US20070227769A1 - Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member - Google Patents
Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member Download PDFInfo
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- US20070227769A1 US20070227769A1 US11/760,919 US76091907A US2007227769A1 US 20070227769 A1 US20070227769 A1 US 20070227769A1 US 76091907 A US76091907 A US 76091907A US 2007227769 A1 US2007227769 A1 US 2007227769A1
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- United States
- Prior art keywords
- carrier
- interposer
- resilient wire
- retention member
- aperture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
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- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).
Description
- This patent application is a continuation application of U.S. patent application Ser. No. 11/297,307 (docket no. ROC920050235US1), filed Dec. 8, 2005, entitled “METHOD AND APPARATUS FOR ELECTRICALLY CONNECTING TWO SUBSTRATES USING A RESILIENT WIRE BUNDLE CAPTURED IN AN APERTURE OF AN INTERPOSER BY A RETENTION MEMBER”, which is hereby incorporated by reference.
- 1. Field of Invention
- The present invention relates in general to the electrical connector field. More particularly, the present invention relates to the assembly of electrical connectors incorporating an interposer having a resilient wire bundle that provides a conductive path between two substrates and that is captured within an aperture of the interposer by a retention member. The present invention also relates to apparatus involved in the assembly of such electrical connectors.
- 2. Background Art
- Electrical connectors are in widespread use in the electronics industry. In many computer and other electronic circuit structures, an electronic module such as a central processor unit (CPU), memory module, application-specific integrated circuit (ASIC) or other integrated circuit, must be connected to a printed circuit board (PCB). In connecting an electronic module to a PCB, a plurality of individual electrical contacts on the base of the electronic module must be connected to a plurality of corresponding individual electrical contacts on the PCB. This set of contacts on the PCB dedicated to contacting the electronic module contacts is known as a land grid array (LGA) site. Rather than permanently soldering the electronic module contacts to the LGA site, it is desirable to use LGA connectors that allow the electronic module to be installed to and removed from the LGA site. LGA connectors are also known as sockets, interconnects, interposers, carriers, and button board assemblies.
- LGA connectors provide the user with the flexibility to upgrade or replace electronic modules during the manufacturing cycle and in the field. A trend in the electronics industry has been to increase both the quantity LGA sites and the density of each LGA site, i.e., the number of contacts per unit area at the LGA site. Another trend in the electronics industry is to reduce the rated insertion force necessary to insert the electronic module into the LGA connector.
- One type of LGA connector that has proven to be very reliable incorporates resilient wire bundles. Electrical connectors having resilient wire bundles for providing conductive paths between two electronic substrates, i.e., an electronic module and a PCB, are well known to those skilled in the art. Such resilient wire bundles are also well known as wadded wire, fuzz buttons, button contacts, button wads, or contact wads, which are collectively referred to hereafter as resilient wire bundles.
- For example, U.S. Pat. No. 6,062,870 to Hopfer, III et al., the disclosure of which is incorporated by reference herein, discloses an electrical interconnect that incorporates resilient wire bundles that are retained in holes of a carrier by compressive frictional engagement with a central section of the side wall of each of the holes. In use, the carrier is placed between two circuit boards and the resilient wire bundles provide conductive paths between the two circuit boards.
- A well known problem with electrical connectors that incorporate resilient wire bundles is that one or more of the resilient wire bundles may be jarred loose and fall out from the interposer during transit or handling. If a resilient wire bundle is missing from the interposer, an open circuit will result when the interposer is used to connect two electronic substrates. In this case, the interposer that is missing the resilient wire bundle must be replaced for the two electronic substrates to be properly connected. Such opens occur notwithstanding the teachings of Hopfer, III et al. that the resilient wire bundles are force fitted into holes in the interposer. In a related problem, instead of being jarred completely out of the interposer, the resilient wire bundle is instead jarred partially loose from the interposer such that when the resilient wire bundle is compressed between the two electronic substrates, the resilient wire bundle bends over and makes contact with an adjacent resilient wire bundle or an adjacent contact on the electronic substrate. If a bent-over resilient wire bundle makes such an inadvertent contact, a short circuit will result. Such a short can catastrophically damage to one or both of the electronic substrates being interconnected. Accordingly, the interposer that contains the bent-over resilient wire bundle, and possibly also one or both of the electronic substrates being interconnected, would have to be replaced.
- These problems are recognized in U.S. Patent Application Publication No. 2004/0002233 A1 to Advocate, Jr. et al., the disclosure of which is incorporated by reference herein, which discloses a method of assembling an interconnect device assembly which consists of cylindrical resilient wire bundles captured with a carrier. The interconnect device assembly is placed in a fixture and the ends of the resilient wire bundles are deformed by shaping dies in the fixture so that the resilient wire bundles now have a dog bone shape. The dog bone shape of the resilient wire bundles prevents the resilient wire bundles from being partially or totally dislodged during handling and transit. However, one or more of the shaping dies may insufficiently deform the resilient wire bundles and thereby fail to prevent same from being dislodged. Also, the shaping dies may inconsistently deform the resilient wire bundles (i.e., some shaping dies will under-penetrate the resilient wire bundles while other shaping dies will over-penetrate). The resulting unequal resilient wire bundle height increases the likelihood that one or more open circuits will occur when the resilient wire bundles are compressed between two electronic substrates. In this case, the interposer that contains the resilient wire bundles of unequal height must be replaced for the two electronic substrates to be properly connected.
- Another problem with electrical connectors that incorporate resilient wire bundles is that the strands of the resilient wire bundles are not very robust. For example, the strands of resilient wire bundles are prone to spreading or “mushrooming” upon repeated insertions. If a resilient wire bundle is sufficiently mushroomed, an open circuit or near-open circuit will result when the mushroomed resilient wire bundle is subsequently compressed between two electronic substrates. This occurs because mushrooming can undesirably limit the compressive force on the resilient wire bundle and thereby increase electrical resistance through the resilient wire bundle to the point where an open circuit or near-open circuit is created. In this case, the interposer that contains the mushroomed resilient wire bundle must be replaced for the two electronic substrates to be properly connected. Moreover, the strands of resilient wire bundles can snag on mating features during insertion and withdrawals. If either a snagged strand of a resilient wire bundle or a mushroomed resilient wire bundle subsequently makes contact with an adjacent resilient wire bundle or an adjacent contact on the electronic substrate, a short circuit will result. Such a short can catastrophically damage to one or both of the electronic substrates being interconnected. Accordingly, the interposer that contains the snagged strand or mushroomed resilient wire bundle, and possibly also one or both of the electronic substrates being interconnected, would have to be replaced.
- It should therefore be apparent that a need exists for an enhanced mechanism for connecting two substrates using resilient wire bundles.
- According to the preferred embodiments of the present invention, two substrates are electrically connected using resilient wire bundles captured in apertures of an interposer by a retention member. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention member, such as a thin polyimide film, is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention member and partially through the apertures. In one embodiment of the present invention, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).
- The foregoing and other features and advantages of the present invention will be apparent from the following more particular description of the preferred embodiments of the present invention, as illustrated in the accompanying drawings.
- The preferred exemplary embodiments of the present invention will hereinafter be described in conjunction with the appended drawings, where like designations denote like elements.
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FIG. 1 is a side perspective view of a circuit card assembly having an interposer that incorporates a retention member according to the preferred embodiments of the present invention. -
FIG. 2 is a partial, sectional view of the circuit card assembly ofFIG. 1 , taken along the section line indicated inFIG. 1 . -
FIG. 3 is an enlarged partial, sectional view of the circuit card assembly ofFIG. 2 , in an area of a single aperture of the interposer. -
FIG. 4 is an unassembled version of the enlarged partial, sectional view of the circuit card assembly shown inFIG. 3 . -
FIG. 5 is a partial, top perspective view of an interposer that incorporates a retention member according to the preferred embodiments of the present invention. The retention member is shown partially cut away to reveal a portion of an underlying carrier. -
FIG. 6 is a partial, sectional view of a circuit card assembly having a hybrid interposer that incorporates a retention member according to the preferred embodiments of the present invention. -
FIG. 7 is a flow diagram of a method for assembling an interposer that incorporates a retention member according to the preferred embodiments of the present invention. - 1.0 Overview
- In accordance with the preferred embodiments of the present invention, two subtrates are electrically connected using resilient wire bundles captured in apertures of an interposer by a retention member. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention member, such as a thin polyimide film, is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperature. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention member and partially through the apertures. In one embodiment of the present invention, the interposer is a land grid array connector that connects an electronic module and a printed circuit board.
- 2.0 Detailed Description
- With reference to the figures and in particular
FIG. 1 , there is depicted, in a side perspective view, acircuit card assembly 100 having aninterposer 102 that incorporates one or more retention members, such asthin polymer films circuit card assembly 100,interposer 102 is sandwiched between aceramic module substrate 108 and a printed circuit board (PCB) 110. Although the preferred embodiments of the present invention are described herein within the context of a land grid array (LGA) connector that connects an electronic module to a PCB, one skilled in the art will appreciate that many variations are possible within the scope of the present invention. For example, the present invention may be utilized in connecting any two substrates, such as connecting a ribbon substrate to any of a PCB, an electronic module, or another ribbon substrate. - A
rectilinear heat sink 112 is connected to a bare die ormodule cap 114, which is in turn connected toceramic module substrate 108.Heat sink 112 provides heat transfer functions, as is well known in the art. Electronic components, such a microprocessors and integrated circuits, must operate within certain specified temperature ranges to perform efficiently. Excessive heat degrades electronic component performance, reliability, life expectancy, and can even cause failure. Heat sinks, such asrectilinear heat sink 112, are widely used for controlling excessive heat. Typically, heat sinks are formed with fins, pins or other similar structures to increase the surface area of the heat sink and thereby enhance heat dissipation as air passes over the heat sink. In addition, it is not uncommon for heat sinks to contain high performance structures, such as vapor chambers and/or heat pipes, to further enhance heat transfer. Heat sinks are typically formed of metals, such as copper or aluminum. The use of a heat sink, per se, is not necessary for purposes of the present invention, but is important in understanding an environment in which the present invention may be used. - Electronic components are generally packaged using electronic packages (i.e., modules) that include a module substrate, such as
ceramic module substrate 108, to which the electronic component is electronically connected. In some cases, the module includes a cap (i.e., capped modules) which seals the electronic component within the module. In other cases, the module does not include a cap (i.e., a bare die module). In the case of a capped module, a heat sink is typically attached with a thermal interface between a bottom surface of the heat sink and a top surface of the cap, and another thermal interface between a bottom surface of the cap and a top surface of the electronic component. In the case of a bare die module, a heat sink is typically attached with a thermal interface between a bottom surface of the heat sink and a top surface of the electronic component. - Referring again to
FIG. 1 , arigid insulator 116 is disposed along the bottom surface ofPCB 110 and is preferably fabricated from fiberglass reinforced epoxy resin.Rigid insulator 116 is urged upwards againstPCB 110, andPCB 110 is thereby urged upward towardsinterposer 102 andmodule substrate 108, by a clamping mechanism. Preferably, the clamping mechanism is a post/spring-platetype clamping mechanism 150 as shown inFIG. 1 . Because such clamping mechanisms are conventional, the post/spring-platetype clamping mechanism 150 is only briefly described below. Additional details about post/spring-plate type clamping mechanisms may be found in U.S. Pat. No. 6,386,890 to Bhatt et al., the disclosure of which is incorporated by reference herein. One skilled in the art will appreciate that any of the many different types and configurations of clamping mechanisms known in the art may be used in lieu of the post/spring-platetype clamping mechanism 150 shown inFIG. 1 . - In the embodiment shown in
FIG. 1 ,clamping mechanism 150 includes astiffener 152, which is preferably a metal or steel plate. An upward force is generated by aspring 154, which directs force upward againststiffener 152 through interaction with a spring-plate 156. It is preferred that spring-plate 156 is a square structure with about the same overall footprint depth asheat sink 112. Fourcylindrical posts 158 are connected at the four corners ofrectilinear heat sink 112 and disposed through cylindricalinterposer post apertures 160,PCB post apertures 162, post apertures ininsulator 116,stiffener post apertures 164, and spring-plate post apertures 166. Post mushroom heads 168 are formed at the ends ofposts 158. The post mushroom heads 168 rest against spring-plate 156 and thereby prevent spring-plate 156 from moving downward. Downward expansion or deflection forces fromspring 154 are exerted directly upon spring-plate 156, which translates the forces throughposts 158,heat sink 112, bare die ormodule cap 114 intomodule substrate 108, thereby forcingmodule substrate 108 downward untilmodule substrate 108 comes into contact with and exerts force upon stops (not shown inFIG. 1 ) ofinterposer 102. Similarly, force fromspring 154 is also exerted upwards byspring 154 and translated throughstiffener 152 andinsulator 116 intoPCB 110, forcingPCB 110 upwards untilPCB 110 comes into contact with and exerts force upon stops (not shown inFIG. 1 ) ofinterposer 102. Accordingly,PCB 110 andmodule substrate 108 are forced toward each other with compressive forces uponinterposer 102 disposed therebetween. - Spring-
plate 156 also has a threadedscrew 170 in the center ofspring 154. Whenscrew 170 is turned clockwise, its threads travel along corresponding thread grooves in a spring-plate screw aperture 172 in spring-plate 156 and, accordingly, screw 170 moves upward toward and againststiffener 152. Asscrew 170 engagesstiffener 152 and exerts force upward against it, corresponding relational force is exerted by the threads ofscrew 170 downward against the thread grooves in spring-plate 156. As illustrated above in the discussion ofspring 154, the downward force exerted byscrew 170 is translated by spring-plate 156, post mushroom heads 168,posts 158,heat sink 112 and the bare die ormodule cap 114 intomodule substrate 108, thereby forcingmodule substrate 108 downward untilmodule substrate 108 comes into contact with and exerts force against stops (not shown inFIG. 1 ) ofinterposer 102. Similarly, upward force fromscrew 170 is translated throughstiffener 152 andinsulator 116 intoPCB 110, forcingPCB 110 upwards untilPCB 110 comes into contact with and exerts force against stops (not shown inFIG. 1 ) ofinterposer 102. Accordingly, afterscrew 170 is rotated clockwise into contact withstiffener 152, additional clockwise rotation ofscrew 170 results in increasing compressive force exerted byPCB 110 andmodule substrate 108 uponinterposer 102 disposed therebetween. - Reference is now made to
FIGS. 2-4 .FIG. 2 illustrates, in a partial, sectional view, circuit ofcard assembly 100 along the section line 2-2 ofFIG. 1 . More particularly,FIG. 2 shows a portion of a land grid array (LGA) site comprising pin contacts ofPCB 110 and corresponding pin contacts ofmodule substrate 108. As discussed in detail below, these pin contacts make electrical contact with each other through resilient wire bundles captured in apertures ofinterposer 102 by retention members.FIG. 3 illustrates, in an enlarged partial, sectional view,circuit card assembly 100 in an area of a single aperture ofinterposer 102.FIG. 4 is an unassembled version ofFIG. 3 . That is,FIG. 4 illustrates, in an enlarged partial, sectional view,circuit card 100 in an area of a single aperture ofinterposer 102 in an unassembled state. - According to the preferred embodiments of the present invention,
interposer 102 includes an electricallynon-conductive carrier 202 and one or more electricallynon-conductive retention members carrier 202 is conventional, and thus only briefly described herein. Additional details about the construction of such carriers may be found in U.S. Pat. No. 6,062,870 to Hopfer, III et al., the disclosure of which was already incorporated by reference herein. Preferably,carrier 202 is molded or machined withapertures 208. For example,carrier 202 may be formed by injection molding of suitable electrically non-conductive materials. Those materials should have good flow characteristics at molding temperatures to assure formation of the fine detail required for the small aperture configurations, particularly when molding athin carrier 202. The mold typically includes core pins that when withdrawn defineapertures 208. Specific examples of suitable moldable materials include polyesters, such as the thermoplastic polyester resin product sold by E.I. DuPont de Nemours & Co., Inc. under the tradename Rynite and liquid crystal polymers such as the product sold by Hoechst Celanese Corporation under the tradename Vectra. Smooth inner wall surfaces ofapertures 208 are assured by a molding process, even when glass fiber fillers are included to enhance the stability of the final interposer product. -
Carrier 202 may alternatively be fabricated by machiningapertures 208 into a solid sheet or board. Eachaperture 208 is bored completely throughcarrier 202 so that it extends form surface to surface with a desired diameter. Formingapertures 208 by such machining usually is more economical for short production runs. However, more care is required to secure smooth inner wall surfaces inapertures 208. Also, use of glass fiber fillers incarrier 202 preferably is avoided whenapertures 208 are to be machined as the imbedded fibers tend to result in rough inner wall surfaces in apertures formed by machining. Rough inner wall surfaces can catch individual strands of wire which may interfere with the desired resilient operation of the resilient wire bundles. -
Retention members orifices retention members orifices orifices carrier 202, on whichretention members orifice retention member - Alternatively,
retention members orifices carrier 202 as a one-piece unit. For example,retention members - Inserted within each
aperture 208 ofcarrier 202 is aresilient wire bundle 220. Such resilient wire bundles are also well known as wadded wire, fuzz buttons, button contacts, button wads, or contact wads, which are collectively referred to herein as resilient wire bundles. For example, U.S. Pat. No. 6,062,870 to Hopfer, III et al., the disclosure of which was already incorporated by reference herein, discloses an electrical interconnect that incorporates resilient wire bundles that are retained in holes in a carrier by compressive friction engagement with a central section of the side wall of each of the holes. As shown inFIGS. 2-4 , the top end of eachresilient wire bundle 220 mates with apin contact 214 ofmodule substrate 108 and the bottom end of eachresilient wire bundle 220 mates with apin contact 216 ofPCB 110. Alternatively, the interposer may be of a hybrid-type, wherein contact pins are incorporated in only one of the substrates, i.e., either themodule substrate 108 or thePCB 110. For example, as shown inFIG. 6 , the top end of eachresilient wire bundle 220 mates with apin contact 214 ofsubstrate module 108 while the bottom end of eachresilient wire bundle 220 mates with apad contact 226. - According to the preferred embodiments of the present invention, the width of each
orifice retention members aperture 208 to thereby enhance retention of theresilient wire bundle 220 withinaperture 208. - The upper end of each
resilient wire bundle 220 is captured withinaperture 208 by an annular ledge formed whereretention member 104overhangs aperture 208, while the bottom end of eachresilient wire bundle 220 is captured withinaperture 208 by an annular ledge formed whereretention member 106 projects underaperture 208. Preferably, the ledges retain physical contact with resilient wire bundles 220 in a manner that is not a press-fit, but which prevents resilient wire bundles 220 from rotating. Accordingly, resilient wire bundles 220 preferably have relaxed (non-stressed) diameters and heights approximately equal to those ofapertures 208. - These ledges substantially prevent any strand of
resilient wire bundle 220 from escapingaperture 208, and therefore the possibility of shorting is much lower than in conventional button boards (wherein the resilient wire bundles are retained solely by compressive friction engagement with the side wall of the aperture). Preferably, there is a slight interference between the ledges and pincontacts 214, 216 (i.e., the diameter of pin contacts is slightly larger than that oforifices retention members 104, 106) so that upon withdrawal ofpin contacts apertures 208 the ledges act as “wiper blades” to scrape any snagged strands of resilient wire bundles 220 off thepin contacts dimension pin contacts orifices - In addition, the ledges protect the resilient wire bundles 220 and prevent resilient wire bundles 220 from being jarred completely or partially loose from
interposer 102. Moreover, resilient wire bundles 220 will not mushroom because the ledges prevent the resilient wire bundles 220 from escaping the confines ofapertures 208. - Resilient wire bundles are typically formed from a single strand of metal wire, which is preferably plated with a precious metal such as gold. Resilient wire bundles typically have a wire diameter in the range of approximately 0.002 inch. Preferably, resilient wire bundles 220 are formed from a single strand of gold plated beryllium copper wire having a wire diameter in the range of approximately 0.002 inch. Each strand is preferably wadded together in a random orientation to form a generally cylindrical “button” of wadded wire. Generally, it is preferable that a precious metal wire having a random orientation be used for
resilient wire bundle 220 to provide multiple contact points onpin contacts 214, 216 (as best seen inFIG. 3 ), increasing the reliability of the overall electrical interconnection by providing multiple hertzian or high localized stress contacts. Suitable resilient wire bundles are exemplified by, but not limited to, resilient wire bundle products sold by Cinch Connectors, Lombard, Ill. under the tradename CIN::APSE and Tecknit, Inc., Cranford, N.J. under the tradename Fuzz Button. -
Pin contacts 214 are preferably soldered to conventional electricallyconductive pad contacts 224 onmodule substrate 108. Similarly, pincontacts 216 are preferably soldered to conventional electricallyconductive pad contacts 226 onPCB 110.Pin contacts contacts - In general, the size and shape of
pin contacts pin contact resilient wire bundle 220 so that at a given insertion force the contact stress will be large. Accordingly, the reliability ofinterposer 102 is likely to be greater than conventional interposers having resilient wire bundles that mate with pad contacts having a larger area of contact and consequently less contact stress at a given insertion force. - Most of the insertion force of
pin contacts resilient wire bundle 220, not compressingresilient wire bundle 220. Accordingly, insertion force can be minimized because it is used efficiently. Thus, the present invention facilitates the use of an LGA connector for connecting a bare die module to a PCB by minimizing the rated insertion and operating force. When bare die modules are used, it is desirable to minimize the rated insertion and operating force because the clamping mechanism applies this force directly through the electronic component itself. -
Stops 230 set the length of penetration ofpin contacts 214 ofmodule substrate 108 into the top ofapertures 208 ofcarrier 202. Similarly, stops 232 set the length of penetration ofpin contacts 216 ofPCB 110 into the bottom ofapertures 208 ofcarrier 202. As best seen inFIG. 4 , stops 230, 232 preferably project fromcarrier 202 through stop holes 502 (shown inFIG. 5 ) in the thin polymer films that formretention members carrier 202 ascarrier 202 is formed by injection molding. - Preferably, stops 230, 232 are interspersed on both surfaces of
carrier 202 in a pattern that facilitates generally uniform penetration ofpin contacts apertures 208. This is best seen inFIG. 5 , which illustrates, in a partial, top perspective view, aninterposer 102 that incorporates aretention member 104 according to the preferred embodiments of the present invention. InFIG. 5 , for purposes of illustration,retention member 104 is partially cut away to reveal a portion theunderlying carrier 202. As shown inFIG. 5 , stops 230, 232 may be interspersed on both surfaces (only one surface is shown inFIG. 5 ) ofcarrier 202 betweenapertures 208. Alternatively, or in addition, stops 230, 232 may be interspersed on both surfaces ofcarrier 202 along the edges ofinterposer 102 outside the area ofapertures 208. Those skilled in the art will appreciate, however, that the stops need not be present on both surfaces ofcarrier 202. For example, in the case of a hybrid interposer, such ashybrid interposer 102′ shown inFIG. 6 , the stops need only be present on a single surface ofcarrier 202. -
Stops retention members carrier 202, i.e., theretention member 104 is aligned relative tocarrier 202 so that the carrier'sstops 230 will penetrate this retention member's stop holes 502, and, likewise,retention member 106 is aligned relative tocarrier 202 so that the carrier'sstops 230 will penetrate this retention member's stop holes. Those skilled in the art will appreciate, however, that other configurations of the stops are possible without departing from the scope of the present invention. For example, in lieu of projecting fromcarrier 202, the stops may project frommodule substrate 108 andPCB 110, or may be integrally formed withretention members - By way of example, and without limitation, for a
carrier 202 having a thickness of in the range of approximately 0.040 inch,retention members pin contacts aperture 208 incarrier 202. Also, by way of example, and without limitation, forpin contacts orifices retention members apertures 208 incarrier 202 would each have a diameter of in the range of approximately 0.025 inch. In this example, the annular ledge would be in the range of approximately 0.005 inch (i.e., (0.025-0.015)/2) and thepin contacts orifices -
FIG. 6 illustrates, in a partial, sectional view, a circuit card assembly having ahybrid interposer 102′ that incorporates asingle retention member 104 according to the preferred embodiments of the present invention.Hybrid interposer 102′ shown inFIG. 6 is similar tointerposer 102 shown inFIG. 2 , except thatretention member 106 and stops 232 are omitted from the bottom surface ofcarrier 202. In some cases it may be desirable for one of the substrates (i.e., eitherPCB 110 or module substrate 108) to have conventional pad contacts rather than pin contacts.Hybrid interposer 102′ addresses such a case, i.e., the case where the PCB has conventional pad contacts rather than pin contacts. As shown inFIG. 6 , the bottom of eachresilient wire bundle 220 makes contact withpad contacts 226 ofPCB 110 in a conventional manner, such as by compression force, solder, electrically-conductive adhesive, etc. Although not shown inFIG. 6 , it may be desirable to mount an additional retention member on the bottom surface ofcarrier 202 to enhance retention of resilient wire bundles 220 (i.e., similar toretention member 106 inFIG. 2 ). -
FIG. 7 is a flow diagram of amethod 700 for assembling an interposer that incorporates a retention member according to the preferred embodiments of the present invention.Method 700 sets forth the preferred order of the steps. It must be understood, however, that the various steps may occur at any time relative to one another. A first retention member having orifices therein is mounted on a first surface of the carrier having apertures therein (step 710). This step may be facilitated by aligning and inserting stops of the carrier into stop holes of the first retention member. Preferably, the first retention member is attached to the first surface of the carrier through the use of a conventional fastening mechanism, such as adhesive, thermal welding, or the like. Next, resilient wire bundles are inserted in the apertures of the carrier from the still-open second surface of the carrier (step 720). A second retention member having orifices therein is then mounted on the second surface of the carrier (step 730). This step may be facilitated by aligning and inserting stops of the carrier into stop holes of the second retention member. Preferably, the second retention member is attached to the second surface of the carrier through the use of a conventional fastening mechanism, such as adhesive, thermal welding, or the like. - One skilled in the art will appreciate that many variations are possible within the scope of the present invention. For example, although the preferred embodiments of the present invention are described herein within the context of a land grid array (LGA) connector that connects an electronic module to a PCB, the present invention may be utilized in connecting any two substrates, such as connecting a ribbon substrate to any of a PCB, an electronic module, or another ribbon substrate. Moreover, different types and configurations of clamping mechanisms known in the art may be used to force the substrates together in lieu of the post/spring-plate type clamping mechanism described herein. Also, although the dimensions of the pin contacts, apertures of the carrier, and orifices of the retention members are set forth as diameters, these features need not be round. Thus, while the present invention has been particularly shown and described with reference to the preferred embodiments thereof, it will be understood by those skilled in the art that these and other changes in form and detail may be made therein without departing from the spirit and scope of the present invention.
Claims (17)
1. An interposer, comprising:
an electrically non-conductive carrier having a first surface and a second surface, and an aperture extending from the first surface to the second surface;
an electrically non-conductive first retention member associated with the first surface of the carrier and having an orifice overlying the aperture of the carrier, wherein the orifice of the first retention member has a width smaller than that of the aperture of the carrier;
a resilient wire bundle disposed in the aperture of the carrier.
2. The interposer as recited in claim 1 , wherein the first retention member comprises a thin polymer film.
3. The interposer as recited in claim 1 , further comprising an electrically non-conductive second retention member associated with to the second surface of the carrier and having an orifice underlying the aperture of the carrier, wherein the orifice of the second retention member has a width smaller than that of the aperture of the carrier.
4. The interposer as recited in claim 3 , wherein the first and second retention members each comprises a thin polymer film.
5. The interposer as recited in claim 1 , wherein the carrier includes a stop member projecting from the first surface thereof and through a hole in the first retention member.
6. The interposer as recited in claim 1 , wherein the carrier includes a plurality of the apertures arranged in an array, wherein the first retention member has a plurality of the orifices, and wherein a plurality of the resilient wire bundles are disposed in the apertures of the carrier.
7. The interposer as recited in claim 6 , further comprising an electrically non-conductive second retention member associated with the second surface of the carrier and having a plurality of orifices underlying the apertures of the carrier, wherein the each orifice of the second retention member has a width smaller than that of the overlying aperture of the carrier.
8. The interposer as recited in claim 7 , wherein the first and second retention members each comprises a thin polymer film.
9. The interposer as recited in claim 8 , wherein the thin polymer film has a thickness of about 0.006 inch.
10. An interposer, comprising:
an electrically non-conductive carrier having a first surface and a second surface, and a plurality of apertures arranged in an array and extending from the first surface to the second surface;
an electrically non-conductive first retention member attached to the first surface of the carrier and having a plurality of orifices overlying the apertures of the carrier, wherein each orifice of the first retention member has a width smaller than that of the underlying aperture of the carrier;
a plurality of resilient wire bundles disposed in the apertures of the carrier.
11. The interposer as recited in claim 10 , wherein the first retention member comprises a thin polymer film.
12. The interposer as recited in claim 10 , further comprising an electrically non-conductive second retention member attached to the second surface of the carrier and having a plurality of orifices underlying the apertures of the carrier, wherein the each orifice of the second retention member has a width smaller than that of the overlying aperture of the carrier.
13. The interposer as recited in claim 12 , wherein the first and second retention members each comprises a thin polymer film.
14. The interposer as recited in claim 13 , wherein the thin polymer film has a thickness of about 0.006 inch.
15. The interposer as recited in claim 10 , wherein the carrier includes a stop member projecting from the first surface thereof and through a hole in the first retention member.
16. An interposer, comprising:
an electrically non-conductive carrier having a first surface and a second surface, and a plurality of apertures arranged in an array and extending from the first surface to the second surface;
an electrically non-conductive first retention member comprising a thin polymer film attached to the first surface of the carrier and having a plurality of orifices overlying the apertures of the carrier, wherein each orifice of the first retention member has a width smaller than that of the underlying aperture of the carrier;
a plurality of resilient wire bundles disposed in the apertures of the carrier.
17. The interposer as recited in claim 16 , further comprising an electrically non-conductive second retention member comprising a thin polymer film attached to the second surface of the carrier and having a plurality of orifices underlying the apertures of the carrier, wherein the each orifice of the second retention member has a width smaller than that of the overlying aperture of the carrier.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/760,919 US20070227769A1 (en) | 2005-12-08 | 2007-06-11 | Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/297,307 US7293994B2 (en) | 2005-12-08 | 2005-12-08 | Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member |
US11/760,919 US20070227769A1 (en) | 2005-12-08 | 2007-06-11 | Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/297,307 Continuation US7293994B2 (en) | 2005-12-08 | 2005-12-08 | Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070227769A1 true US20070227769A1 (en) | 2007-10-04 |
Family
ID=38139980
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/297,307 Active US7293994B2 (en) | 2005-12-08 | 2005-12-08 | Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member |
US11/760,919 Abandoned US20070227769A1 (en) | 2005-12-08 | 2007-06-11 | Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member |
US11/760,925 Abandoned US20070226997A1 (en) | 2005-12-08 | 2007-06-11 | Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member |
US12/183,288 Expired - Fee Related US7765693B2 (en) | 2005-12-08 | 2008-07-31 | Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/297,307 Active US7293994B2 (en) | 2005-12-08 | 2005-12-08 | Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/760,925 Abandoned US20070226997A1 (en) | 2005-12-08 | 2007-06-11 | Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member |
US12/183,288 Expired - Fee Related US7765693B2 (en) | 2005-12-08 | 2008-07-31 | Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member |
Country Status (2)
Country | Link |
---|---|
US (4) | US7293994B2 (en) |
CN (1) | CN101013783A (en) |
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US9824704B2 (en) | 2015-02-17 | 2017-11-21 | Hutchinson Technology Incorporated | Partial curing of a microactuator mounting adhesive in a disk drive suspension |
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US10290313B2 (en) | 2015-06-30 | 2019-05-14 | Hutchinson Technology Incorporated | Disk drive head suspension structures having improved gold-dielectric joint reliability |
US9734852B2 (en) | 2015-06-30 | 2017-08-15 | Hutchinson Technology Incorporated | Disk drive head suspension structures having improved gold-dielectric joint reliability |
US10748566B2 (en) | 2015-06-30 | 2020-08-18 | Hutchinson Technology Incorporated | Disk drive head suspension structures having improved gold-dielectric joint reliability |
US10109305B2 (en) | 2016-05-12 | 2018-10-23 | Hutchinson Technology Incorporated | Co-located gimbal-based DSA disk drive suspension with traces routed around slider pad |
US9646638B1 (en) | 2016-05-12 | 2017-05-09 | Hutchinson Technology Incorporated | Co-located gimbal-based DSA disk drive suspension with traces routed around slider pad |
Also Published As
Publication number | Publication date |
---|---|
US20070134948A1 (en) | 2007-06-14 |
US7765693B2 (en) | 2010-08-03 |
US7293994B2 (en) | 2007-11-13 |
CN101013783A (en) | 2007-08-08 |
US20080282539A1 (en) | 2008-11-20 |
US20070226997A1 (en) | 2007-10-04 |
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