US20060192273A1 - Integrated circuit package and method of manufacture thereof - Google Patents
Integrated circuit package and method of manufacture thereof Download PDFInfo
- Publication number
- US20060192273A1 US20060192273A1 US11/066,875 US6687505A US2006192273A1 US 20060192273 A1 US20060192273 A1 US 20060192273A1 US 6687505 A US6687505 A US 6687505A US 2006192273 A1 US2006192273 A1 US 2006192273A1
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- Prior art keywords
- integrated circuit
- leads
- positioning
- lead
- stop
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10787—Leads having protrusions, e.g. for retention or insert stop
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10871—Leads having an integral insert stop
Definitions
- the present invention is directed to integrated circuit packaging and a method for manufacturing an integrated circuit package.
- integrated circuit package After the manufacture of integrated circuits on a semiconductor wafer there remains the need to protect the individual integrated circuit dies from damage and to provide connections to other devices.
- the enclosure surrounding and connections to the integrated circuit is referred to as an integrated circuit package.
- Numerous consumer electrical products demand integrated circuit packages that are subject to high cost constraints. As integrated circuits grow in complexity and capabilities, however, conventional integrated circuit packages have inadequate thermal management and connectivity requirements. Additionally, today's complex integrated circuits are highly susceptible to damage by mechanical stresses that can be imparted from the surface that the integrated circuit package is mounted on.
- the present invention provides in one embodiment, an integrated circuit package.
- the integrated circuit package comprises an integrated circuit and leads coupled to the integrated circuit.
- Each of the leads have a first end configured to be coupled to the integrated circuit and a second end configured to pass through one of a plurality of mounting holes extending through a mounting board.
- the leads comprise at least one positioning lead comprising a stop being a continuous part of the positioning lead and having a lateral dimension greater than a diameter of a first hole of the plurality of mounting holes.
- the leads further comprise at least one non-positioning lead having a continuous uniformly shaped body with a lateral dimension less than a diameter of a second hole of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.
- Another aspect of the present invention is a method of manufacturing an integrated circuit package.
- the method comprises forming a plurality of leads.
- Each of said leads having first and second ends configured as described above.
- Forming the plurality of leads includes forming positioning and non-positioning leads configured as described above.
- FIG. 1 illustrates a perspective view of one embodiment of an integrated circuit package of the present invention
- FIG. 2 presents a plan view of exemplary integrated circuit package of the present invention
- FIG. 3 presents a plan view of another embodiment of the integrated circuit package of the present invention.
- FIGS. 4-8 illustrate plan views of selected steps in an exemplary method of manufacturing an integrated circuit package following the principles of the present invention.
- FIGS. 9-13 illustrate plan views of selected steps in an alternative method of manufacturing an integrated circuit package of the present invention.
- FIG. 1 presents a perspective view of one embodiment of the present invention, an integrated circuit package 100 .
- the integrated circuit package 100 comprises an integrated circuit 102 and leads 104 coupled to the integrated circuit 102 .
- the integrated circuit 102 can comprise any conventional microelectronic device, such as standard linear and logic products, digital signal processors, microprocessors, digital and analog devices, high frequency and higher power devices, and comprise either large or small chip sizes.
- Each of the leads 104 have a first end 106 configured to be coupled to the integrated circuit 102 and a second end 108 configured to pass through one of a plurality of mounting holes 110 extending through a mounting board 112 .
- the leads 104 comprise at least one positioning lead 114 and at least one non-positioning lead 116 .
- the positioning lead 114 comprises a stop 118 .
- the stop 118 is a continuous part of the positioning lead 114 and has a lateral dimension 120 that is greater than a diameter 122 of a first hole 124 of the plurality of mounting holes 110 .
- the term lateral dimension 120 as used herein refers to any number of directions 126 , 127 that is parallel with a plane 128 of the mounting board 112 .
- the non-positioning lead 116 has a continuous uniformly shaped body 130 with a lateral dimension 132 less than a diameter 134 of a second hole 136 of the plurality of mounting holes 110 .
- the stop 118 limits an extension of the non-positioning lead 116 through the second hole 136 .
- the first ends 106 of the leads 104 can be configured for direct or indirect coupling to the integrated circuit 102 .
- bonding wires 138 facilitate the indirect coupling of the first ends 106 of the leads 104 to bond pads 140 on the integrated circuit 105 .
- direct coupling by placing the first ends 106 in contact with the bond pads 140 is also within the scope of the present invention.
- the second ends 108 of the leads 104 can be coupled directly or indirectly to metal lines 142 of a printed circuit 144 .
- the second ends 108 of both the positioning lead 114 and non-positioning lead 116 are directly coupled via solder to the metal lines 142 of the printed circuit 144 .
- the metal lines 142 are patterned on a bottom side 146 of the mounting board 112
- the integrated circuit package 100 is surface mounted on a topside 148 of the mounting board 112
- the integrated circuit package 100 can further comprise a mold 150 , a heat sink 152 and a mounting pad 154 .
- the integrated circuit 102 is coupled to the mounting pad 154 using an adhesive such as epoxy.
- the mold 150 which can also be made of an epoxy, encompasses the integrated circuit 102 .
- the mold 150 securely holds the leads 104 , bond wire 138 and heat sink 152 at appropriate locations relative to the integrated circuit 102 .
- the first end 106 of the leads 104 is encompassed by the mold 150 , and at least a portion of the heat sink 152 is surrounded by the mold 150 .
- the mold 150 holds the heat sink 152 above a top surface 156 of the integrated circuit 102 . Locating the heat sink 152 over the integrated circuit 102 is advantageous in embodiments where the integrated circuit package 100 is held above the plane 128 of the mounting board 112 and the heat sink 152 does not contact the mounting board 112 . In these cases, there is greater dissipation of heat generated from the active integrated circuit 102 as compared to a heat sink that is under the integrated circuit 102 .
- the stop 118 of the positioning lead 114 is configured to hold the integrated circuit package 100 above the plane 128 of the mounting board 112 by a fixed distance 158 , for example, about 100 microns to about 2000 microns. Holding the integrated circuit package 100 above the plane 128 of the mounting board 112 advantageously protects the integrated circuit 102 against damage from mechanical stresses that can otherwise be imparted from the mounting board 112 to the integrated circuit package 100 .
- the stop 118 is configured to prevent a segment 160 of the positioning lead 114 from passing through the first hole 124 . As illustrated in FIG. 1 , the segment 160 is between the first end 106 and the stop 118 .
- the stop can be configured to have a number of different shapes to provide the lateral dimension greater than the diameter of its corresponding mounting hole.
- the stop 118 of the positioning lead 114 comprises an increased width 162 in one direction 126 .
- the increase width 162 is at least about 5 percent greater than the diameter 122 of the first hole 124 .
- other configurations where the increased width is in a different direction 127 , or several directions that are parallel to the plane of the mounting board 112 are also within the scope of the present invention.
- the positioning lead can have a stop that comprises a bend in the positioning lead.
- FIG. 1 shows a second positioning lead 164 having a stop 166 that comprises a bend in the second positioning lead 164 .
- the stop 166 has an interior angle 168 ranging from about 70 to about 110 degrees, although other ranges of angles and type types of bends can be used.
- positioning lead having stops that comprise multiple bends, or both and increased width and a bend are also within the scope of the present invention.
- FIG. 2 presents a plan view of exemplary integrated circuit package 200 .
- the same reference numbers used in FIG. 1 are used to label analogous components of the integrated circuit package 200 .
- the leads 104 and mold 150 are depicted as being semitransparent and transparent, respectively.
- the positioning leads 114 , 164 are coupled to the same side of the integrated circuit 102 . It is more preferable, however, for the two positioning leads 205 , 210 to be coupled to opposing sides of the integrated circuit 102 , as shown in FIG. 2 . Locating the positioning leads 205 , 210 on opposing sides of the integrated circuit 102 more stably holds the integrated circuit package 100 at the fixed distance 158 , as compared to having positioning leads on only one side of the integrated circuit 102 .
- Configuring the two positioning leads 205 , 210 as corner leads, such as shown in FIG. 2 is even more desirable, as this configuration further stabilizes the seating of the integrated circuit package 200 on the mounting board 112 . Additional stability can be gain by locating the corner positioning leads 205 , 210 in opposing diagonal corners of the integrated circuit 102 , such as shown in FIG. 2 .
- configuring the positioning leads 205 , 210 as corner leads provides the additional benefit of reducing the pitch 215 between the corner positioning lead 210 and an adjacent interior non-positioning lead 220 . Reducing the pitch 215 between the corner positioning lead 210 and the adjacent interior non-positioning lead 220 is facilitated by locating the stop 118 on a side of the positioning lead 210 that is non-proximal to the adjacent non-positioning lead 220 , as shown in FIG. 2 .
- Corner positioning leads 205 , 210 can be advantageously used in combination with a variety of surface mounting configurations to reduce the interior lead pitch 225 and thereby increase the number of connections to the integrated circuit 102 .
- the interior non-positioning leads 230 are extended through mounting holes 110 that are arranged in a staggered configuration.
- shorter non-positioning leads 235 are interleaved with longer non-positioning leads 240 on the same side of the integrated circuit 102 .
- short and long positioning leads 205 , 210 can also be using in a staggered hole configuration.
- FIG. 3 presents a plan view of another embodiment of the integrated circuit package 300 of the present invention.
- the same reference numbers as used in FIG. 1 are used to label analogous components of the integrated circuit package 300 .
- FIG. 3 presents a preferred embodiment of the integrated circuit package comprising at least four positioning leads 305 , 310 , 315 , 320 .
- the positioning leads 305 , 310 , 315 , 320 are corner leads, where each one of the positioning leads 305 , 310 , 315 , 320 are coupled to different corners of the integrated circuit 102 .
- FIG. 1 presents a plan view of another embodiment of the integrated circuit package 300 of the present invention.
- the same reference numbers as used in FIG. 1 are used to label analogous components of the integrated circuit package 300 .
- FIG. 3 presents a preferred embodiment of the integrated circuit package comprising at least four positioning leads 305 , 310 , 315 , 320 .
- the positioning leads 305 , 310 , 315 , 320 are corner
- FIG. 3 illustrates the positioning leads 305 , 310 , 315 , 320 and non-positioning leads 325 being extended, below the plane of view, through mounting holes 110 that are arranged in a straight-line configuration.
- mounting holes 110 that are arranged in a straight-line configuration.
- a staggered arrangement of mounting holes 110 similar to that presented in FIG. 2 could also be used.
- leads 104 are depicted in the embodiments of the integrated circuit packages illustrated in FIGS. 1-3 . It should be understood, however, that the integrated circuit package of the present invention could contain any number of leads found in a conventional surface-mount integrated circuit packages. For instance, integrated circuit packages having from two to three hundred leads are known in the industry.
- the integrated circuit package can be any number of conventional type of lead-containing package, including plastic dual in-line integrated circuit packages (PDIP), small outline integrated circuits (SOICs), quad flat packages (QFPs), thin QFPs (TQFPs), Small Shrink Outline Plastic packages (SSOP), thin SSOPs (TSSOPs), thin very small-outline packages (TVSOPs), or other packages known to those skilled in the art.
- the leads can be made of any conventional ductile conductive material used for through-hole leads. Non-limiting examples of such materials include gold, silver, copper and alloys thereof. In some cases, the leads are plated with tin, nickel, palladium or similar materials to improved adhesion to solder.
- Another aspect of the present invention is a method of manufacturing an integrated circuit package.
- the method of manufacturing an integrated circuit package can be used to produce any of the embodiments of the integrated circuit package presented in FIGS. 1-3 and discussed above.
- FIGS. 4-8 illustrate plan views of selected steps in an exemplary method of manufacturing an integrated circuit package 400 following the principles of the present invention.
- FIG. 4 presented is a plan view of a partially completed integrated circuit package 400 after forming a layout pattern 405 on a metal sheet 410 .
- Any conventional process, such as photolithography can be used to define the layout pattern 405 on the metal sheet 410 .
- the layout pattern 405 comprises a lead layout pattern 415 for at least one positioning lead having a stop.
- FIG. 5 shows the partially completed integrated circuit package 400 after removing portions of the metal sheet 410 that are outside of the layout pattern 405 to thereby form a lead frame 505 comprising at least one positioning lead segment 510 having a stop 515 .
- the stop 515 is configured to be a continuous part of the positioning lead segment 510 .
- Any conventional method, such as stamping or etching, can be used to form the leads frame 505 out of the sheet of metal 415 .
- the lead frame 505 further comprises a one or more non-positioning lead segments 520 and pad 525 configured to accommodate an integrated circuit.
- the lead frame 505 can also include other conventional components, such as shorting bars, dam bars, etc. . . . , to facilitate forming the integrated circuit package 400 .
- FIG. 6 presents the integrated circuit package 400 after coupling an integrated circuit 605 to the pad 525 , coupling a heat sink 610 to the integrated circuit 605 , and coupling the positioning lead segments 510 and non-positioning lead segments 520 to the integrated circuit 520 . Similar to that discussed above in the context of FIG. 1 , both direct coupling, or indirect coupling via bonding wires 615 , are within the scope of the invention.
- FIG. 7 show the partially completed integrated circuit package 400 after removing portions of the lead frame 505 to thereby form a plurality of leads 705 comprising positioning leads 710 having a stop 715 and non-positioning leads 720 .
- Any conventional device such as a trimmer tool can be used to remove the undesired portions of the lead frame.
- Each of the leads 705 has a first end 725 and a second end 730 , the first end 725 being coupled to the integrated circuit 605 .
- FIG. 7 also illustrates the partially completed integrated circuit package 400 after enclosing the integrated circuit 605 in a mold 740 .
- a transparent view through the mold 740 is presented.
- the mold 740 also encloses the first end 725 of the each of leads 705 .
- the positioning leads 710 it is advantageous for one or more of the positioning leads 710 to be left attached to the lead frame 505 shown in FIG. 5 , while the non-positioning leads 715 are isolated from the lead frame 505 .
- the positioning lead segment 510 and positioning lead 710 are substantially the same structures.
- any combination of leads 705 that are each attached or isolated from the lead frame 505 is also within the scope of the present invention.
- FIG. 8 shows the completed integrated circuit package 400 after bending the leads 705 , below the plane of view, and mounting the integrated circuit package to a mounting board 805 having a plurality of mounting holes 810 .
- Any conventional device such as a bending tool can be used to bend the leads 705 .
- the leads 705 are bent below the plane of view to configure the second ends of the leads 730 shown in FIG. 7 to pass through the mounting holes 810 and thereby extend the second ends 730 through the mounting board 805 .
- the positioning lead 710 is bent to configure the stop 715 to be below a bottom surface of the mold 740 .
- the plurality of mounting holes 810 all have substantially a same diameter 815 , although embodiments with differently-sized mounting holes are also within the scope of the present invention.
- the stop 715 of the positioning leads 710 is configured to have a lateral dimension 820 greater than the diameter 815 of a first hole 825 .
- the stop 715 thereby limits an extension of at least one non-positioning lead 720 through a second hole 830 of the mounting holes 810 .
- the stop 715 is a continuous part of the positioning lead 710 , the stop 715 is less prone to deform, break or shear off while the integrated circuit package is being mounted or in use, as compared to a stop that is mechanically attached or bonded to the positioning lead 710 .
- the stop 715 of the positioning lead 710 is also configured to have a width 745 greater than a width 750 that of an adjacent portion 755 of the positioning lead.
- the adjacent portion 755 is configured to pass through the first hole 825 shown in FIG. 8 .
- the properties of the positioning lead 710 requires that the method include the preparation of a layout pattern 405 , shown in FIG. 4 , to have a special lead layout pattern 415 for the positioning lead to define a stop. In other embodiments of the method, however, the layout pattern does not have a special lead layout pattern.
- FIGS. 9-13 Such an embodiment is illustrated in FIGS. 9-13 , which present plan views of selected steps for an alternative exemplary method of manufacturing an integrated circuit package 900 according to the present invention.
- FIG. 9 illustrated is a plan view of a partially completed integrated circuit package 900 after forming a layout pattern 905 on a metal sheet 910 .
- the layout pattern 905 comprises a lead layout pattern 915 for a plurality of uniformly shaped leads.
- portions of the metal sheet 910 outside of the layout pattern 905 can be removed, using the same procedures as discussed in the context of FIG. 5 , to provide a lead frame 1005 .
- the lead frame 1005 comprises lead segments 1010 that are uniformly shaped.
- FIG. 11 shows the partially completed integrated circuit package 900 after adding an integrated circuit 1105 , heat sink 1110 , and bonding wiring 1115 to the integrated circuit package 900 using the same procedures as discussed in the context of FIG. 6 .
- portions of the lead frame 1005 can be removed to form a plurality of uniformly-shaped leads 1120 having first and second ends 1125 , 1130 , and a mold 1140 applied to enclose the integrated circuit 1105 , using the same procedures discussed in the context of FIG. 7 .
- all of the leads 1120 at this stage in the manufacturing process are substantially identical and uniformly shaped.
- FIG. 12 shows the partially completed integrated circuit package 900 after forming at least one positioning lead 1210 by bending at least one of the uniformly-shaped leads 1120 shown in FIG. 11 to form a stop 1215 .
- the stop 1215 is a bend in the positioning lead 1210 .
- Leads 1120 that are not bent in this fashion are non-positioning leads 1220 .
- configuring the stop 1215 as a continuous part of the positioning lead 1210 makes the stop 1215 resistant to deformation, breaking or shearing off while the integrated circuit package 900 is being mounted or in use.
- FIG. 13 shows the integrated circuit package 900 , after additional bending of the positioning leads 1210 , and for the first time, bending of the non-positioning leads 1220 , to situate their second ends 1130 , shown in FIG. 12 , below the plane of view.
- the integrated circuit package 900 is shown after coupling to a mounting board 1305 , having a plurality of holes 1310 .
- the stop 1215 of the positioning lead 1210 is configured to have a lateral dimension 1315 that greater than a diameter 1320 of a first hole 1325 .
- the stop 1210 thereby limits an extension of one or more non-positioning leads 1220 through a second hole 1330 .
- FIGS. 4-8 and 9 - 13 For clarity, the manufacture of the integrated circuit packages shown in FIGS. 4-8 and 9 - 13 are shown as separate process flows. However, one skilled in the art would recognize that these processes could be combined into a single process flow, if desired.
Abstract
An integrated circuit (IC) package 100 comprises an IC 102 and leads 104 coupled to the IC. Each lead has a first end 106 configured to be coupled to the integrated circuit and a second end 108 configured to pass through one of a plurality of mounting holes 110 extending through a mounting board 112. The leads comprise at least one positioning lead 114 comprising a stop 118 being a continuous part of the positioning lead and having a lateral dimension 120 greater than a diameter 122 of a first hole 124 of the plurality of mounting holes. The leads further comprise at least one non-positioning lead 116 having a continuous uniformly shaped body 130 with a lateral dimension 132 less than a diameter 134 of a second hole 136 of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.
Description
- The present invention is directed to integrated circuit packaging and a method for manufacturing an integrated circuit package.
- After the manufacture of integrated circuits on a semiconductor wafer there remains the need to protect the individual integrated circuit dies from damage and to provide connections to other devices. The enclosure surrounding and connections to the integrated circuit is referred to as an integrated circuit package. Numerous consumer electrical products demand integrated circuit packages that are subject to high cost constraints. As integrated circuits grow in complexity and capabilities, however, conventional integrated circuit packages have inadequate thermal management and connectivity requirements. Additionally, today's complex integrated circuits are highly susceptible to damage by mechanical stresses that can be imparted from the surface that the integrated circuit package is mounted on.
- Accordingly, what is needed in the art is an integrated circuit package that allows a large number of connections to the integrated circuit, facilitate heat transfer away from the integrated circuit, and protect the integrated circuit from mechanical stresses.
- To address the above-discussed deficiencies of the prior art, the present invention provides in one embodiment, an integrated circuit package. The integrated circuit package comprises an integrated circuit and leads coupled to the integrated circuit. Each of the leads have a first end configured to be coupled to the integrated circuit and a second end configured to pass through one of a plurality of mounting holes extending through a mounting board. The leads comprise at least one positioning lead comprising a stop being a continuous part of the positioning lead and having a lateral dimension greater than a diameter of a first hole of the plurality of mounting holes. The leads further comprise at least one non-positioning lead having a continuous uniformly shaped body with a lateral dimension less than a diameter of a second hole of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.
- Another aspect of the present invention is a method of manufacturing an integrated circuit package. The method comprises forming a plurality of leads. Each of said leads having first and second ends configured as described above. Forming the plurality of leads includes forming positioning and non-positioning leads configured as described above.
- The foregoing has outlined preferred and alternative features of the present invention so that those skilled in the art may better understand the detailed description of the invention that follows. Additional features of the invention will be described hereinafter that form the subject of the claims of the invention. Those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention. Those skilled in the art should also realize that such equivalent constructions do not depart from the scope of the invention.
- For a more complete understanding of the present invention, reference is now made to the following detailed description taken in conjunction with the accompanying FIGUREs. It is emphasized that various features may not be drawn to scale. In fact, the dimensions of various features may be arbitrarily increased or reduced for clarity of discussion. In addition, it is emphasized that some circuit components may not be illustrated for clarity of discussion. Reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
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FIG. 1 illustrates a perspective view of one embodiment of an integrated circuit package of the present invention; -
FIG. 2 presents a plan view of exemplary integrated circuit package of the present invention; -
FIG. 3 presents a plan view of another embodiment of the integrated circuit package of the present invention; -
FIGS. 4-8 illustrate plan views of selected steps in an exemplary method of manufacturing an integrated circuit package following the principles of the present invention; and -
FIGS. 9-13 illustrate plan views of selected steps in an alternative method of manufacturing an integrated circuit package of the present invention. -
FIG. 1 presents a perspective view of one embodiment of the present invention, anintegrated circuit package 100. Theintegrated circuit package 100 comprises anintegrated circuit 102 and leads 104 coupled to theintegrated circuit 102. Theintegrated circuit 102 can comprise any conventional microelectronic device, such as standard linear and logic products, digital signal processors, microprocessors, digital and analog devices, high frequency and higher power devices, and comprise either large or small chip sizes. - Each of the
leads 104 have afirst end 106 configured to be coupled to the integratedcircuit 102 and asecond end 108 configured to pass through one of a plurality ofmounting holes 110 extending through amounting board 112. Theleads 104 comprise at least onepositioning lead 114 and at least onenon-positioning lead 116. Thepositioning lead 114 comprises astop 118. Thestop 118 is a continuous part of thepositioning lead 114 and has alateral dimension 120 that is greater than adiameter 122 of afirst hole 124 of the plurality ofmounting holes 110. The termlateral dimension 120 as used herein refers to any number ofdirections plane 128 of themounting board 112. Thenon-positioning lead 116 has a continuous uniformlyshaped body 130 with alateral dimension 132 less than adiameter 134 of asecond hole 136 of the plurality ofmounting holes 110. Thestop 118 limits an extension of thenon-positioning lead 116 through thesecond hole 136. - The
first ends 106 of theleads 104 can be configured for direct or indirect coupling to the integratedcircuit 102. For the embodiment shown inFIG. 1 ,bonding wires 138 facilitate the indirect coupling of thefirst ends 106 of theleads 104 tobond pads 140 on the integrated circuit 105. Of course, direct coupling by placing thefirst ends 106 in contact with thebond pads 140 is also within the scope of the present invention. Similarly, thesecond ends 108 of theleads 104 can be coupled directly or indirectly tometal lines 142 of a printedcircuit 144. For instance, as shown inFIG. 1 , thesecond ends 108 of both thepositioning lead 114 andnon-positioning lead 116 are directly coupled via solder to themetal lines 142 of the printedcircuit 144. For the embodiment shown inFIG. 1 , themetal lines 142 are patterned on abottom side 146 of themounting board 112, whereas theintegrated circuit package 100 is surface mounted on atopside 148 of themounting board 112 - With continuing reference to
FIG. 1 , theintegrated circuit package 100 can further comprise amold 150, aheat sink 152 and amounting pad 154. In preferred embodiments the integratedcircuit 102 is coupled to themounting pad 154 using an adhesive such as epoxy. Themold 150, which can also be made of an epoxy, encompasses the integratedcircuit 102. In addition to protecting the integratedcircuit 102 against harmful environmental conditions, themold 150 securely holds theleads 104,bond wire 138 andheat sink 152 at appropriate locations relative to the integratedcircuit 102. For instance, thefirst end 106 of theleads 104 is encompassed by themold 150, and at least a portion of theheat sink 152 is surrounded by themold 150. - In some preferred embodiments, such as shown in
FIG. 1 , themold 150 holds theheat sink 152 above atop surface 156 of the integratedcircuit 102. Locating theheat sink 152 over theintegrated circuit 102 is advantageous in embodiments where theintegrated circuit package 100 is held above theplane 128 of themounting board 112 and theheat sink 152 does not contact themounting board 112. In these cases, there is greater dissipation of heat generated from the active integratedcircuit 102 as compared to a heat sink that is under the integratedcircuit 102. - The
stop 118 of thepositioning lead 114 is configured to hold theintegrated circuit package 100 above theplane 128 of themounting board 112 by afixed distance 158, for example, about 100 microns to about 2000 microns. Holding theintegrated circuit package 100 above theplane 128 of themounting board 112 advantageously protects the integratedcircuit 102 against damage from mechanical stresses that can otherwise be imparted from themounting board 112 to theintegrated circuit package 100. Preferably, thestop 118 is configured to prevent asegment 160 of thepositioning lead 114 from passing through thefirst hole 124. As illustrated inFIG. 1 , thesegment 160 is between thefirst end 106 and thestop 118. - The stop can be configured to have a number of different shapes to provide the lateral dimension greater than the diameter of its corresponding mounting hole. For example, as illustrated in
FIG. 1 , thestop 118 of thepositioning lead 114 comprises an increasedwidth 162 in onedirection 126. In some preferred embodiments, theincrease width 162 is at least about 5 percent greater than thediameter 122 of thefirst hole 124. Of course, other configurations where the increased width is in adifferent direction 127, or several directions that are parallel to the plane of the mountingboard 112, are also within the scope of the present invention. - As another example, the positioning lead can have a stop that comprises a bend in the positioning lead. For instances,
FIG. 1 shows asecond positioning lead 164 having a stop 166 that comprises a bend in thesecond positioning lead 164. In some preferred embodiments, thestop 166 has aninterior angle 168 ranging from about 70 to about 110 degrees, although other ranges of angles and type types of bends can be used. Of course, positioning lead having stops that comprise multiple bends, or both and increased width and a bend are also within the scope of the present invention. - With continuing reference to
FIG. 1 , to present additional aspects of the present invention,FIG. 2 presents a plan view of exemplaryintegrated circuit package 200. The same reference numbers used inFIG. 1 are used to label analogous components of theintegrated circuit package 200. For clarity, theleads 104 andmold 150 are depicted as being semitransparent and transparent, respectively. - As shown in
FIG. 2 , to hold theintegrated circuit package 200 above theplane 128 of the mountingboard 112, it is preferable to have at least two positioning leads 205, 210. In some cases, such as shown inFIG. 1 , the positioning leads 114, 164 are coupled to the same side of theintegrated circuit 102. It is more preferable, however, for the two positioning leads 205, 210 to be coupled to opposing sides of theintegrated circuit 102, as shown inFIG. 2 . Locating the positioning leads 205, 210 on opposing sides of theintegrated circuit 102 more stably holds the integratedcircuit package 100 at the fixeddistance 158, as compared to having positioning leads on only one side of theintegrated circuit 102. Configuring the two positioning leads 205, 210 as corner leads, such as shown inFIG. 2 , is even more desirable, as this configuration further stabilizes the seating of theintegrated circuit package 200 on the mountingboard 112. Additional stability can be gain by locating the corner positioning leads 205, 210 in opposing diagonal corners of theintegrated circuit 102, such as shown inFIG. 2 . - In some instances, configuring the positioning leads 205, 210 as corner leads provides the additional benefit of reducing the
pitch 215 between thecorner positioning lead 210 and an adjacent interiornon-positioning lead 220. Reducing thepitch 215 between thecorner positioning lead 210 and the adjacent interiornon-positioning lead 220 is facilitated by locating thestop 118 on a side of thepositioning lead 210 that is non-proximal to the adjacentnon-positioning lead 220, as shown inFIG. 2 . - Corner positioning leads 205, 210 can be advantageously used in combination with a variety of surface mounting configurations to reduce the
interior lead pitch 225 and thereby increase the number of connections to theintegrated circuit 102. For instance, as shown inFIG. 2 , the interior non-positioning leads 230 are extended through mountingholes 110 that are arranged in a staggered configuration. In some cases, to facilitate extension ofleads 104 through the staggered mountingholes 110, shorter non-positioning leads 235 are interleaved with longer non-positioning leads 240 on the same side of theintegrated circuit 102. Of course, short and long positioning leads 205, 210 can also be using in a staggered hole configuration. - With continuing reference to
FIG. 1 ,FIG. 3 presents a plan view of another embodiment of theintegrated circuit package 300 of the present invention. Again, the same reference numbers as used inFIG. 1 are used to label analogous components of theintegrated circuit package 300.FIG. 3 presents a preferred embodiment of the integrated circuit package comprising at least four positioning leads 305, 310, 315, 320. Preferably, the positioning leads 305, 310, 315, 320 are corner leads, where each one of the positioning leads 305, 310, 315, 320 are coupled to different corners of theintegrated circuit 102.FIG. 3 illustrates the positioning leads 305, 310, 315, 320 and non-positioning leads 325 being extended, below the plane of view, through mountingholes 110 that are arranged in a straight-line configuration. Of course, a staggered arrangement of mountingholes 110, similar to that presented inFIG. 2 could also be used. - For clarity, only a limited number of
leads 104 are depicted in the embodiments of the integrated circuit packages illustrated inFIGS. 1-3 . It should be understood, however, that the integrated circuit package of the present invention could contain any number of leads found in a conventional surface-mount integrated circuit packages. For instance, integrated circuit packages having from two to three hundred leads are known in the industry. Also, the integrated circuit package can be any number of conventional type of lead-containing package, including plastic dual in-line integrated circuit packages (PDIP), small outline integrated circuits (SOICs), quad flat packages (QFPs), thin QFPs (TQFPs), Small Shrink Outline Plastic packages (SSOP), thin SSOPs (TSSOPs), thin very small-outline packages (TVSOPs), or other packages known to those skilled in the art. The leads can be made of any conventional ductile conductive material used for through-hole leads. Non-limiting examples of such materials include gold, silver, copper and alloys thereof. In some cases, the leads are plated with tin, nickel, palladium or similar materials to improved adhesion to solder. - Another aspect of the present invention is a method of manufacturing an integrated circuit package. The method of manufacturing an integrated circuit package can be used to produce any of the embodiments of the integrated circuit package presented in
FIGS. 1-3 and discussed above. -
FIGS. 4-8 illustrate plan views of selected steps in an exemplary method of manufacturing anintegrated circuit package 400 following the principles of the present invention. Turning first toFIG. 4 , presented is a plan view of a partially completedintegrated circuit package 400 after forming alayout pattern 405 on ametal sheet 410. Any conventional process, such as photolithography can be used to define thelayout pattern 405 on themetal sheet 410. Thelayout pattern 405 comprises alead layout pattern 415 for at least one positioning lead having a stop. - With continuing reference to
FIG. 4 ,FIG. 5 shows the partially completedintegrated circuit package 400 after removing portions of themetal sheet 410 that are outside of thelayout pattern 405 to thereby form alead frame 505 comprising at least onepositioning lead segment 510 having astop 515. As illustrated inFIG. 5 , thestop 515 is configured to be a continuous part of thepositioning lead segment 510. Any conventional method, such as stamping or etching, can be used to form theleads frame 505 out of the sheet ofmetal 415. Thelead frame 505 further comprises a one or more non-positioninglead segments 520 and pad 525 configured to accommodate an integrated circuit. Although not shown for the sake of clarity, one of ordinary skill in the art would understand that thelead frame 505 can also include other conventional components, such as shorting bars, dam bars, etc. . . . , to facilitate forming theintegrated circuit package 400. - With continuing reference to
FIGS. 4-5 ,FIG. 6 presents theintegrated circuit package 400 after coupling anintegrated circuit 605 to thepad 525, coupling aheat sink 610 to theintegrated circuit 605, and coupling thepositioning lead segments 510 and non-positioninglead segments 520 to theintegrated circuit 520. Similar to that discussed above in the context ofFIG. 1 , both direct coupling, or indirect coupling viabonding wires 615, are within the scope of the invention. - With continuing reference to
FIGS. 4-6 ,FIG. 7 show the partially completedintegrated circuit package 400 after removing portions of thelead frame 505 to thereby form a plurality ofleads 705 comprising positioning leads 710 having astop 715 and non-positioning leads 720. Any conventional device such as a trimmer tool can be used to remove the undesired portions of the lead frame. Each of theleads 705 has afirst end 725 and asecond end 730, thefirst end 725 being coupled to theintegrated circuit 605. -
FIG. 7 also illustrates the partially completedintegrated circuit package 400 after enclosing theintegrated circuit 605 in amold 740. For clarity, a transparent view through themold 740 is presented. Preferably, themold 740 also encloses thefirst end 725 of the each of leads 705. As shown inFIG. 7 , in some cases it is advantageous for one or more of the positioning leads 710 to be left attached to thelead frame 505 shown inFIG. 5 , while the non-positioning leads 715 are isolated from thelead frame 505. In such instances, thepositioning lead segment 510 andpositioning lead 710 are substantially the same structures. Of course, any combination ofleads 705 that are each attached or isolated from thelead frame 505 is also within the scope of the present invention. - With continuing reference to
FIGS. 4-7 ,FIG. 8 shows the completedintegrated circuit package 400 after bending theleads 705, below the plane of view, and mounting the integrated circuit package to a mountingboard 805 having a plurality of mountingholes 810. Any conventional device such as a bending tool can be used to bend the leads 705. The leads 705 are bent below the plane of view to configure the second ends of theleads 730 shown inFIG. 7 to pass through the mountingholes 810 and thereby extend the second ends 730 through the mountingboard 805. Preferably, thepositioning lead 710 is bent to configure thestop 715 to be below a bottom surface of themold 740. In some preferred embodiments, the plurality of mountingholes 810 all have substantially asame diameter 815, although embodiments with differently-sized mounting holes are also within the scope of the present invention. - The
stop 715 of the positioning leads 710 is configured to have alateral dimension 820 greater than thediameter 815 of afirst hole 825. Thestop 715 thereby limits an extension of at least onenon-positioning lead 720 through asecond hole 830 of the mounting holes 810. Moreover, because thestop 715 is a continuous part of thepositioning lead 710, thestop 715 is less prone to deform, break or shear off while the integrated circuit package is being mounted or in use, as compared to a stop that is mechanically attached or bonded to thepositioning lead 710. Returning toFIG. 7 , thestop 715 of thepositioning lead 710 is also configured to have awidth 745 greater than awidth 750 that of anadjacent portion 755 of the positioning lead. Theadjacent portion 755 is configured to pass through thefirst hole 825 shown inFIG. 8 . - For the embodiment presented in
FIGS. 4-8 , the properties of thepositioning lead 710 requires that the method include the preparation of alayout pattern 405, shown inFIG. 4 , to have a speciallead layout pattern 415 for the positioning lead to define a stop. In other embodiments of the method, however, the layout pattern does not have a special lead layout pattern. - Such an embodiment is illustrated in
FIGS. 9-13 , which present plan views of selected steps for an alternative exemplary method of manufacturing anintegrated circuit package 900 according to the present invention. Turning first toFIG. 9 , illustrated is a plan view of a partially completedintegrated circuit package 900 after forming alayout pattern 905 on ametal sheet 910. Thelayout pattern 905 comprises alead layout pattern 915 for a plurality of uniformly shaped leads. Unlike the embodiment presented inFIGS. 4-8 , however, there is no special pattern for a positioning lead having a stop. - With continuing reference to
FIG. 9 , as illustrated inFIG. 10 , portions of themetal sheet 910 outside of thelayout pattern 905 can be removed, using the same procedures as discussed in the context ofFIG. 5 , to provide alead frame 1005. Thelead frame 1005 compriseslead segments 1010 that are uniformly shaped. - While maintaining reference to
FIG. 9-10 ,FIG. 11 shows the partially completedintegrated circuit package 900 after adding anintegrated circuit 1105,heat sink 1110, andbonding wiring 1115 to theintegrated circuit package 900 using the same procedures as discussed in the context ofFIG. 6 . Similarly, portions of thelead frame 1005 can be removed to form a plurality of uniformly-shapedleads 1120 having first andsecond ends mold 1140 applied to enclose theintegrated circuit 1105, using the same procedures discussed in the context ofFIG. 7 . As illustrated inFIG. 11 , however, all of theleads 1120 at this stage in the manufacturing process are substantially identical and uniformly shaped. - With continuing reference to
FIG. 9-11 ,FIG. 12 shows the partially completedintegrated circuit package 900 after forming at least onepositioning lead 1210 by bending at least one of the uniformly-shapedleads 1120 shown inFIG. 11 to form astop 1215. In this embodiment, thestop 1215 is a bend in thepositioning lead 1210.Leads 1120 that are not bent in this fashion arenon-positioning leads 1220. As noted above, configuring thestop 1215 as a continuous part of thepositioning lead 1210, makes thestop 1215 resistant to deformation, breaking or shearing off while theintegrated circuit package 900 is being mounted or in use. - While still referring to
FIG. 9-12 ,FIG. 13 shows theintegrated circuit package 900, after additional bending of the positioning leads 1210, and for the first time, bending of the non-positioning leads 1220, to situate theirsecond ends 1130, shown inFIG. 12 , below the plane of view. Theintegrated circuit package 900 is shown after coupling to a mountingboard 1305, having a plurality ofholes 1310. Similar to previously discussed embodiments, thestop 1215 of thepositioning lead 1210 is configured to have alateral dimension 1315 that greater than adiameter 1320 of afirst hole 1325. Thestop 1210 thereby limits an extension of one or more non-positioning leads 1220 through asecond hole 1330. - For clarity, the manufacture of the integrated circuit packages shown in
FIGS. 4-8 and 9-13 are shown as separate process flows. However, one skilled in the art would recognize that these processes could be combined into a single process flow, if desired. - Although the present invention has been described in detail, those skilled in the art should understand that they could make various changes, substitutions and alterations herein without departing from the scope of the invention in its broadest form.
Claims (20)
1. An integrated circuit package, comprising:
an integrated circuit; and
leads coupled to said integrated circuit, each of said leads having a first end configured to be coupled to said integrated circuit and a second end configured to pass through one of a plurality of mounting holes extending through a mounting board, and wherein said leads comprise:
one or more positioning lead comprising a stop being a continuous part of said positioning lead and having a lateral dimension greater than a diameter of a first hole of said plurality of mounting holes, and
one or more non-positioning lead having a continuous uniformly shaped body with a lateral dimension less than a diameter of a second hole of said plurality of mounting holes, wherein said stop limits an extension of said non-positioning lead through said second hole.
2. The integrated circuit package as recited in claim 1 , further comprises a mold encompassing said integrated circuit and holding a heat sink above a top surface of said integrated circuit.
3. The integrated circuit package as recited in claim 1 , further comprises a mold encompassing said integrated circuit, wherein said first end is encompassed by said mold and at least a portion of said stop is below a bottom surface of said mold.
4. The integrated circuit package as recited in claim 3 , wherein said stop is configured to hold said bottom surface above said mounting board by a fixed distance.
5. The integrated circuit package as recited in claim 1 , wherein said stop is configured to prevent a segment of said positioning lead from passing through said first hole, said segment being between said first end and said stop.
6. The integrated circuit package as recited in claim 1 , wherein said stop comprises a bend in said positioning lead.
7. The integrated circuit package as recited in claim 6 , wherein said bend has an interior angle ranging from about 70 to about 110 degrees.
8. The integrated circuit package as recited in claim 1 , wherein said stop comprises an increased width in said positioning lead.
9. The integrated circuit package as recited in claim 8 , wherein said increased width is at least about 5 percent greater than said diameter of said first hole.
10. The integrated circuit package as recited in claim 1 , further comprises at least two of said positioning leads, wherein said positioning leads are corner leads being coupled to opposing corners of said integrated circuit.
11. The integrated circuit package as recited in claim 1 , further comprises at least four of said positioning leads, wherein said positioning leads are corner leads each one of said positioning leads being coupled to different corners of said integrated circuit.
12. The integrated circuit package as recited in claim 1 , wherein said stop is located on a side of said positioning lead that is non-proximal to an adjacent non-positioning lead.
13. The integrated circuit package as recited in claim 1 , wherein said non-positioning lead comprises short non-positioning leads interleaved with long non-positioning leads, both said short and long non-positioning leads being coupled to a same side of said integrated circuit.
14. A method of manufacturing an integrated circuit package, comprising:
forming a plurality of leads, each of said leads having a first end configured to be coupled to an integrated circuit and a second end configured to pass through one of a plurality of holes extending through a mounting board, including:
forming a positioning lead comprising a stop being a continuous part of said positioning lead and having a lateral dimension greater than a diameter of a first hole of said plurality of mounting holes; and
forming a non-positioning lead having a continuous uniformly shaped body having a lateral dimension less than a diameter of a second hole of said plurality of mounting holes, wherein said stop limits an extension of said non-positioning lead through said second hole.
15. The method recited in claim 14 , wherein forming said positioning lead comprises:
forming a layout pattern on a metal sheet, wherein said layout pattern comprises a lead layout pattern for said least one positioning lead having said stop; and
removing portions of said metal sheet that are outside of said layout pattern to thereby form a lead frame comprising said at least one positioning lead.
16. The method as recited in claim 15 , wherein said stop comprises a width greater than that of an adjacent portion of said positioning lead, said adjacent portion being configured to pass through said first hole.
17. The method of fabrication recited in claim 14 , wherein forming said positioning lead comprises:
forming a lead layout pattern on a metal sheet, wherein said layout pattern comprises a lead layout pattern for a plurality of uniformly shaped leads;
removing portions of said metal sheet that are outside of said layout pattern to thereby form said leads that are uniformly-shaped leads; and
bending at least one of said uniformly shaped leads to form said positioning lead comprising said stop.
18. The method as recited in claim 17 , wherein said stop comprises a bend with an interior angle ranging from about 70 to about 110 degrees.
19. The method as recited in claim 14 , further includes bending said positioning lead to configure said stop to be below a bottom surface of a mold encompassing said integrated circuit.
20. The method as recited in claim 14 , further comprising
coupling a heat sink to a top surface of said integrated circuit; and
encompassing said integrated circuit in a mold.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/066,875 US20060192273A1 (en) | 2005-02-25 | 2005-02-25 | Integrated circuit package and method of manufacture thereof |
PCT/US2006/006853 WO2006091940A1 (en) | 2005-02-25 | 2006-02-27 | Integrated circuit package with lead stops |
US11/552,803 US7531895B2 (en) | 2005-02-25 | 2006-10-25 | Integrated circuit package and method of manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/066,875 US20060192273A1 (en) | 2005-02-25 | 2005-02-25 | Integrated circuit package and method of manufacture thereof |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/552,803 Continuation-In-Part US7531895B2 (en) | 2005-02-25 | 2006-10-25 | Integrated circuit package and method of manufacture thereof |
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US20060192273A1 true US20060192273A1 (en) | 2006-08-31 |
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US11/552,803 Active 2025-04-24 US7531895B2 (en) | 2005-02-25 | 2006-10-25 | Integrated circuit package and method of manufacture thereof |
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US11/552,803 Active 2025-04-24 US7531895B2 (en) | 2005-02-25 | 2006-10-25 | Integrated circuit package and method of manufacture thereof |
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US (2) | US20060192273A1 (en) |
WO (1) | WO2006091940A1 (en) |
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KR101357142B1 (en) * | 2011-11-22 | 2014-02-04 | 하나 마이크론(주) | Semiconductor package and method of manufacturing the same |
US20160133373A1 (en) * | 2014-11-07 | 2016-05-12 | Solantro Semiconductor Corp. | Non-planar inductive electrical elements in semiconductor package lead frame |
RU2658516C2 (en) * | 2014-04-07 | 2018-06-21 | Тюбитак | Apparatus with electrochemical sensor matrix |
US10264679B2 (en) | 2015-04-21 | 2019-04-16 | The Procter & Gamble Company | Special electric component, printed circuit board assembly, and method of manufacturing an electric appliance |
EP3544394A1 (en) * | 2018-03-24 | 2019-09-25 | Melexis Technologies SA | Integrated circuit lead frame design and method |
CN114252820A (en) * | 2020-09-24 | 2022-03-29 | 迈来芯电子科技有限公司 | Magnetic sensor components and assemblies |
US11543466B2 (en) | 2018-03-24 | 2023-01-03 | Melexis Technologies Sa | Magnetic sensor component and assembly |
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CN101368713B (en) * | 2007-08-17 | 2010-11-10 | 富准精密工业(深圳)有限公司 | Heat radiator |
JP2009239898A (en) * | 2008-03-06 | 2009-10-15 | Nec Electronics Corp | Solid-state image sensor and package for the same |
US7612436B1 (en) | 2008-07-31 | 2009-11-03 | Micron Technology, Inc. | Packaged microelectronic devices with a lead frame |
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Also Published As
Publication number | Publication date |
---|---|
WO2006091940A1 (en) | 2006-08-31 |
US7531895B2 (en) | 2009-05-12 |
US20070057361A1 (en) | 2007-03-15 |
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