Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUS20050225222 A1
Publication typeApplication
Application numberUS 10/822,191
Publication dateOct 13, 2005
Filing dateApr 9, 2004
Priority dateApr 9, 2004
Also published asEP1738386A2, US7728341, US20070064429, WO2005101446A2, WO2005101446A3
Publication number10822191, 822191, US 2005/0225222 A1, US 2005/225222 A1, US 20050225222 A1, US 20050225222A1, US 2005225222 A1, US 2005225222A1, US-A1-20050225222, US-A1-2005225222, US2005/0225222A1, US2005/225222A1, US20050225222 A1, US20050225222A1, US2005225222 A1, US2005225222A1
InventorsJoseph Mazzochette, Edmar Amaya
Original AssigneeJoseph Mazzochette, Edmar Amaya
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Light emitting diode arrays with improved light extraction
US 20050225222 A1
Abstract
In accordance with the invention, an illumination device comprises a highly thermally conductive substrate having a surface, a plurality of light emitting diodes (LEDs) supported by the surface and arranged in an array to provide illumination. At least one reflective barrier at least partially surrounds each LED. The reflective barrier is shaped to reflect away from the LED light emitted by other LEDs in the array. Advantageously the substrate and reflective barrier are thermally coupled to a heat spreader to dissipate heat generated by the LEDs. The substrate preferably comprises an LTTC-M heat spreader, and the reflective thermal barriers preferably comprise metal ridges or cups.
Images(8)
Previous page
Next page
Claims(9)
1. An illumination device comprising:
a substrate having a surface and including a highly thermally conductive heat spreader;
a plurality of light emitting diodes (LEDs) supported by the surface, the LEDs arranged in an array to provide illumination;
at least one reflective barrier at least partially surrounding each LED, the reflective barrier shaped to reflect away from the LED light emitted by other LEDs in the array;
the LEDs and the reflective barrier thermally coupled to the heat spreader to dissipate heat generated by the LEDs and heat produced by light absorption.
2. The device of claim 1 wherein the substrate comprises an LTCC-M heat spreader.
3. The device of claim 1 wherein the at least one reflective barrier comprises a periodic array of troughs and reflective ridges, the ridges shaped to reflect away from an LED light from an LED in an adjacent trough.
4. The device of claim 1 wherein the at least one reflective barrier comprises a reflective ridge shaped to reflect away LED light from an adjacent LED.
5. The device of claim 1 wherein at least one reflective barrier comprises a cup substantially peripherally surrounding an LED to reflect light away from adjacent LEDs.
6. The device of claim 4 wherein the at least one reflective barrier comprises an array of cups, each cup substantially peripherally surrounding a respective LED to reflect light away from adjacent LEDs.
7. The device of claim 1 wherein the at least one reflective barrier comprises a plurality of reflective circular sectors arranged in a circle, each reflective sector shaped to reflect away light from other sectors in the array.
8. The device of claim 1 wherein the at least one reflective barrier comprises a cavity having reflective walls and one or more smoothly curved reflective edges formed by the cooling of molten metal.
9. The device of claim 1 wherein the at least one reflective barrier is shaped to provide directional illumination.
Description
    FIELD OF THE INVENTION
  • [0001]
    This invention relates to light emitting diode (LED) arrays and, in particular, to LED arrays with integral reflective barriers and methods for making same.
  • BACKGROUND OF THE INVENTION
  • [0002]
    Light emitting diodes (LEDs) are being used as light sources in an increasing variety of applications extending from communications and instrumentation to household, automotive and other visual displays. LED arrays comprise a plurality of LEDs arranged on a common substrate. One problem with LED arrays is the significant heat generated by dense concentrations of LEDs. Solutions to the thermal problems associated with LED arrays are the subject of a related application entitled, “Light Emitting Diodes Packaged For High Temperature Operation” U.S. patent application Ser. No. 10/638,579, filed Aug. 11, 2003. The Ser. No. 10/630,579 application is incorporated herein by reference.
  • [0003]
    Another problem in LED arrays concerns illumination efficiency. Illumination efficiency is a measure of the percentage of generated light that actually leaves an LED package and that can serve as useable light in the intended application. FIGS. 1 and 2 show a typical LED array 10. LED dies (semiconductor chips) 12 generate light. LED dies 12 are typically box-like in structure with 6 sides. Since they are almost always mounted on one of the light surfaces, the other 5 surfaces are capable of emitting light generated by the device. Some of the light is absorbed by nearby walls 22 of array package 11, some is reflected back to the emitting die, and some is absorbed directly by nearby LED die 12 in the array. The remainder of the light exits the package.
  • [0004]
    There is a relationship between illumination efficiency and the thermal problems of LED arrays. Self-heating by absorption contributes to thermal problems. Thus, there is a need for an LED packaging arrangement that can increase the illumination efficiency of LED array devices and reduce the thermal problems produced by absorption.
  • SUMMARY OF THE INVENTION
  • [0005]
    In accordance with the invention, an illumination device comprises a highly thermally conductive substrate having a surface, a plurality of light emitting diodes (LEDs) supported by the surface and arranged in an array to provide illumination. At least one reflective barrier at least partially surrounds each LED. The reflective barrier is shaped to reflect away from the LED light emitted by other LEDs in the array. Advantageously the substrate and reflective barrier are thermally coupled to a heat spreader to dissipate heat. The substrate preferably comprises an LTTC-M heat spreader, and the reflective thermal barriers preferably comprise metal ridges or cups.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0006]
    The advantages, nature and various additional features of the invention will appear more fully upon consideration of the illustrative embodiments now to be described in detail in connection with the accompanying drawings. In the drawings:
  • [0007]
    FIG. 1 shows a typical LED array according to the prior art;
  • [0008]
    FIG. 2 shows a side view of the LED array of FIG. 1;
  • [0009]
    FIG. 3 shows an exemplary LED package of the prior art;
  • [0010]
    FIG. 4 shows accordion-tapered reflective thermal barriers;
  • [0011]
    FIG. 5 shows a side view of an LED array with integral tapered thermal barrier reflectors;
  • [0012]
    FIG. 6 shows a metal cup tapered reflective barrier;
  • [0013]
    FIG. 7 shows a multi-cup tapered reflective barrier; and
  • [0014]
    FIG. 8 shows wedge shaped cup tapered barriers arranged to form a circular array.
  • [0015]
    It is to be understood that these drawings are for illustrating the concepts of the invention and are not to scale.
  • DETAILED DESCRIPTION
  • [0016]
    This description is divided into two parts. Part I describes the structure and features of light emitting diodes (LEDs) packaged in an array for high illumination efficiency in accordance with the invention and illustrate exemplary embodiments. Part II provides further details of the LTCC-M packaging technology as applicable to LED arrays.
  • [0000]
    I. LEDs Packaged for High Illumination Efficiency
  • [0017]
    FIG. 4 illustrates, a tapered barrier reflector 40 fabricated as a periodic array of troughs 41 and tapered reflective ridges 42. This accordion-like structure is a particularly cost effective to manufacture. Metal reflective material can be folded in an accordion-like manner to form the tapered reflective barriers 42. LED dies 12 can be affixed in the troughs 43 between reflective barriers 42.
  • [0018]
    The barrier reflector 40 can provide a connection to the anode or cathode of LED dies 12. The barrier 40 also serves a thermal cooling function. Heat from the LED die 12 can be channeled by the barrier reflector 40 to associated thermal spreaders and to a supporting LTCC-M substrate
  • [0019]
    FIG. 5 shows an alternative high efficiency LED array 50 comprising discrete reflective barrier structures 52. The reflective thermal barriers 52 are advantageously shaped as fins causing the heat to move from the bottom of the LED 12 through the thermally conductive material (such as solder or silver epoxy 53) to the top of the fin. The length and angle of the fin can be modified by those skilled in the art. The thermal resistance of a LED array package is inversely proportional to the heat dissipating area. Thus the more and longer reflective thermal barriers 52 are, the larger the area for heat dissipation. The LED devises are subsequently encapsulated as by an optically matched clear epoxy 55 formed in a domed shaped in order to increase light extraction and to minimize total internal reflection (TIR).
  • [0020]
    LED dies 12 are disposed in an array pattern overlying substrate 54. Tapered discrete reflective barriers 52 cause light that would have been absorbed by other die or walls of the package to reflect out of the array package, thus increasing the illumination efficiency. LED dies 12 can be affixed to substrate 54 by solder or epoxy 53.
  • [0021]
    Substrate 54 may be non-conducting or conducting. In the case where substrate 54 is conducting, or has overlaying conductive patterns and traces (not shown), an electrical connection can be made on the mounting surface to either the anode or cathode of LED dies 12. In the case of conductive traces, both the anode and cathode connections can be made on the mounting surfaces of dies 12.
  • [0022]
    FIG. 3 shows further detail of possible electrical connections to die 12. The electrical connections can be made via wire bonds 32 to the LED anode and cathode. Alternatively either the anode or cathode can make electrical contact with a conductor on an insulating substrate, or a conductive substrate. In this case, the remaining terminal can then be connected to dies 12 by a single wire bond. LED die can be soldered (to a metal substrate 36 or overlying conductor 35) or they can be epoxied to substrate 36. A typically translucent or transparent package wall 34 can support a translucent or transparent LED encapsulate 31.
  • [0023]
    Turning back to FIG. 5, it can be seen that liquid epoxy 53 can be deposited on a metal conductor 52 and conductor 52 can be attached to substrate 54. Conductor 52 can be thick film, thin film, electro-deposited, a metal laminate, or other suitable electrical and thermal conductor. If no electrical contact is required conductor 52 can be omitted; however additional heat spreading from the die can be accomplished if conductor 52 is used. Substrate 54 can be a ceramic, multilayer printed wire board, low temperature cofired ceramic (LTCC), LTCC on metal (LTCC-M), high temperature cofired ceramic (HTCC), or other suitable electrical insulator and thermal conductor. Substrate 54 can be an electrically conducting material if electrical contact to die 12 is desirable, or it can be an electrically insulating layer formed between the substrate and die 12.
  • [0024]
    FIG. 6 is an exploded view that shows a device 60 where the tapered barrier is a reflective cup 61. LED dies 12 can then be affixed within each cup 61. Each cup 61 is affixed to substrate 54 by solder or epoxy. A small hole 62, with a diameter slightly smaller than the width of the die, can be formed in cup 61. The hole 62 allows some of the liquid epoxy or solder to seep into the cup. Die 12 is then placed into the cup on top of the epoxy or solder. Similarly, LED die 12 can be placed in cup 61 and bonded directly through hole 62 to substrate 54 by epoxy or solder. While hole 62 is not required in assembly 60, the hole facilitates fabrication because the additional step of adding epoxy or solder in the cup for the die can be avoided.
  • [0025]
    Cup 61 can be fabricated from aluminum, stainless steel, tin, nickel, or other reflective material. The cups can be formed by stamping, etching, coining, machining, or other manufacturing method. Assembly of an array of LED die in reflective cup tapered barriers can be accomplished using inexpensive pick-and-place assembly.
  • [0026]
    FIG. 7 illustrates an advantageous embodiment 70 using an array of cups 71. This multi-cup assembly can be pressed, stamped, or otherwise formed from a sheet of metal 72. Cups 71 need not be round and can be elliptical, square, or rectangular in shape. The metal can gauge from 0.002″ to 0.030″, and it can comprise brass, copper, phosphorous bronze, beryllium copper, stainless steel, titanium, Inconel, carbon or alloy steel or precious metal.
  • [0027]
    FIG. 8 shows a circular array 80 created from wedge-shaped sector cups 81. Each wedge 81 can include an LED die 12, and the sector cups can be arranged in the form of a circle.
  • [0028]
    Referring to FIGS. 9, 10 and 11, yet another method to create a reflecting surface on an LED cavity wall is to metallize the wall of the cavity with a thick or thin reflective metal film 101, such as silver. Then a molten reflecting metal 92 such as solder is applied to use the cavity edge as a capillary holder (FIG. 9). The molten metal will conform to the edge capillary and will shape the reflector cup wall into a parabola shape as seen in assemblies 100 and 110. The middle of the cup can have a metal insert such as a high temperature solder ball 91 (FIG. 10) or a metal/solder column 111 (FIG. 11).
  • [0029]
    In all of the above mentioned embodiments, the materials used to form the reflective barriers should have low absorption characteristics in the 300 to 800 nm wavelength range. The barrier surfaces can be dispersive or non-dispersive depending on the application.
  • [0030]
    It is sometimes desirable to direct light that comes out of the LED on to a certain target. FIG. 12 shows a conventional assembly 120 composed of multiple subassemblies 121 illuminating from the periphery of a mushroom-like heat sink 122. The target illumination profile of this subassembly is 360 degrees at an inclination angle θ. In order to direct light at this angle, a truncated cone shape heat sink would have to be machined. Placing the subassemblies on the angled surface of the heat sink is difficult. Standard surface mount (SMT) technology can not be used. Thus fabrication becomes a complex, laborious and expensive process.
  • [0031]
    In accordance with this aspect of the invention, reflector walls are used as guides for reflecting light directionally from an array. The barrier surfaces can be shaped as light guides to reflect the light at a particular target angle. FIG. 13 depicts the outline of a stamped reflector cup 131 adapted for a directional lighting array. Direction at an angle θ is accomplished by shaping the cup. The die will sit at an angle due to the slope of the cup. The LED die will be connected with the substrate using conductive epoxy and wired using a wirebond though hole 132. The die/cup assemblies can be mounted on a planar substrate by SMT assembly.
  • [0032]
    Another advantageous embodiment is depicted in FIG. 14. The LED 12 can be placed using standard SMT equipment parallel with the thermally conductive substrate. A glob of conductive epoxy 142 is dispensed on the bottom of the cup 141, attaching to the board both the cup and the LED die. The cup 141 is shaped so that the majority of the rays come out at angle θ. The electrical connection can be made with a gold wirebond 32 through a hole 132 in the cup. This embodiment is advantageous due to its simplicity and ease of volume manufacturing. Cup 141 can be fabricated from aluminum, stainless steel, tin, nickel, or other reflective material. It can be formed by stamping, etching, coining, machining, or other manufacturing method.
  • [0000]
    II. LTCC-M Packaging
  • [0033]
    LTCC-M packaging is particularly suitable for dispensing heat generated by densely packed arrays of LED die. This section highlights some of the important aspects of LTCC-M packaging applicable to fabricating LED arrays with reflective barriers.
  • [0034]
    Multilayer ceramic circuit boards are made from layers of green ceramic tapes. A green tape is made from particular glass compositions and optional ceramic powders, which are mixed with organic binders and a solvent, cast and cut to form the tape. Wiring patterns can be screen printed onto the tape layers to carry out various functions. Vias are then punched in the tape and are filled with a conductor ink to connect the wiring on one green tape to wiring on another green tape. The tapes are then aligned, laminated, and fired to remove the organic materials, to sinter the metal patterns and to crystallize the glasses. This is generally carried out at temperatures below about 1000° C., and preferably from about 750-950° C. The composition of the glasses determines the coefficient of thermal expansion, the dielectric constant and the compatibility of the multilayer ceramic circuit boards to various electronic components. Exemplary crystallizing glasses with inorganic fillers that sinter in the temperature range 700 to 1000° C. are Magnesium Alumino-Silicate, Calcium Boro-Silicate, Lead Boro-Silicate, and Calcium Alumino-Boricate.
  • [0035]
    More recently, metal support substrates (metal boards) have been used to support the green tapes. The metal boards lend strength to the glass layers. Moreover since the green tape layers can be mounted on both sides of a metal board and can be adhered to a metal board with suitable bonding glasses, the metal boards permit increased complexity and density of circuits and devices. In addition, passive and active components, such as resistors, inductors, and capacitors can be incorporated into the circuit boards for additional functionality. Where optical components, such as LEDs are installed, the walls of the ceramic layers can be shaped and/or coated to enhance the reflective optical properties of the package, or reflective barriers as described herein in Part I, can be used to further improve both the illumination and thermal efficiency of the LED array package.
  • [0036]
    This system, known as low temperature cofired ceramic-metal support boards, or LTCC-M, has proven to be a means for high integration of various devices and circuitry in a single package. The system can be tailored to be compatible with devices including silicon-based devices, indium phosphide-based devices and gallium arsenide-based devices, for example, by proper choice of the metal for the support board and of the glasses in the green tapes.
  • [0037]
    The ceramic layers of the LTCC-M structure must be matched to the thermal coefficient of expansion of the metal support board. Glass ceramic compositions are known that match the thermal expansion properties of various metal or metal matrix composites. The LTCC-M structure and materials are described in U.S. Pat. No. 6,455,930, “Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology”, issued Sep. 24, 2002 to Ponnuswamy, et al and assigned to Lamina Ceramics. U.S. Pat. No. 6,455,930 is incorporated by reference herein. The LTCC-M structure is further described in U.S. Pat. Nos. 5,581,876, 5,725,808, 5,953,203, and 6,518,502, all of which are assigned to Lamina Ceramics and also incorporated by reference herein.
  • [0038]
    The metal support boards used for LTCC-M technology do have a high thermal conductivity, but some metal boards have a high thermal coefficient of expansion, and thus a bare die cannot always be directly mounted to such metal support boards. However, some metal support boards are known that can be used for such purposes, such as metal composites of copper and molybdenum (including from 10-25% by weight of copper) or copper and tungsten (including 10-25% by weight of copper), made using powder metallurgical techniques. Copper clad Kovar®, a metal alloy of iron, nickel, cobalt and manganese, a trademark of Carpenter Technology, is a very useful support board. AlSiC is another material that can be used for direct attachment, as can aluminum or copper graphite composites.
  • [0039]
    Another instance wherein good cooling is required is for thermal management of flip chip packaging. Densely packed microcircuitry, and devices such as decoder/drivers, amplifiers, oscillators and the like which generate large amounts of heat, can also use LTCC-M techniques advantageously. Metallization on the top layers of an integrated circuit bring input/output lines to the edge of the chip so as to be able to wire bond to the package or module that contains the chip. Thus the length of the wirebond wire becomes an issue; too long a wire leads to parasitics. The cost of very high integration chips may be determined by the arrangement of the bond pads, rather than by the area of silicon needed to create the circuitry. Flip chip packaging overcomes at least some of these problems by using solder bumps rather than wirebond pads to make connections. These solder bumps are smaller than wire bond pads and, when the chip is turned upside down, or flipped, solder reflow can be used to attach the chip to the package. Since the solder bumps are small, the chip can contain input/output connections within its interior if multilayer packaging is used. Thus the number of die in it, rather than the number and size of bond pads will determine the chip size.
  • [0040]
    However, increased density and integration of functions on a single chip leads to higher temperatures on the chip, which may prevent full utilization of optimal circuit density. The only heat sinks are the small solder bumps that connect the chip to the package. If this is insufficient, small active or passive heat sinks must be added on top of the flip chip. Such additional heat sinks increase assembly costs, increase the number of parts required, and increase the package costs. Particularly if the heat sinks have a small thermal mass, they have limited effectiveness as well.
  • [0041]
    In the simplest form of the present invention, LTCC-M technology is used to provide an integrated package for a semiconductor component and accompanying circuitry, wherein the conductive metal support board provides a heat sink for the component. A bare semiconductor die, for example, can be mounted directly onto a metal base of the LTCC-M system having high thermal conductivity to cool the semiconductor component. In such case, the electrical signals to operate the component must be connected to the component from the ceramic.
  • [0042]
    Indirect attachment to the metal support board can also be used. In this package, all of the required components are thermally coupled to a metal support board, that can also incorporate embedded passive components such as conductors and resistors into the multilayer ceramic portion, to connect the various components, i.e., semiconductor components, circuits, heat sink and the like, in an integrated package. In the case of LED arrays, where electrical circuit considerations would dictate an insulating material be used, thermal conduction can be problematic. Here the inventive reflective barriers further serve as thermal spreading devices to help transfer heat received by conduction and radiation through the insulating layer to the metal base.
  • [0043]
    For a more complex structure having improved heat sinking, the integrated package of the invention combines a first and a second LTCC-M substrate. The first substrate can have mounted thereon a semiconductor device, and a multilayer ceramic circuit board with embedded circuitry for operating the component; the second substrate has a heat sink or conductive heat spreader mounted thereon. Thermoelectric (TEC) plates (Peltier devices) and temperature control circuitry are mounted between the first and second substrates to provide improved temperature control of semiconductor devices. A hermetic enclosure can be adhered to the metal support board.
  • [0044]
    The use of LTCC-M technology can also utilize the advantages of flip chip packaging together with integrated heat sinking. The packages of the invention can be made smaller, cheaper and more efficient than existing present-day packaging. The metal substrate serves as a heat spreader or heat sink. The flip chip can be mounted directly on the metal substrate, which is an integral part of the package, eliminating the need for additional heat sinking. A flexible circuit can be mounted over the bumps on the flip chip. The use of multilayer ceramic layers can also accomplish a fan-out and routing of traces to the periphery of the package, further improving heat sinking. High power integrated circuits and devices that have high thermal management needs can be used with this new LTCC-M technology.
  • [0045]
    It is understood that the above-described embodiments are illustrative of only a few of the many possible specific embodiments, which can represent applications of the invention. Numerous and varied other arrangements can be made by those skilled in the art without departing from the spirit and scope of the invention.
Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US3711789 *Nov 18, 1970Jan 16, 1973Texas Instruments IncDiode array assembly for diode pumped lasers
US4886709 *Jul 1, 1988Dec 12, 1989Sumitomo Electric Industries, Ltd.Member for semiconductor apparatus
US4935666 *Aug 26, 1988Jun 19, 1990English Electric Valve Co., Ltd.Spark gap devices
US5117281 *Oct 22, 1990May 26, 1992Nec CorporationSemiconductor device having a heat-sink attached thereto
US5122781 *Sep 6, 1990Jun 16, 1992Bolan Trading Inc.Hazard warning light
US5140220 *Sep 1, 1988Aug 18, 1992Yumi SakaiLight diffusion type light emitting diode
US5482898 *Mar 27, 1995Jan 9, 1996Amkor Electronics, Inc.Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding
US5485037 *Mar 27, 1995Jan 16, 1996Amkor Electronics, Inc.Semiconductor device having a thermal dissipator and electromagnetic shielding
US5581876 *Jan 27, 1995Dec 10, 1996David Sarnoff Research Center, Inc.Method of adhering green tape to a metal support substrate with a bonding glass
US5660461 *Dec 8, 1994Aug 26, 1997Quantum Devices, Inc.Arrays of optoelectronic devices and method of making same
US5725808 *May 23, 1996Mar 10, 1998David Sarnoff Research Center, Inc.Multilayer co-fired ceramic compositions and ceramic-on-metal circuit board
US5745624 *Aug 23, 1996Apr 28, 1998The Boeing CompanyAutomatic alignment and locking method and apparatus for fiber optic module manufacturing
US5841244 *Jun 18, 1997Nov 24, 1998Northrop Grumman CorporationRF coil/heat pipe for solid state light driver
US5847935 *Dec 16, 1996Dec 8, 1998Sarnoff CorporationElectronic circuit chip package
US5857767 *Feb 25, 1997Jan 12, 1999Relume CorporationThermal management system for L.E.D. arrays
US5953203 *Mar 6, 1997Sep 14, 1999Sarnoff CorporationMultilayer ceramic circuit boards including embedded capacitors
US5977567 *Jan 6, 1998Nov 2, 1999Lightlogic, Inc.Optoelectronic assembly and method of making the same
US6016038 *Aug 26, 1997Jan 18, 2000Color Kinetics, Inc.Multicolored LED lighting method and apparatus
US6045240 *Oct 20, 1997Apr 4, 2000Relume CorporationLED lamp assembly with means to conduct heat away from the LEDS
US6220722 *Sep 16, 1999Apr 24, 2001U.S. Philips CorporationLed lamp
US6259838 *Oct 15, 1999Jul 10, 2001Sarnoff CorporationLinearly-addressed light-emitting fiber, and flat panel display employing same
US6259868 *Jan 12, 2000Jul 10, 2001Fujitsu LimitedImage forming apparatus with width detection
US6318886 *Feb 11, 2000Nov 20, 2001Whelen Engineering CompanyHigh flux led assembly
US6325524 *Jan 29, 1999Dec 4, 2001Agilent Technologies, Inc.Solid state based illumination source for a projection display
US6376268 *Jun 15, 1999Apr 23, 2002Intel CorporationOptoelectronic assembly and method of making the same
US6455930 *Sep 18, 2000Sep 24, 2002Lamina Ceramics, Inc.Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
US6480389 *Mar 19, 2002Nov 12, 2002Opto Tech CorporationHeat dissipation structure for solid-state light emitting device package
US6488623 *Nov 9, 2000Dec 3, 2002Hill-Rom Services, Inc.Skin perfusion evaluation apparatus
US6518502 *May 10, 2001Feb 11, 2003Lamina Ceramics, InCeramic multilayer circuit boards mounted on a patterned metal support substrate
US6634750 *Jun 13, 2002Oct 21, 2003Wavefront Sciences, Inc.Tomographic wavefont analysis system and method of mapping an optical system
US6634770 *Aug 24, 2001Oct 21, 2003Densen CaoLight source using semiconductor devices mounted on a heat sink
US6670751 *Oct 19, 2001Dec 30, 2003Samsung Electro-Mechanics Co., Ltd.Light emitting diode, light emitting device using the same, and fabrication processes therefor
US6692252 *Dec 17, 2001Feb 17, 2004Ultradent Products, Inc.Heat sink with geometric arrangement of LED surfaces
US6793374 *Sep 25, 2002Sep 21, 2004Simon H. A. BegemannLED lamp
US6949771 *Apr 23, 2002Sep 27, 2005Agilent Technologies, Inc.Light source
US20010032965 *Feb 16, 2001Oct 25, 2001Young WangCatalyst and method of steam reforming
US20020004251 *Aug 23, 2001Jan 10, 2002Roberts John K.Method of making a semiconductor radiation emitter package
US20020034834 *Jun 15, 1999Mar 21, 2002Jean-Marc VerdiellOptoelectronic assembly and method of making the same
US20020163006 *Apr 23, 2002Nov 7, 2002Yoganandan Sundar A/L NatarajanLight source
US20020175621 *Oct 19, 2001Nov 28, 2002Samsung Electro-Mechanics Co., Ltd.Light emitting diode, light emitting device using the same, and fabrication processes therefor
US20020176250 *May 24, 2002Nov 28, 2002Gelcore, LlcHigh power led power pack for spot module illumination
US20030010993 *Jul 27, 1998Jan 16, 2003Shuji NakamuraNitride semiconductor device
US20030025486 *Jul 31, 2001Feb 6, 2003Ellis Thomas E.FFT based digital radiometer
US20030057421 *Sep 27, 2001Mar 27, 2003Tzer-Perng ChenHigh flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate
US20040026706 *Jul 30, 2001Feb 12, 2004Georg BognerRadiation source and method for producing a lens mould
US20040150996 *Dec 22, 2003Aug 5, 2004Sun Ming-Shen MartinDisplay structure
US20040222433 *Aug 11, 2003Nov 11, 2004Lamina CeramicsLight emitting diodes packaged for high temperature operation
US20040233672 *Sep 30, 2003Nov 25, 2004Eden DubucMethod and apparatus for irradiation of plants using light emitting diodes
US20050029535 *Sep 2, 2004Feb 10, 2005Joseph MazzochetteLight emitting diodes packaged for high temperature operation
US20050169557 *Mar 24, 2005Aug 4, 2005Sony CorporationImage processing apparatus and method, recording medium, and program thereof
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7071620 *Oct 31, 2003Jul 4, 2006Barco, Naamloze VennootschapDisplay pixel module for use in a configurable large-screen display application and display with such pixel modules
US7176502Mar 18, 2005Feb 13, 2007Lamina Ceramics, Inc.Light emitting diodes packaged for high temperature operation
US7252408Jul 19, 2004Aug 7, 2007Lamina Ceramics, Inc.LED array package with internal feedback and control
US7300182Jan 6, 2005Nov 27, 2007Lamina Lighting, Inc.LED light sources for image projection systems
US7528421Jul 12, 2005May 5, 2009Lamina Lighting, Inc.Surface mountable light emitting diode assemblies packaged for high temperature operation
US7633093Jan 31, 2006Dec 15, 2009Lighting Science Group CorporationMethod of making optical light engines with elevated LEDs and resulting product
US7722220May 3, 2007May 25, 2010Cree Led Lighting Solutions, Inc.Lighting device
US7728341Nov 20, 2006Jun 1, 2010Lighting Science Group CorporationIllumination device for providing directionally guided light
US7733663 *Apr 29, 2008Jun 8, 2010Tdk CorporationMultilayer ceramic substrate
US7777235Apr 24, 2006Aug 17, 2010Lighting Science Group CorporationLight emitting diodes with improved light collimation
US7794114 *Oct 11, 2006Sep 14, 2010Cree, Inc.Methods and apparatus for improved heat spreading in solid state lighting systems
US7838897Nov 23, 2010Shinko Electric Industries Co., Ltd.Light-emitting device and method for manufacturing the same
US7872418 *Jan 18, 2011Sharp Kabushiki KaishaLight emitting device and method for manufacturing the same
US7964883Jun 21, 2011Lighting Science Group CorporationLight emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
US7982379 *Jun 5, 2007Jul 19, 2011Koninklijke Philips Electronics N.V.Flexible display device
US8008682 *Aug 30, 2011Hong Kong Applied Science And Technology Research Institute Co. Ltd.Alumina substrate and method of making an alumina substrate
US8022426 *Apr 24, 2009Sep 20, 2011Advanced Optoelectronic Technology, Inc.Color mixing light emitting diode device
US8022533 *Sep 20, 2011Sanyo Electric Co., Ltd.Circuit apparatus provided with asperities on substrate surface
US8044429Oct 25, 2011Shinko Electric Industries Co., Ltd.Light-emitting device and method for manufacturing the same
US8093789 *Jun 2, 2008Jan 10, 2012Koninklijke Philips Electronics N.V.Light output device
US8222584Jul 17, 2012Abl Ip Holding LlcIntelligent solid state lighting
US8324654 *May 18, 2011Dec 4, 2012Lg Innotek Co., Ltd.Light emitting device and light unit having the same
US8410501 *Jan 10, 2008Apr 2, 2013Panasonic CorporationLight source
US8415704Sep 22, 2010Apr 9, 2013Ut-Battelle, LlcClose-packed array of light emitting devices
US8437141 *Nov 23, 2006May 7, 2013Nxp B.V.Device comprising a substrate including an electronic contact, and transponder
US8511862 *Mar 11, 2011Aug 20, 2013Toshiba Lighting & Technology CorporationOptical unit and lighting apparatus
US8608340Jun 27, 2011Dec 17, 2013Toshiba Lighting & Technology CorporationLight-emitting module and lighting apparatus with the same
US8680546Jun 23, 2009Mar 25, 2014Sharp Kabushiki KaishaLight-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus
US8759733May 24, 2010Jun 24, 2014Abl Ip Holding LlcOptical integrating cavity lighting system using multiple LED light sources with a control circuit
US8772691Apr 16, 2010Jul 8, 2014Abl Ip Holding LlcOptical integrating cavity lighting system using multiple LED light sources
US8814396Mar 11, 2011Aug 26, 2014Toshiba Lighting & Technology CorporationLighting apparatus
US8835970Dec 13, 2013Sep 16, 2014Sharp Kabushiki KaishaLight-emitting apparatus
US8860072Nov 30, 2012Oct 14, 2014Lg Innotek Co., Ltd.Light emitting device and light unit having the same
US9012938Apr 9, 2010Apr 21, 2015Cree, Inc.High reflective substrate of light emitting devices with improved light output
US9105824 *Feb 10, 2012Aug 11, 2015Cree, Inc.High reflective board or substrate for LEDs
US9178125Aug 25, 2014Nov 3, 2015Sharp Kabushiki KaishaLight-emitting apparatus
US20050052374 *Oct 31, 2003Mar 10, 2005Bruno DevosDisplay pixel module for use in a configurable large-screen display application and display with such pixel modules
US20050161682 *Mar 18, 2005Jul 28, 2005Joseph MazzochetteLight emitting diodes packaged for high temperature operation
US20050174544 *Jan 6, 2005Aug 11, 2005Joseph MazzochetteLED light sources for image projection systems
US20050285147 *Jun 29, 2005Dec 29, 2005Sanyo Electric Co., Ltd.Circuit apparatus and method of manufacturing the same
US20060006405 *Jul 12, 2005Jan 12, 2006Lamina Ceramics, Inc.Surface mountable light emitting diode assemblies packaged for high temperature operation
US20060012986 *Jul 19, 2004Jan 19, 2006Joseph MazzochetteLED array package with internal feedback and control
US20060186423 *Jan 31, 2006Aug 24, 2006Greg BlonderMethod of making optical light engines with elevated LEDs and resulting product
US20070013057 *Jun 2, 2006Jan 18, 2007Joseph MazzochetteMulticolor LED assembly with improved color mixing
US20070064429 *Nov 20, 2006Mar 22, 2007Joseph MazzochetteLight emitting diode arrays with improved light extraction
US20070176197 *Jan 29, 2007Aug 2, 2007Shinko Electric Industries Co., Ltd.Semiconductor device and method of manufacturing semiconductor device
US20070187706 *Feb 12, 2007Aug 16, 2007Shinko Electric Industries Co., Ltd.Light-emitting device and method for manufacturing the same
US20070263393 *May 3, 2007Nov 15, 2007Led Lighting Fixtures, Inc.Lighting device
US20080089069 *Oct 11, 2006Apr 17, 2008Medendorp Nicholas WMethods and Apparatus for Improved Heat Spreading in Solid State Lighting Systems
US20080149946 *Dec 22, 2006Jun 26, 2008Philips Lumileds Lighting Company, LlcSemiconductor Light Emitting Device Configured To Emit Multiple Wavelengths Of Light
US20080231169 *Mar 19, 2008Sep 25, 2008Sharp Kabushiki KaishaLight emitting device and method for manufacturing the same
US20080283281 *Apr 29, 2008Nov 20, 2008Tdk CorporationMultilayer ceramic substrate
US20080308310 *Nov 23, 2006Dec 18, 2008Nxp B.V.Device Comprising a Substrate Including an Electronic Contact, and Transponder
US20090212309 *Feb 27, 2008Aug 27, 2009Jui-Lun KuoLight emitting diode package structure and a packaging method thereof
US20090252950 *Apr 4, 2008Oct 8, 2009Hong Kong Applied Science And Technology Research InstituteAlumina substrate and method of making an alumina substrate
US20090267090 *Oct 29, 2009Advanced Optoelectronic Technology, Inc.Color mixing light emitting diode device
US20090294793 *Dec 3, 2009Samsung Electro-Mechanics Co., Ltd.Led package and method of manufacturing the same
US20090315057 *Dec 24, 2009Sharp Kabushiki KaishaLight-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus
US20090321772 *Jan 10, 2008Dec 31, 2009Satoshi ShidaLight source
US20100045167 *Feb 25, 2010Yasuki KawashimaSurface light-emitting device and illuminating apparatus and display apparatus including the same
US20100176705 *Jun 2, 2008Jul 15, 2010Koninklijke Philips Electronics N.V.Light output device
US20100219441 *May 17, 2010Sep 2, 2010Ledtech Electronics Corp.Light emitting diode package structure
US20100253216 *Jun 5, 2007Oct 7, 2010Koninklijke Philips Electronics N.V.Flexible display device
US20100264454 *Oct 21, 2010Koninklijke Philips Electronics N.V.Semiconductor light emitting device growing active layer on textured surface
US20110032710 *Feb 10, 2011Shinko Electric Industries Co., Ltd.Light-emitting device and method for manufacturing the same
US20110085314 *Jul 10, 2008Apr 14, 2011Michael FranzElectrical circuit system and method for producing an electrical circuit system
US20110215349 *Sep 8, 2011Joong In AnLight emitting device and light unit having the same
US20110220947 *Sep 15, 2011Gio Optoelectronics Corp.Light emitting diode unit
US20110235334 *Sep 29, 2011Toshiba Lighting & Technology CorporationOptical unit and lighting apparatus
US20110235335 *Sep 29, 2011Toshiba Lighting & Technology CorporationLighting apparatus
US20120199843 *Feb 10, 2012Aug 9, 2012Cree, Inc.High reflective board or substrate for leds
US20150014640 *Dec 13, 2013Jan 15, 2015Samsung Display Co., Ltd.Organic light emitting diode display and manufacturing method thereof
CN102207271A *Mar 8, 2011Oct 5, 2011东芝照明技术株式会社Optical unit and lighting apparatus
CN103471002A *Mar 8, 2011Dec 25, 2013东芝照明技术株式会社Lighting apparatus
EP1806792A2 *Dec 22, 2006Jul 11, 2007Shinko Electric Industries Co., Ltd.Semiconductor light emitting device and manufacturing method thereof
EP1821345A2 *Feb 16, 2007Aug 22, 2007Shinko Electric Industries Co., Ltd.Light-emitting device and method for manufacturing the same
EP1821345A3 *Feb 16, 2007Oct 20, 2010Shinko Electric Industries Co., Ltd.Light-emitting device and method for manufacturing the same
WO2007005003A1 *Jun 30, 2005Jan 11, 2007Lamina Ceramics, Inc.Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
WO2008078297A2 *Dec 20, 2007Jul 3, 2008Philips Lumileds Lighting Company, LlcSemiconductor light emitting device configured to emit multiple wavelengths of light
WO2008078297A3 *Dec 20, 2007Oct 23, 2008James C KimSemiconductor light emitting device configured to emit multiple wavelengths of light
WO2008084878A1 *Jan 10, 2008Jul 17, 2008Panasonic CorporationLight source
WO2009015798A2 *Jul 21, 2008Feb 5, 2009Perkinelmer Elcos GmbhMounting structure for leds, led assembly, led assembly socket, method for forming a mounting structure
WO2009015798A3 *Jul 21, 2008Apr 23, 2009Perkinelmer Elcos GmbhMounting structure for leds, led assembly, led assembly socket, method for forming a mounting structure
WO2009107085A2 *Feb 26, 2009Sep 3, 2009Easy International S.R.L.Led lamp and method for its design
WO2009107085A3 *Feb 26, 2009Dec 10, 2009Easy International S.R.L.Led lamp and method for its design
WO2010076435A1 *Dec 31, 2009Jul 8, 2010Finan Trading CompanyLighting system with electroluminescent diodes
WO2010130597A1 *May 4, 2010Nov 18, 2010Osram Gesellschaft mit beschränkter HaftungLight emitting diode module and lighting unit comprising a light emitting diode module
Legal Events
DateCodeEventDescription
Sep 9, 2004ASAssignment
Owner name: LAMINA CERAMICS, INC., NEW JERSEY
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MAZZOCHETTE, JOSEPH;AMAYA, EDMAR M.;REEL/FRAME:015115/0321
Effective date: 20040818