US 20080020230 A1
Improved mechanical and adhesive strength and resistance to breakage of copper integrated circuit interconnections is obtained by forming a copper alloy in a copper via/wiring connection in an integrated circuit while minimizing adverse electrical effects of the alloy by confining the alloy to an interfacial region of said via/wiring connection and not elsewhere by a barrier which reduces or substantially eliminates the thickness of alloy in the conduction path. The alloy location and composition are further stabilized by reaction of all available alloying material with copper, copper alloys or other metals and their alloys.
1. An integrated circuit including
a first layer having metal or metal alloy at a surface thereof,
a second layer adjacent to said surface having a metal or metal alloy via therein,
an interlayer connection between metal or metal alloy of said first layer and said metal or metal alloy via comprising a stable alloy region having a concentration of alloying material which is continuously graded from a diffusion reaction front at an interface between said first layer and said second layer and graded mechanical characteristics containing a predetermined quantity of alloying material which is restricted to an interfacial region of said metal or metal alloy of said first layer and said metal or metal alloy via by a barrier layer and by said quantity of alloying material being fully reacted with said metal or metal alloy of said first layer or said second layer.
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11. A method of forming a connection between metal or metal alloy at a surface of a first layer and a metal or metal alloy via of a second layer, said method comprising steps of
depositing an alloying material, and
forming an alloy confined to an interfacial region of said metal or metal alloy at a contact surface between said first layer and said metal or metal alloy of said second layer by a barrier.
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1. Field of the Invention
The present invention generally relates to semiconductor integrated circuit structures and, more particularly, to electrical interconnection structures formed of copper in integrated circuit devices.
2. Description of the Prior Art
Well-recognized improvements in performance, functionality and economy of manufacture have led to integrated circuit designs at extreme levels of device density and reduced size of electronic structures, such as transistors and capacitors, and conductive interconnections between them. At the same time, higher clock rates have increased requirements for low resistance of interconnection structures and reduced capacitive coupling between them in order to reduce signal propagation time while subjecting such structures to increased thermal cycling, often of increased severity. Moreover, increased integration density places more stringent requirements for reliability of interconnections on structures of increased complexity with increased numbers of regions which may be relatively more subject to failure, possibly causing failure of an entire device.
In the past few years, copper has been substituted for aluminum in selected structures or layers or even throughout high performance integrated circuits to achieve reduced connection resistance, good mechanical strength and more rapid signal propagation even though copper has relatively poor adhesive strength to other materials and vice-versa unless complex and special processing is employed and which may result in compromise of electrical properties. In some cases, recently developed insulating materials having a low dielectric constant (e.g. below 4.0), referred to as low-k materials, have also been used.
However, the low bulk resistance of copper, as well as its mechanical strength, can be compromised by contamination or additional materials provided, for example, to increase adhesion between layers and/or reduce electro-migration of conductor material. Low-k materials can also be subject to contamination, particularly in regard to materials that may cause corrosion of copper and may also cause mismatches of thermal expansion coefficients that can impose increased mechanical stresses on copper conductors and thus may drive breakage of weak vias. As the via-line contact from one interconnect level to another involves several intermediate processing steps between the respective metallizations, including breaking the vacuum, depositing a cap and interlayer dielectric, etching, stripping, cleaning and the like, there is significant opportunity for contamination and/or oxidation of this interface.
As such, the predominant yield and defect reliability defect failure mechanism in all types of multi-level on-chip metallization schemes tends to be at this via-line interface. That is, the layered nature of integrated circuit devices tends to increase the possibility of contamination of surfaces and/or alloying of materials with unpredictable results which may be contrary to the result intended or which may, for example, improve electro-migration or adhesion properties while degrading bulk resistance or vice-versa. Properties of alloys can also change radically with relative concentration of alloying materials and unreacted materials may diffuse and cause such changes in concentration during thermal cycling.
For example, alloying tin, indium and/or magnesium and the like with copper to reduce electro-migration without adversely affecting bulk resistance has been attempted. However, it has been found that such alloying materials getter contaminants such as sulfur and oxygen which increase bulk resistance by alloy scattering and may impede copper grain growth after electroplating, for further resistance increase. In other cases, differing solubility of alloying materials in copper or copper in other materials has required complex processing to regulate alteration of alloy composition or other undesirable effects such as copper precipitation.
In summary, while copper interconnections and via structures can potentially provide greatly improved performance by reducing signal propagation time, that performance enhancement may be compromised and the likelihood of a number of failure modes is increased due to the strong tendency toward compromised adhesion to copper as well as difficulty of avoiding or regulating reaction of copper with other materials which may cause increase of bulk resistance or adhesive weakness or both. Such weakness, tending to cause breakage, or increased bulk resistance is generally encountered at the interface of interconnection and via structures where different materials may be layered and/or contamination is most likely and where it is most difficult to avoid reaction of copper without substantial increase of processing complexity. This problem is common, albeit to differing degrees, to all multi-level metallization schemes such as aluminum, silver, gold and tungsten.
It is therefore an object of the present invention to provide a structure which provides increased strength and reliability of interconnect and via structures, particularly at their connections with no significant impact on bulk resistance or processing complexity.
In order to accomplish these and other objects of the invention, a barrier is provided adjacent a layer of alloying material to confine the alloying material within a small, shallow region of the metal or metal alloy on only one side of an interface between layers and not elsewhere. The alloy may be formed as the alloying material is deposited (e.g. at a high temperature) or later by heat treatment such as annealling to consume all available alloying material to stabilize the location and composition of the alloyed region. The barrier as well as the alloyed region also serves to avoid the metal or metal alloy on either side of the interface from sourcing further alloying beyond the shallow region at the interface between metal of metal alloy of respective layers.
Thus, in accordance with one aspect of the invention, an integrated circuit is provided including a first layer having metal or metal alloy at a surface thereof, a second layer adjacent said surface having a metal or metal alloy via therein, an interlayer connection between metal or metal alloy of the first layer and the metal or metal or metal alloy of the second layer comprising an alloy region restricted to an interfacial region of the first layer and the second layer by a barrier layer.
In accordance with another aspect of the invention, a method of forming a connection between metal or metal alloy at a surface of a first layer and a metal or metal alloy via of a second layer is provided, comprising steps of depositing an alloying material, and forming a copper alloy confined to an interfacial region of the first layer and the second layer by a barrier.
The foregoing and other objects, aspects and advantages will be better understood from the following detailed description of a preferred embodiment of the invention with reference to the drawings, in which:
Referring now to the drawings, and more particularly to
The alloying material layer provides an easily regulated amount of alloying material which is, preferably, entirely reacted with copper to form a graded and thus highly stable alloy composition distribution with stable desired properties. The alloy region also has graded mechanical properties which tends to distribute stresses applied thereto, reducing potential tendencies toward metal fatigue at via/wiring interfaces due to thermal cycling. Typically, the alloying diffusion is limited to at most one diffusion length beyond the reaction front where a fully stoichiometric alloy has formed. In many alloying systems such as Cu/Sn or Cu/In bronzes, the resulting alloy also acts as a diffusion barrier against the further penetration of alloying element or copper through the stoichiometrically formed alloy layer.
The barrier layer further confines and regulates the diffusion and reaction of the alloying material during annealing to form the desired alloy and thus further enhances the stability of the alloy composition distribution and location as well as reducing the thickness of the alloy region to limit adverse effects of resistance of the alloy region. In the case where the alloying film is not removed from regions away from the via-line (reacted) contact area, the barrier is necessary to separate the alloying film from subsequent copper fill throughout the vias and interconnection trenches on the upper dual-Damascene level.
Only the via-line contact area is allowed to react to form the alloy, and in the case of the first and second embodiment of the invention, the copper reactant is sourced from the line below the via-line interface or, in the case of the third embodiment, the copper reactant is sourced from the via above the interface. In the case where the unreacted alloying film is selectively removed, the remaining material is fully reacted and may not act as a significant source for further diffusion or reaction with the copper above. The liner/diffusion barrier is still necessary in its role for avoiding copper diffusion outside the barrier. The confinement of the alloy also avoids detrimental effects on wire and via resistance which would be caused by copper consumption after alloy formation in non-restricted areas.
The layer to be formed thereon is also a wiring layer and is connected to the lower (M1) layer by vias and thus, if placed on an M1 layer, would be identified as a V1/M2 layer since it would be the first layer with vias and the second layer with metal interconnects. The wiring/via structures of the second (V1/M2) layer are depicted as so-called dual-Damascene structures since two different patterning processes are employed in forming the different depths of the trenches and via apertures. However, other structures could be employed to which the invention is equally applicable.
As will be understood by those skilled in the art, any layer overlaid on another is subject to registration or “overlay” errors 140 which are illustrated to indicate that the invention may be practiced without engendering any sensitivity or criticality in regard to the presence or magnitude of such errors. On the contrary, it should be evident from the illustration of overlay errors that the cross-sectional area of the interface of the vias of the V1/M2 layer and the interconnects of the M1 layer may be substantially reduced by such errors and mechanical weakness and increased resistance engendered thereby. Therefore it should also be appreciated that the confinement of alloying in accordance with the invention provides increased mechanical strength where it is most needed without significantly further compromising low resistance connections.
As illustrated in
The alloying material can be freely chosen to provide the desired conductivity and mechanical properties and tin, indium, nickel, gold, silver, aluminum, beryllium, tellurium, magnesium, zinc, zirconium and the like are considered suitable for practice of the invention. The thickness of the alloying material liner component should be chosen to provide the desired alloying material concentration. The deposition temperature should be chosen in consideration of the deposition rate and diffusion rate of the alloying material in copper to achieve the desired gradation of alloying material composition. The unreacted alloying material can then be removed, as illustrated in
Then, as shown in
It should be noted that the alloying layer, barrier layer, seed layer and plated copper layer need not be patterned since portions of these layers on the upper surface of ILD layer 160 are removed by the planarization of the copper 330. It should also be appreciated that the region in which the alloy material 220 is located is stabilized at a very small thickness and cannot extend upward due to barrier layer 310 and is laterally confined to the interface between copper wiring 130 and the via portion of copper wiring 330 where the additional adhesive strength is needed for highly reliable via connections while minimizing any effects of higher resistivity of the alloy material.
Referring now to
In the following discussion of the second embodiment of the invention, elements which have been discussed above in connection with the first embodiment will have the same reference numeral applied thereto and discussion thereof will be correspondingly limited in regard to the second embodiment. Further, while overlay error illustrated in
The second embodiment 400 of the invention illustrated in
However, it is preferred that the thickness of the alloying material liner 410 be maintained as thin as possible since, in theory, a void will be formed as the alloying material is reacted. However, (without wishing to be held to any particular rationale for a phenomenon which is theoretical, has not been observed and of no discernible effect in regard to the successful practice of the invention) the development of a void, if it occurs, may be a very minuscule event and the alloying to form a very thin and shallow annulus may become stable before all alloying material is consumed possibly due to the formation of a shallow void immediately above the alloy annulus and terminating the alloying reaction. In any event, no deleterious effects attributable to a void has been observed and the dimensions of the alloy annulus are non-critical to development of improved resistance to via breakage in accordance with the invention. Therefore, the invention may be successfully practiced with any thickness of alloying material in the above range and, in effect, the noted preference for a thinner layer of alloying material is principally theoretical.
The deposition of liner 410 is followed by deposition of a barrier layer 420 of one of the above-mentioned barrier materials, preferably tantalum nitride deposited by sputtering, to a thickness also between 50 and 500 Angstroms. Again, thinner layers of barrier material (e.g. somewhat less than the diffusion length of the alloying material) are preferred to avoid consuming more of the via space than necessary and to assure that the alloy annulus which will be formed later will reach the copper in the via. The barrier layer deposition is followed by an anisotropic, vertical argon sputter etch which removes barrier 420 and liner 410 at the bottom of the trench and on other surfaces parallel to the surface of the V1/M2 layer, leaving liner 410 and barrier 420 only on the trench sidewalls, as shown in
Further, as shown in
This process can, of course, provide many possible final structures and combinations of materials for the resulting layered structure of the sidewall and barrier, particularly when it is considered that either or both of the sidewall and the barrier structures may be multi-layer structures. Some combinations of sidewall/barrier are Sn/Ta, Ta/CuSn/Ta and Al/Ta.
In summary, the second embodiment provides increased structural integrity with reduced potential compromise of conductivity at the via-line contact since the copper via extends into a recess in the M1 conductor layer and alloy is formed at the periphery thereof where stresses due to thermal cycling will be greatest. Perhaps more importantly, the copper of the M1 layer wiring is directly adjacent to the copper of the via in the V1/M2 layer for further reduced resistance compared with the first embodiment since no alloy is interposed between the via and the connecting line.
It should be appreciated that the sacrificial liner technique can also be applied in a manner similar to the first embodiment by reversing the order of the liner 410 and barrier 420 and depositing the alloying material at a high temperature to react with the underlying copper prior to deposition of the tantalum barrier layer 420′. Alternatively, an alloy annulus can be formed using the barrier 420′ instead of barrier 420 when the barrier and alloying material layer are reversed and then annealing after formation of barrier 420′ or during deposition of tantalum at a high temperature.
Referring now to
This difference may be useful in some processing circumstances and provides advantages of increased resistance to damage of the via/wiring connection as well as reduced resistance and increased stability of location and composition of alloy compared with prior processes as produced by the first and second embodiments described above. However, small quantities of unreacted alloying material may remain, the alloyed region may be slightly thicker than in the first embodiment and the processing is more complex than either the first or second embodiments of the invention. Therefore, the third embodiment is not preferred for general application but may provide the meritorious effects of the invention in structures to which the first and second embodiments cannot be applied.
In view of the foregoing, the invention provides improved reliability of integrated circuit interlayer connections while preserving low electrical resistance by forming copper alloy of desired mechanical properties but confining the alloy to an extremely thin region at the interlayer via/wiring interfacial region and not elsewhere. The invention is not limited to copper vias and interconnects but is equally applicable to copper alloys and other metals and their alloys as well as at interfaces between different metals and/or metal alloys and in structures other than connections between lines and vias. The thickness of an alloy region is reduced or substantially avoided in the conduction path by confinement of diffusion of the alloying material to only the via or the wiring copper or to an annulus surrounding the conduction path.
While the invention has been described in terms of a single preferred embodiment, those skilled in the art will recognize that the invention can be practiced with modification within the spirit and scope of the appended claims.