|Publication number||US20070234540 A1|
|Application number||US 11/278,291|
|Publication date||Oct 11, 2007|
|Filing date||Mar 31, 2006|
|Priority date||Mar 31, 2006|
|Also published as||US7281305, US7748093, US20080033496|
|Publication number||11278291, 278291, US 2007/0234540 A1, US 2007/234540 A1, US 20070234540 A1, US 20070234540A1, US 2007234540 A1, US 2007234540A1, US-A1-20070234540, US-A1-2007234540, US2007/0234540A1, US2007/234540A1, US20070234540 A1, US20070234540A1, US2007234540 A1, US2007234540A1|
|Inventors||Rajesh Iyer, Susan Tettemer, John Tardiff, Shawn Knowles|
|Original Assignee||Iyer Rajesh V, Tettemer Susan A, Tardiff John P, Knowles Shawn D|
|Export Citation||BiBTeX, EndNote, RefMan|
|Referenced by (15), Classifications (20), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This invention relates generally to implantable medical devices and, more particularly, to a filtered feedthrough assembly for use with an implantable medical device.
Cardiac pacemakers and other such implantable medical devices (e.g., cochlear implants, defibrillators, neurostimulators, active drug pumps, etc.) typically comprise a hermetically sealed container and a feedthrough assembly having one or more terminals (e.g., niobium pins) that provide conductive paths from the interior of the device to one or more lead wires exterior to the device. In general, such feedthrough assemblies comprise a ferrule that is fixedly coupled (e.g., welded) to a container and an insulating structure disposed within the ferrule. The insulating structure may include joint-insulator sub-assemblies, each of which is disposed around a different terminal pin. For example, the insulating structure may include one or more braze joints, each of which comprises an insulator ring (e.g., glass, ceramic, etc.) that insulates the pin from the ferrule, a pin-insulator braze (e.g., gold) that couples the insulating ring to the pin, and an insulator-ferrule braze (e.g., gold) that couples the insulating ring to the ferrule. When the medical device is implanted, the braze joints may be exposed to body fluids. It is thus important that each of the braze joints forms a hermetic seal between the ferrule and its respective terminal pin. To ensure that a satisfactory seal has been formed, a gas may be introduced through an aperture provided through a wall of the ferrule proximate the braze joint or joints. The aperture is then plugged, and the feedthrough assembly is externally monitored for the gas by way of, for example, a mass spectrometer.
To reduce the effects of stray electromagnetic interference (EMI) signals that may be collected by lead wires coupled to the feedthrough terminal pins, it is known to attach a discoidal capacitor to the feedthrough assembly that permits passage of relatively low frequency electrical signals along the terminal pin or pins while shunting undesired high frequency interference signals to the device's container. Typically, the attachment of such a capacitor includes the thermal curing of one or more non-conductive epoxy preforms to physically couple the capacitor to the insulating structure of the feedthrough.
Although feedthrough filter capacitor assemblies of the type described above perform satisfactorily, the installation of such filter capacitor assemblies poses certain problems related to the curing of the epoxy preforms. For example, the epoxy preforms may wick into the annular cavities provided between the capacitor and the terminal pins during curing and thus occupy space that should be filled by a conductive material (e.g., epoxy, solder, etc.). This results in a degraded electrical connection between the terminal pins and the capacitors. Additionally, the non-conductive epoxy preforms may seep into the insulating structure and cover cracks that have formed through the braze joint. This may prevent gas from being detected during leak testing and, therefore, may create the impression that a satisfactory hermetic seal has been formed when, in fact, one has not.
Considering the above, it should be appreciated that it would be desirable to provide a filtered feedthrough assembly utilizing an improved capacitor attachment technique that prevents the undesired travel of non-conductive epoxy. Furthermore, other desirable features and characteristics of the present invention will become apparent from the subsequent detailed description of the invention and the appended claims, taken in conjunction with the accompanying drawings and this background of the invention.
A method for attaching a capacitor to the feedthrough assembly of a medical device is provided. The feedthrough assembly comprises a ferrule configured to be coupled to the medical device and an insulating structure disposed within the ferrule for insulatively guiding at least one terminal pin through the ferrule. The method comprises threading a first washer over the terminal pin, and placing a body of epoxy in contact with the first washer. The capacitor is positioned over the terminal pin such that the first washer and the body of epoxy are between the capacitor and the insulating structure, and the epoxy preform is cured to couple the capacitor to the insulating structure.
A filtered feedthrough assembly having at least one terminal pin therethrough is also provided. The feedthrough assembly comprises a ferrule having a cavity therethrough for receiving the terminal pin, and insulating structure having an upper surface. The insulating structure is disposed within the cavity and around the terminal pin for electrically isolating the pin from the ferrule. A capacitor is disposed around the pin and electrically coupled thereto. The capacitor has a lower surface that is disposed proximate the upper surface, and at least one washer is disposed between the upper surface and the lower surface. To attach the capacitor to the insulating structure, a body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the at least one washer.
The following drawings are illustrative of particular embodiments of the invention and therefore do not limit the scope of the invention, but are presented to assist in providing a proper understanding. The drawings are not to scale (unless so stated) and are intended for use in conjunction with the explanations in the following detailed descriptions. The present invention will hereinafter be described in conjunction with the appended drawings, wherein like reference numerals denote like elements, and:
The following description is exemplary in nature and is not intended to limit the scope, applicability, or configuration of the invention in any way. Rather, the following description provides a convenient illustration for implementing an exemplary embodiment of the invention. Various changes to the described embodiment may be made in the function and arrangement of the elements described herein without departing from the scope of the invention.
As can be seen in
Terminal pin 102 provides a conductive path from the interior of a medical device (not shown) to one or more lead wires exterior to the medical device. As described previously, these lead wires are known to act as antennae that collect stray electromagnetic interference (EMI) signals, which may interfere with the proper operation of the device. To suppress and/or transfer such EMI signals to the container of the medical device, a discrete discoidal capacitor may be attached to feedthrough assembly 100. In particular, the capacitor may be disposed around and electrically coupled to terminal pin 102 and fixedly coupled to supporting structure 108.
During curing, preform 152 melts and disperses under the weight of capacitor 150, which moves downward toward supporting structure 108. Preform 152 disperses along the annular space provided between the bottom surface of capacitor 150 and the upper surface of supporting structure 108 to physically couple capacitor 150 and supporting structure 108 as described above. In addition, preform 152 may disperse upward into the annular space provided between the inner surface of capacitor 150 and outer surface of terminal pin 102 (shown in
After washer 208, epoxy preform 202, washer 206, and capacitor 200 have been threaded over terminal pin 102, feedthrough 100 may be placed within a curing oven and heated to cure preform 202 (indicated in
Attachment of capacitor 200 to the remainder of feedthrough assembly 100 may be completed in the following manner. First, a conductive material (e.g., epoxy, polyimide, solder, etc.) 212 is dispensed into the annular cavity provided between pin 102 and capacitor 200 to electrically couple pin 102 to the inner electrode plates of capacitor 200. A second thermal curing step is then performed to cure conductive material 212 if material 212 comprises epoxy or polyimide or to reflow conductive material 212 if material 212 comprises solder. Next, an adhesive fillet 214 may be disposed around the outer periphery of capacitor 200 proximate ferrule 104 to further secure and electrically couple the outer electrode plates of capacitor 200 to ferrule 104. Lastly, a non-conductive top coat 216 (e.g., epoxy, polyimide, glass, etc.) may be applied to the upper surface of capacitor 200 to decrease the likelihood of high-voltage breakdown. Once properly installed, capacitor 200 functions to permit passage of relatively low frequency electrical signals along terminal pin 102 while shunting undesired high frequency interference signals to the container of a medical device to which ferrule 104 is coupled.
FIG.10 is an exploded view of an implantable medical device (e.g., a pulse generator) 350 coupled to a connector block 351 and a lead 352 by way of an extension 354. The proximal portion of extension 354 comprises a connector 356 configured to be received or plugged into connector block 351, and the distal end of extension 354 likewise comprises a connector 358 including internal electrical contacts 360 configured to receive the proximal end of lead 352 having electrical contacts 362 thereon. The distal end of lead 352 includes distal electrodes 364, which may deliver electrical pulses to target areas in a patient's body (or sense signals generated in the patient's body; e.g., cardiac signals).
After a capacitor 300 has been attached to feedthrough assembly 302 in the manner described above, assembly 302 may be welded to the housing of an implantable medical device 350 as shown in
Although the inventive filtered feedthrough assembly and method for the assembly thereof have been described above as utilizing two washers per terminal pin, it should be appreciated that only one washer may be utilized and disposed either between the capacitor and the preform or the supporting structure and the preform. Indeed, in the case of a unipolar feedthrough assembly wherein the aperture through the supporting structure may be narrowly tailored to conform to the outer diameter of the terminal pin, disposing a washer between the supporting structure and the preform may be largely unnecessary. It should also be appreciated that, although the inventive method for attaching a capacitor to a feedthrough assembly has been described as utilizing one or more epoxy preforms to physically couple the capacitor to the feedthrough assembly, other adhesives may be used. If a liquid epoxy (e.g., UV cure epoxy) is employed, it may be desirable to physically couple a washer to the capacitor before threading the capacitor over the terminal pin or pins and immediately curing the assembly after the capacitor/washer combination is properly positioned. This will help prevent the liquid epoxy from being entirely forced out from between the capacitor/washer combination and the supporting structure or other washer. Lastly, it should be understood that, although the insulating structures in the exemplary feedthrough assemblies described above employed one or more braze joints, other types of joint-insulator sub-assemblies may be utilized providing that the sub-assembly or assemblies utilized are biocompatible and form a suitable hermetic seal between the insulator pin and ferrule.
It should also be understood that curing processes other than the thermal curing described above may be utilized. For example, if a UV-curable epoxy is used for the liquid epoxy or the epoxy preform, a UV snap cure process may be performed to effectuate capacitor attachment. UV curing occurs as the UV-curable epoxy is exposed to a UV light source (e.g., emitting light having a wavelength of approximately 200-300 nanometers) for a predetermined period of time (e.g., approximately 30-40 seconds). Though the UV light may only directly reach the portions of the epoxy exposed through the annular cavity formed between the outer diameter of the capacitor and the inner wall of the ferrule, the UV-curing process will also affect neighboring portions of epoxy that are not directly exposed to the UV light. Exposure to UV light causes the epoxy to undergo a cross-linking process, harden, and consequently couple the capacitor or capacitors to the feedthrough assembly.
It should thus be appreciated from the foregoing that there has been provided filtered feedthrough assembly utilizing an improved capacitor attachment technique that prevents the non-conductive epoxy from undesired travel thereby preserving the integrity of the electrical connection between the capacitors and the terminal pins and the leak testability of the feedthrough assembly. Although the invention has been described with reference to a specific embodiment in the foregoing specification, it should be appreciated that various modifications and changes can be made without departing from the scope of the invention as set forth in the appended claims. Accordingly, the specification and figures should be regarded as illustrative rather than restrictive, and all such modifications are intended to be included within the scope of the present invention.
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7928818||Jul 31, 2008||Apr 19, 2011||Medtronic, Inc.||Capacitive elements and filtered feedthrough elements for implantable medical devices|
|US8059386||Jul 31, 2008||Nov 15, 2011||Medtronic, Inc.||Capacitive elements and filtered feedthrough elements for implantable medical devices|
|US8129622 *||May 21, 2009||Mar 6, 2012||Medtronic, Inc.||Insulator for feedthrough|
|US8288654 *||Sep 9, 2009||Oct 16, 2012||Medtronic, Inc.||Feedthrough assembly including a ferrule, an insulating structure and a glass|
|US8331077||Sep 30, 2009||Dec 11, 2012||Medtronic, Inc.||Capacitor for filtered feedthrough with annular member|
|US8373965||Feb 10, 2009||Feb 12, 2013||Medtronic, Inc.||Filtered feedthrough assembly and associated method|
|US8593816||Sep 21, 2011||Nov 26, 2013||Medtronic, Inc.||Compact connector assembly for implantable medical device|
|US8982532||Feb 12, 2013||Mar 17, 2015||Medtronic, Inc.||Filtered feedthrough assembly and associated method|
|US9009935||May 6, 2009||Apr 21, 2015||Medtronic, Inc.||Methods to prevent high voltage arcing under capacitors used in filtered feedthroughs|
|US9138821 *||Apr 24, 2014||Sep 22, 2015||Medtronic, Inc.||Methods for simultaneously brazing a ferrule and lead pins|
|US20090229858 *||May 21, 2009||Sep 17, 2009||William John Taylor||Insulator for feedthrough|
|US20090321107 *||Dec 31, 2009||Medtronic, Inc.||Feedthrough assembly and associated method|
|WO2010014377A1 *||Jul 10, 2009||Feb 4, 2010||Medtronic, Inc.||Novel capacitive elements and filtered feedthrough elements for implantable medical devices|
|WO2010093651A1 *||Feb 10, 2010||Aug 19, 2010||Medtronic, Inc.||Filtered feedthrough assembly and associated method|
|WO2013162701A1 *||Mar 1, 2013||Oct 31, 2013||Medtronic, Inc.||Filling implantable medical devices for leak checking|
|U.S. Classification||29/25.42, 361/311, 29/25.35, 29/592.1, 361/313|
|Cooperative Classification||Y10T29/49002, Y10T29/49165, Y10T29/49004, H01G4/242, Y10T29/49176, Y10T29/49171, H01G4/35, Y10T29/49078, Y10T29/42, Y10T29/4913, H01G2/106, Y10T29/435|
|European Classification||H01G4/242, H01G2/10C|
|Aug 9, 2007||AS||Assignment|
Owner name: MEDTRONIC, INC., MINNESOTA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:IYER, RAJESH V.;TETTEMER, SUSAN A.;TARDIFF, JOHN P.;AND OTHERS;REEL/FRAME:019671/0343;SIGNING DATES FROM 20060327 TO 20060328
|Mar 23, 2011||FPAY||Fee payment|
Year of fee payment: 4
|Apr 16, 2015||FPAY||Fee payment|
Year of fee payment: 8