US 20050195571 A1
A thermal assembly for cooling an electronics module is described. The assembly includes a compressible thermal pad, a thermal plate, and a clip. The thermal plate attaches to a heat sink. The clip urges the thermal pad against a surface of the thermal plate. Heat generated by electronics components in the pluggable electronics module is conducted to the heat sink through a thermal path defined by the thermal plate, the compressible thermal pad, and the clip.
1. An assembly for cooling an electronics module comprising:
a compressible thermal pad;
a thermal plate having a surface and configured for coupling to a heat sink; and
a clip attached to the thermal plate, the clip substantially surrounding the thermal pad and urging the thermal pad against the surface of the thermal plate, the compressible thermal pad, the thermal plate, and the clip providing a thermal path between the electronics module and the heat sink.
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9. An assembly for cooling an electronics module comprising:
a rigid means for conducting heat to a heat sink attached to the heat sink;
a compressible means for conducting heat from the electronics module, the compressible means being thermally coupled to the rigid means, the compressible means generating a force normal to the rigid means when in a compressed state; and
a means for securing the compressible means to the rigid means, the means for securing substantially surrounding the compressible means and adapted for thermal contact with the electronics module to conduct heat therefrom.
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The invention relates to a thermal assembly for use with a heat sink. More specifically, the invention relates to a thermal assembly for cooling an electronics module.
Electronic component manufacturers often work together to develop multi-source agreements (MSA) that describe guidelines for manufacturing various electronics modules. For example, there exists an MSA for dense wavelength division multiplexing (DWDM) pluggable transceiver modules and for XFP (10 gigabit small form factor pluggable module) devices. With reference to
In some communications applications, multiple pluggable modules 10 are grouped together in an enclosure. The enclosure typically includes printed circuit boards (PCBs), circuitry, and various devices, which are part of an optical communications system. The top surface of the enclosure often is a heat sink. As the modules 10 are inserted into the enclosure, the heat transfer fins 30 of the pluggable modules 10 make contact with the underside of the heat sink to establish a thermal path to help dissipate the heat generated by the enclosed electronic components. Friction between the heat transfer fins 30 and the underside of the heat sink during insertion is undesirable because it increases the force necessary to insert and remove the pluggable modules 10.
Alternatively, a gap can be maintained between the underside of the heat sink and the heat transfer fins 30. The gap eliminates the friction between the heat transfer fins 30 and the underside of the heat sink module; however, the gap also creates a break in the thermal path between the module 10 the heat sink, resulting in increased component temperature and possibly degraded operation of the module 10.
What is needed is a thermal assembly that reduces friction during insertion and provides a thermal path between the module and the heat sink.
In one aspect the invention relates to an assembly for cooling an electronics module. The assembly has a compressible thermal pad, a thermal plate, and a clip. The thermal plate has a surface and is configured for coupling to a heat sink. The clip attaches to the thermal plate and surrounds the thermal pad. The clip urges the thermal pad against the surface of the thermal plate to provide a thermal path between the clip and the heat sink.
In yet another aspect, the invention relates to a means for cooling an electronics module. The cooling means includes a rigid means, a compressible means, and a securing means. The rigid means conducts heat to a heat sink and attaches to the heat sink. The compressible means conducts heat from the electronics module. The compressible means is thermally coupled to the rigid means and generates a force normal to the rigid means when in a compressed state. The means for securing secures the compressible means to the rigid means. The securing means surrounds the compressible means and is adapted for thermal contact with the electronics module to conduct heat from the module.
The above and further advantages of this invention may be better understood by referring to the following description in conjunction with the accompanying drawings, in which like numerals indicate like structural elements and features in various figures. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention.
In one exemplary configuration, the electronics module 10 is inserted into a carrier 34 as shown in
While the invention has been shown and described with reference to specific preferred embodiments, it should be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the following claims. For example, the thermal plate 64 can be an integral part of the heat sink 54.