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Publication numberUS20080137289 A1
Publication typeApplication
Application numberUS 11/608,378
Publication dateJun 12, 2008
Filing dateDec 8, 2006
Priority dateDec 8, 2006
Also published asCN101548255A, CN101548255B, DE602007013933D1, EP2092406A1, EP2092406B1, US8120908, US20100067191, WO2008073592A1
Publication number11608378, 608378, US 2008/0137289 A1, US 2008/137289 A1, US 20080137289 A1, US 20080137289A1, US 2008137289 A1, US 2008137289A1, US-A1-20080137289, US-A1-2008137289, US2008/0137289A1, US2008/137289A1, US20080137289 A1, US20080137289A1, US2008137289 A1, US2008137289A1
InventorsMehmet Arik, Charles Franklin Wolfe, Yogen Vishwas Utturkar, Charles Erklin Seeley, David Shannon Slaton, William Henry Lueckenbach
Original AssigneeGeneral Electric Company
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Thermal management system for embedded environment and method for making same
US 20080137289 A1
Abstract
A thermal management system for an embedded environment is described. The thermal management system includes a pleumo-jet that has at least one wall defining a chamber, at least one piezoelectric device on the at least one wall, and a compliant material within the at least one wall and encompassing the chamber. The compliant material has at least one opening providing fluid communication between said chamber and the embedded environment. A cooling system is also described. A method for making a pleumo-jet is also described.
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Claims(29)
1. A thermal management system for a heated environment, comprising:
a pleumo-jet, comprising:
at least one wall defining a chamber;
at least one active material on said at least one wall; and
a compliant material within said at least one wall and encompassing said chamber, said compliant material having at least one opening facilitating fluid communication between said chamber and the heated environment.
2. The thermal management system of claim 1, wherein said compliant material comprises an elastomeric material.
3. The thermal management system of claim 1, comprising an electrical circuit to provide an electrical current to said pleumo-jet.
4. The thermal management system of claim 3, wherein said electrical current is one exhibiting lowered harmonics.
5. The thermal management system of claim 4, wherein said electrical current omprises a sine wave.
6. The thermal management system of claim 1, wherein the heated environment includes single board computers, programmable logic controllers (PLCs), operator interface computers, laptop computers, cell phones, personal digital assistants (PDAs), and personal pocket computers.
7. The thermal management system of claim 1, wherein the heated environment comprises at least one heated body.
8. The thermal management system of claim 7, wherein said at least one opening is positioned to eject an ambient fluid directly on said at least one heated body.
9. The thermal management system of claim 8, wherein said at least one opening is at an angle transverse to an upper surface of the at least one heated body.
10. The thermal management system of claim 1, wherein said elastomeric material comprises a plurality of openings facilitating fluid communication between said chamber and the heated environment.
11. The thermal management system of claim 10, wherein said at least one wall has a circular profile.
12. The thermal management system of claim 10, wherein said at least one wall has a rectangular profile.
13. The thermal management system of claim 1, comprising:
a base upon which said pleumo-jet is positioned; and
a plurality of fins surrounding said pleumo-jet.
14. The thermal management system of claim 13, comprising a plurality of pleumo-jets positioned on said base in a stacked arrangement.
15. The thermal management system of claim 1, wherein said pleumo-jet comprises a pair of walls sandwiching said elastomeric material, each of said walls having said at least one piezoelectric device.
16. A pleumo-jet, comprising:
a first flexible structure;
a second flexible structure;
at least one active material on at least one of said first and second flexible structures; and
a compliant material positioned between said first and second flexible structures and defining a chamber, wherein said compliant material comprises at least one orifice for facilitating fluid communication between said chamber and an ambient environment.
17. The pleumo-jet of claim 16, comprising an electrical circuit to provide an electrical current to the at least one active material.
18. The pleumo-jet of claim 16, wherein said compliant material comprises an elastomeric material.
19. The pleumo-jet of claim 16, wherein said apparatus is no larger than meso-scale sized.
20. The pleumo-jet of claim 16, wherein said at least one active material comprises a piezoceramic material.
21. The pleumo-jet of claim 16, wherein said at least one active material is positioned on both of said first and second flexible structures.
22. A cooling system for a heated environment, comprising:
a substrate having one free end and one anchored end;
at least one piezoelectric device positioned on said substrate; and
an electrical circuit to provide an electrical current to the at least one piezoelectric device.
23. The cooling system of claim 22, wherein the heated environment includes single board computers, programmable logic controllers (PLCs), operator interface computers, laptop computers, cell phones, personal digital assistants (PDAs), and personal pocket computers.
24. The cooling system of claim 22, wherein said substrate is no larger than meso-scale sized.
25. A method for making a pleumo-jet, comprising:
providing a pair of flexible flexible structures, at least one of the structures having an attached active material;
attaching a compliant material between the pair of flexible structures, said elastomeric material having at least one orifice; and
adding electrical contacts to the pair of flexible structures.
26. The method of claim 25, wherein said providing comprises providing attached active material for each of the pair of flexible flexible structures.
27. The method of claim 25, wherein said attaching comprises attaching an elastomeric material between the pair of flexible structures.
28. The method of claim 25, wherein said attaching comprises:
dispensing the compliant material as a semi-liquid silicone-based material;
contacting the semi-liquid silicon-based material with one of the flexible structures; and
placing the other of the flexible structures in contact with the semi-liquid silicone-based material.
29. The method of claim 25, wherein said attaching comprises:
forming the compliant material from a pre-made sheet of silicone-based material; and
bonding the compliant material to the pair of flexible structures.
Description
BACKGROUND

The invention relates generally to thermal management systems, and more particularly to thermal management systems for use in embedded environments.

Environments having embedded electronic systems, hereinafter embedded environments or heated environments, offer challenges for thermal management. Such systems produce waste heat as a part of their normal operation, heat that must be removed for proper performance and reliability of the embedded electronics. The design of thermal management systems to provide cooling for embedded electronics is a formidable challenge due to space limitations. Examples of embedded electronic systems include single board computers, programmable logic controllers (PLCs), operator interface computers, laptop computers, cell phones, personal digital assistants (PDAs), personal pocket computers, and other small electronic devices, there is a limited amount of available space for thermal management systems. It has been known to use passive cooled heat sinks or forced air-cooling as thermal management systems to assist in the removal of heat from electronic components. Further, it has been known that conducting the heat generated by electronic components to a printed circuit board, on which they are mounted, thereby providing a migration of the heat from a smaller area to a larger area.

SUMMARY

The invention includes embodiments that relate to a thermal management system for a heated environment that includes a pleumo-jet. The pleumo-jet includes at least one wall defining a chamber, at least one active material on the at least one wall, and a compliant material within the at least one wall and encompassing the chamber. The compliant material has at least one opening facilitating fluid communication between the chamber and the heated environment.

The invention includes embodiments that relate to a pleumo-jet that includes a first flexible structure, a second flexible structure, at least one active material on at least one of the first and second flexible structures, and a compliant material positioned between the first and second flexible structures and defining a chamber. The compliant material includes at least one orifice for facilitating fluid communication between the chamber and an ambient environment.

The invention includes embodiments that relate to a cooling system for a heated environment. The cooling system includes a substrate having one free end and one anchored end, at least one piezoelectric device positioned on the substrate, and an electrical circuit to provide an electrical current to the at least one piezoelectric device.

The invention includes embodiments that relate to a method for making a pleumo-jet. The method includes providing a pair of flexible structures, at least one of the structures having an attached active material, attaching a compliant material between the pair of flexible structures, the elastomeric material having at least one orifice, and adding electrical contacts to the pair of flexible structures.

These and other advantages and features will be more readily understood from the following detailed description of preferred embodiments of the invention that is provided in connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional side view of a thermal management system utilizing a pleumo-jet constructed in accordance with an embodiment of the invention.

FIG. 2 is a cross-sectional side view showing the thermal management system of FIG. 1 with the pleumo-jet in a different position.

FIG. 3 is a top view of a thermal management system constructed in accordance with an embodiment of the invention.

FIG. 4 is a cross-sectional side view of the thermal management system of FIG. 3 taken along line IV-IV.

FIG. 5 is a top view of a pleumo-jet constructed in accordance with an embodiment of the invention.

FIG. 6 is a top view of a pleumo-jet constructed in accordance with an embodiment of the invention.

FIG.7 is a side view of the pleumo-jet of FIG. 6.

FIG. 8 is a schematic view a thermal management system utilizing a piezoelectrically driven flexible cooling apparatus constructed in accordance with an embodiment of the invention.

FIG. 9 is a schematic view showing the thermal management system of FIG. 8 with the piezoelectrically driven flexible cooling apparatus in a different position.

FIG. 10 illustrates process steps for forming a pleumo-jet in accordance with an embodiment of the invention.

DETAILED DESCRIPTION

Referring to FIGS. 1 and 2, there is shown a thermal management system 10 that includes a pleumo-jet 12 illustrated in cross-section and placed in proximity to a printed circuit board assembly (PCA) 30 having a plurality of electronic components to be cooled 32 a-d. While a PCA 30 is depicted with reference to an embodiment of the invention, it should be appreciated that the thermal management system 10 may be utilized in any suitable embedded environment and its depiction with reference to the PCA 30 is merely for convenience in description. The PCA 30 may be used in heated environments in any number of small electronic devices, such as, for example, single board computers, programmable logic controllers (PLCs), laptop computers, cell phones, personal digital assistants (PDAs), personal pocket computers, to name a few. The pleumo-jet 12 is sized appropriately for its use, and generally is in the meso-scale or micro-scale.

The pleumo-jet 12 is positioned such that a pulsating fluid stream of ambient air can be generated from the apparatus 12 and directed at the electronic components to be cooled 32 a-d. As shown, in FIG. 1, a fluid stream of ambient air, or other fluid, is directed along direction A toward the electronic component to be cooled 32 b. Alternatively, the pleumo-jet 12 may be positioned to direct a fluid stream of ambient air along direction B toward the electronic component to be cooled 32 b (FIG. 2).

The pleumo-jet 12 includes a first structure or wall 14 and a second structure or wall 16. The walls 14, 16 are formed of a flexible material, such as, for example, metal, foil, plastic, or polymer composite material. A compliant material 18 is positioned between the pair of walls 14, 16, and the combination of the walls 14, 16 and the compliant material 18 define a chamber 20. At least one orifice 22 provides a channel between the chamber 20 and the environment outside the apparatus 12. Although a pair of opposing walls 14, 16 are depicted, it should be appreciated that instead of two walls, a single wall (wrapping around to form a cylinder) along with the compliant material 18 may form a pleumo-jet, such as the pleumo-jet 12.

Positioned on at least one of the walls 14, 16 is an active material, such as, for example, a piezoelectric material. As shown, active materials 24 and 26 are positioned, respectively, on walls 14 and 16. A suitable active material is one which is capable of creating stress resulting from an electrical stimulus. Examples of suitable active material include piezoelectric material, magnetostrictive material (magnetic fields from coils attract/oppose one another), shape-memory alloy, and motor imbalance (motor with a mass imbalance creates oscillatory motion). Within the subset of piezoelectric materials, suitable active materials include bimorph piezoelectric configurations, where two piezo layers are energized out of phase to produce bending; thunder configurations, where one piezo layer is disposed on a pre-stressed stainless steel shim; buzzer element configurations, where one piezo layer is disposed on a brass shim; and MFC configurations, where a piezo fiber composite on a flexible circuit is bonded to a shim.

The active material 24, 26 may incorporate a ceramic material. Electrical circuitry (schematically depicted in FIG. 8) is attached to the pleumo-jet 12 to provide an electrical current to one or both of the active material 24, 26. The current may be provided as a sine wave, a square wave, a triangular wave, or any other suitable waveform, and it should be appreciated that the current is not to be limited to any specific wave form. Specifically, it has been found that currents having lower harmonics, such as, for example, a sine wave may be used to provide a quieter pleumo-jet 12.

FIGS. 3 and 4 illustrate a thermal management system 110 in accordance with another embodiment of the invention. The thermal management system 110 includes a pleumo-jet system 111, which has a plurality of pleumo-jets in a stacked arrangement. As shown, the pleumo-jet system 111 includes pleumo-jets 112 a, 112 b, and 112 c in a stacked arrangement. The pleumo-jet 112 c is positioned over a base 129 and supported in that location with one or more supports 127. The pleumo-jets 112 a, 112 b, and 112 c have a similar construction to the pleumo-jet 12 (FIGS. 1, 2), with the optional exception of the orifices. Specifically, each of the pleumo-jets 112 a, 112 b, and 112 c includes flexible walls and a compliant material defining a chamber 120, and each of the flexible walls has one or more active materials (not shown). Supports between the pleumo-jets 112 a, 112 b, and 112 c are necessary to provide sufficient room to accommodate the active materials on one or both flexible walls of each pleumo-jet.

Each pleumo-jet 112 a, 112 b, and 112 c may include a single orifice 122 extending from the chambers 120 through the compliant material. The pleumo-jet system 111 may be arranged such that each of the single orifices 122 of each pleumo-jet 112 a, 112 b, and 112 c is positioned in the same direction (FIG. 4). Alternatively, each of the single orifices 122 may be positioned to direct ambient air in a different direction than the other single orifices 122 (FIG. 3). For any two adjacent orifices 122, the separation between the orifices 122 may be in a range between just above zero degrees (0) to less than ninety degrees (90). In one embodiment, adjacent orifices 122 may be separated by a range of about 5 to about 45.

The pleumo-jets 112 a, 112 b, and 112 c are surrounded by fins 128, which are supported on the base 129. The fins 128 assist in increasing the surface area for heat transfer for cooling the electronic components 32 a-d. As with the previously described pleumo-jet 12, the pleumo-jets 112 a, 112 b, and 112 c utilize active material, for example a piezoelectric material (not shown), to form streams of ambient air. Briefly, electrical current from electrical circuitry (shown in FIG. 8) is received by the active material, and transformed into mechanical energy. The electrical current can take the form of a sine wave, a square wave, a triangular wave, or any other suitable wave form. The voltage level for the electrical current may be between 1 and 150 volts but is not so limited. The frequency of the current may be between 2 and 300 hertz for embodiments requiring reduced noise, and between 300 hertz and 15 kilohertz for embodiments that do not require reduced noise levels.

The active material creates stress on the flexible walls, causing them to flex inwardly, resulting in a chamber volume change and an influx of ambient air into the chambers 120, and then outwardly, thereby ejecting the ambient air from the chambers 120 via the orifices 122.

Another alternative embodiment of a pleumo-jet system is illustrated in FIG. 5. Specifically, a pleumo-jet system 211 is illustrated as including a base 229 supporting a pleumo-jet 212. The pleumo-jet 212 has a plurality of orifices 222, each extending outwardly in different radial directions. An active material 224 is shown on a surface of a flexible wall of the pleumo-jet 212. For any two adjacent orifices 222, the separation between the orifices 222 may be in a range between just above 0 to less than 90. In one embodiment, adjacent orifices 222 may be separated by a range of about 5 to about 45.

FIGS. 6 and 7 illustrate a pleumo-jet 312. The pleumo-jet 312 includes a first flexible wall or structure 314, a second flexible wall or structure 316, and a compliant material 318 positioned between the flexible walls 314, 316. The walls 314 and 316 are rectangular in shape and, together with the compliant material 318, form a chamber (not shown). Orifices 322 extend out through the compliant material 318 from the chamber to the ambient environment. An active material 324 is positioned on the wall 314, and optionally an active material 326 may be positioned on the wall 316. The active material can be activated with an electric current provided by electrical circuitry (not shown) to create stress on the wall(s) 314 (and 316) to allow for the ingestion of ambient air into the chamber and the expulsion of the ambient air from the chamber to the ambient, heated environment.

FIGS. 8 and 9 illustrate another embodiment of a thermal management system. A thermal management system 410 is illustrated as including a piezoelectric fan apparatus 412 in working relationship with a PCA 30 containing electronic components to be cooled 32 a-d. The piezo fan apparatus 412 includes one free end and one end fixed to a support member 420. The piezo fan apparatus includes a substrate 414 and an active material 416. The active material 416 may utilize, for example, a piezoceramic material.

An electrical circuit 418 is connected to the piezo fan apparatus 412. Running an electrical current through the piezo fan apparatus 412 sends an electrical charge through the active material 416. The active material 416 transforms the electrical energy into mechanical energy by creating a stress on the substrate 414, causing it to rotate about the fixed end. This creates a current of ambient air to travel in a direction C (FIG. 8) or in a direction D (FIG. 9), depending upon the positioning of the piezo fan apparatus 412 relative to the electronic components to be cooled 32 a-d.

Next, and with specific reference to FIG. 10, will be discussed a process for forming a pleumo-jet in accordance with an embodiment of the invention. At Step 500, a pair of flexible structures is provided. The flexible structures may be metallic or they may be non-metallic, such as plastic or polymer composite material. Examples of the flexible structures include flexible walls 14, 16 (FIGS. 1, 2) and flexible walls 314, 316 (FIGS. 6, 7). One or both of the flexible structures require an active material that is excitable by an electrical stimulus to be affixed thereon. Suitable examples of active material include material 24, 26 (FIGS. 1, 2) and material 324, 326 (FIGS. 6, 7).

At Step 505, a compliant material is attached between the flexible structures. The compliant material may be compliant material 18 (FIGS. 1, 2) or compliant material 318 (FIGS. 6, 7). The compliant material is to be provided in such a form as to define a chamber between the flexible structures. One process for providing the compliant material is to dispense the compliant material in a liquid or semi-liquid form onto one of the flexible structures, placing the other conductive structure on the compliant material, and allowing the compliant material to dry. A liquid silicone-based material may be suitable for such a process. Another process for providing the compliant material is to cut the compliant material from a pre-made sheet of compliant material, and bonding the pre-made sheet of cut compliant material to the flexible structures. A pre-made silicone-based sheet of material may be suitable for this process.

At Step 510, electrical contacts are provided to the flexible structures. Electrical circuitry will be attached to the electrical contacts.

While the invention has been described in detail in connection with only a limited number of embodiments, it should be readily understood that the invention is not limited to such disclosed embodiments. Rather, the invention can be modified to incorporate any number of variations, alterations, substitutions or equivalent arrangements not heretofore described, but which are commensurate with the spirit and scope of the invention. Additionally, while various embodiments of the invention have been described, it is to be understood that aspects of the invention may include only some of the described embodiments. Accordingly, the invention is not to be seen as limited by the foregoing description, but is only limited by the scope of the appended claims.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7550901 *Sep 27, 2007Jun 23, 2009Intel CorporationPiezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using same
US7619894 *Feb 22, 2008Nov 17, 2009Inventec CorporationHeat dissipation device
US7633753 *Sep 27, 2007Dec 15, 2009Intel CorporationPiezoelectric air jet augmented cooling for electronic devices
US8120908 *Oct 26, 2007Feb 21, 2012General Electric CompanyThermal management system for embedded environment and method for making same
US8246324 *Jun 10, 2009Aug 21, 2012Hon Hai Precision Industry Co., Ltd.Piezoelectric fan assembly
US8418934 *Aug 26, 2008Apr 16, 2013General Electric CompanySystem and method for miniaturization of synthetic jets
US8453715 *Oct 30, 2008Jun 4, 2013General Electric CompanySynthetic jet embedded heat sink
US8496049Apr 9, 2009Jul 30, 2013General Electric CompanyHeat sinks with distributed and integrated jet cooling
US8506105Aug 18, 2011Aug 13, 2013Generla Electric CompanyThermal management systems for solid state lighting and other electronic systems
US8695686 *Jan 7, 2010Apr 15, 2014General Electric CompanyMethod and apparatus for removing heat from electronic devices using synthetic jets
US20100110630 *Oct 30, 2008May 6, 2010Mehmet ArikSynthetic jet embedded heat sink
US20110162823 *Jan 7, 2010Jul 7, 2011General Electric CompanyMethod and apparatus for removing heat from electronic devices using synthetic jets
EP2239775A2 *Mar 31, 2010Oct 13, 2010General Electric CompanyHeat sinks with distributed and integrated jet cooling
Classifications
U.S. Classification361/689
International ClassificationH05K7/20
Cooperative ClassificationY10S165/908, G06F1/20
European ClassificationG06F1/20
Legal Events
DateCodeEventDescription
Jan 22, 2007ASAssignment
Owner name: GENERAL ELECTRIC COMPANY, NEW YORK
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ARIK, MEHMET;WOLFE, CHARLES FRANKLIN;UTTURKAR, YOGEN VISHWAS;AND OTHERS;REEL/FRAME:018783/0989;SIGNING DATES FROM 20061130 TO 20061205