US20070085721A1 - Signal converters with multiple gate devices - Google Patents
Signal converters with multiple gate devices Download PDFInfo
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- US20070085721A1 US20070085721A1 US11/250,993 US25099305A US2007085721A1 US 20070085721 A1 US20070085721 A1 US 20070085721A1 US 25099305 A US25099305 A US 25099305A US 2007085721 A1 US2007085721 A1 US 2007085721A1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
- H03M1/00—Analogue/digital conversion; Digital/analogue conversion
- H03M1/12—Analogue/digital converters
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
- H03M1/00—Analogue/digital conversion; Digital/analogue conversion
- H03M1/12—Analogue/digital converters
- H03M1/34—Analogue value compared with reference values
- H03M1/36—Analogue value compared with reference values simultaneously only, i.e. parallel type
- H03M1/361—Analogue value compared with reference values simultaneously only, i.e. parallel type having a separate comparator and reference value for each quantisation level, i.e. full flash converter type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/0886—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate including transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
- H01L27/1211—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI combined with field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
- H03M1/00—Analogue/digital conversion; Digital/analogue conversion
- H03M1/66—Digital/analogue converters
- H03M1/74—Simultaneous conversion
- H03M1/742—Simultaneous conversion using current sources as quantisation value generators
- H03M1/745—Simultaneous conversion using current sources as quantisation value generators with weighted currents
Definitions
- the present invention relates generally to signal converters, and more particularly to signal converters with multiple gate devices.
- signal converters such as analog to digital converters (ADCs) and digital to analog converters (DACs) have used resistor banks and comparators to convert an analog signal to a digital signal and vice versa.
- ADCs analog to digital converters
- DACs digital to analog converters
- resistor banks and comparators present several problems. For example, process variations or thermal effects may result in resistor banks that provide inaccurate voltage division. This is because it is difficult to fabricate high precision resistors in an integrated circuit. Thus, use of traditional resistor banks in signal converters may result in errors in signal conversion.
- each comparator may be implemented using approximately 15 transistors.
- a typical 32 level signal converter, such as an ADC, may then need approximately 480 transistors.
- FIG. 1 is an exemplary analog to digital converter having multiple gate devices, consistent with one embodiment of the invention
- FIG. 2 is a partial top view of an exemplary multiple gate device that may be used as part of the exemplary analog to digital converter of FIG. 1 ;
- FIG. 3 is a graph illustrating exemplary relationship between the threshold voltage of a multiple gate device and its channel length, consistent with one embodiment of the invention
- FIG. 4 is a graph illustrating exemplary relationship between the threshold voltage of a multiple gate device and its body width, consistent with one embodiment of the invention.
- FIG. 5 is an exemplary digital to analog converter having multiple gate devices, consistent with another embodiment of the invention.
- a signal converter may use multiple independent gate FETs (MIGFETs) with different threshold voltages to provide the conversion.
- MIGFETs may have different threshold voltages based preferably on body width and channel length to provide the number of different conversions required. This takes advantage of the relatively linear change in threshold voltage with body width change. Thus many different threshold voltages may be available by altering the body width by the corresponding amounts. This is similarly true for channel length change for MIGFETs.
- Threshold voltage may further be adjustable with the second independent gate of the MIGFETs. This may be useful for establishing an offset for the threshold voltages to be calibrated relative to an independently determined reference voltage.
- an analog to digital converter comprising a plurality of multiple independent gate field effect transistors (MIGFET) that provide a plurality of digital output signals.
- MIGFET multiple independent gate field effect transistors
- Each MIGFET of the plurality of MIGFETs may have a first gate for receiving an analog signal, a second gate for being biased, and a current electrode for providing a digital output signal from among the plurality of the digital output signals.
- Each MIGFET of the plurality of MIGFETs may have a combination of body width and channel length that is unique among the plurality of MIGFETs to result in a threshold voltage that is unique among the plurality of MIGFETs.
- Each MIGFET may have a second current electrode coupled to a ground terminal.
- an analog to digital converter comprising a plurality of FETs that provides a plurality of digital output signals.
- Each FET of the plurality FETs may have a first gate for receiving an analog signal and a current electrode for providing a digital output signal of a plurality of the digital output signals.
- Each FET of the plurality of FETs may have a threshold voltage that is unique among the plurality of FETs.
- a digital to analog converter comprising a plurality of FETs that provides an analog signal at a summing node.
- Each FET of the plurality of FETs may have a first gate for receiving a different digital signal from among a plurality of digital signals, and a current electrode coupled to the summing node.
- Each FET of the plurality of FETs may have a threshold voltage that is unique among the plurality of FETs.
- FIG. 1 is an exemplary analog to digital converter 10 having multiple gate devices, consistent with one embodiment of the invention.
- Analog to digital converter (ADC) 10 may be implemented using multiple gate devices 14 , 16 , 18 , and 20 , for example.
- ADC 10 may receive an analog signal 12 , which may then be sampled using a sample and hold circuit 13 . The sampled analog signal may then be fed to a first gate of each of multiple gate devices 14 , 16 , 18 , and 20 .
- a current electrode, the drain terminal, of each of the multiple gate devices 14 , 16 , 18 , and 20 may be connected via respective load elements 22 , 24 , 26 , and 28 to a voltage source (V dd ) 30 .
- V dd voltage source
- a second current electrode, the source terminal, of each of the multiple gate devices 14 , 16 , 18 , and 20 may be grounded.
- the source terminal of each of the multiple gate devices 14 , 16 , 18 , and 20 may be connected to V dd .
- a second gate of each of multiple gate devices 14 , 16 , 18 , and 20 may be connected to a programmable bias circuit 32 .
- Programmable bias circuit 32 may provide a selectable bias voltage or a set of selectable bias voltages to the multiple gate devices 14 , 16 , 18 , and 20 .
- each multiple gate device may have the same or a different bias voltage applied to its second gate.
- Each multiple gate device may provide an output, which in combination with the outputs V 0 36 , V 1 38 , V 2 40 . . . and V n 42 may represent a digital value corresponding to an analog input value.
- the output may be 16 digital signals corresponding to a particular sampled analog value.
- Digital signals need not be linear in relation to the analog input value.
- digital signals may be a logarithmic function, a non-linear function, or any other user-desirable function of the analog input value.
- the 16 digital signals may be further processed to generate a digital word corresponding to a particular sampled analog signal value.
- any appropriate number of multiple gate devices may be used. In operation, the sampled analog signal is used to bias each of the multiple gate devices 14 , 16 , 18 , and 20 .
- Multiple gate devices 14 , 16 , 18 , and 20 may be implemented using a multiple independent gate field effect transistor (MIGFET), FinFET, or any other suitable multiple gate transistor.
- Load elements 22 , 24 , 26 , and 28 may be implemented using a resistor, MIGFET, FinFET, or any other suitable transistor.
- Each of these transistors may be N-channel or P-channel. Further, each of these transistors may be planar or non-planar.
- the transistors corresponding to the load elements may have tunable impedances.
- the threshold voltage of these multiple gate devices determines which one of these will be turned on when a certain value of the sampled analog signal is applied.
- the output current increases for that particular multiple gate device. This would result in a first voltage output value corresponding to that multiple gate device, as the increased output current flows through the load element ( 22 , for example).
- the output current decreases substantially for that particular multiple gate device. This would result in a second voltage output value corresponding to that multiple gate device, as the decreased output current flows through the load element ( 22 , for example).
- a particular multiple gate device may be turned on when the input sampled analog signal value exceeds the threshold voltage of the particular multiple gate device. As shown in FIG.
- each of these multiple gate devices 14 , 16 , 18 , and 20 may have a different threshold voltage.
- the threshold voltage of each of these multiple gate devices may depend, among other things, on the channel length, the body width, and the gate bias of the second gate of the multiple gate device.
- FIG. 1 shows multiple gate devices 14 , 16 , 18 , and 20 as having two gates, they may have additional gates.
- FIG. 2 is a partial top view of an exemplary multiple gate device 14 that may be used as part of the exemplary analog to digital converter of FIG. 1 .
- Multiple gate device 14 may include a source 50 , a drain 52 , and a channel 54 . Additionally, multiple gate device 14 may include two gates: gate G 1 60 and gate G 2 62 .
- body width (BW) 56 and channel length (LG) 58 may be varied for each of the multiple gate devices 14 , 16 , 18 , and 20 .
- the body width and the channel length may be defined during the layout of the active area and gate area, respectively. Various combinations of the body width and the channel length may result in different voltage thresholds for a particular multiple gate device.
- FIG. 3 is a graph illustrating exemplary relationship between the threshold voltage of a multiple gate device and its channel length, consistent with one embodiment of the invention.
- threshold voltage (V t ) 70 may change as channel length (LG) 72 is changed.
- Exemplary lines ( 74 , 76 , and 78 ) represent the relationship between threshold voltage (V t ) 70 and channel length (LG) 72 , as bias voltage for the second gate (VG 2 ) of a multiple gate device is varied (VG 2 1 , VG 2 2 , and VG 2 3 80 ).
- the threshold voltage (V t ) 70 of a multiple gate device may be varied based on its channel length.
- channel length of a multiple gate device may be varied from 30 nano-meters to 100 nano-meters.
- multiple gate device 14 may have a first body width and a first channel length.
- Multiple gate device 16 may have a second body width and a second channel length.
- Multiple gate device 18 may have a third body width and a third channel length.
- Multiple gate device 20 may have a fourth body width and a fourth channel length.
- FIG. 4 is a graph illustrating exemplary relationship between the threshold voltage of a multiple gate device and its body width, consistent with one embodiment of the invention.
- threshold voltage (V t ) 70 may change as body width (BW) 82 is changed.
- Exemplary lines ( 84 , 86 , and 88 ) represent the relationship between threshold voltage (V t ) 70 and body width (BW) 82 , as bias voltage for the second gate (VG 2 ) of a multiple gate device is varied (VG 2 1 , VG 2 2 , and VG 2 3 90 ).
- the threshold voltage (V t ) 70 of a multiple gate device may be varied based on its body width.
- body width of a multiple gate device may be varied from 10 nano-meters to 100 nano-meters.
- simulation software such as MATLAB
- various combinations of channel length, body width, and bias voltage may be tested to select the right combination of these values for each of the multiple gate devices 14 , 16 , 18 , and 20 .
- any other suitable tool may also be used for this purpose.
- FIG. 5 is an exemplary digital to analog converter having multiple gate devices, consistent with another embodiment of the invention.
- Digital to analog converter (DAC) 92 may be implemented using multiple gate devices 102 , 103 , 104 , and 106 .
- DAC 92 may receive digital signals D 0 94 , D 1 96 , D 2 98 , and D n 100 and may convert these digital signals into an analog voltage V o 91 .
- Each of received digital signals D 0 94 , D 1 96 , D 2 98 , and D n 100 may make the respective multiple gate device conductive.
- An electrode, for example the source, of each of the multiple gate devices 102 , 103 , 104 , and 106 may be coupled to a programmable bias circuit 1 112 .
- Each conductive multiple gate device may generate a current at a summing node 116 , which may then be coupled to a first input of a current to voltage converter, which may include an operational amplifier 108 and a feedback element 110 .
- a current to voltage converter which may include an operational amplifier 108 and a feedback element 110 .
- any suitable components may be used to implement the current to voltage converter.
- FIG. 5 shows multiple gate devices 102 , 103 , 104 , and 106 as having two gates, they may have additional gates.
- each of multiple gate devices 102 , 103 , 104 , and 106 may be implemented using a resistor, a multiple independent gate field effect transistor (MIGFET), FinFET, or any other suitable multiple gate transistor.
- MIGFET multiple independent gate field effect transistor
- FinFET any other suitable multiple gate transistor.
- channel length, body width, and bias voltage for the second gate of the multiple gate devices may be varied.
- a programmable bias circuit 2 114 may provide a programmable bias voltage to the second gate of each of the multiple gate devices.
- the programmable bias voltage may be different or the same for each of the multiple gate devices.
- the threshold voltage for a particular multiple gate device varies with its channel length, body width, and bias voltage. The on-current changes in accordance with the change in the threshold voltage.
- a change in the channel length, the body width, and/or the bias voltage of a multiple gate device changes the current the multiple gate device would supply to the current to voltage converter.
- the current supplied to the current to voltage converter can be set, such that it generates an analog voltage representing a particular digital word.
- appropriately calibrated simulation software such as MATLAB
- various combinations of channel length, body width, and bias voltage may be tested to select the right combination of these values for each of the multiple gate devices 102 , 103 , 104 , and 106 .
- any other suitable tool may also be used for this purpose.
- the output analog voltage need not be linear in relation to the input digital signals.
- the output analog voltage may be a logarithmic function, a non-linear function, or any other user-desirable function of the input digital signals.
Abstract
Description
- A related, copending application is entitled “Method and Circuit for Multiplying Signals With a Transistor Having More Than One Independent Gate Structure,” by Yang Du et al., application Ser. No. 10/728,621, assigned to Freescale Semiconductor, Inc., and was filed on Dec. 5, 2003.
- A related, copending application is entitled “Fully Programmable Phase Locked Loop,” by Hector Sanchez et al., application Ser. No. 11/069,664, assigned to Freescale Semiconductor, Inc., and was filed on Mar. 1, 2005.
- A related application is entitled “Voltage Controlled Oscillator with a Multiple Gate Transistor and Method Therefor,” by Sriram Kalpat et al., Attorney Docket No. SC14354TP, assigned to Freescale Semiconductor, Inc. and filed simultaneously herewith.
- A related application is entitled “Voltage Controlled Oscillator Having Digitally Controlled Phase Adjustment and Method Therefor,” by Hector Sanchez et al., Attorney Docket No. SC14378TC, assigned to Freescale Semiconductor, Inc. and filed simultaneously herewith.
- The present invention relates generally to signal converters, and more particularly to signal converters with multiple gate devices.
- Traditionally, signal converters, such as analog to digital converters (ADCs) and digital to analog converters (DACs) have used resistor banks and comparators to convert an analog signal to a digital signal and vice versa. The use of resistor banks and comparators in such signal converters presents several problems. For example, process variations or thermal effects may result in resistor banks that provide inaccurate voltage division. This is because it is difficult to fabricate high precision resistors in an integrated circuit. Thus, use of traditional resistor banks in signal converters may result in errors in signal conversion.
- Furthermore, use of comparators raises the implementation complexity of signal converter circuits. In particular, each comparator may be implemented using approximately 15 transistors. A typical 32 level signal converter, such as an ADC, may then need approximately 480 transistors. Thus, there is a need for signal converters that result in lower errors during signal conversion and are less complex.
- The present invention is illustrated by way of example and not limited by the accompanying figures, in which like references indicate similar elements, and in which:
-
FIG. 1 is an exemplary analog to digital converter having multiple gate devices, consistent with one embodiment of the invention; -
FIG. 2 is a partial top view of an exemplary multiple gate device that may be used as part of the exemplary analog to digital converter ofFIG. 1 ; -
FIG. 3 is a graph illustrating exemplary relationship between the threshold voltage of a multiple gate device and its channel length, consistent with one embodiment of the invention; -
FIG. 4 is a graph illustrating exemplary relationship between the threshold voltage of a multiple gate device and its body width, consistent with one embodiment of the invention; and -
FIG. 5 is an exemplary digital to analog converter having multiple gate devices, consistent with another embodiment of the invention. - Skilled artisans appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve the understanding of the embodiments of the present invention.
- A signal converter, whether analog to digital or digital to analog, may use multiple independent gate FETs (MIGFETs) with different threshold voltages to provide the conversion. The MIGFETs may have different threshold voltages based preferably on body width and channel length to provide the number of different conversions required. This takes advantage of the relatively linear change in threshold voltage with body width change. Thus many different threshold voltages may be available by altering the body width by the corresponding amounts. This is similarly true for channel length change for MIGFETs. The combination of body width and channel length may make for a large number of different threshold voltages. Threshold voltage may further be adjustable with the second independent gate of the MIGFETs. This may be useful for establishing an offset for the threshold voltages to be calibrated relative to an independently determined reference voltage.
- In one aspect, an analog to digital converter comprising a plurality of multiple independent gate field effect transistors (MIGFET) that provide a plurality of digital output signals, is provided. Each MIGFET of the plurality of MIGFETs may have a first gate for receiving an analog signal, a second gate for being biased, and a current electrode for providing a digital output signal from among the plurality of the digital output signals. Each MIGFET of the plurality of MIGFETs may have a combination of body width and channel length that is unique among the plurality of MIGFETs to result in a threshold voltage that is unique among the plurality of MIGFETs. Each MIGFET may have a second current electrode coupled to a ground terminal.
- In another aspect, an analog to digital converter comprising a plurality of FETs that provides a plurality of digital output signals, is provided. Each FET of the plurality FETs may have a first gate for receiving an analog signal and a current electrode for providing a digital output signal of a plurality of the digital output signals. Each FET of the plurality of FETs may have a threshold voltage that is unique among the plurality of FETs.
- In yet another aspect, a digital to analog converter comprising a plurality of FETs that provides an analog signal at a summing node is provided. Each FET of the plurality of FETs may have a first gate for receiving a different digital signal from among a plurality of digital signals, and a current electrode coupled to the summing node. Each FET of the plurality of FETs may have a threshold voltage that is unique among the plurality of FETs.
-
FIG. 1 is an exemplary analog todigital converter 10 having multiple gate devices, consistent with one embodiment of the invention. Analog to digital converter (ADC) 10 may be implemented usingmultiple gate devices analog signal 12, which may then be sampled using a sample and holdcircuit 13. The sampled analog signal may then be fed to a first gate of each ofmultiple gate devices multiple gate devices respective load elements multiple gate devices multiple gate devices multiple gate devices programmable bias circuit 32.Programmable bias circuit 32 may provide a selectable bias voltage or a set of selectable bias voltages to themultiple gate devices outputs V 0 36,V 1 38,V 2 40 . . . andV n 42 may represent a digital value corresponding to an analog input value. Thus, for example, if sixteen multiple gate devices are used inFIG. 1 , then the output may be 16 digital signals corresponding to a particular sampled analog value. - Digital signals need not be linear in relation to the analog input value. By way of example, digital signals may be a logarithmic function, a non-linear function, or any other user-desirable function of the analog input value. Although not shown in
FIG. 1 , the 16 digital signals may be further processed to generate a digital word corresponding to a particular sampled analog signal value. Depending upon the granularity of the quantization value needed, any appropriate number of multiple gate devices may be used. In operation, the sampled analog signal is used to bias each of themultiple gate devices -
Multiple gate devices Load elements - The threshold voltage of these multiple gate devices determines which one of these will be turned on when a certain value of the sampled analog signal is applied. In general, when a particular multiple gate device is turned on, the output current increases for that particular multiple gate device. This would result in a first voltage output value corresponding to that multiple gate device, as the increased output current flows through the load element (22, for example). In contrast, when a particular multiple gate device is turned off, the output current decreases substantially for that particular multiple gate device. This would result in a second voltage output value corresponding to that multiple gate device, as the decreased output current flows through the load element (22, for example). A particular multiple gate device may be turned on when the input sampled analog signal value exceeds the threshold voltage of the particular multiple gate device. As shown in
FIG. 1 , each of thesemultiple gate devices FIG. 1 showsmultiple gate devices -
FIG. 2 is a partial top view of an exemplarymultiple gate device 14 that may be used as part of the exemplary analog to digital converter ofFIG. 1 .Multiple gate device 14 may include asource 50, adrain 52, and achannel 54. Additionally,multiple gate device 14 may include two gates:gate G1 60 andgate G2 62. By using suitable semiconductor processing and design techniques, body width (BW) 56 and channel length (LG) 58 may be varied for each of themultiple gate devices -
FIG. 3 is a graph illustrating exemplary relationship between the threshold voltage of a multiple gate device and its channel length, consistent with one embodiment of the invention. By way of example, as shown inFIG. 3 , threshold voltage (Vt) 70 may change as channel length (LG) 72 is changed. Exemplary lines (74, 76, and 78) represent the relationship between threshold voltage (Vt) 70 and channel length (LG) 72, as bias voltage for the second gate (VG2) of a multiple gate device is varied (VG2 1, VG2 2, and VG2 3 80). Thus, the threshold voltage (Vt) 70 of a multiple gate device may be varied based on its channel length. By way of example, channel length of a multiple gate device (14, for example) may be varied from 30 nano-meters to 100 nano-meters. Referring back toFIG. 1 , in one embodiment of analog todigital converter 10,multiple gate device 14 may have a first body width and a first channel length.Multiple gate device 16 may have a second body width and a second channel length.Multiple gate device 18 may have a third body width and a third channel length.Multiple gate device 20 may have a fourth body width and a fourth channel length. -
FIG. 4 is a graph illustrating exemplary relationship between the threshold voltage of a multiple gate device and its body width, consistent with one embodiment of the invention. By way of example, as shown inFIG. 4 , threshold voltage (Vt) 70 may change as body width (BW) 82 is changed. Exemplary lines (84, 86, and 88) represent the relationship between threshold voltage (Vt) 70 and body width (BW) 82, as bias voltage for the second gate (VG2) of a multiple gate device is varied (VG2 1, VG2 2, and VG2 3 90). Thus, the threshold voltage (Vt) 70 of a multiple gate device may be varied based on its body width. By way of example, body width of a multiple gate device (14, for example) may be varied from 10 nano-meters to 100 nano-meters. By using appropriately calibrated simulation software, such as MATLAB, various combinations of channel length, body width, and bias voltage may be tested to select the right combination of these values for each of themultiple gate devices -
FIG. 5 is an exemplary digital to analog converter having multiple gate devices, consistent with another embodiment of the invention. Digital to analog converter (DAC) 92 may be implemented usingmultiple gate devices DAC 92 may receive digital signals D0 94, D1 96,D 2 98, andD n 100 and may convert these digital signals into ananalog voltage V o 91. Each of received digital signals D0 94, D1 96,D 2 98, andD n 100 may make the respective multiple gate device conductive. An electrode, for example the source, of each of themultiple gate devices programmable bias circuit 1 112. Each conductive multiple gate device may generate a current at a summingnode 116, which may then be coupled to a first input of a current to voltage converter, which may include anoperational amplifier 108 and afeedback element 110. Indeed, any suitable components may be used to implement the current to voltage converter. AlthoughFIG. 5 showsmultiple gate devices multiple gate devices FIGS. 2, 3 , and 4, channel length, body width, and bias voltage for the second gate of the multiple gate devices may be varied. - Referring again to
FIG. 5 , aprogrammable bias circuit 2 114 may provide a programmable bias voltage to the second gate of each of the multiple gate devices. The programmable bias voltage may be different or the same for each of the multiple gate devices. As further explained above with reference toFIGS. 3 and 4 , the threshold voltage for a particular multiple gate device varies with its channel length, body width, and bias voltage. The on-current changes in accordance with the change in the threshold voltage. Thus, a change in the channel length, the body width, and/or the bias voltage of a multiple gate device, changes the current the multiple gate device would supply to the current to voltage converter. By selecting appropriate values of the channel length, the body width, and/or the bias voltage of the multiple gate devices, the current supplied to the current to voltage converter can be set, such that it generates an analog voltage representing a particular digital word. By using appropriately calibrated simulation software, such as MATLAB, various combinations of channel length, body width, and bias voltage may be tested to select the right combination of these values for each of themultiple gate devices - Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments. However, the benefits, advantages, solutions to problems, and any element(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential feature or element of any or all the claims. As used herein, the terms “comprises,” “comprising,” or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Claims (20)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
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US11/250,993 US7215268B1 (en) | 2005-10-14 | 2005-10-14 | Signal converters with multiple gate devices |
JP2008535774A JP2009512358A (en) | 2005-10-14 | 2006-10-13 | Signal converter with multi-gate device |
PCT/US2006/040388 WO2007047589A1 (en) | 2005-10-14 | 2006-10-13 | Signal converters with multiple gate devices |
CN2006800382654A CN101288231B (en) | 2005-10-14 | 2006-10-13 | Signal converters with multiple gate devices |
KR1020087008695A KR101221348B1 (en) | 2005-10-14 | 2006-10-13 | Signal converters with multiple gate devices |
EP06826033A EP1938456A4 (en) | 2005-10-14 | 2006-10-13 | Signal converters with multiple gate devices |
TW095137849A TW200721696A (en) | 2005-10-14 | 2006-10-14 | Signal converters with multiple gate devices |
Applications Claiming Priority (1)
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US11/250,993 US7215268B1 (en) | 2005-10-14 | 2005-10-14 | Signal converters with multiple gate devices |
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US (1) | US7215268B1 (en) |
EP (1) | EP1938456A4 (en) |
JP (1) | JP2009512358A (en) |
KR (1) | KR101221348B1 (en) |
CN (1) | CN101288231B (en) |
TW (1) | TW200721696A (en) |
WO (1) | WO2007047589A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2568108A (en) * | 2017-11-07 | 2019-05-08 | Analog Devices Global | Current steering digital to analog converter |
Families Citing this family (4)
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US7307467B2 (en) * | 2006-04-28 | 2007-12-11 | International Business Machines Corporation | Structure and method for implementing oxide leakage based voltage divider network for integrated circuit devices |
JP4777710B2 (en) * | 2005-07-22 | 2011-09-21 | 富士通セミコンダクター株式会社 | Analog / digital converter |
US7579897B2 (en) * | 2006-04-28 | 2009-08-25 | International Business Machines Corporation | Design structure for implementing oxide leakage based voltage divider network for integrated circuit devices |
AU2010339481B2 (en) | 2009-12-30 | 2016-02-04 | Pioneer Hi-Bred International, Inc. | Methods and compositions for targeted polynucleotide modification |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4872010A (en) * | 1988-02-08 | 1989-10-03 | Hughes Aircraft Company | Analog-to-digital converter made with focused ion beam technology |
US5144170A (en) * | 1991-06-28 | 1992-09-01 | Motorola, Inc. | Circuit and method of aligning clock signals |
US5463353A (en) * | 1994-09-06 | 1995-10-31 | Motorola, Inc. | Resistorless VCO including current source and sink controlling a current controlled oscillator |
US5675341A (en) * | 1995-06-02 | 1997-10-07 | Lucent Technologies Inc. | Current-mode parallel analog-to-digital converter |
US5936433A (en) * | 1998-01-23 | 1999-08-10 | National Semiconductor Corporation | Comparator including a transconducting inverter biased to operate in subthreshold |
US6222395B1 (en) * | 1999-01-04 | 2001-04-24 | International Business Machines Corporation | Single-ended semiconductor receiver with built in threshold voltage difference |
US6462527B1 (en) * | 2001-01-26 | 2002-10-08 | True Circuits, Inc. | Programmable current mirror |
US6677569B2 (en) * | 2001-10-12 | 2004-01-13 | Massachusetts Institute Of Technology | Methods and apparatus for performing signal processing functions in an electronic imager |
US6720812B2 (en) * | 1995-06-02 | 2004-04-13 | Nova R&D, Inc. | Multi-channel integrated circuit |
US6842136B1 (en) * | 2003-11-28 | 2005-01-11 | Texas Instruments Incorporated | Low-jitter clock distribution circuit |
US6972702B1 (en) * | 2004-06-15 | 2005-12-06 | Hrl Laboratories, Llc | 1-Of-N A/D converter |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5252356A (en) * | 1975-10-24 | 1977-04-27 | Mitsubishi Electric Corp | A-d converter |
JP2854204B2 (en) * | 1991-11-07 | 1999-02-03 | 川崎製鉄株式会社 | A / D converter |
US5376935A (en) * | 1993-03-30 | 1994-12-27 | Intel Corporation | Digital-to-analog and analog-to-digital converters using electrically programmable floating gate transistors |
AU2003239887A1 (en) * | 2003-05-27 | 2005-01-21 | Georgia Tech Research Corporation | Floating-gate reference circuit |
-
2005
- 2005-10-14 US US11/250,993 patent/US7215268B1/en active Active
-
2006
- 2006-10-13 EP EP06826033A patent/EP1938456A4/en not_active Withdrawn
- 2006-10-13 WO PCT/US2006/040388 patent/WO2007047589A1/en active Application Filing
- 2006-10-13 KR KR1020087008695A patent/KR101221348B1/en active IP Right Grant
- 2006-10-13 JP JP2008535774A patent/JP2009512358A/en active Pending
- 2006-10-13 CN CN2006800382654A patent/CN101288231B/en active Active
- 2006-10-14 TW TW095137849A patent/TW200721696A/en unknown
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4872010A (en) * | 1988-02-08 | 1989-10-03 | Hughes Aircraft Company | Analog-to-digital converter made with focused ion beam technology |
US5144170A (en) * | 1991-06-28 | 1992-09-01 | Motorola, Inc. | Circuit and method of aligning clock signals |
US5463353A (en) * | 1994-09-06 | 1995-10-31 | Motorola, Inc. | Resistorless VCO including current source and sink controlling a current controlled oscillator |
US5675341A (en) * | 1995-06-02 | 1997-10-07 | Lucent Technologies Inc. | Current-mode parallel analog-to-digital converter |
US6720812B2 (en) * | 1995-06-02 | 2004-04-13 | Nova R&D, Inc. | Multi-channel integrated circuit |
US5936433A (en) * | 1998-01-23 | 1999-08-10 | National Semiconductor Corporation | Comparator including a transconducting inverter biased to operate in subthreshold |
US6222395B1 (en) * | 1999-01-04 | 2001-04-24 | International Business Machines Corporation | Single-ended semiconductor receiver with built in threshold voltage difference |
US6462527B1 (en) * | 2001-01-26 | 2002-10-08 | True Circuits, Inc. | Programmable current mirror |
US6677569B2 (en) * | 2001-10-12 | 2004-01-13 | Massachusetts Institute Of Technology | Methods and apparatus for performing signal processing functions in an electronic imager |
US6842136B1 (en) * | 2003-11-28 | 2005-01-11 | Texas Instruments Incorporated | Low-jitter clock distribution circuit |
US6972702B1 (en) * | 2004-06-15 | 2005-12-06 | Hrl Laboratories, Llc | 1-Of-N A/D converter |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2568108A (en) * | 2017-11-07 | 2019-05-08 | Analog Devices Global | Current steering digital to analog converter |
US10615817B2 (en) | 2017-11-07 | 2020-04-07 | Analog Devices Global Unlimited Company | Current steering digital to analog converter |
GB2568108B (en) * | 2017-11-07 | 2021-06-30 | Analog Devices Global | Current steering digital to analog converter |
Also Published As
Publication number | Publication date |
---|---|
CN101288231A (en) | 2008-10-15 |
JP2009512358A (en) | 2009-03-19 |
KR101221348B1 (en) | 2013-01-11 |
EP1938456A1 (en) | 2008-07-02 |
CN101288231B (en) | 2011-05-04 |
KR20080058377A (en) | 2008-06-25 |
WO2007047589A1 (en) | 2007-04-26 |
US7215268B1 (en) | 2007-05-08 |
TW200721696A (en) | 2007-06-01 |
EP1938456A4 (en) | 2011-05-04 |
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