|Publication number||US20050077616 A1|
|Application number||US 10/683,489|
|Publication date||Apr 14, 2005|
|Filing date||Oct 9, 2003|
|Priority date||Oct 9, 2003|
|Also published as||DE102004044149A1, DE102004044149B4, US7612386, US20060138645|
|Publication number||10683489, 683489, US 2005/0077616 A1, US 2005/077616 A1, US 20050077616 A1, US 20050077616A1, US 2005077616 A1, US 2005077616A1, US-A1-20050077616, US-A1-2005077616, US2005/0077616A1, US2005/077616A1, US20050077616 A1, US20050077616A1, US2005077616 A1, US2005077616A1|
|Inventors||Kee Ng, Cheng Tan, Ji Tham|
|Original Assignee||Ng Kee Yean, Tan Cheng Why, Tham Ji Kin|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (4), Referenced by (31), Classifications (28), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present invention relates to packaged integrated circuits, and more particularly, to high-power LEDs.
Light emitting diodes (LEDs) are fabricated from compound semiconductor materials, which have the characteristic of emitting light when biased with a forward current. LEDs are widely used as indicators or displays in various types of appliances. Historically, LEDs emitted a relatively low level of light compared to other light sources and were suitable for indoor applications only.
Recent advances in compound semiconductor materials research have yielded new LEDs, which emit very high levels of light. Examples of these new LED materials are Aluminum Indium Gallium Phosphide (AlInGaP) and Indium Gallium Nitride (InGaN). These high brightness LEDs have given rise to new LED devices suitable for applications in areas such as outdoor video displays, automotive signals, traffic signals and illumination.
The high output achieved with these devices is the result of efficient semiconductor materials and of driving the LEDs at very high forward currents. Drive currents in the hundreds or thousands of milliamperes (mA) are often utilized. Unfortunately, such high drive currents produce excessive heat. Since the efficiency of an LED decreases at these high temperatures, light output starts to drop. In addition, the packaging of the devices starts to break down due to prolonged exposure to the elevated temperatures. Such packaging failures limit useful life of the device. A number of device packages have been proposed; however, none of these provide sufficient heat dissipation for the current generation of high-power LEDs.
The present invention includes a circuit element having a heat-conducting body having top and bottom surfaces, and a die having an electronic circuit thereon. The die includes first and second contact points for powering the electronic circuit. The die is in thermal contact with the heat-conducting body, the die having a bottom surface that is smaller than the top surface of the heat-conducting body. A first trace constructed from an electrically conducting material bonded to the top surface of the heat-conducting body and electrically insulated therefrom is connected to the first contact point by an electrically conducting path that is preferably a wire bond. An encapsulating cap covers the die and the first electrically conducting path. The first trace has a first portion that extends outside of the encapsulating cap and a second portion that is covered by the encapsulating cap. The heat-conducting body is preferably constructed from copper or aluminum and includes a cavity having an opening on the first surface in which the die is mounted. The die preferably includes a light-emitting device that emits light in a direction pointing away from the top surface, the encapsulating cap being optically transparent to the emitted light. The encapsulating cap can include a dam surrounding the die, the dam is filled with a clear encapsulating material.
The first trace preferably includes a solder ball on the first portion thereof. The circuit element may include a second trace for making the connection to the second contact point on the die. Alternatively, the second connection can be made through the heat-conducting die itself. A second solder ball is preferably placed on the second trace or the heat-conducting body to provide an electrical connection to the second contact point of the die. A third solder ball is preferably provided on the top surface of the heat conducting body at a location that is non-colinear with the first and second solder balls. The solder balls provide a mechanism for coupling the circuit element to a printed circuit board as well as providing power to the die. To further facilitate heat transfer from the heat-conducting body, the bottom surface of the heat conducting body may include fins or other features for increasing the surface area of the bottom surface relative to the top surface of the heat conducting body.
The manner in which the present invention provides its advantages can be more easily understood with reference to
Refer now to
The LED device in
Prior art devices attempt to overcome the limitations of the substrate size by relying on a secondary heat sink in the form of the PCB 116 to help conduct the heat away from the LED, and hence, limit the temperature rise to which the LED is subjected. This solution moves the heat dissipation problem to the PCB. To provide adequate heat conduction and sinking, a metal core PCB with some provision for transferring the heat to the surrounding air is often needed. Since the cost of such metal core PCBs is significantly greater than the cost of the more common glass epoxy PCBs, this solution significantly increases the cost of the final circuit utilizing the LED. In addition, this solution increases the design complexity of the final PCB since the PCB must be arranged to dissipate the heat without subjecting other components on the PCB to excessive temperatures.
In addition, these prior art solutions require a good contact between the PCB and substrate 102. The coplanarity among the leads 110 & 112 and the substrate 102 can make achieving adequate thermal contact difficult. Even if a layer of thermal glue is used to ensure good contact, air gaps or voids may still exist in between the device and the mounting PCB. Furthermore, such thermal glue layers can also restrict the flow of heat. Finally, the thermal glue further increases the cost and complexity of the assembly of the final PCB.
The present invention provides a high power LED device, which has sufficient heat sinking capability to absorb fluctuations in the heat output of the LED. In addition, the present invention dissipates heat without relying on secondary heat sinks. Refer now to FIGS. 3A-D, which illustrate an LED device 300 according to one embodiment of the present invention.
To facilitate the wire bonding operation, traces 306 and 308 preferably include a T-shaped region as shown at 331 in
Refer now to
LED device 300 is connected to substrate 361 via traces 371 and 372 by any of a number of methods. For example, heat can be applied to substrate 361 sufficient to cause the solder to reflow and make the connections between LED device 300 and substrate 361. In another example, the solder can be deposited on the PCB before the placement of device 300, and the assembly subsequently reflowed. Additionally, an electrically conductive adhesive such as epoxy, silicone or suitable plastic can be used to make the attachment. Such adhesive can be either cured by heat or other means, such as exposure to ultraviolet (UV) light.
Body 301 provides two functions. First, body 301 acts as a heat sink that buffers thermal fluctuations. Surface 304 dissipates heat to the surrounding air. Body 301 is preferably made of a metal such as copper or aluminum to provide a high thermal conductivity. Since surface 304 is as large as the footprint of the device, this embodiment of the present invention provides substantially more heat transfer area than the prior art devices discussed above.
It should be noted that the heat transfer capability of the present invention can be enhanced by including a surface having a greater surface area in place of surface 304. Such an embodiment is shown in
The above-described embodiments utilize a body having a flat surface such as surface 302 on which the LED is mounted. However, the present invention can be implemented by using a body that includes a cavity having reflective sides that improve light extraction from the LED by reflecting light leaving the sides of the LED such that the reflected light becomes part of the output light from the device. Refer now to
The above-described embodiments of the present invention utilize an encapsulating layer to protect the LED and bond wires. Embodiments that utilize a mold ring to aid in this encapsulating process can also be incorporated. Refer now to
The annular-shaped ring 764 can be of any shape such as circular or polygonal. It acts as a reservoir to contain the optically clear encapsulant 726. Additionally, an optically clear lens 765 made of plastic, polymer or glass can be incorporated on top of the annular-shaped body so as to direct the light in a desired direction. The lens can be glued to the surface of the encapsulant or formed in the encapsulant by a molding operation.
It should be noted that surface 702 may include additional solder bumps to provide additional adhesion points for connecting the LED device to a PCB or the like. Such solder bumps are shown at 771 and 772 in
The above-described embodiments utilize bond wires to make all of the connections between the LED and the solder bumps that connect to the PCB. However, the body may be used for one of these connections. If the chip is conductive or the bottom of the chip having the LED has a contact thereon, and the chip is mounted to the body by an electrically conducting adhesive, then the body can be used to connect to that contact. In this case, an appropriately placed solder bump is formed directly on surface 702.
The above-described embodiments utilize passive convection/conduction to move the heat from the bottom surface of the body, e.g., surface 704 or surface 404, to the surrounding air. However, embodiments in which a fan is utilized to enhance the airflow can also be constructed. The fan can be attached to the bottom surface of the body or provided in the enclosure in which the LED device is located.
From the forgoing discussion, it is clear that an LED device according to the present invention has the body, which spans the device footprint. Therefore the LED device has a heat sink that utilizes the full footprint of the device. Additionally, the body is not encased in any kind of thermally insulative encapsulant, and therefore, is able to dissipate heat more efficiently. Further, the problems related to the coplanarity of the leads and the heat sink in prior art devices have been overcome.
The bottom surface of the body is exposed to the ambient, and hence, efficient heat dissipation can be obtained. Additionally, since the bottom surface does not come in contact with any other surface, the body can be fabricated such that this surface extends as long or deep as possible. Hence, it is now possible to fabricate devices with long or deep heat sinks without having to increase the lateral dimensions of the devices.
Furthermore, since an LED device according to the present invention does not need to conduct heat to the mounting substrate, the mounting substrate can be constructed from common materials such as those used in inexpensive PCBs. In addition, the end-user does not need to provide an additional heat sink, thus simplifying the design of products that use the LED device.
The above-described embodiments of the present invention have been described in terms of transferring the heat generated by the LED to the air via contact between the air and the second surface of the body on which the LED is mounted. However, the present invention can be utilized to construct products having a number of LEDs on a single PCB which transfer the heat generated in each of the LEDs to a common heat sink that dissipates the heat. Refer now to
In the above-described embodiments, the die is mounted on a heat-conducting body that is preferably made from Aluminum or Copper. However, other materials such as ceramics and composites may be utilized for the heat-conducting body.
Various modifications to the present invention will become apparent to those skilled in the art from the foregoing description and accompanying drawings. Accordingly, the present invention is to be limited solely by the scope of the following claims.
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|U.S. Classification||257/707, 257/E33.075, 257/E33.066, 257/E23.101, 257/E23.01, 257/E23.08|
|International Classification||H01L23/36, H01L33/62, H01L33/64|
|Cooperative Classification||H01L24/49, H01L24/48, H01L2924/12041, H01L2924/15311, H01L2224/32257, H01L23/36, H01L2224/48091, H01L33/62, H01L33/64, H01L2224/48247, H01L2224/49175, H01L2224/32245, H01L2924/01068, H01L2924/1532, H01L2224/73265, H01L2924/14|
|European Classification||H01L23/36, H01L33/64, H01L33/62|
|Jul 1, 2004||AS||Assignment|
Owner name: AGILENT TECHNOLOGIES, INC., COLORADO
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NG, KEE YEAN;TAN, CHENG WHY;THAM, JI KIN;REEL/FRAME:014813/0805;SIGNING DATES FROM 20030916 TO 20031001
|Feb 22, 2006||AS||Assignment|
Owner name: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.,SINGAPORE
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:AGILENT TECHNOLOGIES, INC.;REEL/FRAME:017206/0666
Effective date: 20051201
|May 25, 2006||AS||Assignment|
Owner name: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.,S
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.;REEL/FRAME:017675/0518
Effective date: 20060127