US20090029185A1 - Magnetic device and manufacturing method thereof - Google Patents
Magnetic device and manufacturing method thereof Download PDFInfo
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- US20090029185A1 US20090029185A1 US12/022,040 US2204008A US2009029185A1 US 20090029185 A1 US20090029185 A1 US 20090029185A1 US 2204008 A US2204008 A US 2204008A US 2009029185 A1 US2009029185 A1 US 2009029185A1
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 238000000034 method Methods 0.000 claims description 33
- 239000000696 magnetic material Substances 0.000 claims description 25
- 229910000859 α-Fe Inorganic materials 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 229920002120 photoresistant polymer Polymers 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000005245 sintering Methods 0.000 claims description 10
- 239000006247 magnetic powder Substances 0.000 claims description 9
- 238000001723 curing Methods 0.000 claims description 8
- 239000002861 polymer material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229910003962 NiZn Inorganic materials 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 238000009760 electrical discharge machining Methods 0.000 claims description 2
- 238000007772 electroless plating Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000003801 milling Methods 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000007514 turning Methods 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 239000012774 insulation material Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
- H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
- H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
- H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
- H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12201—Width or thickness variation or marginal cuts repeating longitudinally
Definitions
- the invention relates to a magnetic device and a manufacturing method thereof.
- Magnetic devices have been widely applied to inductors or noise filters of electronic products.
- the conventional magnetic devices are made by winding enameled copper wires around magnetic cores.
- the miniaturization of the conventional magnetic devices is restricted by the conventional manufacturing apparatuses, the width of the copper wires and the size of the magnetic cores.
- the micro-fabrication technology can bring smaller inductors and filters, such as the common-mode noise filters.
- a ferrite that can fit to high frequency operation is often used as a substrate. Then a coil is formed on the ferrite by the micro-fabrication technology. As show in FIG. 1 , a coil 13 and two non-magnetic materials 14 and 15 are disposed between two ferrite substrates 11 and 12 so as to form a magnetic device 1 . Because the magnetic device 1 must be surface-planarized, the non-magnetic materials 14 and 15 are indispensable and the thicknesses thereof must be greater than a certain value. Hence the whole thickness of the magnetic device 1 is larger than that desired. Furthermore, the coil 13 is surrounded by the non-magnetic materials 14 and 15 , so the inductance of the magnetic device 1 is reduced.
- a first ferrite 22 , a coil 23 , a second ferrite 24 and two external electrodes 25 are formed on a substrate 21 in sequence by screen printing, and then sintered to form a magnetic device 2 .
- the coil 23 of the magnetic device 2 is directly surrounded by the ferrites 22 , 24 , the magnetic device 2 can be thinner and higher inductance.
- the sintering temperature is up to 1000° C. to 1200° C., the usable material of the coil 23 is limited. For example, aluminum can not be adopted as the material of the coil 23 .
- a first ferrite 32 , a seed layer 35 , a coil 33 , a second ferrite 34 and a protection layer 36 are formed in sequence on a substrate 31 by electroplating to form a magnetic device 3 .
- the coil 33 of the magnetic device 3 is directly surrounded by the ferrites 32 , 34 , the magnetic device 3 can become thinner and higher inductance.
- the magnetic properties of the ferrites 32 and 34 made by a ferrite plating method are poorer than that of the ferrites made by sintering.
- the magnetic device 3 has worse inductance and quality factor (Q) than that of the magnetic device 2 .
- the invention is to provide a magnetic device and a manufacturing method thereof that can become thinner and higher inductance and has no limitation on the material of the coil.
- the invention discloses a manufacturing method of a magnetic device including the steps of: forming a magnetic substrate having at least one recess, and forming at least one coil at the recess.
- a magnetic device includes a magnetic substrate and at least one coil.
- the magnetic substrate has at least one recess, and the coil is disposed in the recess.
- the magnetic substrate of the invention is formed in advance, and the magnetic substrate has the recess for accommodating the coil.
- the magnetic device has a thinner thickness and higher inductance.
- the coil is formed after the magnetic substrate is made, so the magnetic substrate can be made by sintering if the material of the substrate is ferrite. Therefore, the magnetic substrate can have pretty good magnetic properties, and the material of the coil is not limited because of the high temperature process.
- FIG. 1 is a schematic view of a first conventional magnetic device
- FIG. 2 is a schematic view of a second conventional magnetic device
- FIG. 3 is a schematic view of a third conventional magnetic device
- FIGS. 4A to 4F are schematic diagrams of magnetic devices according to various embodiments of the invention.
- FIGS. 5A to 5D are schematic diagrams showing the manufacturing steps of two of the magnetic devices according to the embodiments of the invention.
- FIGS. 6A to 6C are schematic diagrams showing a first manufacturing method of the recess of the magnetic device according to the embodiments of the invention.
- FIGS. 7A to 7C are schematic diagrams showing a second manufacturing method of the recess of the magnetic device according to the embodiments of the invention.
- FIGS. 8A to 8C are schematic diagrams showing a third manufacturing method of the recess of the magnetic device according to the embodiments of the invention.
- a magnetic device 4 includes a magnetic substrate 41 and at least one coil 42 .
- the magnetic substrate 41 can be formed by sintering or curing.
- the magnetic substrate 41 has at least one recess 43 disposed on one side of the magnetic substrate 41 for accommodating the coil 42 .
- the material of the magnetic substrate 41 can be ferrite mixed with a binder.
- the ferrite can be, for example, NiZn ferrite or MnZn ferrite.
- the material of the magnetic substrate 41 can be a metal soft magnetic powder mixed with a polymer material as the isolation among magnetic particles.
- the material of the coil 42 can be alloy or metal such as copper or aluminum.
- the magnetic device 4 can have several variations, for example as shown in FIGS. 4B to 4F .
- the magnetic substrate 41 A of the magnetic device 4 a is a cylindrical magnetic core, and the recess 43 A is disposed on the outer surface of the magnetic core.
- the coil 42 A is disposed in the recess 43 A.
- the recesses 43 and 43 B are disposed on the opposite sides of the magnetic substrate 41 B.
- the coils 42 and 42 B are disposed in the recesses 43 and 43 B, respectively, so that the magnetic device 4 b has the coils 42 and 42 B disposed at its opposite sides.
- the magnetic device 4 c further includes a non-magnetic material 44 formed on the coil 42 and the magnetic substrate 41 with recesses 43 accommodating the coil 42 . Therefore, the coil 42 is disposed between the non-magnetic material 44 and the magnetic substrate 41 . Moreover, the magnetic device 4 c further includes another magnetic substrate 45 which is connected to the non-magnetic material 44 .
- the non-magnetic material 44 can be oxide, nitride, spin-on glass (SOG), polymer material, epoxy resin or any other material with adhesion or insulation function.
- the magnetic substrate 45 can adhere to the magnetic substrate 41 through the non-magnetic material 44 , and the short circuit of the coil 42 due to the material of the magnetic substrate 45 can be prevented. Furthermore, the additional magnetic substrate 45 can increase the inductance of the magnetic device 4 c and decrease the inductor loss.
- two magnetic devices 4 are connected oppositely to form the magnetic device 4 d .
- the magnetic devices 4 can be adhered to each other and separated by the non-magnetic material 44 .
- two magnetic substrates 45 are adhered to the top and bottom sides of the magnetic device 4 b , respectively, to form the magnetic device 4 e .
- the magnetic substrates 45 can be adhered to the magnetic device 4 b through the non-magnetic materials 44 .
- the magnetic devices 4 , 4 a , 4 c with one-sided coil can be applied to the inductors or some electronic devices with one-sided coil.
- the magnetic devices 4 b , 4 d and 4 e with two-sided coils can be applied to the filters, transformers, double-layer inductors or some electronic devices with two-sided coils.
- the manufacturing method of the magnetic devices 4 , 4 c of the invention is illustrated as follows.
- a magnetic substrate 41 having at least one recess 43 is formed by sintering or curing a magnetic base.
- a metal layer 46 is formed in the recesses 43 .
- a portion of the metal layer 46 is removed for forming the coil 42 .
- the magnetic device 4 can be manufactured.
- the metal layer 46 can be formed by electroplating, electroless plating or deposition.
- the metal layer 46 can be made by screen printing a copper paste or a silver paste on the recesses 43 , and then is cured.
- the portion of the metal layer 46 can be removed by a semiconductor process, a MEMS process or a grinding process.
- the manufacturing method further includes a step of forming a non-magnetic material 44 at one side of the coil 42 , so that the coil 42 can be disposed between the non-magnetic material 44 and the magnetic substrate 41 .
- another magnetic substrate 45 is provided to connect to the non-magnetic material 44 , thereby forming the magnetic device 4 c .
- the non-magnetic material 44 can be formed by deposition or coating.
- the magnetic substrate 45 can connect to the non-magnetic material 44 by adhesion or wedging.
- the magnetic devices 4 a , 4 b , 4 d , 4 e can also be made by the above-mentioned manufacturing method.
- the magnetic substrate 41 a is cylindrical so that it can be rotated to make the metal layer uniformly formed thereon.
- the magnetic device 4 b because the recesses are disposed in two sides of the magnetic device 4 b , two metal layers are needed.
- the magnetic device 4 d two magnetic devices 4 can be manufactured in advance and then adhered to each other through the non-magnetic material 44 .
- it can be formed by the manufacturing processes of the magnetic device 4 b and the magnetic device 4 c.
- the recesses of the magnetic substrate can be formed by many methods.
- the first method for forming the recesses is illustrated below with reference to FIGS. 6A to 6C .
- a magnetic powder is disposed into a mold 5 , which has the structure corresponding to the recess 43 . Then, the magnetic powder in the mold 5 is pressurized to form a magnetic base 47 .
- the structure of the mold 5 corresponding to the recess 43 can be made by ordinary machining, etching, electrical discharge machining (EDM) or micro electroforming with UVLIGA technology.
- the magnetic powder can include ferrite and polymer material as binder; otherwise, it can include metal soft magnetic powder and polymer material.
- the mold 5 is then removed.
- the magnetic base 47 is processed to form the magnetic substrate 41 with the recess 43 .
- the magnetic base 47 containing ferrite powder can be sintered to form the magnetic substrate 41 , and the magnetic base 47 containing metal soft magnetic powder can be cured to form the magnetic substrate 41 .
- the recess 43 is formed before the magnetic base 47 is sintered or cured.
- the second method for forming the recess 43 is illustrated below with reference to FIGS. 7A to 7C .
- a magnetic base 47 A which has not been sintered or cured, is provided.
- the recess 43 is formed on the magnetic base 47 A.
- the recess 43 can be formed by a turning process, a MEMS process, a semiconductor process, an impression process or a grinding process.
- the MEMS or semiconductor process can include the steps of coating a photoresist layer on the magnetic base 47 A, disposing a mask having the pattern corresponding to the recess 43 over the photoresist layer, exposing and developing the photoresist through the mask etching the magnetic base 47 A, and removing the residual photoresist to obtain the recess 43 .
- the magnetic base 47 A is sintered or cured to form the magnetic substrate 41 with the recess 43 .
- the recess 43 is also formed before the magnetic base 47 A is sintered or cured.
- the third method for forming the recess 43 is illustrated below with reference to FIGS. 8A to 8C .
- a magnetic base is sintered or cured to form a magnetic substrate 41 .
- the recess 43 is formed on the magnetic substrate 41 .
- the recess 43 can be formed by a milling process, a semiconductor process or a MEMS process.
- the MEMS or semiconductor process can include the steps of: coating a photoresist layer PR on the magnetic substrate 41 , disposing a mask having the pattern corresponding to the recess 43 over the photoresist layer PR, exposing and developing the photoresist layer PR through the mask, etching the magnetic base 47 A (as shown in FIG. 8B ), and removing the photoresist remaining to obtain the recess 43 (as shown in FIG. 8C ).
- the recess 43 of this embodiment is formed after the magnetic base 47 is sintered or cured.
- the magnetic substrate of the invention is formed in advance, and the magnetic substrate has the recess for accommodating the coil.
- the coil of the invention is directly surrounded by the magnetic substrate, so the magnetic device has a thinner thickness and higher inductance.
- the coil is formed after sintering or curing the magnetic substrate, so the magnetic substrate can have good magnetic properties.
- the material of the coil is not limited due to the high temperature process.
Abstract
A manufacturing method of a magnetic device includes the steps of forming a magnetic substrate having a plurality of recesses, and forming at least one coil in the recess. In addition, a magnetic device is also disclosed. The magnetic device includes a magnetic substrate and at least one coil. The magnetic substrate has a plurality of recesses and the coil is disposed in the recess.
Description
- This Non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 096127440 filed in Taiwan, Republic of China on Jul. 27, 2007, the entire contents of which are hereby incorporated by reference.
- 1. Field of Invention
- The invention relates to a magnetic device and a manufacturing method thereof.
- 2. Related Art
- Magnetic devices have been widely applied to inductors or noise filters of electronic products. The conventional magnetic devices are made by winding enameled copper wires around magnetic cores. However, the miniaturization of the conventional magnetic devices is restricted by the conventional manufacturing apparatuses, the width of the copper wires and the size of the magnetic cores. Compared with the conventional manufacturing method of winding, the micro-fabrication technology can bring smaller inductors and filters, such as the common-mode noise filters.
- In order to manufacture a magnetic device such as an inductor, a ferrite that can fit to high frequency operation is often used as a substrate. Then a coil is formed on the ferrite by the micro-fabrication technology. As show in
FIG. 1 , acoil 13 and twonon-magnetic materials ferrite substrates magnetic device 1. Because themagnetic device 1 must be surface-planarized, thenon-magnetic materials magnetic device 1 is larger than that desired. Furthermore, thecoil 13 is surrounded by thenon-magnetic materials magnetic device 1 is reduced. - As shown in
FIG. 2 , afirst ferrite 22, acoil 23, asecond ferrite 24 and twoexternal electrodes 25 are formed on asubstrate 21 in sequence by screen printing, and then sintered to form a magnetic device 2. Because thecoil 23 of the magnetic device 2 is directly surrounded by theferrites coil 23 is limited. For example, aluminum can not be adopted as the material of thecoil 23. - As shown in
FIG. 3 , afirst ferrite 32, aseed layer 35, acoil 33, asecond ferrite 34 and aprotection layer 36 are formed in sequence on asubstrate 31 by electroplating to form amagnetic device 3. Because thecoil 33 of themagnetic device 3 is directly surrounded by theferrites magnetic device 3 can become thinner and higher inductance. However, the magnetic properties of theferrites magnetic device 3 has worse inductance and quality factor (Q) than that of the magnetic device 2. - Therefore, there is a need to provide a magnetic device and a manufacturing method thereof that can become thinner and higher inductance and have no limitation on the material of the coil.
- In view of the foregoing, the invention is to provide a magnetic device and a manufacturing method thereof that can become thinner and higher inductance and has no limitation on the material of the coil.
- To achieve the above, the invention discloses a manufacturing method of a magnetic device including the steps of: forming a magnetic substrate having at least one recess, and forming at least one coil at the recess.
- To achieve the above, the invention also discloses a magnetic device includes a magnetic substrate and at least one coil. The magnetic substrate has at least one recess, and the coil is disposed in the recess.
- As mentioned above, the magnetic substrate of the invention is formed in advance, and the magnetic substrate has the recess for accommodating the coil. Compared with the prior art, because the coil is directly surrounded by the magnetic substrate in the invention, the magnetic device has a thinner thickness and higher inductance. Furthermore, in the invention the coil is formed after the magnetic substrate is made, so the magnetic substrate can be made by sintering if the material of the substrate is ferrite. Therefore, the magnetic substrate can have pretty good magnetic properties, and the material of the coil is not limited because of the high temperature process.
- The invention will become more fully understood from the detailed description and accompanying drawings, which are given for illustration only, and thus are not limitative of the present invention, and wherein:
-
FIG. 1 is a schematic view of a first conventional magnetic device; -
FIG. 2 is a schematic view of a second conventional magnetic device; -
FIG. 3 is a schematic view of a third conventional magnetic device; -
FIGS. 4A to 4F are schematic diagrams of magnetic devices according to various embodiments of the invention; -
FIGS. 5A to 5D are schematic diagrams showing the manufacturing steps of two of the magnetic devices according to the embodiments of the invention; -
FIGS. 6A to 6C are schematic diagrams showing a first manufacturing method of the recess of the magnetic device according to the embodiments of the invention; -
FIGS. 7A to 7C are schematic diagrams showing a second manufacturing method of the recess of the magnetic device according to the embodiments of the invention; and -
FIGS. 8A to 8C are schematic diagrams showing a third manufacturing method of the recess of the magnetic device according to the embodiments of the invention. - The present invention will be apparent from the following detailed description, which proceeds with reference to the accompanying drawings, wherein the same references relate to the same elements.
- As shown in
FIG. 4A , amagnetic device 4 according to an embodiment of the invention includes amagnetic substrate 41 and at least onecoil 42. Themagnetic substrate 41 can be formed by sintering or curing. Themagnetic substrate 41 has at least onerecess 43 disposed on one side of themagnetic substrate 41 for accommodating thecoil 42. If themagnetic substrate 41 is formed by sintering, the material of themagnetic substrate 41 can be ferrite mixed with a binder. The ferrite can be, for example, NiZn ferrite or MnZn ferrite. If themagnetic substrate 41 is formed by curing, the material of themagnetic substrate 41 can be a metal soft magnetic powder mixed with a polymer material as the isolation among magnetic particles. In addition, the material of thecoil 42 can be alloy or metal such as copper or aluminum. - In the embodiment, the
magnetic device 4 can have several variations, for example as shown inFIGS. 4B to 4F . - As shown in
FIG. 4B , themagnetic substrate 41A of themagnetic device 4 a is a cylindrical magnetic core, and therecess 43A is disposed on the outer surface of the magnetic core. Thecoil 42A is disposed in therecess 43A. - As shown in
FIG. 4C , in themagnetic device 4 b, therecesses magnetic substrate 41B. Thecoils recesses magnetic device 4 b has thecoils - As shown in
FIG. 4D , themagnetic device 4 c further includes anon-magnetic material 44 formed on thecoil 42 and themagnetic substrate 41 withrecesses 43 accommodating thecoil 42. Therefore, thecoil 42 is disposed between thenon-magnetic material 44 and themagnetic substrate 41. Moreover, themagnetic device 4 c further includes anothermagnetic substrate 45 which is connected to thenon-magnetic material 44. In the embodiment, thenon-magnetic material 44 can be oxide, nitride, spin-on glass (SOG), polymer material, epoxy resin or any other material with adhesion or insulation function. Therefore, themagnetic substrate 45 can adhere to themagnetic substrate 41 through thenon-magnetic material 44, and the short circuit of thecoil 42 due to the material of themagnetic substrate 45 can be prevented. Furthermore, the additionalmagnetic substrate 45 can increase the inductance of themagnetic device 4 c and decrease the inductor loss. - As shown in
FIG. 4E , twomagnetic devices 4 are connected oppositely to form themagnetic device 4 d. In the embodiment, themagnetic devices 4 can be adhered to each other and separated by thenon-magnetic material 44. - As shown in
FIG. 4F , twomagnetic substrates 45 are adhered to the top and bottom sides of themagnetic device 4 b, respectively, to form themagnetic device 4 e. In the embodiment, themagnetic substrates 45 can be adhered to themagnetic device 4 b through thenon-magnetic materials 44. - The
magnetic devices magnetic devices - With reference to
FIGS. 5A to 5D , the manufacturing method of themagnetic devices - At first, as shown in
FIG. 5A , amagnetic substrate 41 having at least onerecess 43 is formed by sintering or curing a magnetic base. Next, as shown inFIG. 5B , ametal layer 46 is formed in therecesses 43. Then, as shown inFIG. 5C , a portion of themetal layer 46 is removed for forming thecoil 42. Through the above-mentioned steps, themagnetic device 4 can be manufactured. In the embodiment, themetal layer 46 can be formed by electroplating, electroless plating or deposition. Alternatively, themetal layer 46 can be made by screen printing a copper paste or a silver paste on therecesses 43, and then is cured. The portion of themetal layer 46 can be removed by a semiconductor process, a MEMS process or a grinding process. - In addition, as shown in
FIG. 5D , the manufacturing method further includes a step of forming anon-magnetic material 44 at one side of thecoil 42, so that thecoil 42 can be disposed between thenon-magnetic material 44 and themagnetic substrate 41. Then, anothermagnetic substrate 45 is provided to connect to thenon-magnetic material 44, thereby forming themagnetic device 4 c. In the embodiment, thenon-magnetic material 44 can be formed by deposition or coating. Themagnetic substrate 45 can connect to thenon-magnetic material 44 by adhesion or wedging. - To be noted that the
magnetic devices magnetic device 4 a, the magnetic substrate 41 a is cylindrical so that it can be rotated to make the metal layer uniformly formed thereon. For themagnetic device 4 b, because the recesses are disposed in two sides of themagnetic device 4 b, two metal layers are needed. For themagnetic device 4 d, twomagnetic devices 4 can be manufactured in advance and then adhered to each other through thenon-magnetic material 44. For themagnetic device 4 e, it can be formed by the manufacturing processes of themagnetic device 4 b and themagnetic device 4 c. - In the above embodiments, the recesses of the magnetic substrate can be formed by many methods. The first method for forming the recesses is illustrated below with reference to
FIGS. 6A to 6C . - As shown in
FIG. 6A , a magnetic powder is disposed into amold 5, which has the structure corresponding to therecess 43. Then, the magnetic powder in themold 5 is pressurized to form amagnetic base 47. In the embodiment, the structure of themold 5 corresponding to therecess 43 can be made by ordinary machining, etching, electrical discharge machining (EDM) or micro electroforming with UVLIGA technology. The magnetic powder can include ferrite and polymer material as binder; otherwise, it can include metal soft magnetic powder and polymer material. As shown inFIG. 6B , themold 5 is then removed. As shown inFIG. 6C , themagnetic base 47 is processed to form themagnetic substrate 41 with therecess 43. Herein, themagnetic base 47 containing ferrite powder can be sintered to form themagnetic substrate 41, and themagnetic base 47 containing metal soft magnetic powder can be cured to form themagnetic substrate 41. To be noted, therecess 43 is formed before themagnetic base 47 is sintered or cured. - The second method for forming the
recess 43 is illustrated below with reference toFIGS. 7A to 7C . - As shown in
FIG. 7A , amagnetic base 47A, which has not been sintered or cured, is provided. As shown inFIG. 7B , therecess 43 is formed on themagnetic base 47A. In the embodiment, therecess 43 can be formed by a turning process, a MEMS process, a semiconductor process, an impression process or a grinding process. The MEMS or semiconductor process can include the steps of coating a photoresist layer on themagnetic base 47A, disposing a mask having the pattern corresponding to therecess 43 over the photoresist layer, exposing and developing the photoresist through the mask etching themagnetic base 47A, and removing the residual photoresist to obtain therecess 43. As shown inFIG. 7C , themagnetic base 47A is sintered or cured to form themagnetic substrate 41 with therecess 43. In the embodiment, therecess 43 is also formed before themagnetic base 47A is sintered or cured. - The third method for forming the
recess 43 is illustrated below with reference toFIGS. 8A to 8C . - As shown in
FIG. 8A , a magnetic base is sintered or cured to form amagnetic substrate 41. As shown inFIG. 8B , therecess 43 is formed on themagnetic substrate 41. In the embodiment, therecess 43 can be formed by a milling process, a semiconductor process or a MEMS process. The MEMS or semiconductor process can include the steps of: coating a photoresist layer PR on themagnetic substrate 41, disposing a mask having the pattern corresponding to therecess 43 over the photoresist layer PR, exposing and developing the photoresist layer PR through the mask, etching themagnetic base 47A (as shown inFIG. 8B ), and removing the photoresist remaining to obtain the recess 43 (as shown inFIG. 8C ). To be noted, therecess 43 of this embodiment is formed after themagnetic base 47 is sintered or cured. - In summary, the magnetic substrate of the invention is formed in advance, and the magnetic substrate has the recess for accommodating the coil. Compared with the prior art, the coil of the invention is directly surrounded by the magnetic substrate, so the magnetic device has a thinner thickness and higher inductance. Furthermore, the coil is formed after sintering or curing the magnetic substrate, so the magnetic substrate can have good magnetic properties. In addition, the material of the coil is not limited due to the high temperature process.
- Although the invention has been described with reference to specific embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternative embodiments, will be apparent to persons skilled in the art. It is, therefore, contemplated that the appended claims will cover all modifications that fall within the true scope of the invention.
Claims (24)
1. A manufacturing method of a magnetic device comprising steps of:
forming a first magnetic substrate having at least one recess; and
forming at least one coil in the recess.
2. The manufacturing method as recited in claim 1 , wherein the first magnetic substrate is formed by sintering or curing a magnetic base, and the recess is formed on the magnetic base before the magnetic base is sintered or cured.
3. The manufacturing method as recited in claim 2 , wherein before the step of sintering or curing the magnetic base, the manufacturing method further comprises steps of:
disposing a magnetic powder into a mold having a structure corresponding to the recess;
pressing the magnetic powder to form the magnetic base; and
removing the mold.
4. The manufacturing method as recited in claim 2 , wherein before the step of sintering or curing the magnetic base, the manufacturing method further comprises a step of forming the recess on the magnetic base through a turning process, a MEMS process, a semiconductor process, an impression process or a grinding process.
5. The manufacturing method as recited in claim 2 , wherein after the step of forming the first magnetic substrate, the manufacturing method further comprises a step of forming the recess on the first magnetic substrate by milling machining, EDM, laser machining a semiconductor process or a MEMS process.
6. The manufacturing method as recited in claim 4 , wherein the MEMS process or the semiconductor process comprises steps of:
coating a photoresist layer on the magnetic base;
disposing a mask with a pattern corresponding to the recess on the photoresist layer;
exposing and developing the photoresist through the mask;
etching the magnetic base; and
removing the photoresist so as to form the recess.
7. The manufacturing method as recited in claim 5 , wherein the MEMS process or the semiconductor process comprises steps of:
coating a photoresist layer on the magnetic base;
disposing a mask with a pattern corresponding to the recess on the photoresist layer;
exposing and developing the photoresist through the mask;
etching the magnetic base; and
removing the photoresist so as to form the recess.
8. The manufacturing method as recited in claim 1 , wherein the step of forming the coil comprises steps of:
forming a metal layer on the recess; and
removing a portion of the metal layer to form the coil.
9. The manufacturing method as recited in claim 7 , wherein the metal layer is formed by electroplating, electroless plating, deposition, or curing a copper paste or a silver paste printed in the recess, and the portion of the metal layer is removed by a semiconductor process, a MEMS process or a grinding process.
10. The manufacturing method as recited in claim 1 , wherein after the step of forming the coil, the manufacturing method further comprises:
forming a non-magnetic material on the first magnetic substrate and the coil.
11. The manufacturing method as recited in claim 10 , wherein the non-magnetic material is formed by deposition or coating, and the non-magnetic material comprises oxide, nitride, spin-on glass (SOG), a polymer material, an epoxy resin or an insulation material.
12. The manufacturing method as recited in claim 10 , further comprising a step of forming a second magnetic substrate for connecting to the non-magnetic material by adhesion or wedging.
13. The manufacturing method as recited in claim 12 , wherein the second magnetic substrate has at least one recess and at least one coil is disposed in the recess of the second magnetic substrate.
14. The manufacturing method as recited in claim 1 , further comprising steps of:
forming two connection materials on opposite sides of the first magnetic substrate; and
connecting the connection materials to a second magnetic substrate and a third magnetic substrate, respectively.
15. A magnetic device comprising:
a first magnetic substrate having at least one recess; and
at least one coil disposed in the recess.
16. The magnetic device as recited in claim 15 , wherein the first magnetic substrate has a plurality of recesses, and the recesses are disposed on opposite sides or one side of the first magnetic substrate.
17. The magnetic device as recited in claim 16 , wherein when the coil is disposed on one side of the first magnetic substrate, the magnetic device is an inductor, and when the coils are disposed on the opposite sides of the first magnetic substrate, the magnetic device is a filter, a transformer or a double-layer inductor.
18. The magnetic device as recited in claim 15 , wherein the first magnetic substrate is a magnetic core, or a cylindrical magnetic core, and the recess is disposed on an outer surface of the magnetic core.
19. The magnetic device as recited in claim 14 , wherein a material of the first magnetic substrate comprises ferrite, NiZn ferrite, MnZn ferrite or metal soft magnetic powder mixed with a polymer material.
20. The magnetic device as recited in claim 15 , wherein a material of the coil comprises metal, alloy, copper or aluminum.
21. The magnetic device as recited in claim 15 , further comprising a non-magnetic material disposed on the coil and the first magnetic substrate such that the coil is disposed between the non-magnetic material and the first magnetic substrate.
22. The magnetic device as recited in claim 21 , further comprising a second magnetic substrate connected to the nonmagnetic material, wherein the second magnetic substrate has at least one recess and at least one coil is disposed in the recess of the second magnetic.
23. The magnetic device as recited in claim 15 , further comprising:
two non-magnetic materials disposed on opposite sides of the first magnetic substrate; and
a second magnetic substrate and a third magnetic substrate connected to the non-magnetic materials, respectively.
24. The magnetic device as recited in claim 20 , wherein a material of the non-magnetic material comprises oxide, nitride, SOG, polymer material or epoxy resin.
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TW096127440A TW200905703A (en) | 2007-07-27 | 2007-07-27 | Magnetic device and manufacturing method thereof |
TW096127440 | 2007-07-27 |
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US12/022,040 Abandoned US20090029185A1 (en) | 2007-07-27 | 2008-01-29 | Magnetic device and manufacturing method thereof |
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JP2009033106A (en) | 2009-02-12 |
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