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Publication numberUS20060054709 A1
Publication typeApplication
Application numberUS 11/206,339
Publication dateMar 16, 2006
Filing dateAug 18, 2005
Priority dateSep 15, 2004
Also published asCN1750026A, CN100458837C, DE102005043902A1, US7337978
Publication number11206339, 206339, US 2006/0054709 A1, US 2006/054709 A1, US 20060054709 A1, US 20060054709A1, US 2006054709 A1, US 2006054709A1, US-A1-20060054709, US-A1-2006054709, US2006/0054709A1, US2006/054709A1, US20060054709 A1, US20060054709A1, US2006054709 A1, US2006054709A1
InventorsKyeong Lee
Original AssigneeYbl Co. Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Dual interface IC card
US 20060054709 A1
Abstract
The present invention relates to a Dual Interface IC card including a top layer, a bottom layer, an antenna embedding layer between the top and bottom layers and an IC chip module embedded in an IC chip module embedding hole. The antenna embedding layer has a groove in a rectangular shape at its one side where elastic plates are embedded in both sides of the groove. The IC chip module is inserted by applying an adhesive onto the antenna embedding layer or using an adhesive tape. Thus, the IC chip module is easily installed and not detached to give a good connection and a long time use.
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Claims(5)
1. A Dual Interface IC card, comprising:
a top layer,
a bottom layer,
an antenna formed between the top layer and the bottom layer,
an IC chip module of dual interface cards, and
an elastic plate which electrically connects connecting terminals of said IC chip module with contacting points of said antenna.
2. The Dual Interface IC card according to claim 1, further comprising:
an antenna embedding layer formed between said top layer and said antenna,
a groove formed in said antenna embedding layer for embedding said elastic plate, and
an IC chip module embedding hole formed in said top layer for inserting said IC chip module, such that one end of said elastic plate is contacted with one contacting point of said antenna and the other end of said elastic plate is contacted with said IC chip module connecting terminal when said elastic plate is inserted into said groove and said IC chip module is embedded in said IC chip module embedding hole.
3. The Dual Interface IC card according to claim 1, in which said elastic plate is a compound metal plate.
4. The Dual Interface IC card according to claim 2, in which the girth of the groove formed in the antenna embedding layer is determined by said antenna embedding layer, and a hole where said antenna embedding layer is removed is formed in said groove.
5. The Dual Interface IC card according to claim 4, in which said IC chip module is adhered onto said antenna embedding layer formed by said groove by using an adhesive.
Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a Dual Interface IC card, and more particularly, said Dual Interface IC card comprising a top layer, a bottom layer, an antenna embedding layer between said layers and an IC chip module embedded in an IC chip module embedding hole, and said antenna embedding layer has a groove in a rectangular shape at its one side where elastic plates are inserted at the both sides of the groove. The IC chip module embedded by applying an adhesive onto the antenna embedding layer or using a hot melt tape comprised heat-activated film. Thus, IC chip module is easily installed and not detached to give a good connection and a long time use.

An IC chip module is embedded in a contacting point with a antenna which is located in an antenna embedding layer formed between a top layer and a bottom layer. In general, the IC chip module is embedded in the contacting point by applying a silver-containing conductive adhesive to the contacting point. Such silver-containing conductive adhesive is used to maintain conductivity during a long time use. However, the IC chip module is readily detached due to the rapid loss of adhesive strength which results in a poor connection. Thus, there is a problem to replace the Dual Interface IC card with a new one and it is not economical. In order to solve the above problem, a method is used for soldering an IC chip module to a contacting point with the antenna. This method has many drawbacks of the IC chip module being melted when soldering, the operation being difficult to perform, environment problems by soldering and so on.

SUMMARY OF THE INVENTION

The present invention was designed to solve aforementioned problems. An object of the present invention is to provide a Dual Interface IC card which can easily attach an IC chip module, and solve poor connection problems resulting from IC chip module detachment even in long time use by embedding a conductive elastic compound metal plate into both ends of the antenna which is laid inside the IC card and adhering the IC chip to said metal plate.

The Dual Interface IC card according to the present invention comprises an antenna formed between a top layer and a bottom layer and an IC chip module connecting terminals combined with both ends of said antenna. Said IC chip module connecting the terminals is electrically connected with contacting points of said antenna via an elastic plate. The Dual Interface IC card according to the present invention further comprises an antenna embedding layer formed between said top layer and said antenna, a groove formed on said antenna embedding layer for embedding said elastic plate, and an IC chip module embedding hole formed in said top layer for embedding the IC chip module. If said elastic plate is embedded in said groove and said IC chip module is embedded in said IC chip module embedding hole, then one end of said elastic plate is contacted with the contacting point of said antenna and the other end of said elastic plate is contacted with said IC chip module connecting terminal.

When embedding the IC chip module with the Dual Interface IC card, a conductive elastic compound metal plate is embedded in contacting points of both sides of the antenna and the IC chip module is combined on the antenna embedding layer having a groove by using an adhesive or an hot melt tape comprised heat-activated film. Therefore, the Dual Interface IC card of the present invention does not provide a poor connection of the contacting points of the antenna with the IC chip module and detachment of the IC chip module even in long time use, as well as easy attachment of the IC chip module.

BRIEF DESCRIPTION OF THE DRAWINGS

The other objects and features of the present invention will be hereinafter explained in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of showing an unfolded state of Dual Interface IC card according to the present invention.

FIG. 2 is a perspective view of showing a folded state of Dual Interface IC card according to the present invention.

FIG. 3 is an illustrative cross-sectional view of Dual Interface IC card of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Dual Interface IC card (1) according to the present invention comprises antenna (30) formed between top layer (10) and bottom layer (20) and IC chip module (80) connecting terminals combined with both ends of said antenna (30). Said IC chip module (80) connecting the terminals are electrically connected with contacting points (50) of said antenna (30) via elastic plate (60). The Dual Interface IC card according to the present invention further comprises antenna embedding layer (40) formed between said top layer (10) and said antenna (30), groove (41) formed on said antenna embedding layer (40) for embedding said elastic plate (60), and IC chip module embedding hole (11) formed in said top layer (40) for embedding IC chip module (80). If said elastic plate (60) is inserted into said groove (41) and IC chip module (80) is embedded in said IC chip module embedding hole (11), then one end of said elastic plate (60) is contacted with the contacting point of said antenna (30) and the other end of said elastic plate (60) is contacted with said IC chip module (80) connecting terminal.

In the Dual Interface IC card of the present invention, antenna (30) and antenna embedding layer (40) are formed between top layer (10) and bottom layer (20) of the card. Top layer (10) has IC chip module embedding hole (11) and antenna embedding layer (40) has groove (41). The girth of groove (41) is determined by antenna embedding layer (40). A hole in which antenna embedding layer (40) is removed is formed in groove (41). Elastic plate (60) which is electrically connected with contacting point (50) of said antenna (30) is made by conductive alloy metal and is mounted on contacting point (50) on groove (41) when combining with IC chip module (80). The one end of elastic plate (60) is contacted with contacting point (50) of said antenna (30) and the other end of elastic plate (60) is contacted with IC chip module (80) connecting terminal and thus electrically connected. Elastic plate (60) may be manufactured in circle, triangle or rectangular shapes. IC chip module (80) is completely attached to Dual Interface IC card (1) by fixing IC chip module (80) with an adhesive or an adhesive tape onto antenna embedding layer (40) formed around said groove (41).

As described above, Dual Interface IC card of the present invention is readily manufactured and gives safe connection of antenna (30) with IC chip module (80) and strong adhesion of IC chip module without detachment. Thus, Dual Interface IC card of the present invention can be used for a long time without replacement with new one and is very economical.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8100337 *Aug 28, 2006Jan 24, 2012Smart Packaging Soultions (SPS)Double interface communication electronic module, in particular for a chip card
US8348155 *Sep 21, 2007Jan 8, 2013Telefonaktiebolaget L M Ericsson (Publ)All in one card
US8381993 *Sep 3, 2010Feb 26, 2013Incard S.A.Method for realizing a dual interface IC card
US8763912 *Mar 29, 2013Jul 1, 2014Identive Group, Inc.Dual interface module and dual interface card having a dual interface module
US8789762Aug 27, 2012Jul 29, 2014Feinics Amatech TeorantaRFID antenna modules and methods of making
US20110084145 *Sep 3, 2010Apr 14, 2011Incard S.A.Method for realizing a dual interface ic card
Classifications
U.S. Classification235/492
International ClassificationG06K19/06, G06K19/07, G06K19/077
Cooperative ClassificationG06K19/0775, G06K19/07749
European ClassificationG06K19/077T2, G06K19/077T
Legal Events
DateCodeEventDescription
Jun 20, 2011FPAYFee payment
Year of fee payment: 4
Sep 9, 2005ASAssignment
Owner name: YBL CO. LTD., KOREA, REPUBLIC OF
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LEE, KYEONG KU;REEL/FRAME:016515/0146
Effective date: 20050818