|Publication number||US20050116730 A1|
|Application number||US 10/724,512|
|Publication date||Jun 2, 2005|
|Filing date||Nov 28, 2003|
|Priority date||Nov 28, 2003|
|Also published as||US6897668|
|Publication number||10724512, 724512, US 2005/0116730 A1, US 2005/116730 A1, US 20050116730 A1, US 20050116730A1, US 2005116730 A1, US 2005116730A1, US-A1-20050116730, US-A1-2005116730, US2005/0116730A1, US2005/116730A1, US20050116730 A1, US20050116730A1, US2005116730 A1, US2005116730A1|
|Original Assignee||Ming-Huey Hsu|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (3), Referenced by (9), Classifications (9), Legal Events (5)|
|External Links: USPTO, USPTO Assignment, Espacenet|
In general, the present invention relates to double-faced detecting devices for an electronic substrate, and more particularly to detecting devices that enables to alternatively place the electronic substrate in a horizontal position or a vertical position to detect high-frequency properties of the electronic substrate.
With reference to
When the detecting devices operate, a calibration substrate 90 with multiple detecting points 91 (or so-called “pads”) is placed on the top face of the substrate platform 70 for adjustment by the two probes 51 on the two probe-detecting devices 50. After adjustment, the calibration substrate 90 is removed from the substrate platform 70. Then, the flip chip, the wafer or the printed circuit board (not shown) with multiple detecting points is settled on the top face of the substrate platform 70. The probes 51 on the probe-detecting machines 50 extend to touch multiple detecting points 91 to detect high-frequency properties of the electronic substrate.
However, the flip chip, the wafer or the printed circuit board usually has the multiple detecting points formed on a top face and a bottom face in an ideal configuration. For convenience in detection, most of the flip chips, the wafers or the printed circuit boards are designed to arrange the multiple detecting points of circuit on the same face. Unfortunately, data of high-frequency properties obtained from the designed wafers or the printed circuit boards are only simulating data that is not precise. Additionally, only 80% of the electronic substrates can be modified and be detected by the conventional detecting devices. Rest of the electronic substrate still can not be modified in circuit to arrange the multiple detecting points on the same face and thus can not be detected.
The present invention provides double-faced detecting devices for an electronic substrate in high-frequency properties, which conveniently contact multiple detecting points on two faces of the electronic substrate to detect the high-frequency properties.
To achieve the foregoing purpose, the double-faced detecting devices for an electronic substrate comprise:
Whereby, the electronic substrate is rotated and erected to the vertical position to expose two faces to respectively face the two probe-detecting machines to allow multiple detecting points on the two faces to be touched in a convenient way.
With reference to
The base 10 has an erecting post (not numbered) with a front face, an guiding groove 101 longitudinally defined in the front face of the erecting post, and the substrate platform 11 with a connecting rod 112 movably and rotatably attached to the erecting post via the guiding groove 101. The substrate platform 11 has a top face. A through hole 114 is defined in the substrate platform 11 and has a diameter smaller than that of the electronic substrate 40. Therefore, the electronic substrate 40 enables to be mounted on the top face of the substrate platform 11 and exposes the bottom face of the electronic substrate 40 via the through hole 114. The substrate platform 11 is controlled by a controlling device (not shown) to move vertically to change the height of electronic substrate 40. Additionally, the substrate platform 11 also enables to be rotated to hold the electronic substrate 40 at a horizontal position or a vertical position. Preferably, the substrate platform 11 rotates from 0 to 90 degrees.
The two pivot bases 33 are oppositely located beside the substrate platform 11. Each pivot base 33 has a levering plate 32. Each probe-detecting machine 30 is mounted on the levering plate 32 and has a probe 31 retractably extending toward to the electronic substrate 40. Whereby, the probe-detecting machine 30 can be pivoted to allow the probe 31 being inclined to extend upward to reach the contacts 41 at high locations when the electronic substrate 40 is in the vertical position.
With further reference to
For an actually complete operation, a calibration substrate is applied on the detecting devices initially for adjustment as described in the conventional ones. Then, a flip chip, a wafer or a printed circuit board is mounted on the top face of the substrate platform 11 to detect high-frequency properties. Operational procedures of the detecting devices for each detection of any electronic substrate, whether the calibration substrate or the flip chip, the wafer or the printed circuit board, are the same as described as in the conventional detecting devices.
Although particular and specific embodiments of the invention have been disclosed in some detail, numerous modifications will occur to those having skill in the art, which modifications hold true to the spirit of this invention. Such modifications are deemed to be within the scope of the following claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
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|US3701021 *||Nov 27, 1970||Oct 24, 1972||Signetics Corp||Apparatus for testing circuit packages|
|Citing Patent||Filing date||Publication date||Applicant||Title|
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|US7876114||Aug 7, 2008||Jan 25, 2011||Cascade Microtech, Inc.||Differential waveguide probe|
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|International Classification||G01R31/02, G01R31/28, G01R1/067|
|Cooperative Classification||G01R31/2808, G01R31/2893, G01R1/06772|
|European Classification||G01R31/28G6, G01R31/28B4B|
|Nov 28, 2003||AS||Assignment|
|Nov 10, 2008||FPAY||Fee payment|
Year of fee payment: 4
|Jan 7, 2013||REMI||Maintenance fee reminder mailed|
|May 24, 2013||LAPS||Lapse for failure to pay maintenance fees|
|Jul 16, 2013||FP||Expired due to failure to pay maintenance fee|
Effective date: 20130524