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Publication numberUS20070163270 A1
Publication typeApplication
Application numberUS 11/622,956
Publication dateJul 19, 2007
Filing dateJan 12, 2007
Priority dateJan 17, 2006
Publication number11622956, 622956, US 2007/0163270 A1, US 2007/163270 A1, US 20070163270 A1, US 20070163270A1, US 2007163270 A1, US 2007163270A1, US-A1-20070163270, US-A1-2007163270, US2007/0163270A1, US2007/163270A1, US20070163270 A1, US20070163270A1, US2007163270 A1, US2007163270A1
InventorsYi-Shen CHIEN, I-Ta HSU
Original AssigneeCooler Master Co., Ltd
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Liquid cooling system with thermoeletric cooling module
US 20070163270 A1
Abstract
A liquid cooling system has a thermoelectric cooling module, a heat dissipating assembly, a water block and multiple flexible guide tubes with liquid flows inside. The thermoelectric cooling module has a cold surface and a hot surface. The water block has a contacting surface attached to a processor of a computer. The guide tubes are mounted between the thermoelectric cooling module, the heat dissipating assembly and the water block. With the thermoelectric cooling module, the liquid cooling system can cool a processor of computer hardware with high efficiency, and is able to dissipate extraordinary heat generated by the processor.
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Claims(17)
1. A liquid cooling system comprising
a cooling module having a cold surface, a hot surface, and two electrical wires;
a cold plate being a hollow plate, wherein the cold plate has two joint pipes communicated with two opposite sides thereof, and a cold exchanging surface attached to the cold surface of the cooling module;
a hot plate being a hollow plate, wherein the hot plate has two joint pipes communicated with two opposite sides thereof, and a hot exchanging surface attached to the hot surface of the cooling module;
a pressure increasing device having two tubes for increasing pressure for fluid inside the tubes;
a water block having
a receiving space formed therein; and
two joint heads and a contacting surface respectively disposed on an outside portion thereof; and
a heat dissipating assembly allowing to dissipate heat of the fluid flowing inside the heat dissipating assembly to lower the temperature of the fluid;
wherein one of the tubes of the pressure increasing device connects with the joint pipe of the cold plate via a guide tube and the other joint pipe of the cold plate connects with the heat dissipating assembly via a guide tube;
wherein the other tube of the pressure increasing device connects with one joint head of the water block and the other joint head of the block connects with one joint pipe of the hot plate via a guide tube;
wherein the other joint pipe of the hot plate connects with the heat dissipating assembly via a guide tube.
2. The liquid cooling system as claimed in claim 1, wherein the heat dissipating assembly comprises
an outlet chamber and an inlet chamber being formed oppositely;
two tubes being respectively formed on the inlet chamber and the outlet chamber; and
a fin assembly having
a rear;
a plurality of plates being mounted securely between the outlet chamber and the inlet chamber in an interval and parallel to each other, each of the plurality of plate having a channel formed through the plate to communicate the outlet chamber and the inlet chamber; and
a plurality of fins being respectively mounted securely between the plates, each of the plurality of fin having a surface attached to the adjacent plates; and
a fan being mounted securely in the rear of the fin assembly.
3. The liquid cooling system as claimed in claim 1, wherein the guide tubes are made of rubber.
4. The liquid cooling system as claimed in claim 1, wherein the guide tubes are made of metallic,
5. A liquid cooling system comprising
a cooling module connecting having a cold surface, a hot surface, and two electrical wires;
a cold plate being a hollow plate, wherein the cold plate has two joint pipes communicated with two opposite sides thereof, and a cold exchanging surface attached to the cold surface of the cooling module;
a hot plate being a hollow plate, wherein the hot plate has two joint pipes communicated with two opposite sides thereof, and a hot exchanging surface attached to the hot surface of the cooling module;
a pressure increasing cooling device having a receiving space formed therein; and two joint heads and a contacting surface respectively disposed on an outside portion thereof allowing to increase pressure of fluid inside the tubes; and
a heat dissipating assembly allowing to dissipate heat of the fluid flowing inside the heat dissipating assembly to lower the temperature of the fluid;
wherein one of the tubes of the pressure increasing cooling device connects with the joint pipe of the cold plate via a guide tube and the other joint pipe of the cold plate connects with the heat dissipating assembly via a guide tube;
wherein the other tube of the pressure increasing cooling device connects with the heat dissipating assembly via a guide tube.
6. The liquid cooling system as claimed in claim 5, wherein the heat dissipating assembly comprises
an outlet chamber and an inlet chamber being formed oppositely;
two tubes being respectively formed on the inlet chamber and the outlet chamber; and
a fin assembly having
a rear;
a plurality of plates being mounted securely between the outlet chamber and the inlet chamber in an interval and parallel to each other, each of the plurality of plate having a channel formed through the plate to communicate the outlet chamber and the inlet chamber; and
a plurality of fins being respectively mounted securely between the plates, each of the plurality of fin having a surface attached to the adjacent plates; and
a fan being mounted securely in the rear of the fin assembly.
7. The liquid cooling system as claimed in claim 5, wherein the guide tubes are made of rubber.
8. The liquid cooling system as claimed in claim 5, wherein the guide tubes are made of metallic.
9. A liquid cooling system comprising
a cooling module having a cold surface and a hot surface;
a cold plate being a hollow plate, wherein the cold plate has a cold exchanging surface attached to the cold surface of the cooling module; and
a water block having
a receiving space formed therein; and
two joint heads and a contacting surface respectively disposed on an outside portion thereof; and
wherein one of the joint heads of the water block connects with one side of the cold plate via a guide tube and the other joint head of the water block connects with the other side of the cold plate via a guide tube.
10. The liquid cooling system as claimed in claim 12, wherein the guide tubes are made of rubber.
11. The liquid cooling system as claimed in claim 12, wherein the guide tubes arc made of metallic.
12. A liquid cooling system comprising
a cooling module having a cold surface and a hot surface;
a cold plate being a hollow plate, wherein the cold plate has a cold exchanging surface attached to the cold surface of the cooling module; and
a pressure increasing cooling device having a receiving space formed therein; and two joint heads and a contacting surface respectively disposed on an outside portion thereof allowing to increase pressure of fluid inside the tubes;
wherein one of the tubes of the pressure increasing cooling device connects with one side the cold plate via a guide tube and the other tube of the pressure increasing cooling device connects with the other side of the cold plate via a guide tube.
13. The liquid cooling system as claimed in claim 12, wherein the guide tubes are made of rubber.
14. The liquid cooling system as claimed in claim 12, wherein the guide tubes are made of metallic.
15. A liquid cooling system comprising
a thermoelectric cooling module having
a hot surface; and
a cold surface attached with a cold plate having
two joint pipes connecting to each other via at least one guide tube.
16. The liquid cooling system as claimed in claim 15, wherein the guide tubes are made of rubber.
17. The liquid cooling system as claimed in claim 15, wherein the guide tubes are made of metallic.
Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a cooling system, and more particularly to a liquid cooling system with thermoelectric cooling module that can cool a processor of a computer more efficiently, and dissipate much more of extraordinary heat generated by the processor

2. Description of Related Art

Since computer hardware is developed rapidly and provides high performance, as a result, there is a significant problem of computer processor overheating.

The most common solution for cooling a working computer processor is to use a heat dissipating fan or a heat dissipating fin assembly to take away heat generated by the computer processor. Mostly, the heat dissipating fan or heat dissipating fin assembly is mounted securely in a case of the computer hardware and has air or water as coolant to flow through and to absorb heat.

However, as the function of the computer hardware becomes more efficient, more heat is generated by the processor. Current solutions based on passive fan or fin assembly are only just able to cope with the heat generated by the conventional computer and may unable to dissipate extraordinary heat generated by the processor of the modern computer.

Furthermore, the components of the conventional heat dissipating fan or heat dissipating fin assembly are connected by rigid tubes, such that if the computer cases having electronic elements in different positions, the heat dissipating fan or heat dissipating fin assembly may be troublesome to mount in the cases.

To overcome the shortcomings, the present invention provides a liquid cooling system with thermoelectric cooling module to obviate or mitigate the aforementioned problems.

SUMMARY OF THE INVENTION

The main objective of the present invention is to provide a liquid cooling system with thermoelectric cooling module having larger cooling capability and is adjustable to fit computer cases having electronic element in difference positions.

To achieve the objective, the liquid cooling system in accordance with the present invention comprises a thermoelectric cooling, module, a heat dissipating assembly, a water block and multiple flexible guide tubes with liquid flows inside.

The thermoelectric cooling module has a cold surface and a hot surface to transfer heat from the cold surface to the hot surface.

The heat dissipating assembly has a tube and a tube to dissipate heat and has a fan to accelerate heat dissipation.

The water block has a contacting surface attached to a processor of a computer and has two connectors. One of the connectors is connecting to the tube of the heat dissipating assembly via guide tubes mounted through the hot surface. The other connector is connecting to the tube of the heat dissipating assembly via guide tubes mounted through the cold surface.

With such an arrangement, heat generated by the processor is quickly absorbed by the liquid. Then, the liquid takes heat away from the processor to the heat dissipating assembly for dissipation. Additionally, when the liquid pass through the hot surface, the liquid absorbs the heat of the hot surface transferred from the cold surface so as to reduce the temperature of the hot surface and to prevent the thermoelectric cooling module from burning.

With activity of the thermoelectric cooling module, the liquid cooling system in accordance with the present invention can cool a processor of computer hardware more high efficiently, and is able to dissipate much more of extraordinary heat generated by the processor.

Otherwise, because the guide tubes are flexible, the components of the liquid cooling system can be mounted in the case at will, such that the liquid cooling system in accordance with the present invention provides more convenience to use.

Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a first embodiment of a liquid cooling system with thermoelectric cooling module in accordance with the present invention;

FIG. 2 is a partially exploded perspective view of the liquid cooling system in FIG. 1;

FIG. 3 is a perspective view of a second embodiment of a liquid cooling system in accordance with the present invention; and

FIG. 4 is a perspective view of a third embodiment of a liquid cooling system in accordance with the present invention.

FIG. 5 is a perspective view of a fourth embodiment of a liquid cooling system in accordance with the present invention.

FIG. 6 is a perspective view of a fifth embodiment of a liquid cooling system in accordance with the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

With reference to FIGS. 1 to 6, the liquid cooling system with thermoelectric cooling module in accordance with present invention comprises a thermoelectric cooling module (10), a water block (50), a heat dissipating assembly (60), a pressure increasing device (40), a first guide tube (70 a), a second guide tube (70 b), a third guide tube (70 c), a fourth guide tube (70 d), a fifth guide tube (70 e), an optional sixth guide tube (70 f), an optional seventh guide tube (70 g), an optional eighth guide tube (70 h) and an optional pressure increasing cooling device (80).

The thermoelectric cooling module (10) has two electrical wires, a cold surface (11) and a hot surface (12) being respectively attached to a cold plate (20) and a hot plate (30) to transfer the heat from the cold surface (11) to the hot surface (12). The cold plate being a hollow plate, wherein the cold plate (20) has two joint pipes (21)(22) communicated with two opposite sides thereof, and a cold exchanging surface attached to the cold surface (11) of the cooling module (10). The hot plate (30) being a hollow plate, wherein the hot plate (30) has two joint pipes (31)(32) communicated with two opposite sides thereof, and a hot exchanging surface attached to the hot surface (12) of the cooling module (10).

The water block (50) has a receiving space formed therein, and a joint head (51), a joint head (52) and a contacting surface (53) respectively disposed on an outside portion thereof.

The heat dissipating assembly (60) allowing to dissipate heat of the fluid flowing inside the heat dissipating assembly to lower the temperature of the fluid and comprises an outlet chamber (63), an inlet chamber (64), a fin assembly (61) and a fan (62). Ache chambers (63)(64) are formed oppositely on two sides of the fin assembly (61). The inlet chamber (64) has a tube (640). The outlet chamber (63) has a tube (630). The fin assembly (61) has a rear, a plurality of plates (611) and a plurality of fins (610). The plates (611) are mounted securely between the outlet chamber (63) and the inlet chamber (64) in an interval and parallel to each other. Each plate (611) has a channel (612) formed through the plate (611) to communicate the outlet chamber (63) and the inlet chamber (64). The fins (610) are respectively mounted securely between the plates (611), each fin (610) has a surface attached to the adjacent plates (611). The fan (62) is mounted securely in the rear of the fin assembly (61) to generate airflow flowing through the fins (610) of the fin assembly (61) to accelerate heat dissipation.

The pressure increasing device (40) may be turbine or compressor, has two tubes (41)(42) for increasing pressure for fluid inside the tubes (41)(42) and pressurizing the liquid flow.

The guide tubes (70 a)(70 b)(70 c)(70 d)(70 e)(70 f)(70 g)(70 h) are flexible and may be made of rubber or metallic. The first guide tube (70 a) is mounted between the tube (630) of the outlet chamber (63) of the heat dissipating assembly (60) and the joint pipe (21) of the cold plate (20). The second guide tube (70 b) is mounted between the joint pipe (22) of the cold plate (20) and the tube (41) of the pressure increasing device (40). The third guide tube (70 c) is mounted between the tube (42) of the pressure increasing device (40) and the joint head (51) of the water block (50). The fourth guide tube (70 d) is mounted between the joint head (52) of the water block (50) and the joint pipe (31) of the hot plate (30). The fifth guide tube (70 e) is mounted between the joint pipe (32) of the hot plate (30) and the tube (640) of the heat dissipating assembly (60).

With liquid fill inside the liquid cooling system in accordance with the present invention, the pressure increasing device (40) can pressurize and make the liquid to recycle in the liquid cooling system.

With reference to FIG. 1 and 2, the cold liquid flows out from the tube (630) of the heat dissipating assembly (63), passes through the cold plate (20), is pressed by the pressure increasing device (40) and enters the water block (50). With the cold liquid passing through the cold plate (20), the liquid will be quickly cooled down by the cold surface (11) of the thermoelectric cooling module (10), such that the cold liquid can efficiently absorb the heat generated by a process attached to the water block (60). Then, the cool liquid flows into the tube (640) of the heat dissipating assembly (60) through the hot plate (30).

Such that, heat generated by the processor can be quickly absorbed and dissipated by the liquid cooled by the cold surface (11) of the thermoelectric cooling module (10) in the water block (50) with the contacting surface (53) attached to the processor.

Additionally, when the liquid pass through the hot plate (30), the liquid absorbs heat of the hot surface (12) transferred from the cold surface (11) so as to lower the temperature of the hot surface (12) to prevent the thermoelectric cooling module (10) from overheat. Finally, the liquid will be cooled when the liquid flows into the heat dissipating assembly (60) via the tube (640).

With further reference to FIG. 3, in the second embodiment, the fourth and fifth guide tubes (70 d)(70 e) and the hot plate (30) are replaced by the sixth guide tube (70 f). The sixth guide tube (70 f) is flexible, may be made of rubber or metallic and connects the joint head (52) of the water block (50) to the tube (640) of the heat dissipating assembly (60). Such that recycling of the liquid is faster and average temperature of the liquid may be lower.

With further reference to FIG. 4, in the third embodiment, the pressure increasing device (40) and the water block (50) aforementioned are integrated into a pressure increasing cooling device (80). The pressure increasing cooling device (80) pressurizes liquid flow and has two tubes (81,82) and a contacting surface (53) attached to a processor of a computer. Such that the second guide tube (70 b) connects the joint pipe (22) of the cold plate (20) to the tube (81). The sixth guide tube (70 f) connects the tube (82) to the tube (640) of the heat dissipating assembly (60). With such an arrangement, the liquid cooling system in accordance with the present invention is more compact.

With further reference to FIG. 5, in the fourth embodiment, the second guide tube (70 b) connects the joint pipe (22) of the cold plate (20) to the tube (81) of the pressure increasing cooling device (80). The seventh guide tube (70 g) connects the tube (82) to the joint pipe (21) of the cold plate (20). With such an arrangement, the liquid cooling system in accordance with the present invention is much more compact.

Otherwise, aforementioned pressure increasing cooling device (80) may be replace by said water block (50), such the second guide tube (70 b) connects the joint pipe (22) of the cold plate (20) to the joint head (51) of the water block (50). The seventh guide tube (70 g) connects the joint head (52) to the joint pipe (21) of the cold plate (20).

wherein one of the joint heads of the water block connects with one side the cold plate via a guide tube and the other joint head of the water block connects with the other side of the cold plate via a guide tube.

Furthermore, with reference to FIG. 6, in the fifth embodiment, the eighth guide tube (70 h) connects the joint pipe (22) to the joint pipe (21) of the cold plate (20). With such an arrangement, electronic component can directly mounted on the eighth guide tube (70 h) and dissipate heat via liquid recycling in the eighth guide tube (70 h).

To sum up, the liquid cooling system in accordance with the present invention may used to cool processors of computer hardware with high efficiency, and is able to dissipate much more extraordinary heat generated by the processor.

Otherwise, because the guide tubes (70 a)(70 b)(70 c)(70 d)(70 e)(70 f) are flexible, the components of the liquid cooling system can be mounted in the case at desire, such that the liquid cooling system in accordance with the present invention provides more convenience to use.

Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description together with details of the structure and function of the invention, the disclosure is illustrative only. Changes may be made in detail especially in matters of shape, size and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7669642Oct 22, 2008Mar 2, 2010Aisa Vital Components Co., Ltd.Thermal module
US8443613 *Aug 27, 2009May 21, 2013Thermotek, Inc.Vehicle air comfort system and method
US8650886 *Sep 12, 2008Feb 18, 2014Rockwell Collins, Inc.Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections
US8839633Apr 17, 2013Sep 23, 2014Thermotek, Inc.Vehicle air comfort system and method
US20100050659 *Aug 27, 2009Mar 4, 2010Tony QuisenberryVehicle air comfort system and method
US20100064695 *Sep 12, 2008Mar 18, 2010Wilcoxon Ross KFlexible flow channel for a modular liquid-cooled thermal spreader
US20100071384 *Mar 25, 2010B/E Aerospace, Inc.Refrigeration systems and methods for connection with a vehicle's liquid cooling system
US20110192572 *Feb 5, 2010Aug 11, 2011Ching-Hsien TsaiHeat exchanger
US20130255280 *Apr 3, 2012Oct 3, 2013Thomas John MurphyPortable water-generating and filtering apparatus
Classifications
U.S. Classification62/3.3, 62/3.2, 257/E23.098
International ClassificationF25B21/02
Cooperative ClassificationH01L2924/0002, F25B21/02, H01L23/473
European ClassificationF25B21/02, H01L23/473
Legal Events
DateCodeEventDescription
Jan 12, 2007ASAssignment
Owner name: COOLER MASTER CO., LTD., TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHIEN, YI-SHEN;HSU, I-TA;REEL/FRAME:018754/0782
Effective date: 20070112