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Publication numberUS20060005953 A1
Publication typeApplication
Application numberUS 11/066,779
Publication dateJan 12, 2006
Filing dateFeb 25, 2005
Priority dateJun 25, 2004
Also published asCN1713376A
Publication number066779, 11066779, US 2006/0005953 A1, US 2006/005953 A1, US 20060005953 A1, US 20060005953A1, US 2006005953 A1, US 2006005953A1, US-A1-20060005953, US-A1-2006005953, US2006/0005953A1, US2006/005953A1, US20060005953 A1, US20060005953A1, US2006005953 A1, US2006005953A1
InventorsHsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
Original AssigneeFoxconn Technology Co., Ltd
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Liquid cooling device
US 20060005953 A1
Abstract
A liquid cooling device includes a casing (10), a liquid inlet port (18) and a liquid outlet port (19) in communication with the casing (10). The casing (10) includes a heat-absorbing base (11). The base (11) includes a porous layer interior of the casing (10).
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Claims(8)
1. A liquid cooling device comprising:
a casing comprising a heat-absorbing base, the base comprising a porous layer interior of the casing;
liquid accommodated in the casing;
an actuator,
pipes connecting the casing and the actuator,
a liquid inlet port which renders the liquid to enter the casing; and
a liquid outlet port which allows the liquid to leave the casing when actuated by the actuator.
2. The liquid cooling device of claim 1, wherein the layer is made of sintered metal powder.
3. The liquid cooling device of claim 1, wherein the layer is made of foaming metal.
4. The liquid cooling device of claim 1, further comprising a heat sink connected to the pipes.
5. A liquid cooling device for a heat-generating component, comprising:
a casing disposed next to said component, comprising a heat-absorbing base thermally contacting with said component for heat transmission from said component via said base, and a container used to receive cooling liquid therein;
a cooling liquid circulation system connected to said casing and in communication with said container for said cooling liquid so as to urge said cooling liquid flowing into said container for said heat transmission and out of said container for heat dissipation; and
at least one porous layer formed in said casing next to said base and in communication with said container so that liquid in said container is accessible and containable in said layer for said heat transmission.
6. The liquid cooling device of claim 5, wherein said layer is made of sintered metal powder and formed on a side of said base facing said container.
7. A method for cooling a heat-generating component, comprising the steps of
providing a casing having a cooling-liquid-receivable container and a heat-absorbing base disposed next to said container for thermally contacting with said component;
circulating cooling liquid between said casing and a radiator so that said cooling liquid absorbs heat from said component via said base in said container and dissipates said heat via said radiator, and
sucking said cooling liquid via a porous layer formed in said casing next to said base for enhancing heat absorption of said liquid in said container.
8. The method of claim 7, wherein said layer is made of sintered metal powder and formed on a side of said base facing said container.
Description
    BACKGROUND OF THE INVENTION
  • [0001]
    1. Field of the Invention
  • [0002]
    The present invention relates to a cooling device, and more particularly to a cooling device utilizing liquid for cooling a heat-generating device.
  • [0003]
    2. Description of Related Art
  • [0004]
    Liquid cooling devices were commonly utilized to cool huge systems such as furnaces. Today, liquid cooling devices also are used to cool electronic or electrical components, such as chipsets, dies or computer central processing units (CPUs), by circulating the cooling liquid in a channel.
  • [0005]
    Generally, a liquid cooling device comprises a casing, forming a liquid container made of metal material. The casing comprises a base and a lid covering the base. The base is for contacting a wait-to-be-cooled component and comprises an upper surface. The lid comprises a liquid outlet and a liquid inlet. Liquid pipes respectively connect the liquid outlet and the liquid inlet to a liquid tank. The liquid tank is further provided with a submersible motor therein. In operation to dissipate heat from the component, the liquid in the liquid tank flows through the liquid inlet pipe into the casing, and is drawn by the motor to exit from the casing to the liquid tank for a subsequent circulation.
  • [0006]
    However, the upper surface of the base is generally flat. Heat exchange surface between the base and the liquid is limited. As a result, the liquid is only to flow in a limited surface in the casing. It is difficult to get maximized heat exchange efficiency.
  • SUMMARY OF THE INVENTION
  • [0007]
    Accordingly, an object of the present invention is to provide a liquid cooling device getting maximized heat exchange efficiency.
  • [0008]
    In order to achieve the object set out above, a liquid cooling device in accordance with a preferred embodiment of the present invention comprises a casing, a liquid inlet port and a liquid outlet port in communication with the casing. The casing comprises a heat-absorbing base. The base comprises a porous layer interior of the casing.
  • [0009]
    Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0010]
    FIG. 1 is an assembled, isometric view of a liquid cooling device in accordance with a preferred embodiment of the present invention;
  • [0011]
    FIG. 2 is a view of a casing of the liquid cooling device of FIG. 1;
  • [0012]
    FIG. 3 is a cross-sectional view of FIG. 2, taken along line III-III; and
  • [0013]
    FIG. 4 is a view of a base of a casing of a liquid cooling device in accordance with the preferred embodiment of the present invention.
  • DETAILED DESCRIPTION OF THE INVENTION
  • [0014]
    Referring to FIGS. 1-3, a liquid cooling device for a heat-generating component in accordance with a preferred embodiment of the present invention comprises a casing 10, and an actuator 50 connected to the casing 10 by a liquid outlet pipe 100 and a liquid inlet pipe 200 respectively at opposite locations of the actuator 50 to form a cooling liquid circulation system.
  • [0015]
    The casing 10 comprises a base 11 for intimately contacting a heat generating component or source (not shown) by a side surface thereof and a lid 12 cooperating with the base 11 to form a container 14 therebetween to accommodate liquid for circulation. The base 11 and the lid 12 are hermetizated by calk packing, shim, or seal, for keeping the liquid from leaking out of the container 14. A pair of tubular connectors, for connecting the pipes 100, 200 to the casing 10, extends outwardly from the lid 12. The connectors are respectively named as liquid inlet port 18 and liquid outlet port 19, according to the directions along which the liquid flows in the connectors. The liquid inlet port 18 is disposed at a middle of the lid 12.
  • [0016]
    The container 14, the liquid outlet pipe 100, the actuator 50 and the liquid inlet pipe 200 cooperatively define a hermetical circulation route or loop for liquid. The actuator 50 can be a pump, an impeller, a promoter or the like, for actuating liquid to continuously circulate in the route along the arrow as shown in FIG. 1.
  • [0017]
    For promoting the cooling efficiency of the device, a radiator is arranged on the liquid circulation route. A fin member 30 is an example of the radiator. In the preferred embodiment of the present invention, a portion of the liquid outlet pipe 100 enters into the fin member 30, so that heat, still contained in the liquid after naturally cooled in the casing 10, is removed to the fin member 30 and is dissipated to ambient air. Thus, the liquid is extremely cooled before entering the container 14 for a subsequent circulation. Understandably, a fan (now shown) can be mounted onto the fin member 30 for enhancing heat dissipation capability of the fin member 30.
  • [0018]
    FIG. 4 shows a base 11 of a casing 10 of the liquid cooling device in accordance with the preferred embodiment of the present invention. The base 11 comprises a porous layer 16. The layer 16 defines a plurality of minute pores therein by sintering metal powder. This structure increases surface between the layer 16 and the liquid. Heat exchange surface between the base 11 and the liquid is increased accordingly In use, the liquid enters into the container 14 from the liquid inlet port 18. The liquid flows in the layer 16 to sufficiently absorb heat from the base 11, so that heat exchange efficiency between the liquid and the base 11 is improved.
  • [0019]
    Moreover, it is understood that the layer 16 of the base 11 can be other porous metal layer, such as foaming metal.
  • [0020]
    For showing clearly, the casing 10, the fin member 30 and the actuator 50 are positioned separately, and connected by the 100, 200 in the preferred embodiment of the present invention. However, it is also understood that the fin member 30 can be directly positioned on the casing 10, and the actuator 50 can be positioned within the fin member 30, without the liquid outlet pipe 100 and the liquid inlet pipe 200, to thereby save space occupied by the liquid cooling device.
  • [0021]
    It is understood that the invention may be embodied in other forms without departing from the spirit thereof Thus, the present example and embodiment is to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.
Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US4352392 *Dec 24, 1980Oct 5, 1982Thermacore, Inc.Mechanically assisted evaporator surface
US4583582 *Aug 2, 1984Apr 22, 1986The Charles Stark Draper Laboratory, Inc.Heat exchanger system
US4602679 *Mar 22, 1982Jul 29, 1986Grumman Aerospace CorporationCapillary-pumped heat transfer panel and system
US4612978 *Apr 8, 1985Sep 23, 1986Cutchaw John MApparatus for cooling high-density integrated circuit packages
US4730665 *Sep 19, 1986Mar 15, 1988Technology Enterprises CompanyApparatus for cooling high-density integrated circuit packages
US5263536 *Jul 19, 1991Nov 23, 1993Thermo Electron Technologies Corp.Miniature heat exchanger
US5309319 *Mar 27, 1992May 3, 1994International Business Machines CorporationIntegral cooling system for electric components
US5365400 *Oct 4, 1991Nov 15, 1994Hitachi, Ltd.Heat sinks and semiconductor cooling device using the heat sinks
US5441102 *Jan 26, 1994Aug 15, 1995Sun Microsystems, Inc.Heat exchanger for electronic equipment
US5666269 *Oct 28, 1996Sep 9, 1997Motorola, Inc.Metal matrix composite power dissipation apparatus
US5725049 *Oct 31, 1995Mar 10, 1998The United States Of America As Represented By The Administrator Of The National Aeronautics And Space AdministrationCapillary pumped loop body heat exchanger
US6397932 *Oct 5, 2001Jun 4, 2002Douglas P. CalamanLiquid-cooled heat sink with thermal jacket
US6529377 *Sep 5, 2001Mar 4, 2003Microelectronic & Computer Technology CorporationIntegrated cooling system
US6533029 *Sep 4, 2001Mar 18, 2003Thermal Corp.Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator
US6578626 *Nov 21, 2000Jun 17, 2003Thermal Corp.Liquid cooled heat exchanger with enhanced flow
US6601643 *Apr 25, 2002Aug 5, 2003Samsung Electronics Co., LtdFlat evaporator
US6609560 *Apr 25, 2002Aug 26, 2003Samsung Electronics Co., Ltd.Flat evaporator
US6655449 *Nov 8, 2002Dec 2, 2003Cho-Chang HsienHeat dissipation device by liquid cooling
US6745823 *Feb 21, 2003Jun 8, 2004Modine Manufacturing CompanyHeat exchanger for electronic/electrical components
US7000684 *Oct 6, 2003Feb 21, 2006Cooligy, Inc.Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US7013956 *Aug 30, 2004Mar 21, 2006Thermal Corp.Heat pipe evaporator with porous valve
US20030051859 *Sep 20, 2001Mar 20, 2003Chesser Jason B.Modular capillary pumped loop cooling system
US20030062149 *Jan 19, 2002Apr 3, 2003Goodson Kenneth E.Electroosmotic microchannel cooling system
US20050103472 *Nov 19, 2003May 19, 2005Lofland Steve J.Cold plate
US20050224212 *Apr 2, 2004Oct 13, 2005Par Technologies, LlcDiffusion bonded wire mesh heat sink
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7710722Jul 25, 2007May 4, 2010Fujitsu LimitedLiquid cooling unit and heat exchanger therefor
US8050036 *Jul 25, 2007Nov 1, 2011Fujitsu LimitedLiquid cooling unit and heat receiver therefor
US8289701 *Jul 25, 2007Oct 16, 2012Fujistu LimitedLiquid cooling unit and heat receiver therefor
US20080023178 *Jul 25, 2007Jan 31, 2008Fujitsu LimitedLiquid cooling unit and heat exchanger therefor
US20080024987 *Jul 25, 2007Jan 31, 2008Fujitsu LimitedLiquid cooling unit and heat exchanger therefor
US20080024988 *Jul 25, 2007Jan 31, 2008Fujitsu LimitedLiquid cooling unit and heat receiver therefor
US20080024989 *Jul 25, 2007Jan 31, 2008Fujitsu LimitedLiquid cooling unit and heat receiver therefor
US20140076523 *Sep 19, 2012Mar 20, 2014Aaron Ray Batker PritzkerDevices, systems, and methods for cooling electronic device heat spreaders
WO2016044246A1 *Sep 15, 2015Mar 24, 2016D Onofrio Nicholas MichaelLiquid cooled metal core printed circuit board
Classifications
U.S. Classification165/104.33, 257/E23.098
International ClassificationF28D15/02, F28D15/04, F28D15/00, H01L23/473
Cooperative ClassificationF28D15/0266, F28D15/00, F28D15/046, F28F13/003, H01L2924/0002, H01L23/473
European ClassificationF28F13/00B, F28D15/00, F28D15/04B, F28D15/02M, H01L23/473
Legal Events
DateCodeEventDescription
Feb 25, 2005ASAssignment
Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEE, HSIEH-KUN;LAI, CHENG-TIEN;ZHOU, ZHI-YONG;REEL/FRAME:016342/0313
Effective date: 20050210