US 20070114649 A1
The present invention provides a system and method that mounts integrated circuit devices onto substrates and a system and method for employing the method is stacked modules. The contact pads of a packaged integrated circuit device are substantially exposed. A solder past that includes higher temperature solder paste alloy is applied to a substrate or to the integrated circuit device to be mounted. The integrated circuit device is positioned to contact the contacts of the substrate. Heat is applied to create high temperature joints between the contacts of the substrate and the integrated circuit device resulting in a device-substrate assembly with high temperature joints. The formed joints are less subject to re-melting in subsequent processing steps. The method may be employed in devising stacked module constructions such as those disclosed herein as preferred embodiments in accordance with the invention. Typically, the created joints are low in profile.
1. A high temperature joint in a stacked circuit module in which a first integrated circuit element is disposed above a second integrated circuit element, the high temperature joint comprising:
an alloy comprised of lead and antimony having the proportion of no more that 95% tin and at least 5% antimony, the alloy having a melting point between 235° C. to 260° C.
2. A high temperature joint in a stacked circuit module in which a first integrated circuit element is disposed above a second integrated circuit element, the high temperature joint comprising:
an alloy comprised of lead and tin, the alloy having a melting point between 275° C. 312° C.
3. A high temperature joint in a stacked circuit module in which a first integrated circuit element is disposed above a second integrated circuit element, the high temperature joint comprising:
an alloy comprised of lead, the alloy having a melting point of between 235° C. and 312° C.
The present application is a division of application Ser. No. 11/011,469, filed Dec. 14, 2004, pending, which is a division of application Ser. No. 10/457,608, filed Jun. 9, 2003, which is a continuation-in-part of U.S. patent application Ser. No. 10/005,581, filed Oct. 26, 2001, all of which are hereby incorporated by reference.
The present invention related to mounting integrated circuit devices on substrates and to mounting integrated circuits on substrates employed in stacked modules.
A variety of methods are used to mount integrated circuit devices to substrates such as PWBs and flex circuitry. Solder paste is selectively applied to the integrated circuit device or substrate to which the IC is to be attached. The device and substrate are exposed to reflow temperatures of approximately 220° C. The device is, consequently, soldered to the substrate.
Typically, however, the formed solder joints will re-melt during subsequent processing. Common tin-lead solders start to melt as 183° C. and, when exposed to such temperatures and higher, the exposed joint may re-melt and become unreliable.
What is needed, therefore, is a technique and system for mounting integrated circuit devices on substrates that provide an efficient and readily implemented technique to create structures that reliably withstand subsequent exposure to typical tin-lead solder melting point temperatures.
The present invention provides a system and method that mounts integrated circuit devices onto substrates and a system and method for employing the method in stacked modules. The contact pads of a packaged integrated circuit device are substantially exposed. A solder past that includes higher temperature solder paste alloy is applied to a substrate or the contacts of the packaged device. The integrated circuit device is positioned to contact the contacts of the substrate with the higher temperature solder alloy paste between. Heat is applied to create high temperature joints between the contacts of the substrate and the integrated circuit device resulting in a device-substrate assembly with high temperature joints. The formed joints are less subject to re-melting in subsequent processing steps. The method may be employed in devising stacked module constructions such as those disclosed herein as preferred embodiments in accordance with the invention. Typically, the created joints are low in profile. In a method in accordance with the present invention, a first solder used to construct a stacked module has a higher melting point than a second solder used to populate a board with that module.
Exemplar integrated circuit device 10 may include one or more integrated circuit die and body 12 and a set of contacts 14. The illustrated integrated circuit device 10 has CSP ball contacts 14 arrayed along surface 13 of its body 12. Typically, when integrated circuit device 10 is a CSP device, CSP ball contacts 14 are, as depicted, balls that are a mixture of tin and lead with common relative composition of 63% tin and 37% lead. Such contacts typically have a melting point of about 183° C. Other contacts are sometimes found along a planar surface of integrated circuit devices and such other contacts may also be treated in accordance with the present invention where the opportunity may also be treated in accordance with the present invention where the opportunity arises as will be understood after gaining familiarity with the present disclosure.
In the depiction of
Two or more of the elements lead, tin, silver, copper, antimony, or indium may be employed in a variety of combinations to devise a solder to be employed in solder paste 22 in accordance with the present invention. Therefore, in accordance with preferred embodiments of the present invention, a solder alloy employed in solder paste 22 exhibits a melting point equal to or greater than 235° C. and, preferably between 235° C. and 312° C. The alloy chosen should not have a melting point so high that the IC package is adversely affected, but it should also not be so low as to remelt during board assembly operations.
Some market participants are starting to implement lead-free solders. Such lead-free solders will typically have melting points higher than those found in lead inclusive solders. Typically, those who use lead-free solders to populate boards with stacked modules will, for example, employ temperatures up to 240° C. in the process of attachment of stacked modules to boards. Consequently, a HT joint implemented with a lead-free alloy will, in conformity with preferred embodiments of the present invention, exhibit a melting point greater than those lead-free solders used to populate boards. Consequently, a preferred implementation of the HT joints of the present invention will have a melting point range of between 245° C. and 265° C. The lead-free solder alloy employed in such HT joints will be comprised of at least two of the following elements: tin, silver, copper, or indium.
Preferably , an alloy used as a solder in the present invention will melt over a narrow temperature range. Disintegration of the module during board attachment or population will be less likely if the melt range is narrow. Most preferably, the top of the melting point range of the solder used in board attachment should be exceeded by 15° C. by the melting point of the solder used to manufacture the stacked module although in the case of lead-free solder, this is reduced to ameliorate issues that could arise from exposure of the package to high temperatures.
The following combinations have been found to exhibit the following melting points, and the below recited combinations are merely a representative, but not exhaustive, list of examples of solder alloys appropriate for use in the present invention. As those of skill will recognize, these examples are instructive in selecting other preferred particular combinations of lead, tin, silver copper, antimony, and indium that are readily employed to advantage in the present invention so as to arrive at alloys of at least two of the following solder elements: lead, tin, silver, copper, antimony, and indium that have in their combined mixture, a preferred melting point between 235° C. to 312° C. inclusive.
Those of skill will note that solder alloys or mixtures may also be employed in embodiments of the present invention that exhibit melting points lower than 235° C., as would be exhibited for example with a 97% Sn and a 3% Sb alloy, but preferred embodiments will employ solder mixtures or alloys that melt between 235° C. and 312° C. inclusive.
As depicted in
High temperature joints contacts 38 (“HT joints”) are formed by the melting of the lead alloy in previously applied solder paste 22 and the application of a selected heat range appropriate for the solder mixtures identified previously. Thus, HT joints 38 will, after solidification, typically not re-melt unless exposed subsequently to such temperature ranges. The temperature range applied in this step of assembly will not typically be subsequently encountered in a later assembly operation such as, for example, the application of a stacked module to a DIMM board. Consequently, in one embodiment, the present invention is articulated as a stacked module having HT joints that is appended to a DIMM board with traditional lower melting point solder.
HT contacts 38 are employed in the preferred embodiment of
FIG 7 depicts module 60 as having lower integrated circuit element 52, upper IC element 54, 3rd IC element 58, and 4th IC element 62. When the present invention is employed between flex circuits in stacking multiple levels of CSPs, as for example in
As shown, the HT joints provide connections between integrated circuit devices and substrates and the overall profile of module 60 is reduced by use of the present invention that provides advantages in subsequent processing steps such as for example, affixation of module 60 to DIMM boards, for example.
To construct a stacked module in accordance with a preferred embodiment of the present invention, if present, ball contact 14 are removed from a CSP leaving CSP contacts 16 that typically exhibit a residual layer of solder. A high temperature solder paste composed from a lead alloy or mixture that has a preferable melting point equal to or higher that 235° C. and preferably less than 312° C. is applied to substrate contacts 20 of a substrate such as a flexible circuit and/or the substrate contacts to which it is to be mounted. The CSP is positioned to place the CSP pads 16 and substrate contacts 22 in appropriate proximity. Heat is applied sufficient to melt the lead solder alloy of solder paste 22 thus forming HT joints 38. The flexible circuit is positioned to place portions of the flexible circuit connector between the first CSP and a second CSP that is connected to the substrate with HT joints created using the process described for creating HT joints.
In understanding the present invention, it may be helpful to articulate the relative melting points in terms of variables to illustrate the relationships between the HT joints used to construct a stacked module and the solders used to populate a board with such HT joint-implemented stacked module. In use in board population, the present invention will provide a stacked high module that is assembled using the HT joints that exhibit melting point ranges between X and Y degrees where X is less that Y. Attachment of the stacked module to a board is then implemented with a solder having a melting point between A and B degrees where A and B are less that X.
Although the present invention has been described in detail, it will be apparent to those skilled in the art that the invention may be embodied in a variety of specific forms and that various changes, substitutions and alterations can be made without departing from the spirit and scope of the invention. The described embodiments are only illustrative and not restrictive and the scope of the invention is, therefore, indicated by the following claims.