|Publication number||US20060209598 A1|
|Application number||US 11/084,214|
|Publication date||Sep 21, 2006|
|Filing date||Mar 17, 2005|
|Priority date||Mar 17, 2005|
|Also published as||US7257033, US7791950, US20070263456|
|Publication number||084214, 11084214, US 2006/0209598 A1, US 2006/209598 A1, US 20060209598 A1, US 20060209598A1, US 2006209598 A1, US 2006209598A1, US-A1-20060209598, US-A1-2006209598, US2006/0209598A1, US2006/209598A1, US20060209598 A1, US20060209598A1, US2006209598 A1, US2006209598A1|
|Inventors||Bin Wang, Chih-Hsin Wang, William Colleran|
|Original Assignee||Impinj, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Referenced by (8), Classifications (4), Legal Events (6)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application is related to U.S. Utility application Ser. No. 10/813,907 (IMPJ-0027A) filed on Mar. 30, 2004, Ser. No. 10/814,866 (IMPJ-0027B) filed on Mar. 30, 2004, and Ser. No. 10/814,868 (IMPJ-0027C) filed on Mar. 30, 2004. All three Applications are incorporated herein by reference.
The present invention relates to non-volatile memory cell and array structures, and more particularly, to methods and apparatus for programming, reading or erasing such structures.
Memory circuits may be classified in two main categories: volatile and nonvolatile. Volatile memory loses any data as soon as the system is turned off. Thus, it requires constant power to remain viable. Most types of random access memory (RAM) fall into this category. Non-volatile memory does not lose its data when the system or device is turned off. A non-volatile memory (NVM) device may be implemented as a MOS transistor that has a source, a drain, an access or a control gate, and a floating gate. It is structurally different from a standard MOSFET in its floating gate, which is electrically isolated, or “floating”.
Non-volatile memory arrays include a plurality of NVM cells arranged in rows and columns. In general, single-transistor n-channel NVM cells operate as follows. During an erase operation, electrons are removed from a floating gate of the NVM cell, thereby lowering the threshold voltage of the NVM cell. During a program operation, electrons are inserted into the floating gate of the NVM cell, thereby raising the threshold voltage of the NVM cell. Thus, during program and erase operations, the threshold voltages of selected NVM cells are changed. During a read operation, read voltages are applied to selected NVM cells. In response, read currents may flow through the selected NVM cells. The magnitudes of the read currents are dependent upon the threshold voltages of the selected NVM cells. In another configuration, output voltages of the NVM cells may be varied between two values based on the threshold voltages of those cells.
The disclosure facilitates storage of digital information in a non-volatile memory circuit. Accordingly, the disclosure provides programming, erasing, and reading of non-volatile memory arrays.
In some embodiments, supply voltages for storage elements of NVM cells forming an NVM array are turned off during programming and erase modes enabling a reduction in current consumption by the storage elements. Turning on and off of the supply voltages for the storage elements may also be employed to select particular columns of the NVM array.
While example embodiments are shown using a floating gate, dual transistor storage element, the principles disclosed herein may be implemented in other types of NVM cells. Thus, the invention is not limited to the illustrated examples.
Non-limiting and non-exhaustive embodiments are described with reference to the following drawings.
Various embodiments of the present invention will be described in detail with reference to the drawings, where like reference numerals represent like parts and assemblies throughout the several views. Reference to various embodiments does not limit the scope of the invention, which is limited only by the scope of the claims attached hereto. Additionally, any examples set forth in this specification are not intended to be limiting and merely set forth some of the many possible embodiments for the claimed invention.
Throughout the specification and claims, the following terms take at least the meanings explicitly associated herein, unless the context clearly dictates otherwise. The meanings identified below are not intended to limit the terms, but merely provide illustrative examples for the terms. The meaning of “a,” “an,” and “the” includes plural reference, the meaning of “in” includes “in” and “on.” The term “connected” means a direct electrical connection between the items connected, without any intermediate devices. The term “coupled” means either a direct electrical connection between the items connected or an indirect connection through one or more passive or active intermediary devices. The term “circuit” means either a single component or a multiplicity of components, either active and/or passive, that are coupled together to provide a desired function. The term “signal” means at least one current, voltage, charge, temperature, data, or other measurable quantity. The term “cell” means a unit NVM circuit comprising of a programming and a storage element that are arranged to store one bit. The term “array, refers to a plurality of NVM cells arranged in columns and rows.
In general, dual transistor inverter NVM cells operate as follows. During an erase operation, electrons are removed from a floating gate of the NVM cell, thereby adjusting a switch point voltage of the inverter NVM cell such that an output voltage corresponds to “0” when supply voltage is applied to the storage element. During a program operation, electrons are inserted into the floating gate of the NVM cell, thereby adjusting the switch point voltage of the inverter NVM cell such that the output voltage corresponds to “1” when supply voltage is applied to the storage element. Thus, during program and erase operations, the switch point voltages of selected NVM cells are changed. During a read operation, supply voltages are applied to the storage elements of the selected NVM cells. In response, output voltages of these selected NVM cells reflect a bit value based on the stored charges in their floating gates.
Floating gate type NVM cells may include programming circuits that are arranged to inject electrons to the floating gate of the storage element employing one of impact-ionized hot-electron injection, Fowler-Nordheim (FN) tunneling, channel hot-electron tunneling, and band-to-band tunneling induced electron injection.
Specifically, NVM cell C100 includes first programming transistor M106, second programming transistor M108, first storage transistor M102, and second storage transistor M104. First storage transistor M102 and second storage transistor M104 are arranged to share floating gate fg.
First programming transistor M106 and second programming transistor M108 together form the programming element of cell C100. First programming transistor M106 and second programming transistor M108 are coupled together at their gate terminals and share the floating gate with M102 and M104. A source, a drain, and an n-well terminal of first programming transistor M106 are coupled together to a first programming voltage VER. A source, a drain, and an n-well terminal of second programming transistor M108 are coupled together to a second programming voltage VPP.
The programming element is arranged such that electrons are injected onto the shared floating gate fg when first programming voltage VER has a high value and second programming voltage VPP has a low value. High and low values for the programming voltages may be predetermined based on a type and size of transistors used for M106 and M108. Electrons are removed from the shared floating gate, when first programming voltage VER has the low value and second programming voltage VPP is set to the high value. First programming transistor M106 is preselected such that its area is larger than the areas of second programming transistor M108, first storage transistor M102 and second storage transistor M104. In one embodiment, a size ratio between M106 and M108 may be between about four and about five. However, the invention is not limited to this ratio.
In a programming operation, a high value for programming voltage VER (e.g. ˜10V) is applied to the source, drain, and n-well terminals of M106 (larger size transistor) and about 0V is applied to the source, drain, and n-well terminals of M108 (smaller size transistor). As a result, the shared floating gate fg is coupled at about +9V due to an effect of size difference. This results in about 9V across the smaller transistor from its gate terminal to its source, drain, and n-well terminals, and electrons are attracted to shared floating gate fg. On the other hand, there is only about 1V across M106 transistor, thus no current flow.
In an erase operation, a high value for programming voltage VPP (e.g. ˜10V) is applied to the source, drain, and n-well terminals of M108 (smaller size transistor) and about 0V is applied to the source, drain, and n-well terminals of M106. As a result, the floating gate is coupled at about 1V due to the size difference effect. This results in about 9V (10V−1 V) across the smaller transistor from its source, drain, and n-well terminals to its gate terminal, and electrons are removed from shared floating gate fg.
For either erase or programming operations, there is about 9V across the smaller transistor (M108) with a different polarity in each case. The polarity of the 9V determines a flowing direction of the electrons resulting in either programming or erase operations.
The storage element of cell C100 is formed by first storage transistor M102 and second storage transistor M104. A drain terminal of first storage transistor M102 is coupled to a drain terminal of second storage transistor M104, and the two storage transistors share a common floating gate as mentioned above. A source terminal of M102 is arranged to receive high supply voltage VDD, also referred to as word line signal WL. A source terminal of M104 is arranged to receive low supply signal GND, also referred to as inverted WL. In one embodiment, low supply signal may be a ground signal. Output voltage Vo, also termed bit line signal BL, is provided at node N110 where the drain of M102 and the drain of M104 are coupled together.
Because storage transistors M102 and M104 do not need to be turned on during the programming or erase modes, high supply voltage VDD are turned off during those modes. This enables lower current consumption of NVM cell C100 during those modes.
In a read mode, programming voltages are turned off. High supply voltage VDD is turned on along with low supply voltage GND. If the low supply voltage is ground voltage (0V), it may not need to be turned on. A charge level of shared floating gate fg determines whether the inverter comprising storage transistors M102 and M104 provides an inverted output or not when supply voltages are provided. Accordingly, output voltage Vo at node N110 provides a “1” or a “0” bit value depending on the charge level of floating gate fg.
Values of Vo corresponding to “1” and “0” bit values may be determined based on a size and type of M102 and M104, a value of high and low supply voltages, and a value of the switch point voltage for the transistors. In one embodiment, M102, M106, and M108 may be p-type FETs, and M104 an n-type FET.
Components of NVM cell C150 that are similarly numbered in NVM cell 100 of
A structure and operation of a p-doped, polysilicon, shared gate transistor pair is discussed in detail in U.S. patent application No. (not yet assigned) (Atty. Docket No. 50133-16US01), filed on even date herewith, entitled “SYSTEMS AND METHODS FOR RETENTION ENHANCED PROGRAMMABLE SHARED FLOATING GATE LOGIC CIRCUIT”.
As mentioned previously, NVM arrays include a plurality of NVM cells arranged in rows and columns. In NVM array 200, cells C2-1-1 through C2-1-N are arranged in a row storing bits 1 through N, respectively. Similarly, cells C2-2-1 through C2-2-N form the second row storing a second word and cells C2-M-1 through C2-M-N form Mth row storing an Mth word. M and N are integers indicating a maximum row and column number, respectively.
Programming voltages for each row are represented by VPP0 through VPPM. In one embodiment, as described in conjunction with
Each row of NVM cells may be selected for read mode operations by word line voltages WL0 through WLM. Word line voltages may be implemented as high supply voltage, such as in the example embodiment of
In a read mode, output voltages of individual NVM cells may be read at the bit lines BL0 through BLN, which are coupled to output nodes of each NVM cell within a corresponding column.
In a read mode operation, rows of NVM cells may be selected by providing a predetermined value of word line voltage to the selected rows. Then, selected NVM cells within each column may be read by selecting a corresponding bit line. For example, if NVM cell C2-2-2 is to be read, first WL1 may be set to the predetermined turn-on value, while other WL's are remain at the predetermined turn-off value. Then, BL1 may be recorded providing the stored bit value in NVM cell C2-2-2. to read the whole NVM array, word line voltages WL0 through WLM may be set to turn-on value one-by-one as other WL's are set to turn-off value, and during each step BL1 through BLN may be read, thereby providing the stored word values for each row individually.
NVM array 300 includes four example NVM cells C3-0, C3-1, C3-2, and C3-3. As shown in the figure, individual cells include programming and storage elements similar to those illustrated in
Similarly, second isolation transistor M306-X of each cell is coupled between a source terminal of a second storage transistor of each cell and a ground. Second isolation transistor M306-X is arranged to receive an inverted word line voltage. The word line voltage may be inverted by inverter 302-X for each row of NVM cells. Second isolation transistor M306-X is arranged to provide the ground to the drain terminal of the second storage transistors based on the inverted word line signal completing a path for current flow for the storage element in the read mode.
In a programming mode, programming voltages for cell C3-0 may be selected as VER0=10V and VPP0=0V. This results in injection of electrons onto the shared gate of storage transistors of cell C3-0 as explained in
In both the erase and the programming modes, word line voltages WL0 and WL1 are set to VDD turning off the p-type first isolation transistor (M304-0 through M304-3) and the n-type second transistor (M306-0 through M306-3) in each transistor, thereby turning off the storage elements of each cell in the erase and programming modes.
In a read mode operation, when cells C3-0 and C3-1 are to be read, WL0 is set to 0V turning on the isolation transistors M304-0, M304-1, M306-0, and M306-1, thereby providing VDD and ground signals to the storage elements of cells C3-0 and C3-1. The other two example cells are still turned off. A reading circuit may first read bit line BL0 and determine the bit value stored in cell C3-0, then bit line BL1 and determine the bit value stored in cell C3-1. In an NVM array with N-bit words, bit lines BL0 through BLN may be read consecutively or simultaneously determining the whole word stored in the selected word line.
While NVM array 300 is illustrated with four example cells and particular values for programming and word line selection voltages, the invention is not so limited. Other arrangements of arrays with fewer or more cells and other values of voltages may be selected without departing from the scope and spirit of the invention.
Components of NVM array 400 that are similarly numbered in NVM array 300 of
Isolation transistors 404-X and 406-X are arranged to be turned on and off by corresponding word line voltage WLX provided to a gate terminal of 404-X and an inverted WLX provided to a gate terminal of 406-X for an Xth word line (row).
Similar to NVM array 300, storage elements of all rows may be turned off by turning off the isolation transistor pairs with corresponding word line voltages during erase and programming modes. In a read mode, supply voltages may be provided to all storage elements of cells within a selected row by providing the appropriate value of word line voltage to the isolation transistors of the selected row and keeping the other isolation transistor pairs turned off. Then, each cell within the selected row may be read bit line by bit line.
Components of NVM array 500 that are similarly numbered in NVM array 300 of
In NVM array 500, word line voltages are selected to be substantially equal to a high supply voltage for storage elements, in this case VDD. Inverted word line voltage through inverter 502-X is substantially equal to the low supply voltage for the storage elements. Accordingly, when word line voltage is applied to a selected row, all storage elements are provided with supply voltages, while other rows are still turned off.
While the embodiment represented by NVM array 500 permits more efficient usage of resources such as smaller circuit area, power consumption, and the like, through the elimination of isolation transistors, it also includes the limitation of having the word line voltage be substantially equal to the high supply voltage for the storage elements of the NVM cells.
The examples provided above are for illustration purposes and do not constitute a limitation on the present invention. Other embodiments may be implemented using other arrangements of NVM cells within an NVM array and other implementations of NVM cells without departing from the scope and spirit of the invention.
The above specification, examples and data provide a complete description of the manufacture and use of the composition of the invention. Since many embodiments of the invention can be made without departing from the spirit and scope of the invention, the invention resides in the claims hereinafter appended.
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7263001 *||Mar 17, 2005||Aug 28, 2007||Impinj, Inc.||Compact non-volatile memory cell and array system|
|US7623380 *||Sep 25, 2006||Nov 24, 2009||Panasonic Corporation||Nonvolatile semiconductor memory device|
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|US7791950||May 15, 2007||Sep 7, 2010||Virage Logic Corporation||Inverter non-volatile memory cell and array system|
|US7796450||Feb 5, 2008||Sep 14, 2010||Virage Logic Corporation||Radio frequency (RFID) tag including configurable single bit/dual bits memory|
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|US8159877 *||Mar 25, 2010||Apr 17, 2012||National Semiconductor Corporation||Method of directly reading output voltage to determine data stored in a non-volatile memory cell|
|US20110235425 *||Sep 29, 2011||Pavel Poplevine||Method of directly reading output voltage to determine data stored in a non-volatile memory cell|
|Aug 8, 2005||AS||Assignment|
Owner name: IMPINJI, INC., WASHINGTON
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WANG, BIN;WANG, CHIH-HSIN;COLLERAN, WILLIAM T., PH.D.;REEL/FRAME:016864/0362;SIGNING DATES FROM 20050728 TO 20050801
|Apr 8, 2008||CC||Certificate of correction|
|Oct 6, 2008||AS||Assignment|
Owner name: VIRAGE LOGIC CORPORATION,CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:IMPINJ, INC.;REEL/FRAME:021637/0351
Effective date: 20080625
|Oct 8, 2010||AS||Assignment|
Owner name: SYNOPSYS, INC., CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:VIRAGE LOGIC CORPORATION;VL C.V.;ARC CORES LIMITED;AND OTHERS;REEL/FRAME:025105/0907
Effective date: 20100902
|Feb 14, 2011||FPAY||Fee payment|
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|Dec 9, 2014||FPAY||Fee payment|
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