety of numbers, patterns or fonts. A sidewall 32 extends downwards from each of the display face 31, and each sidewall 32 has a button flange 321 for jointing with the other element. The frame 3 is a hollow box-shaped figure, which has a space 33 and positioning element 34.
To assemble the above elements, the frame 3 is covered onto the protruded circuit board 24, and bottom flanges 321 of each sidewall 32 will be supporting onto the indentation 23 of the protruded circuit board 24 to enable the frame 3 to support against the indention 23 of the upper and lower circuit boards 21, 22 of the protruded circuit board 24 by the sidewall 32. Meanwhile, the upper circuit board 21 of the protruded circuit board 24 is able to fit into the space 33 of the frame 3 as well as the light-emitting diode crystal 211 and IC 212. Further, the positioning element 34 within the frame 3 is used to fit into the upper positioning hole 213 of the upper circuit board 21 and the lower positioning hole 221 of the lower circuit board 22, thus the upper and lower circuit boards 21, 22 are jointed together and substantially positioned by the positioning element 34 to substantially prevent from undesirable movements. Next, a resin or glue or screws are used to securely joint the frame 3 with the protruded circuit board 24. Thus, the assembly of the light emitting diode display device 1 is completed.
The circuit module 2 may comprise a plurality of stacked circuit boards, and each circuit board can be pressed, riveted or welded to joint with each other. The configuration of stacked circuit boards is designed in a manner that sizes of the circuit boards increase in an orderly manner from the upper layer to the lower layer.
The protruded circuit board 24 of the circuit module 2 can be made of metal, bakelite, fiber, insulation material or other various materials.
Because the sidewall 32 of the frame 3 of the display device 1 has button flanges 321 supporting to the indentions 23 of the protruded circuit board 24, the welding phase is accordingly larger. Further, the use of resin, glue or screws, will render the assembly secure so that the sidewall 32 of the frame 3 is prevented from flipping up. Because the sidewall 32 of the frame 3 is securely jointed to the upper and lower circuit board 21 and 22 of the protruded circuit board 24, and the positioning element 34 of the frame 3 is fit into the upper positioning hole 213 of the upper circuit board 21 and the lower positioning hole 221 of the lower circuit board 22, the frame 3 is able to position on the top of the upper and lower circuit boards 21 and 22 of the protruded circuit board 24 and further allows the light-emitting diode crystal 211 or IC 212 to positioned on the top of the upper circuit board 21 to emit then project to the display face 31 of the frame 3.
The above description is merely exemplified by preferred embodiment and therefore not limiting the scope of the present invention, wherein the protruded circuit board is constituted of circuit module, the display device has a frame securely positioned into the protruded circuit board, thus the sidewall of the frame will not flip up or become loose after welding to the protruded circuit board. With such strong assembly, the display device can substantially have a firmer structure and longer work life.
While the invention has been described in conjunction with a specific best mode, it is to be understood that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations in which fall within the spirit and scope of the included claims. All matters set forth herein or shown in the accompanying drawings are to be interpreted in an illustrative and non-limiting sense.
|Cited Patent||Filing date||Publication date||Applicant||Title|
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|US5274570 *||Apr 16, 1993||Dec 28, 1993||Mazda Motor Corporation||Integrated circuit having metal substrate|
|US5938312 *||Sep 23, 1996||Aug 17, 1999||Rohm Co., Ltd.||Surface mounting type light emitting display device, process for making the same, and surface mounting structure of the same|
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|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7364322 *||Jun 10, 2005||Apr 29, 2008||Touchsensor Technologies, Llc||Appliance convenience light|
|US7572037 *||Mar 6, 2008||Aug 11, 2009||Sony Corporation||Light emitting device, display device and a method of manufacturing display device|
|US7665859 *||Dec 27, 2005||Feb 23, 2010||Lg Display Co., Ltd.||Backlight assembly having fluorescent and LED light sources, and liquid crystal display device including the same|
|US20050276046 *||Jun 10, 2005||Dec 15, 2005||Oppor Rick L||Appliance convenience light|
|U.S. Classification||362/23.11, 313/513, 313/512, 313/498, 362/240, 362/800|
|International Classification||G09F9/33, G09F9/302, G01D11/28|
|Cooperative Classification||Y10S362/80, G09F9/33, G09F9/302|
|European Classification||G09F9/302, G09F9/33|
|Oct 2, 2003||AS||Assignment|
|May 13, 2008||FPAY||Fee payment|
Year of fee payment: 4
|Nov 19, 2012||REMI||Maintenance fee reminder mailed|
|Apr 5, 2013||LAPS||Lapse for failure to pay maintenance fees|
|May 28, 2013||FP||Expired due to failure to pay maintenance fee|
Effective date: 20130405