|Publication number||US20050156301 A1|
|Application number||US 11/082,078|
|Publication date||Jul 21, 2005|
|Filing date||Mar 16, 2005|
|Priority date||Jan 6, 2004|
|Also published as||CN1914723A, CN100495689C, US6905910, US20050146001, WO2005067657A2, WO2005067657A3|
|Publication number||082078, 11082078, US 2005/0156301 A1, US 2005/156301 A1, US 20050156301 A1, US 20050156301A1, US 2005156301 A1, US 2005156301A1, US-A1-20050156301, US-A1-2005156301, US2005/0156301A1, US2005/156301A1, US20050156301 A1, US20050156301A1, US2005156301 A1, US2005156301A1|
|Inventors||Hei Shiu, Wai Chow, Kam Lee|
|Original Assignee||Shiu Hei M., Chow Wai W., Lee Kam F.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (19), Referenced by (5), Classifications (18), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present invention relates to image and optical sensors and, more particularly, to a method of packaging an optical sensor and the resulting packaged sensor product.
There has been a constant demand for smaller and smarter industrial and consumer electronic products such as digital cameras, camcorders, audio players, etc. Such miniaturization and increased functionality has benefited from advances in the design and manufacturing of semiconductor circuits and wafers. There has also been a marked increase in the use of optical and image sensors in electronic products. Such sensor devices are packaged in a variety of ways. For example, an optical sensor in a ceramic leadless chip carrier has good optical quality, but large package form factor. A wafer level package has a lesser form factor and good optical quality, but is very expensive. Image sensors are also available as a molded quad flat pack (QFP). While the QFP has a moderate cost, it has low optical quality and a large package form factor. Further, it is important both to accurately align the optical sensor image center with the optical axis of the optical lens and provide proper glass height stand off.
It would be advantageous to provide a packaged image sensor with a low package form factor, moderate cost, and high optical quality.
The foregoing summary, as well as the following detailed description of the present invention, will be better understood when read in conjunction with the appended drawings. For the purpose of illustrating the invention, there is shown in the drawings an embodiment that is presently preferred. It should be understood, however, that the invention is not limited to the precise arrangement and instrumentalities shown. In the drawings:
The detailed description set forth below in connection with the appended drawings is intended as a description of the presently preferred embodiments of the invention, and is not intended to represent the only forms in which the present invention may be practiced. It is to be understood that the same or equivalent functions may be accomplished by different embodiments that are intended to be encompassed within the spirit and scope of the invention.
Certain features in the drawings have been enlarged for ease of illustration and the drawings and the elements thereof are not necessarily in proper proportion. However, those of ordinary skill in the art will readily understand such details. In the drawings, like numerals are used to indicate like elements throughout.
The present invention provides an image sensor device with low cost and high optical quality in a near chip scale package based on standard high density array format, quad flat no-lead (QFN) assembly infrastructure. A tight tolerance in assembly height and unique mechanical structure design provides close dimension matching with mold cavity height. The packaged sensor device uses an inner leadframe panel as a precise height standoff object to control the focal length of the sensor. The lens is attached to its own leadframe panel with tape. The tape prevents resin bleeding, which keeps the lens clean and facilitates post-mold cleaning.
More particularly, in one embodiment, the present invention provides an image sensor device including a first leadframe having a central die receiving area surrounded by a plurality of lead fingers and a sensor integrated circuit (IC) disposed within the die receiving area of the first leadframe. The IC has a first surface with an active area and a peripheral bonding pad area. The peripheral bonding pad area includes a plurality of bonding pads. A plurality of wires are wirebonded to respective ones of the IC bonding pads and corresponding ones of the leadframe lead fingers of the first leadframe, thereby electrically connecting the IC and the first leadframe. A second leadframe having a central lens receiving area is provided. A transparent lens is disposed within the central lens receiving area of the second leadframe and the second leadframe is located over the first leadframe such that the lens is disposed over the IC active area. A transparent adhesive is disposed on the IC active area to secure the lens to the IC. A mold compound is injected between the first and second leadframes, and over the wirebonds. During assembly of the image sensor device, a third leadframe is located between the first and second leadframes for controlling the spacing between the IC active surface and the lens.
In another embodiment, the present invention provides a method of packaging an optical sensor. The method includes the steps of:
Referring now to
After injection of the mold compound 64 and curing, the first and second tapes 32 and 46 are removed from the first sides of the first and second leadframe panels 22 and 38. The first and second tapes 32 and 46 may be removed manually or with commercially available equipment.
The description of the preferred embodiments of the present invention have been presented for purposes of illustration and description, but are not intended to be exhaustive or to limit the invention to the forms disclosed. It will be appreciated by those skilled in the art that changes could be made to the embodiments described above without departing from the broad inventive concept thereof. It is understood, therefore, that this invention is not limited to the particular embodiments disclosed, but covers modifications within the spirit and scope of the present invention as defined by the appended claims.
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|U.S. Classification||257/678, 257/E31.117, 438/123|
|International Classification||H01L23/02, H01L21/48, H01L21/44, H01L23/495, H01L31/0203|
|Cooperative Classification||H01L2924/181, H01L2224/48091, H01L24/97, H01L2224/48227, H01L31/0203, H01L27/14618, H01L27/14683|
|European Classification||H01L31/0203, H01L27/146V, H01L27/146A6|
|Feb 2, 2007||AS||Assignment|
Owner name: CITIBANK, N.A. AS COLLATERAL AGENT,NEW YORK
Free format text: SECURITY AGREEMENT;ASSIGNORS:FREESCALE SEMICONDUCTOR, INC.;FREESCALE ACQUISITION CORPORATION;FREESCALE ACQUISITION HOLDINGS CORP.;AND OTHERS;REEL/FRAME:018855/0129
Effective date: 20061201
|Jun 23, 2010||AS||Assignment|
Owner name: MOTOROLA, INC.,ILLINOIS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SHIU, HEI MING;CHOW, WAI WONG;LEE, KAM FAI;SIGNING DATESFROM 20031013 TO 20031021;REEL/FRAME:024582/0398
Owner name: FREESCALE SEMICONDUCTOR, INC.,TEXAS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MOTOROLA, INC.;REEL/FRAME:024582/0509
Effective date: 20040404
|Jul 12, 2010||AS||Assignment|
Owner name: TANG SUNG CAPITAL, LLC, DELAWARE
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FREESCALE SEMICONDUCTOR, INC.;REEL/FRAME:024662/0192
Effective date: 20100609