US 20080191235 A1
A light emitting diode structure with a high heat dissipating effect includes a lead frame, a chip, two lead wires, an internal casing and an external casing. The lead frame has a first electrode and a second electrode, and the first electrode forms a cavity for installing the visible or invisible light chip in the cavity, and the chip is electrically coupled to two lead wires, and an end of the two lead wires is electrically and respectively coupled to the first and second electrodes, and the chip has an internal casing, and the two lead wires of the lead frame and the surface of the internal casing are wrapped by an external casing having a base and a lens.
1. A light emitting diode structure with high heat dissipation, comprising:
a lead frame, having a first electrode and a second electrode disposed thereon;
a carrying portion disposed on the first electrode,
a cavity disposed on a front side of the carrying portion;
a first lead coupled to an end of the carrying portion;
a heat dissipating protrusion disposed on a back side of the carrying portion and protruding from the back side of the carrying portion essentially in a normal direction thereof;
a solder portion and a second formed on the second electrode;
a chip, mounted onto the cavity;
two lead wires, for electrically coupling the chip to the first and second electrodes; and
an external casing, having a base for wrapping the carrying portion, the chip, the lead wire and the solder portion, and the base carrying a lens;
thereby, back sides of the first and second electrodes are exposed after the external casing wraps the carrying portion, the chip, the lead wire and the solder portion.
wherein the carrying portion is configured to transfer heat out of the external casing to an ambient environment via the heat dissipating protrusion.
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1. Field of the Invention
The present invention relates to a light emitting diode, and more particular to a light emitting diode with a high heat dissipating effect.
2. Description of Prior Art
Traditional light emitting diode (LED) gradually replaces traditional light bulb due to its compact size, low power consumption, and long life expectancy, and thus LEDs are used extensively in the different areas such as traffic lights, signal lights, flashlights, mobile phones, lamps and large outdoor billboards. Since the brightness of a single piece of light emitting diode is very limited, several pieces of light emitting diodes are combined to produce a high-brightness light source, but such arrangement causes more complicated manufacturing processes and incurs higher costs.
As a result, a high-power light emitting diode is introduced to the market, and the high-power light emitting diode can produce a super high brightness light source, and its application simply requires several light emitting diodes to achieve the brightness required for illuminations and displays. Since the high-power light emitting diode can produce a super high-brightness light source and its application also causes a very high heat source, therefore a heat sinking slug is usually combined with the high-power light emitting diode to guide and dissipate the heat source produced by the light emitting chip, so as to ensure a long life expectancy of the high-power light emitting diode.
U.S. Pat. No. 6,274,924 entitled “Surface mountable LED package” discloses a heat sinking slug combined with a high-power light emitting diode. In the manufacturing process of a light emitting diode in accordance with such patented technology, a metal frame is prepared first; a base filled with a plastic material is formed on the metal frame; a through hole is created at the center of the base for inserting a reflector cup on the heat sinking slug into the through hole, an insulating base is produced in the reflector cup, and a chip is mounted onto the base; a lead wire is bonded between the chip and the frame; and an optical lens is packaged onto the base.
When the light emitting chip in accordance with the foregoing patented technology is lit, the heat produced by the light emitting chip is dissipated from the heat sinking slug to achieve the heat dissipating effect, but this type of high-power light emitting diodes involves a complicated manufacturing process and many types of equipments, and thus the manufacture consumes much time, takes many steps, and incurs high costs.
In view of the foregoing shortcomings of the prior art, the inventor of the present invention based on years of experience in the related industry to conduct experiments and modifications, and finally developed a light emitting diode with a high heat dissipating effect by using simple equipment to overcome the shortcomings of the prior art and lower the manufacturing cost significantly.
Therefore, it is a primary objective of the present invention to provide a light emitting diode structure with high dissipating, and the structure comprises: a lead frame, a chip, two lead wires, an internal casing and an external casing. The lead frame has a first electrode and a second electrode, a carrying portion disposed on the first electrode, a cavity and a plurality of through holes disposed on the carrying portion, a lead coupled to an end of the carrying portion, a heat dissipating protrusion disposed on the back side of the carrying portion, a solder portion and a lead disposed on the second electrode, a plurality of through holes disposed on the solder portion for installing the visible or invisible light chip into a cavity of the first electrode, two lead wires electrically coupled to the chip, an end of the two lead wires respectively and electrically coupled to the lead frame, an internal casing formed on the chip, and an external casing having a base and a lens formed at the internal casing, the two lead wires and the lead frame.
The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself however may be best understood by reference to the following detailed description of the invention, which describes certain exemplary embodiments of the invention, taken in conjunction with the accompanying drawings in which:
The technical characteristics, features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings. The drawings are provided for reference and illustration only, but not intended for limiting the present invention.
Step 10: preparing a thick metal;
Step 20: shaping the thick metal into a plurality of connected lead frames by an etching technology or a punching technology;
Step 30: fixing a visible or invisible light chip onto the lead frame by an adhesive to complete a chip bonding process, wherein the adhesive is either non-conductive or conductive (such as a silver paste or a thermal paste);
Step 40: soldering the two lead wires onto the chip, and then soldering the two lead wires with the lead frame to complete a wire bonding process;
Step 50: dispensing silicon onto the chip to protect the chip, and dispensing an epoxy compound on the surface of the silicon (such as the manufacture of yellow light emitting diodes) at the chip, adhesive, lead wire and lead frame, and if it is necessary to manufacture a white light emitting diode, a fluorescent colloid is dispensed onto the chip first, and then silicon is dispensed onto the fluorescent colloid, and finally the epoxy resin is dispensed onto silicon; and
Step 60: pressing the compound into cylindrical, hemispherical or square base and lens by a thermal compression technology to complete the manufacture of a light emitting diode.
In view of the manufacturing flow described above, the light emitting diode of the invention comes with a simple structure, an easy manufacturing process, and easy-to-use equipments for lowering the manufacturing cost of the light emitting diode.
The present invention is illustrated with reference to the preferred embodiment and not intended to limit the patent scope of the present invention. Various substitutions and modifications have suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.